CN105307387B - A kind of high multilayered rigidity and flexibility combined impedance plate of large scale and preparation method thereof - Google Patents

A kind of high multilayered rigidity and flexibility combined impedance plate of large scale and preparation method thereof Download PDF

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CN105307387B
CN105307387B CN201510588294.9A CN201510588294A CN105307387B CN 105307387 B CN105307387 B CN 105307387B CN 201510588294 A CN201510588294 A CN 201510588294A CN 105307387 B CN105307387 B CN 105307387B
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plate
lamination
glue
lines
rigid
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CN105307387A (en
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候利娟
陈晓宇
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Shenzhen Kinwong Electronic Co Ltd
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Shenzhen Kinwong Electronic Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The present invention disclose high multilayered rigidity and flexibility combined impedance plate of a kind of large scale and preparation method thereof, it is of the invention made by rigid-flexible combined impedance plate, its size is big, Multilayer Flexible Board is included, and carries impedance design (it is required that 100 ± 10ohm), performance is more, added value is high, is worth marketing.

Description

A kind of high multilayered rigidity and flexibility combined impedance plate of large scale and preparation method thereof
Technical field
The present invention relates to PCB manufacture technology fields, more particularly to a kind of system of the high multilayered rigidity and flexibility combined impedance plate of large scale Make method.
Background technology
Communicate the development of consumer electronics product and wearable device recently as mobile phone etc., and 4G communication times Arrive, the demand of rigid-flexible combined impedance plate sharply increases.Such products characteristics that industry makes at present are single, and not design contains There is the rigid-flexible combined impedance plate of large scale, high multilayer.
Therefore, prior art has yet to be improved and developed.
The content of the invention
In view of above-mentioned the deficiencies in the prior art, it is an object of the invention to provide a kind of high multilayered rigidity and flexibility of large scale to combine resistance The preparation method of anti-plate, it is intended to solve existing can not also realize Multilayer Flexible Board, the high multilayered rigidity and flexibility combination plate problem of impedance.
Technical scheme is as follows：
A kind of preparation method of the high multilayered rigidity and flexibility combined impedance plate of large scale, wherein, including step：
1）The making of Multilayer Flexible Board：
The making of flex plate：Sawing sheet, drilling, etching, brown, fitting, pressing and solidification are carried out successively, finally turn A sublevels Pressure；
The making of thermosetting glue-line：Sawing sheet, drilling, fitting, false pressure and lamination are carried out successively, turn A lamination；
A lamination：6th wiring board, flex plate, thermosetting glue-line, the 7th wiring board, flex plate and the 8th wiring board are folded Close, be then laminated；
After A lamination：Drilled successively, circuit, brown and fitting obtain Multilayer Flexible Board, finally turn C time be laminated；
2）The making of multilayer rigid plate：
The making of rigid plate：Sawing sheet, drilling, etching, gong plate and brown are carried out successively, finally turn B lamination；
The making of first PP glue-lines：Sawing sheet, finally turn B lamination；
B lamination is divided into B1 and B2；Wherein, B1：It is sequentially stacked first line plate, rigid plate, the second wiring board, the first PP Glue-line, tertiary circuit plate, rigid plate, the 4th wiring board, the first PP glue-lines, the 5th wiring board, rigid plate, are then laminated； B2：It is sequentially stacked the 13rd wiring board, rigid plate, the 12nd wiring board, the first PP glue-lines, the 11st wiring board, rigid plate, Ten wiring boards, the first PP glue-lines, the 9th wiring board, rigid plate, are then laminated；
After B laminations：Drilled successively, circuit, gong plate and brown, the first multilayer rigid plate is obtained by B1, obtained by B2 Second multilayer rigid plate, finally turn C lamination；
3）The making of rigid-flex combined board：
The making of 2nd PP glue-lines：Sawing sheet and gong plate are carried out successively, finally turn C lamination；
