CN114501854A

CN114501854A - Method for manufacturing circuit board with embedded element and circuit board with embedded element

Info

Publication number: CN114501854A
Application number: CN202011166218.6A
Authority: CN
Inventors: 彭超; 胡先钦
Original assignee: Avary Holding Shenzhen Co Ltd; Qing Ding Precision Electronics Huaian Co Ltd
Current assignee: Avary Holding Shenzhen Co Ltd; Qing Ding Precision Electronics Huaian Co Ltd
Priority date: 2020-10-27
Filing date: 2020-10-27
Publication date: 2022-05-13
Anticipated expiration: 2040-10-27
Also published as: CN114501854B

Abstract

A manufacturing method of a circuit board comprises the following steps: providing a first circuit substrate, wherein the first circuit substrate comprises a first connecting pad and a second connecting pad; providing a second circuit substrate, wherein the second circuit substrate comprises a third connecting pad and a through hole; providing an insulating layer, wherein the insulating layer comprises a first opening and a second opening, the first opening corresponds to the first connecting pad and the third connecting pad, and the second opening corresponds to the second connecting pad and the through hole; sequentially laminating the first circuit substrate, the insulating layer and the second circuit substrate to enable the first connecting pad and the third connecting pad to respectively penetrate through the first opening and be electrically connected, and enabling the second connecting pad to be exposed to the second opening and the through hole; arranging an electronic element in the accommodating groove formed by the second opening and the through hole and electrically connected with the second connecting pad; and covering electromagnetic shielding layers on the surfaces of the first circuit substrate and the second circuit substrate to obtain the circuit board with the embedded element. The application also provides an embedded element circuit board.

Description

Method for manufacturing circuit board with embedded element and circuit board with embedded element

Technical Field

The present disclosure relates to the field of circuit boards, and particularly to a method for manufacturing a circuit board with embedded components and a circuit board with embedded components.

Background

With the increasing demand of people for various electronic products such as computers, consumer electronics, communications, and the like, the functions of the electronic products are diversified, and the packaging structures in the electronic products are more and more concentrated, for example, the components are embedded in the multilayer circuit board.

In the existing manufacturing method of the circuit board with the embedded element, the circuit layer is usually manufactured by a subtractive method, and the interlayer conduction adopts a plating hole process which is a wet process, so that the process is complex and the pollution problem is serious; when the electronic component and the signal line are embedded in the circuit board at the same time, the circuit board is not easy to be thinned, and the manufactured circuit board has poor signal quality.

Disclosure of Invention

In view of the above, it is desirable to provide a method for manufacturing a circuit board with embedded components, which has a simplified manufacturing process and a good signal quality, so as to solve the above problems.

In addition, it is necessary to provide a circuit board with embedded components.

A manufacturing method of a circuit board with an embedded element comprises the following steps:

providing a first circuit substrate, wherein the first circuit substrate comprises a first connecting pad and a second connecting pad;

providing a second circuit substrate, wherein the second circuit substrate comprises a third connecting pad, the third connecting pad corresponds to the first connecting pad, and the second circuit substrate further comprises a through hole;

providing an insulating layer, wherein the insulating layer comprises a first opening and a second opening, the first opening corresponds to the first connecting pad and the third connecting pad, and the second opening corresponds to the second connecting pad and the through hole;

sequentially pressing the first circuit substrate, the insulating layer and the second circuit substrate to enable the first connecting pad and the third connecting pad to respectively penetrate through the first opening and be electrically connected, and the second connecting pad to be exposed to the second opening and the through hole;

arranging an electronic element in the second opening and the accommodating groove formed by the through hole, and electrically connecting with the second connecting pad; and

and covering electromagnetic shielding layers on the surfaces of the first circuit substrate and the second circuit substrate, which are far away from the insulating layer, so as to obtain the circuit board of the embedded element.

Furthermore, the surfaces of the first connecting pad and the third connecting pad are provided with metal conductive paste, and after the first circuit substrate, the insulating layer and the second circuit substrate are pressed, the conductive paste is positioned in the first opening and between the first connecting pad and the third connecting pad.

Further, the insulating layer further comprises a metal conductive paste, and the metal conductive paste is contained in the first opening.

Further, the manufacturing step of the insulating layer comprises:

providing a glue layer;

forming the first opening and the second opening in the glue layer; and

and filling metal conductive paste in the first opening.

Further, before the step of forming the electromagnetic shielding layer, the method further comprises the following steps:

and dispensing in the gap between the accommodating groove and the electronic element.

