CN202514155U - Improvement of multilayer soft circuit board structure - Google Patents
Improvement of multilayer soft circuit board structure Download PDFInfo
- Publication number
- CN202514155U CN202514155U CN2012201871843U CN201220187184U CN202514155U CN 202514155 U CN202514155 U CN 202514155U CN 2012201871843 U CN2012201871843 U CN 2012201871843U CN 201220187184 U CN201220187184 U CN 201220187184U CN 202514155 U CN202514155 U CN 202514155U
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- China
- Prior art keywords
- layer
- circuit
- circuit board
- improvement
- multilayer soft
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- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to an improvement of a multilayer soft circuit board structure. The improvement of the multilayer soft circuit board structure comprises at least two single-layer circuit boards, wherein adjacent single-layer circuit boards are stacked up and down, each single-layer circuit board comprises a base plate, a circuit layer is respectively arranged on each of an upper side and a lower side of the base plate, electric connection parts of the base plate and the corresponding circuit layers are correspondingly provided with through holes, two ends of the adjacent circuit boards are connected through two adhesion layers, and a hollow slot is arranged between the two adhesion layers. According to the improvement of the multilayer soft circuit board structure, disclosed by the utility model, the adhesion layers are arranged at the two ends of the adjacent base plates, and the hollow slot is arranged between the adhesion layers and can reduce the stress when a multilayer soft circuit board is bent so as to prevent a line of the multilayer soft circuit board from being broken; in addition, the circuit layers are arranged on the upper side and the lower side of the base plate, and each circuit layer consists of a plurality of secondary circuit layers and can reduce the number of the multilayer soft circuit boards so that the volume becomes smaller and the electric stability can be realized.
Description
Technical field
The utility model relates to a kind of wiring board, is specifically related to a kind of improvement of multi-layer soft circuit board structure.
Background technology
FPC is claimed flexible PCB (Flexible Printed Circuit Board) again, is the printed circuit of processing with flexible insulating substrate, has the advantage that many rigid printed circuit boards do not possess.For example it can free bend, coiling, folding, can require to arrange arbitrarily according to space layout, and move arbitrarily and flexible, thereby reach integrated that the components and parts assembling is connected with lead at three dimensions.Utilize FPC can dwindle the volume of electronic product greatly, be suitable for the needs that electronic product develops to high density, miniaturization, highly reliable direction.Therefore, FPC has obtained using widely on field such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital camera or product.FPC also has good thermal diffusivity and solderability and is easy to advantages such as load, integrated cost be lower.Flexible print circuit board has the branch of single face, two-sided and multi-layer sheet.Mostly existing multi-layer sheet is through between adjacent substrate, making the two stacked on top of one another through a whole piece adhesive layer; Thereby formation multi-layer sheet; But this structure needs when crooked at multi-layer sheet, makes the circuit layer stress that invests on the substrate excessive and damage easily, influences this multiple-plate useful life.In addition; Multi-layer sheet is according to electric needs the number of plies to be set; Generally be that a side at substrate forms circuit layer through etching, when complicated circuit, need more a plurality of substrates to form; Its shortcoming is not only that multi-layer sheet that more a plurality of substrates form is not flexible and can not satisfies the needs of design, and its volume increases the back and satisfied not the demand that people are developed towards little, thin direction product.
The utility model content
To the deficiency of prior art, the utility model provides the multi-layer soft circuit board structure that a kind of wiring board bending is less to the circuit layer influence and overall volume is little.
For realizing above-mentioned purpose, the utility model adopts following technical scheme:
The improvement of multi-layer soft circuit board structure; It comprises at least two individual layer wiring boards, stacked on top of one another between the adjacent monolayer wiring board, and said individual layer wiring board includes substrate; The upper and lower both sides of substrate are equipped with a circuit layer; Substrate and its corresponding circuit layer be the equal corresponding through hole that is provided with at the needs place of being electrically connected, and the two ends of adjacent lines plate connect through two bonding coats, forms a hollow slots between this two bonding coat.
Preferably, said circuit layer is formed from circuit layer at least two, and is adjacent from the logical insulating barrier that is provided with between the circuit layer.
The improvement of the multi-layer soft circuit board structure that the utility model is set forth, compared with prior art, its beneficial effect is: the utility model is provided with bonding coat at the two ends of adjacent monolayer wiring board; Be provided with hollow slots between the bonding coat, when this multi-layer soft wiring board is crooked, the stress when this hollow slots can reduce the circuit layer bending; Avoid the broken string of circuit layer; In addition, be equipped with circuit layer in the both sides up and down of substrate, each circuit layer can be made up of from circuit layer a plurality of again; Can reduce the number of plies of this multi-layer soft wiring board, thereby make its smaller volume and can be electric stable.
Description of drawings
Accompanying drawing 1 is the structural representation of the improvement of the utility model multi-layer soft circuit board structure.