C lamination：It is sequentially stacked the first multilayer rigid plate, the 2nd PP glue-lines, Multilayer Flexible Board, the 2nd PP glue-lines, second Multilayer rigid plate, is then laminated；
After C lamination：Enter row line making and rear process.
The preparation method of the high multilayered rigidity and flexibility combined impedance plate of described large scale, wherein, when carrying out C time and being laminated, by the One and second one side the 2nd PP glue-line of fitting of rigid plate in multilayer rigid plate.
The preparation method of the high multilayered rigidity and flexibility combined impedance plate of described large scale, wherein, the first PP glue-lines are 1080PP glue-lines.
The preparation method of the high multilayered rigidity and flexibility combined impedance plate of described large scale, wherein, the 2nd PP glue-lines are low stream Glue-line.
The preparation method of the high multilayered rigidity and flexibility combined impedance plate of described large scale, wherein, the length and width of rigid-flexible combined impedance plate Size is respectively 460mm*305mm.
A kind of high multilayered rigidity and flexibility combined impedance plate of large scale, wherein, it is made of preparation method as described above.
Beneficial effect：Rigid-flexible combined impedance plate made by the present invention, its size is big, includes Multilayer Flexible Board, and band There is impedance design (it is required that 100 ± 10ohm), performance is more, and added value is high, is worth marketing.
Brief description of the drawings
Fig. 1 is a kind of high multilayered rigidity and flexibility combined impedance plate of large scale of the present invention.
Embodiment
The present invention provides a kind of preparation method of the high multilayered rigidity and flexibility combined impedance plate of large scale, for make the purpose of the present invention, Technical scheme and effect are clearer, clear and definite, and the present invention is described in more detail below.It is it should be appreciated that described herein Specific embodiment only to explain the present invention, is not intended to limit the present invention.
A kind of preparation method preferred embodiment of the high multilayered rigidity and flexibility combined impedance plate of large scale provided by the present invention, it is wrapped Include step：
1）The making of Multilayer Flexible Board：
The making of flex plate：Sawing sheet, drilling, etching are carried out successively（Impedance control）, brown, fitting, pressing and solidification, most After turn A times lamination；
Described flex plate is single or double flex plate.
One side flex plate is that have one layer of conductive pattern formed by chemical etching, double-faced flexible plate in a face of base material When respectively have one layer of conductive pattern formed by chemical etching in two faces of base material, plated through-hole leads insulating materials two sides Electrograph shape connects to form conductive path, to meet the design and use function of flexibility.
The Multilayer Flexible Board that the present invention makes is that the one side flex plate of multilayer or double-faced flexible flaggy force together, then Plated through-hole is formed by drilling, electroplating, forms the path of conduction between the different layers.The Multilayer Flexible Board of the present invention is with poly- Acid imide copper-clad plate is base material, its heat resistance is high, good stability of the dimension, the good electrical insulating properties with having mechanical protection concurrently Cover layer forms final products by hot pressing.
A lamination is the lamination to Multilayer Flexible Board in itself.
The making of thermosetting glue-line：Sawing sheet, drilling, fitting, false pressure and lamination are carried out successively, turn A lamination；The thermosetting glue-line It is for being bonded two layers of flex plate.
A lamination：As shown in figure 1, by the 6th wiring board L6, flex plate 24, thermosetting glue-line 25, the 7th wiring board L7, scratch Property plate 24 and the 8th wiring board L8 overlapping, be then laminated；
After A lamination：Drilled successively, circuit, brown and fitting obtain Multilayer Flexible Board, finally turn C time be laminated；Such as Shown in Fig. 1, its obtained multi-layer flexible harden structure（L6--L8）For interlayer structure.
2）The making of multilayer rigid plate：
The making of rigid plate：Sawing sheet, drilling, etching are carried out successively（Impedance control）, gong plate and brown, finally turn B sublevels Pressure；
