CN105307387A - Large size high multilayer rigid-flexible impedance board and manufacturing method thereof - Google Patents
Large size high multilayer rigid-flexible impedance board and manufacturing method thereof Download PDFInfo
- Publication number
- CN105307387A CN105307387A CN201510588294.9A CN201510588294A CN105307387A CN 105307387 A CN105307387 A CN 105307387A CN 201510588294 A CN201510588294 A CN 201510588294A CN 105307387 A CN105307387 A CN 105307387A
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- lamination
- plate
- line
- glue
- wiring board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a large size high multilayer rigid-flexible impedance board and a manufacturing method thereof. According to the invention, the manufactured rigid-flexible impedance board has the advantages of large size, multiple performances and high added value, comprises a number of flexible boards, has impedance design (the requirement is 100+/-10ohm), and is worthy of marketing.
Description
Technical field
The present invention relates to PCB manufacture technology field, particularly relate to a kind of manufacture method of large scale height multilayered rigidity and flexibility combined impedance plate.
Background technology
In recent years along with the development of the communication consumer electronics products such as mobile phone and wearable device, and the arrival of 4G communication times, the demand of rigid-flexible combined impedance plate sharply increases.This type of products characteristics that current industry makes is single, not the rigid-flexible combined impedance plate of design containing large scale, high multilayer.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of manufacture method of large scale height multilayered rigidity and flexibility combined impedance plate, be intended to solve the existing high multilayered rigidity and flexibility board problem that also cannot realize Multilayer Flexible Board, impedance.
Technical scheme of the present invention is as follows:
A manufacture method for large scale height multilayered rigidity and flexibility combined impedance plate, wherein, comprises step:
1) making of Multilayer Flexible Board:
The making of flex plate: carry out sawing sheet, boring, etching, brown, laminating, pressing and solidification successively, finally turns A lamination;
The making of thermosetting glue-line: carry out sawing sheet, boring, laminating, false pressure and lamination successively, turn A lamination;
A lamination: by superimposed to the 6th wiring board, flex plate, thermosetting glue-line, the 7th wiring board, flex plate and the 8th wiring board, then carry out lamination;
After A lamination: carry out successively holing, circuit, brown and laminating obtain Multilayer Flexible Board, finally turn C lamination;
2) making of multilayer rigid plate:
The making of rigid plate: carry out sawing sheet, boring, etching, gong plate and brown successively, finally turn B lamination;
The making of the one PP glue-line: sawing sheet, finally turns B lamination;
B time lamination is divided into B1 and B2; Wherein, B1: stacked first line plate, rigid plate, the second wiring board, a PP glue-line, tertiary circuit plate, rigid plate, the 4th wiring board, a PP glue-line, the 5th wiring board, rigid plate successively, then carries out lamination; B2: stacked 13 wiring board, rigid plate, the 12 wiring board, a PP glue-line, the 11 wiring board, rigid plate, the tenth wiring board, a PP glue-line, the 9th wiring board, rigid plate successively, then carries out lamination;
After B lamination: carry out successively holing, circuit, gong plate and brown, obtain the first multilayer rigid plate by B1, obtain the second multilayer rigid plate by B2, finally turn C lamination;
3) making of rigid-flex combined board:
The making of the 2nd PP glue-line: carry out sawing sheet and gong plate successively, finally turn C lamination;
C lamination: stacked first multilayer rigid plate, the 2nd PP glue-line, Multilayer Flexible Board, the 2nd PP glue-line, the second multilayer rigid plate successively, then carries out lamination;
After C lamination: carry out circuit making and rear operation.
The manufacture method of described large scale height multilayered rigidity and flexibility combined impedance plate, wherein, when carrying out C lamination, by rigid plate one side laminating the 2nd PP glue-line in the first and second multilayer rigid plate.
The manufacture method of described large scale height multilayered rigidity and flexibility combined impedance plate, wherein, a described PP glue-line is 1080PP glue-line.
The manufacture method of described large scale height multilayered rigidity and flexibility combined impedance plate, wherein, described 2nd PP glue-line is low gummosis layer.
The manufacture method of described large scale height multilayered rigidity and flexibility combined impedance plate, wherein, the length and width size of rigid-flexible combined impedance plate is respectively 460mm*305mm.
A kind of large scale height multilayered rigidity and flexibility combined impedance plate, wherein, adopts manufacture method as above to make.