The first circuit substrate further comprises a ground wire, the ground wire is arranged towards the second circuit substrate after the first circuit substrate, the insulating layer and the second circuit substrate are pressed, and the part of the first circuit substrate, which is provided with the ground wire, protrudes out of the second circuit substrate.

Further, the electromagnetic shielding layer also covers the ground wire.

A circuit board with embedded components, comprising:

a first circuit substrate including a first connection pad and a second connection pad;

a second circuit substrate including a third connection pad corresponding to the first connection pad, the second circuit substrate further including a through hole;

the insulating layer is positioned between the first circuit substrate and the second circuit substrate and comprises a first opening and a second opening, the first connecting pad and the third connecting pad are contained in the first opening and are electrically connected, the second opening is communicated with the through hole to form a containing groove, and the second connecting pad is exposed in the containing groove;

the electronic element is accommodated in the accommodating groove and is electrically connected with the second connecting pad; and

and the electromagnetic shielding layer covers the surfaces of the first circuit substrate and the second circuit substrate, which are deviated from the insulating layer.

Furthermore, the first circuit substrate further comprises a ground wire, the first circuit substrate comprises a part of the ground wire, which protrudes out of the second circuit substrate, and the electromagnetic shielding layer further covers the ground wire.

Further, the circuit board further includes a metal conductive paste, which is located between the first connection pad and the third connection pad and electrically connected to the first circuit substrate and the second circuit substrate.

The method for manufacturing the circuit board with the embedded element, provided by the application, comprises the steps of sequentially pressing a first circuit substrate, an insulating layer and a second circuit substrate to form a containing groove for containing an electronic element, placing the electronic element in the containing groove, and covering an electromagnetic shielding layer on the surfaces, deviating from the insulating layer, of the first circuit substrate and the second circuit substrate respectively to manufacture the circuit board, wherein the manufacturing process flow is simplified and is pollution-free; in addition, the electromagnetic shielding layer covers the first signal line layer, the second signal line layer and the electronic element in the electromagnetic shielding layer, so that interference of external signals on the first signal line layer, the second signal line layer and the electronic element 60 in the circuit board can be shielded, signals in the circuit board can be prevented from leaking, and the quality of signals in the circuit board is guaranteed.

Drawings

Fig. 1 is a schematic cross-sectional view of a first circuit substrate according to an embodiment of the disclosure.

Fig. 2 is a schematic cross-sectional view of an insulating layer according to an embodiment of the present application.

Fig. 3 is a schematic cross-sectional view of a second circuit substrate according to an embodiment of the present disclosure.

Fig. 4 is a schematic cross-sectional view of a first circuit substrate according to another embodiment of the present disclosure.

Fig. 5 is a schematic cross-sectional view of an insulating layer according to another embodiment of the present application.

Fig. 6 is a schematic cross-sectional view of a second circuit substrate according to another embodiment of the present disclosure.

Fig. 7 is a schematic cross-sectional view illustrating the first circuit substrate, the insulating layer and the second circuit substrate being sequentially laminated to form an accommodating cavity.

Fig. 8 is a schematic cross-sectional view of the accommodating groove shown in fig. 7 with an electronic component disposed therein.

Fig. 9 is a schematic cross-sectional view illustrating a colloid filled between the accommodating groove and the electronic component shown in fig. 8.

Fig. 10 is a schematic cross-sectional view of the surfaces of the first circuit substrate and the second circuit substrate shown in fig. 9, which are away from the insulating layer, are covered with the electromagnetic shielding layer.

Description of the main elements

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

In order that the above objects, features and advantages of the present application can be more clearly understood, a detailed description of the present application will be made below with reference to the accompanying drawings and detailed description. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict. In the following description, numerous specific details are set forth to provide a thorough understanding of the present application, and the described embodiments are merely a subset of the embodiments of the present application, rather than all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes all and any combination of one or more of the associated listed items.

In various embodiments of the present application, for convenience in description and not limitation, the term "coupled" as used in the specification and claims of the present application is not limited to physical or mechanical connections, either direct or indirect. "upper", "lower", "above", "below", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly.

Referring to fig. 1 to 10, an embodiment of the present invention provides a method for manufacturing a circuit board 100 with embedded components, including the following steps:

step S1: referring to fig. 1 and fig. 4, a first circuit substrate 10 is provided, wherein the first circuit substrate 10 includes a first connecting pad 13 and a second connecting pad 14.