Rigid plate and the manufacture craft of flex plate are essentially identical, simply need fixture to enter luggage extension, avoid floating.
The making of first PP glue-lines (1080PP)：Sawing sheet, finally turn B lamination；
B lamination is divided into B1 and B2：Wherein, B1：Be sequentially stacked first line plate L1, rigid plate 21, the second wiring board L2, First PP glue-lines 22, tertiary circuit plate L3, rigid plate 21, the 4th wiring board L4, the first PP glue-lines 22, the 5th wiring board L5, just Property plate 21, is then laminated；B2：It is sequentially stacked the 13rd wiring board L13, rigid plate 21, the 12nd wiring board L12, first PP glue-lines 22, the 11st wiring board L11, rigid plate 21, the tenth wiring board L10, the first PP glue-lines 22, the 9th wiring board L9, just Property plate 21, is then laminated；B lamination is the lamination to multilayer rigid plate in itself.Newly-generated first multilayer rigidity after lamination Plate（L1--L5）, the second multilayer rigid plate（L9—L13）.）
After B laminations：Drilled successively, circuit, gong plate and brown obtain multilayer rigid plate, i.e., the first multilayer is obtained by B1 Rigid plate（L1--L5）, the second multilayer rigid plate is obtained by B2（L9—L13）, finally turn C lamination；
3）The making of rigid-flex combined board：
2nd PP glue-lines（Not gummosis PP）Making：Sawing sheet and gong plate are carried out successively, finally turn C lamination；Such as Fig. 1 institutes Show, the first PP glue-lines are 1080PP glue-lines.The 2nd PP glue-lines are not gummosis PP.
C lamination：It is sequentially stacked the first multilayer rigid plate（L1--L5）, the 2nd PP glue-lines 23, Multilayer Flexible Board（L6— L8）, the 2nd PP glue-lines 23, the second multilayer rigid plate（L9—L13）, then it is laminated；Generate L1-L13 rigid-flexible combination resistance Anti- plate, i.e. 13 layers of rigid-flex combined board.As shown in Figure 1.L1 therein is line layer to L13 layers, each layer, and can pass through conducting Hole 20 is conductive, i.e. referred to as 13 layers of rigid-flex combined board, 1080PP, rigid plate in structure（FR4）, flex plate（PI）, not gummosis PP Layer is dielectric layer between layers, i.e. insulating barrier, is not counted in the number of plies of wiring board.
C lamination is the lamination to rigid-flex combined board in itself.During C lamination, by multilayer rigid plate, not gummosis PP, multilayer Flex plate riveted, C lamination is carried out after riveted, by rigid plate one side the 2nd PP glue of fitting in the first and second multilayer rigid plates Layer.
After C lamination：Enter row line making（Impedance control）And rear process.
In above-mentioned making Multilayer Flexible Board and multilayer rigid plate, it is necessary to using the electroplates in hole mode, reach layer and layer Between electric interconnection, and need using insulating cover protection conductive pattern, the insulating cover plays protection conductive pattern Shape is not infected with, the influence to conducting channel such as dust and metallic particles, otherwise easily causes short circuit.Weldering in Multilayer Flexible Board Disk, in insulating cover surface windowing, can expose the pad that needs are welded by the way of drilling or punching, with Just Denso operation is carried out.
Using multilayer rigid plate when Multilayer Flexible Board is combined, the through hole above the two needs to carry out electroless copper plating And electro-coppering, the metal of plating have the electrodeposited coatings such as copper, gold, nickel and leypewter,
Rigid-flexible its size of combined impedance plate of the present invention is big, and specific length and width size is respectively 460mm*305mm, i.e., just Scratch combined impedance plate and use rectangular configuration, instrument cost is consumed and save to reduce.Multilayer Flexible Board is included, and carries impedance Design (it is required that 100 ± 10ohm), performance is more, and added value is high, is worth marketing.
Based on the above method, the present invention also provides a kind of rigid-flexible combined impedance plate, and it uses making side as described above Method makes.
In summary, rigid-flexible its size of combined impedance plate made by the present invention is big, includes Multilayer Flexible Board, and carry Impedance design (it is required that 100 ± 10ohm), performance is more, and added value is high, is worth marketing
It should be appreciated that the application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can To be improved or converted according to the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention Protect scope.