Beneficial effect: the rigid-flexible combined impedance plate made by the present invention, its size is large, include Multilayer Flexible Board, and with impedance design (requiring 100 ± 10ohm), performance is many, and added value is high, is worth marketing.
Accompanying drawing explanation
Fig. 1 is a kind of large scale height multilayered rigidity and flexibility combined impedance plate of the present invention.
Embodiment
The invention provides a kind of manufacture method of large scale height multilayered rigidity and flexibility combined impedance plate, for making object of the present invention, technical scheme and effect clearly, clearly, the present invention is described in more detail below.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The manufacture method preferred embodiment of a kind of large scale height multilayered rigidity and flexibility combined impedance plate provided by the present invention, it comprises step:
1) making of Multilayer Flexible Board:
The making of flex plate: carry out sawing sheet, boring, etching (impedance Control), brown, laminating, pressing and solidification successively, finally turn A lamination;
Described flex plate is single or double flex plate.
One side flex plate is the conductive pattern having one deck to be formed by chemical etching in a face of base material, at the conductive pattern that two of base material faces respectively have one deck to be formed by chemical etching during double-faced flexible plate, the conductive pattern on insulating material two sides is coupled together formation conductive path by plated-through hole, to meet the design and use function of flexibility.
The Multilayer Flexible Board that the present invention makes is forced together at the one side flex plate of multilayer or double-faced flexible flaggy, then forms plated-through hole by boring, plating, form the path of conduction between the different layers.Multilayer Flexible Board of the present invention take polyimide copper clad lamination as base material, and its thermal endurance is high, good stability of the dimension, forms final products with the coverlay of the good electrical insulation property having mechanical protection concurrently by hot pressing.
A lamination is the lamination to Multilayer Flexible Board itself.
The making of thermosetting glue-line: carry out sawing sheet, boring, laminating, false pressure and lamination successively, turn A lamination; This thermosetting glue-line is used to bonding two-layer flex plate.
A lamination: as shown in Figure 1, by superimposed to the 6th wiring board L6, flex plate 24, thermosetting glue-line 25, the 7th wiring board L7, flex plate 24 and the 8th wiring board L8, then carries out lamination;
After A lamination: carry out successively holing, circuit, brown and laminating obtain Multilayer Flexible Board, finally turn C lamination; As shown in Figure 1, its multi-layer flexible plate structure (L6--L8) obtained is sandwich structure.
2) making of multilayer rigid plate:
The making of rigid plate: carry out sawing sheet, boring, etching (impedance Control), gong plate and brown successively, finally turn B lamination;
Rigid plate is substantially identical with the manufacture craft of flex plate, just needs fixture to carry out dress and hangs, avoid floating.
The making of the one PP glue-line (1080PP): sawing sheet, finally turns B lamination;
B time lamination is divided into B1 and B2: wherein, B1: stacked first line plate L1, rigid plate 21, second wiring board L2, a PP glue-line 22, tertiary circuit plate L3, rigid plate 21, the 4th wiring board L4, a PP glue-line 22, the 5th wiring board L5, rigid plate 21 successively, then carries out lamination; B2: stacked 13 wiring board L13, rigid plate the 21, the 12 wiring board L12, PP glue-line the 22, a 11 wiring board L11, rigid plate 21, the tenth wiring board L10, a PP glue-line 22, the 9th wiring board L9, rigid plate 21 successively, then carries out lamination; B lamination is the lamination to multilayer rigid plate itself.Newly-generated first multilayer rigid plate (L1--L5), the second multilayer rigid plate (L9-L13) after lamination.）
After B lamination: carry out successively holing, circuit, gong plate and brown obtain multilayer rigid plate, namely obtain the first multilayer rigid plate (L1--L5) by B1, obtain the second multilayer rigid plate (L9-L13) by B2, finally turn C lamination;
3) making of rigid-flex combined board:
The making of the 2nd PP glue-line (not gummosis PP): carry out sawing sheet and gong plate successively, finally turn C lamination; As shown in Figure 1, a described PP glue-line is 1080PP glue-line.Described 2nd PP glue-line is not gummosis PP.