The first circuit board 10 includes a first substrate layer 11 and is located a first signal line layer 12, an electric connection on the surface of the first substrate layer 11 the first connection pad 13 and the second connection pad 14 of the first signal line layer 12, the first signal line layer 12 the first connection pad 13 and the second connection pad 14 are all located the same surface of the first substrate layer 11. The first connection pads 13 are used for electrically connecting to a second circuit substrate 20 formed later, and the second connection pads 14 are used for electrically connecting to an electronic component 60 formed later (see fig. 10).

The first circuit substrate 10 further includes a ground line 122, the ground line 122 is electrically connected to the first signal line layer 12, and the ground line 122 is used for grounding, housing connection, or connection to a line with a reference potential of zero.

In some embodiments, the surface of the first connection pad 13 is further provided with a metal conductive paste 40a, such as a solder paste, a copper paste, etc., for performing an electrical connection function in the circuit board 100 to be formed later. In other embodiments, the metal conductive paste 40a may not be disposed on the surface of the first connection pad 13.

The material of the first substrate layer 11 may be one of flexible materials such as Polyimide (PI), Liquid Crystal Polymer (LCP), Modified Polyimide (MPI), and the like.

Step S2: referring to fig. 3 and 6, a second circuit substrate 20 is provided, the second circuit substrate 20 includes third connecting pads 23, the third connecting pads 23 correspond to the first connecting pads 13, and the second circuit substrate 20 further includes through holes 24.

The second circuit board 20 includes a second substrate layer 21, a second signal line layer 22 on the surface of the second substrate layer 21, and a third connection pad 23 electrically connected to the second signal line layer 22. The second signal line layer 22 and the third connection pad 23 are both located on the same surface of the second substrate layer 21. The positions and the number of the third connection pads 23 correspond to the positions and the number of the first connection pads 13.

The second signal line layer 22 is used in the circuit board 100 for transferring sensing information and control information.

In some embodiments, the surface of the second connection pad 14 is further provided with a metal conductive paste 40b, such as a solder paste, a copper paste, or the like, for electrically connecting with the first connection pad 13. In other embodiments, the surface of the second connection pad 14 may not be provided with the metal conductive paste 40 b.

The through hole 24 is formed through the second substrate layer 21 and the second signal line layer 22. The number of the through holes 24 can be set according to needs, for example, the number of the electronic components 60 to be connected, wherein one through hole 24 can accommodate one electronic component 60.

The material of the second substrate layer 21 may be one of flexible materials such as Polyimide (PI), Liquid Crystal Polymer (LCP), Modified Polyimide (MPI), and the like. In the same embodiment, the first base material layer 11 and the second base material layer 21 may be made of the same material or different materials.

Step S3: referring to fig. 2 and 5, an insulating layer 30 is provided, where the insulating layer 30 includes a first opening 32 and a second opening 34, the first opening 32 corresponds to the first connecting pad 13 and the third connecting pad 23, and the second opening 34 corresponds to the second connecting pad 14 and the through hole 24.

The material of the insulating layer 30 may be one selected from epoxy resin, Polytetrafluoroethylene (PTFE), and industrial Liquid Crystal Polymer (LCP).

In some embodiments, the insulating layer 30 has a thickness of 10 μm to 25 μm.

The first openings 32 and the second openings 34 penetrate through the insulating layer 30, the positions and the number of the first openings 32 are consistent with those of the first connecting pads 13 or the third connecting pads 23, and the positions and the number of the second openings 34 are corresponding to those of the second connecting pads 14.

Referring to fig. 5, in some embodiments, a metal conductive paste 40c is further contained in the first opening 32 for electrically connecting the first circuit substrate 10 and the second circuit substrate.

In some embodiments, the step of forming the insulating layer 30 having the metal conductive paste 40c includes: providing a glue layer; forming a first opening 32 and a second opening 34 penetrating through the adhesive layer by laser drilling; and filling the metal conductive paste 40c in the first opening 32 to obtain the adhesive layer. It is understood that the above steps of forming the insulating layer 30 are only illustrative and not restrictive.

Step S4: referring to fig. 7, the first circuit substrate 10, the insulating layer 30 and the second circuit substrate 20 are sequentially pressed, so that the first connecting pads 13 and the third connecting pads 23 respectively penetrate through the first openings 32 and are electrically connected, and the second connecting pads 14 are exposed to the second openings 34 and the through holes 24.