Embodiment
Below, in conjunction with accompanying drawing and embodiment, the improvement of the multi-layer soft circuit board structure of the utility model done further describing, so that clearerly understand the utility model technological thought required for protection.
As shown in Figure 1, the multi-layer soft wiring board that the utility model is only formed with two-layer wiring board (individual layer wiring board 1 with individual layer wiring board 2) is as an instance, and other kinds situation is similar with it.The substrate of individual layer wiring board 1 and individual layer wiring board 2 all adopts the structure of polyimide copper clad lamination, and the polyimides thermal endurance is high, dimensional stability is good, and the two is stacked together.Individual layer wiring board 1 includes substrate 11 and invests its circuit layer 12 and circuit layer 13 of both sides up and down; Circuit layer 12, substrate 11 and circuit layer 13 are provided with through hole 14 at the needs place of being electrically connected; As required; Circuit layer 12 and circuit layer 13 all can be designed to the structure be made up of from circuit layer (figure does not show) a plurality of, and these are a plurality of to separate through insulating barrier between adjacent two of circuit layer, adopts such structure can make the circuit structure of individual layer wiring board 1 more integrated; Can reduce total number of plies of FPC, thereby dwindle the volume of the product that uses this FPC.In like manner; Individual layer wiring board 2 comprises substrate 21 and invests its circuit layer 22 and circuit layer 23 of both sides up and down; Circuit layer 22, substrate 21 and circuit layer 23 are provided with through hole 24 at the needs place of being electrically connected; As required, circuit layer 22 and circuit layer 23 all can be designed to the structure be made up of from circuit layer (figure does not show) a plurality of.Need to prove that be merely signal in the cutaway view of Fig. 1 through hole 14 and through hole 24 are all illustrated, in fact, the two might not be on same longitudinal section.
For fear of the utility model multi-layer soft wiring board when the bending and the excessive broken string that causes circuit on it of stress that circuit layer is received in the utility model preferred embodiment, is different from the structure that a whole piece bonding coat is connected of passing through of prior art; The two ends of individual layer wiring board 1 and individual layer wiring board 2 are connected through a bonding coat 3 respectively, form a hollow slots 4 between the bonding coat 3, illustrate its principle; When this multi-layer soft wiring board of downwarping, substrate 11 is given circuit layer 13 1 pressure downwards, and deformation takes place under this pressure effect circuit layer 13; The mid portion of circuit layer 13 is to lower convexity; In the prior art,, blocking of bonding coat cause circuit layer 13 broken strings owing to increasing circuit layer 13 suffered stress, and in the utility model; Its downside is the hollow slots structure; Stress when having reduced circuit layer 13 bendings makes its situation that should not occur breaking, thereby has guaranteed the electric stability of this multi-layer soft wiring board.
For a person skilled in the art, can make other various corresponding changes and distortion, and these all changes and distortion should belong within the protection range of the utility model claim all according to the technical scheme and the design of above description.
Claims (2)
1. the improvement of multi-layer soft circuit board structure, it comprises at least two individual layer wiring boards, stacked on top of one another between the adjacent monolayer wiring board; It is characterized in that; Said individual layer wiring board includes substrate, and the upper and lower both sides of substrate are equipped with a circuit layer, and substrate and its corresponding circuit layer be the equal corresponding through hole that is provided with at the needs place of being electrically connected; The two ends of adjacent lines plate connect through two bonding coats, form a hollow slots between this two bonding coat.
2. the improvement of multi-layer soft circuit board structure according to claim 1 is characterized in that, said circuit layer is formed from circuit layer at least two, and is adjacent from the logical insulating barrier that is provided with between the circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201871843U CN202514155U (en) | 2012-04-27 | 2012-04-27 | Improvement of multilayer soft circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201871843U CN202514155U (en) | 2012-04-27 | 2012-04-27 | Improvement of multilayer soft circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202514155U true CN202514155U (en) | 2012-10-31 |
Family
ID=47066604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201871843U Expired - Fee Related CN202514155U (en) | 2012-04-27 | 2012-04-27 | Improvement of multilayer soft circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202514155U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106027711A (en) * | 2016-07-28 | 2016-10-12 | 广东欧珀移动通信有限公司 | Circuit board component and mobile terminal |
| CN108541198A (en) * | 2018-06-25 | 2018-09-14 | 扬州市玄裕电子有限公司 | A kind of intelligent heat dissipation multilayer circuit board |
-
2012
- 2012-04-27 CN CN2012201871843U patent/CN202514155U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106027711A (en) * | 2016-07-28 | 2016-10-12 | 广东欧珀移动通信有限公司 | Circuit board component and mobile terminal |
| CN108541198A (en) * | 2018-06-25 | 2018-09-14 | 扬州市玄裕电子有限公司 | A kind of intelligent heat dissipation multilayer circuit board |
| CN108541198B (en) * | 2018-06-25 | 2023-12-12 | 江苏卓宝智造科技有限公司 | Intelligent heat dissipation multilayer circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121031 Termination date: 20140427 |