C lamination: stacked first multilayer rigid plate (L1--L5), the 2nd PP glue-line 23, Multilayer Flexible Board (L6-L8), the 2nd PP glue-line 23, second multilayer rigid plate (L9-L13) successively, then carries out lamination; Generate the rigid-flexible combined impedance plate of L1-L13, i.e. 13 layers of rigid-flex combined board.As shown in Figure 1.L1 to L13 layer wherein, every one deck is line layer, and conduct electricity by via 20, namely 13 layers of rigid-flex combined board are called, 1080PP in structure, rigid plate (FR4), flex plate (PI), not gummosis PP layer are dielectric layer between layers, i.e. insulating barrier, is not counted in the number of plies of wiring board.
C lamination is the lamination to rigid-flex combined board itself.During C lamination, by multilayer rigid plate, not gummosis PP, Multilayer Flexible Board riveted, after riveted, carry out C lamination, by rigid plate one side laminating the 2nd PP glue-line in the first and second multilayer rigid plate.
After C lamination: carry out circuit making (impedance Control) and rear operation.
When above-mentioned making Multilayer Flexible Board and multilayer rigid plate; need the mode using the electroplates in hole; reach electric interconnection between layers; and need to adopt insulating cover protection conductive pattern; this insulating cover plays that protection conductive pattern is not infected with, the impact on conducting channel such as dust and metallic particles, otherwise easily causes short circuit.Pad in Multilayer Flexible Board can adopt the mode of boring or punching, and at insulating cover surface windowing, the pad making needs carry out welding exposes, to carry out Denso operation.
When using multilayer rigid plate to combine with Multilayer Flexible Board, the through hole above the two needs to carry out electroless copper plating and electro-coppering, and the metal of plating has the electrodeposited coatings such as copper, gold, nickel and leypewter,
Rigid-flexible its size of combined impedance plate of the present invention is large, and concrete length and width size is respectively 460mm*305mm, and namely rigid-flexible combined impedance plate adopts rectangular configuration, consumes and the instrument of saving cost to reduce.Include Multilayer Flexible Board, and with impedance design (requiring 100 ± 10ohm), performance is many, and added value is high, is worth marketing.
Based on said method, the present invention also provides a kind of rigid-flexible combined impedance plate, and it adopts manufacture method as described above to make.
In sum, rigid-flexible its size of combined impedance plate made by the present invention is large, include Multilayer Flexible Board, and with impedance design (requiring 100 ± 10ohm), performance is many, and added value is high, is worth marketing
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to claims of the present invention.
Claims (6)
1. a manufacture method for large scale height multilayered rigidity and flexibility combined impedance plate, is characterized in that, comprise step:
1) making of Multilayer Flexible Board:
The making of flex plate: carry out sawing sheet, boring, etching, brown, laminating, pressing and solidification successively, finally turns A lamination;
The making of thermosetting glue-line: carry out sawing sheet, boring, laminating, false pressure and lamination successively, turn A lamination;
A lamination: by superimposed to the 6th wiring board, flex plate, thermosetting glue-line, the 7th wiring board, flex plate and the 8th wiring board, then carry out lamination;
After A lamination: carry out successively holing, circuit, brown and laminating obtain Multilayer Flexible Board, finally turn C lamination;
2) making of multilayer rigid plate:
The making of rigid plate: carry out sawing sheet, boring, etching, gong plate and brown successively, finally turn B lamination;
The making of the one PP glue-line: sawing sheet, finally turns B lamination;
B time lamination is divided into B1 and B2; Wherein, B1: stacked first line plate, rigid plate, the second wiring board, a PP glue-line, tertiary circuit plate, rigid plate, the 4th wiring board, a PP glue-line, the 5th wiring board, rigid plate successively, then carries out lamination; B2: stacked 13 wiring board, rigid plate, the 12 wiring board, a PP glue-line, the 11 wiring board, rigid plate, the tenth wiring board, a PP glue-line, the 9th wiring board, rigid plate successively, then carries out lamination;
After B lamination: carry out successively holing, circuit, gong plate and brown, obtain the first multilayer rigid plate by B1, obtain the second multilayer rigid plate by B2, finally turn C lamination;
3) making of rigid-flex combined board:
The making of the 2nd PP glue-line: carry out sawing sheet and gong plate successively, finally turn C lamination;
C lamination: stacked first multilayer rigid plate, the 2nd PP glue-line, Multilayer Flexible Board, the 2nd PP glue-line, the second multilayer rigid plate successively, then carries out lamination;
After C lamination: carry out circuit making and rear operation.