Specifically, the insulating layer 30 is located between the first circuit substrate 10 and the second circuit substrate 20, the surfaces of the first circuit substrate 10 having the first signal line layer 12 and the second circuit substrate 20 having the second signal line layer 22 both face the insulating layer 30, and the first connection pad 13 and the third connection pad 23 are both located in the first opening 32 and are electrically connected through the metal conductive paste 40 located between the first connection pad 13 and the third connection pad 23; the second opening 34 and the through hole 24 are communicated with each other to form a receiving groove 50, and the second connecting pad 14 is exposed to the receiving groove 50.

The portion of the first wiring substrate 10 having the ground line 122 protrudes from the second wiring substrate 20.

Step S5: referring to fig. 8, an electronic component 60 is disposed in the second opening 34 and the receiving cavity 50 formed by the through hole 24, and electrically connected to the second connecting pad 14.

It is understood that the number of the receiving grooves 50 is set according to the number of the electronic components 60 required to be mounted.

Further, in some embodiments, a connection pad (not shown) exposed to another receiving groove (not shown) may be disposed on the second circuit substrate 20, and the electronic component 60 directly connected to the second circuit substrate 20 may be received in the corresponding receiving groove. It can be understood that the positions of the connection pads for connecting different electronic components 60 need to be staggered along the stacking direction of the first circuit substrate 10 and the second circuit substrate 20, which is beneficial to reducing the thickness of the manufactured circuit board 100 on the basis of meeting the requirement of the number of the electronic components 60.

Step S6: referring to fig. 9, a dispensing process is performed in a gap between the accommodating groove 50 and the electronic component 60.

The gap between the accommodating groove 50 and the electronic component 60 is filled with a colloid 70 to further fix the electronic component 60.

Step S7: referring to fig. 10, the surfaces of the first circuit substrate 10 and the second circuit substrate 20 away from the insulating layer 30 are covered with an electromagnetic shielding layer 80 to obtain the circuit board 100 with the embedded component.

The material of the electromagnetic shielding layer 80 may be selected from metals such as copper and aluminum.

Electromagnetic shield layer 80 covers first substrate layer 11 deviates from the surface of first signal line layer 12 and second substrate layer 21 deviates from the surface of second signal line layer 22, electromagnetic shield layer 80 still covers electronic component 60 exposes the surface of second circuit board 20, electromagnetic shield layer 80 still covers first circuit board 10 is protruding to stretch in the surface of ground wire 122 of second circuit board 20. The electromagnetic shielding layer 80 can be used for shielding external signals, preventing the external signals from interfering with the signals of the first signal line layer 12, the second signal line layer 22 and the electronic component 60 in the circuit board 100, and also preventing the signals in the circuit board 100 from leaking, thereby ensuring the quality of the signals in the circuit board 100.

Further, before the electromagnetic shielding layer 80 is disposed, the first substrate layer 11 and the second substrate layer 21 are located at outer layers, and an ink layer or other substrate layers may not be additionally disposed.

The present application further provides a circuit board 100 of embedded component, which includes a first circuit substrate 10, an insulating layer 30, a second circuit substrate 20 stacked in sequence and an electromagnetic shielding layer 80 located on the first circuit substrate 10 and deviating from the second circuit substrate 20 of the insulating layer 30.

The first circuit board 10 includes a first substrate layer 11, and a first signal line layer 12, a first connection pad 13, and a second connection pad 14 on a surface of the first substrate layer 11.

The second circuit board 20 includes a second substrate layer 21, a second signal line layer 22 on the surface of the second substrate layer 21, and the third connection pad 23.

The insulating layer 30 is located between the first circuit substrate 10 and the second circuit substrate 20, the insulating layer 30 includes a first opening 32 and a second opening 34, the first connecting pad 13 and the third connecting pad 23 are accommodated in the first opening 32 and electrically connected, and the second opening 34 corresponds to the second connecting pad 14 and the through hole 24.

The first signal line layer 12 and the second signal line layer 22 are disposed toward the insulating layer 30, the first connection pad 13 and the third connection pad 23 are accommodated in the first opening 32, the metal conductive paste 40 is accommodated in the first opening 32 and located between the first connection pad 13 and the third connection pad 23, and the metal conductive paste 40 is used for electrically connecting the first circuit substrate 10 and the second circuit substrate 20.

The second opening 34 is connected with the through hole 24 to form a receiving groove 50, the second connecting pad 14 is exposed in the receiving groove 50, the electronic component 60 is received in the receiving groove 50 and electrically connected with the second connecting pad 14, and a gap between the receiving groove 50 and the electronic component 60 is filled with a glue 70.

The electromagnetic shield layer 80 covers the surface of the first substrate layer 11 deviating from the first signal line layer 12 and the surface of the second substrate layer 21 deviating from the second signal line layer 22, and the electromagnetic shield layer 80 also covers the surface of the electronic component 60 exposed to the second circuit board 20.