Claims (6)

1. a kind of preparation method of the high multilayered rigidity and flexibility combined impedance plate of large scale, it is characterised in that including step：
1）The making of Multilayer Flexible Board：
The making of flex plate：Sawing sheet, drilling, etching, brown, fitting, pressing and solidification are carried out successively, finally turn A lamination；
The making of thermosetting glue-line：Sawing sheet, drilling, fitting, false pressure and lamination are carried out successively, turn A lamination；
A lamination：6th wiring board, flex plate, thermosetting glue-line, the 7th wiring board, flex plate and the 8th wiring board are overlapped, so After be laminated；
After A lamination：Drilled successively, circuit, brown and fitting obtain Multilayer Flexible Board, finally turn C time be laminated；
2）The making of multilayer rigid plate：
The making of rigid plate：Sawing sheet, drilling, etching, gong plate and brown are carried out successively, finally turn B lamination；
The making of first PP glue-lines：Sawing sheet, finally turn B lamination；
B lamination is divided into B1 and B2；Wherein, B1：It is sequentially stacked first line plate, rigid plate, the second wiring board, the first PP glue Layer, tertiary circuit plate, rigid plate, the 4th wiring board, the first PP glue-lines, the 5th wiring board, rigid plate, are then laminated；B2： It is sequentially stacked the 13rd wiring board, rigid plate, the 12nd wiring board, the first PP glue-lines, the 11st wiring board, rigid plate, the tenth Wiring board, the first PP glue-lines, the 9th wiring board, rigid plate, are then laminated；
After B laminations：Drilled successively, circuit, gong plate and brown, the first multilayer rigid plate is obtained by B1, second is obtained by B2 Multilayer rigid plate, finally turn C lamination；
3）The making of rigid-flex combined board：
The making of 2nd PP glue-lines：Sawing sheet and gong plate are carried out successively, finally turn C lamination；
C lamination：It is sequentially stacked the first multilayer rigid plate, the 2nd PP glue-lines, Multilayer Flexible Board, the 2nd PP glue-lines, the second multilayer Rigid plate, then it is laminated；
After C lamination：Enter row line making and rear process；
The Multilayer Flexible Board is formed using polyimide copper clad lamination as base material, with cover layer by hot pressing.
2. the preparation method of the high multilayered rigidity and flexibility combined impedance plate of large scale according to claim 1, it is characterised in that entering During C lamination of row, by rigid plate one side the 2nd PP glue-lines of fitting in the first and second multilayer rigid plates.
3. the preparation method of the high multilayered rigidity and flexibility combined impedance plate of large scale according to claim 1, it is characterised in that described First PP glue-lines are 1080PP glue-lines.
4. the preparation method of the high multilayered rigidity and flexibility combined impedance plate of large scale according to claim 1, it is characterised in that described 2nd PP glue-lines are low gummosis layer.
5. the preparation method of the high multilayered rigidity and flexibility combined impedance plate of large scale according to claim 1, it is characterised in that rigid-flexible The length and width size of combined impedance plate is respectively 460mm*305mm.
6. a kind of high multilayered rigidity and flexibility combined impedance plate of large scale, it is characterised in that using as described in any one of claim 1 ~ 5 Preparation method is made.
CN201510588294.9A 2015-09-16 2015-09-16 A kind of high multilayered rigidity and flexibility combined impedance plate of large scale and preparation method thereof Active CN105307387B (en)

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Publication number Priority date Publication date Assignee Title
CN107949152B (en) * 2017-11-30 2024-04-09 广州兴森快捷电路科技有限公司 Manufacturing method of rigid-flex circuit board
CN112105175B (en) * 2020-11-09 2021-02-19 广东科翔电子科技股份有限公司 Process method of asymmetric multilayer rigid-flex printed circuit board with air cavity

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102164463A (en) * 2010-11-17 2011-08-24 佛山市成德电路股份有限公司 Method for pressing multi-layer rigid-flexible combined circuit board
CN102970828A (en) * 2012-11-30 2013-03-13 成都航天通信设备有限责任公司 Method for manufacturing rigidity-flexibility combined printing circuit board
CN104135823A (en) * 2014-07-14 2014-11-05 东莞市五株电子科技有限公司 Fabrication method for rigid-flex printed combination board of covering membrane window

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2841996B2 (en) * 1992-01-13 1998-12-24 日立化成工業株式会社 Manufacturing method of rigid flex wiring board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102164463A (en) * 2010-11-17 2011-08-24 佛山市成德电路股份有限公司 Method for pressing multi-layer rigid-flexible combined circuit board
CN102970828A (en) * 2012-11-30 2013-03-13 成都航天通信设备有限责任公司 Method for manufacturing rigidity-flexibility combined printing circuit board
CN104135823A (en) * 2014-07-14 2014-11-05 东莞市五株电子科技有限公司 Fabrication method for rigid-flex printed combination board of covering membrane window

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