2. the manufacture method of large scale height multilayered rigidity and flexibility combined impedance plate according to claim 1, is characterized in that, when carrying out C lamination, by rigid plate one side laminating the 2nd PP glue-line in the first and second multilayer rigid plate.
3. the manufacture method of large scale height multilayered rigidity and flexibility combined impedance plate according to claim 1, it is characterized in that, a described PP glue-line is 1080PP glue-line.
4. the manufacture method of large scale height multilayered rigidity and flexibility combined impedance plate according to claim 1, it is characterized in that, described 2nd PP glue-line is low gummosis layer.
5. the manufacture method of large scale height multilayered rigidity and flexibility combined impedance plate according to claim 1, it is characterized in that, the length and width size of rigid-flexible combined impedance plate is respectively 460mm*305mm.
6. a large scale height multilayered rigidity and flexibility combined impedance plate, is characterized in that, adopts the manufacture method as described in any one of claim 1 ~ 5 to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510588294.9A CN105307387B (en) | 2015-09-16 | 2015-09-16 | A kind of high multilayered rigidity and flexibility combined impedance plate of large scale and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510588294.9A CN105307387B (en) | 2015-09-16 | 2015-09-16 | A kind of high multilayered rigidity and flexibility combined impedance plate of large scale and preparation method thereof |
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| Publication Number | Publication Date |
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| CN105307387A true CN105307387A (en) | 2016-02-03 |
| CN105307387B CN105307387B (en) | 2018-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510588294.9A Active CN105307387B (en) | 2015-09-16 | 2015-09-16 | A kind of high multilayered rigidity and flexibility combined impedance plate of large scale and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019105032A1 (en) * | 2017-11-30 | 2019-06-06 | 广州兴森快捷电路科技有限公司 | Rigid-flex combined circuit board and production method therefor |
| CN112105175A (en) * | 2020-11-09 | 2020-12-18 | 广东科翔电子科技股份有限公司 | Process method of asymmetric multilayer rigid-flex printed circuit board with air cavity |
| CN116321683A (en) * | 2023-03-03 | 2023-06-23 | 江西景旺精密电路有限公司 | A semi-rigid-flex circuit board capable of bidirectional and multi-directional bending and a processing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05191050A (en) * | 1992-01-13 | 1993-07-30 | Hitachi Chem Co Ltd | Manufacture of rigid flex wiring board |
| CN102164463A (en) * | 2010-11-17 | 2011-08-24 | 佛山市成德电路股份有限公司 | Method for pressing multi-layer rigid-flexible combined circuit board |
| CN102970828A (en) * | 2012-11-30 | 2013-03-13 | 成都航天通信设备有限责任公司 | Method for manufacturing rigidity-flexibility combined printing circuit board |
| CN104135823A (en) * | 2014-07-14 | 2014-11-05 | 东莞市五株电子科技有限公司 | A method for manufacturing a rigid-flex printed board with a window opening on the cover film |
-
2015
- 2015-09-16 CN CN201510588294.9A patent/CN105307387B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05191050A (en) * | 1992-01-13 | 1993-07-30 | Hitachi Chem Co Ltd | Manufacture of rigid flex wiring board |
| CN102164463A (en) * | 2010-11-17 | 2011-08-24 | 佛山市成德电路股份有限公司 | Method for pressing multi-layer rigid-flexible combined circuit board |
| CN102970828A (en) * | 2012-11-30 | 2013-03-13 | 成都航天通信设备有限责任公司 | Method for manufacturing rigidity-flexibility combined printing circuit board |
| CN104135823A (en) * | 2014-07-14 | 2014-11-05 | 东莞市五株电子科技有限公司 | A method for manufacturing a rigid-flex printed board with a window opening on the cover film |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019105032A1 (en) * | 2017-11-30 | 2019-06-06 | 广州兴森快捷电路科技有限公司 | Rigid-flex combined circuit board and production method therefor |
| CN112105175A (en) * | 2020-11-09 | 2020-12-18 | 广东科翔电子科技股份有限公司 | Process method of asymmetric multilayer rigid-flex printed circuit board with air cavity |
| CN116321683A (en) * | 2023-03-03 | 2023-06-23 | 江西景旺精密电路有限公司 | A semi-rigid-flex circuit board capable of bidirectional and multi-directional bending and a processing method thereof |
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| CN105307387B (en) | 2018-04-03 |
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