Further, the first circuit substrate 10 further includes a ground line 122, and a portion of the first circuit substrate 10 having the ground line 122 protrudes from the second circuit substrate 20. The electromagnetic shield layer 80 also covers the surface of the first wiring substrate 10 protruding from the ground line 122 of the second wiring substrate 20.

The material of each of the first substrate layer 11 and the second substrate layer 21 may be one selected from flexible materials such as Polyimide (PI), Liquid Crystal Polymer (LCP), Modified Polyimide (MPI), and the like.

The material of the insulating layer 30 may be one selected from epoxy resin, Polytetrafluoroethylene (PTFE), and industrial Liquid Crystal Polymer (LCP). The insulating layer 30 is located between the first circuit substrate 10 and the second circuit substrate 20, and not only has insulating and bonding effects, but also has the effect of buffering stress applied to the first circuit substrate 10 and the second circuit substrate 20, so as to improve the fatigue resistance of the circuit board 100.

Further, the thickness of the circuit board 100 can be set as required in the circuit board 100 of the embedded component, in a specific embodiment, the thickness of the electromagnetic shielding layer 80 is 10 μm, the thicknesses of the first substrate layer 11 and the second substrate layer 21 are both 12 μm, the thicknesses of the first signal line layer 12 and the second signal line layer 22 are both 12 μm, the thickness of the insulating layer 30 not accommodating the first signal line layer 12 and the second signal line layer 22 is 10 μm, and the total thickness of the circuit board is 78 μm, and the circuit board belongs to the ultra-thin circuit board 100. The first base material layer 11, the second base material layer 21, and the insulating layer 30 may be selected from flexible materials, and the circuit board 100 may be flexible.

According to the manufacturing method of the circuit board 100 with the embedded components, the first circuit substrate 10, the insulating layer 30 and the second circuit substrate 20 are sequentially pressed to form the accommodating groove 50 for accommodating the electronic component 60, the electronic component 60 is placed in the accommodating groove 50, and the electromagnetic shielding layer 80 is respectively covered on the surfaces, deviating from the insulating layer 30, of the first circuit substrate 10 and the second circuit substrate 20, so that the circuit board 100 is manufactured, and the manufacturing process flow is simplified and is pollution-free; in addition, the electromagnetic shielding layer 80 covers the first signal line layer 12, the second signal line layer 22 and the electronic component in the electromagnetic shielding layer 80, so that interference of external signals on the signals of the first signal line layer 12, the second signal line layer 22 and the electronic component 60 in the circuit board 100 can be shielded, signals in the circuit board 100 can be prevented from leaking, and the quality of signals in the circuit board 100 can be ensured.

Although the present application has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the present application.

Claims

1. A method for manufacturing a circuit board with embedded elements is characterized by comprising the following steps:

2. The method as claimed in claim 1, wherein a metal conductive paste is disposed on the surfaces of the first connecting pad and the third connecting pad, and the conductive paste is located in the first opening and between the first connecting pad and the third connecting pad after the first circuit substrate, the insulating layer and the second circuit substrate are bonded together.

3. The method as claimed in claim 1, wherein the insulating layer further comprises a metal conductive paste, and the metal conductive paste is received in the first opening.

4. The method for manufacturing a circuit board with embedded components according to claim 3, wherein the step of manufacturing the insulating layer comprises:

providing a glue layer;

forming the first opening and the second opening in the glue layer; and

and filling metal conductive paste in the first opening.

5. The method for manufacturing a circuit board with an embedded component according to claim 1, further comprising, before the step of forming the electromagnetic shielding layer, the steps of:

6. The method as claimed in claim 1, wherein the first circuit board further comprises a ground trace, the ground trace is disposed toward the second circuit board after the first circuit board, the insulating layer and the second circuit board are laminated, and a portion of the first circuit board having the ground trace protrudes from the second circuit board.

7. The method as claimed in claim 6, wherein the electromagnetic shielding layer further covers the ground wire.

8. A circuit board with embedded components, comprising:

9. The circuit board of an embedded component as claimed in claim 8, wherein the first circuit substrate further comprises a ground wire, a portion of the first circuit substrate including the ground wire protrudes from the second circuit substrate, and the electromagnetic shielding layer further covers the ground wire.

10. The circuit board of embedded component as claimed in claim 8, further comprising a metal conductive paste between the first and third connection pads for electrically connecting the first and second circuit substrates.