CN204810683U - Flexible branching multilayer circuit board - Google Patents
Flexible branching multilayer circuit board Download PDFInfo
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- CN204810683U CN204810683U CN201520576736.3U CN201520576736U CN204810683U CN 204810683 U CN204810683 U CN 204810683U CN 201520576736 U CN201520576736 U CN 201520576736U CN 204810683 U CN204810683 U CN 204810683U
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- copper
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- circuit board
- flexible
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Abstract
The utility model relates to a flexible branching multilayer circuit board. The utility model discloses an integrator part and branching, two the branching part is alignd to adhere and is formed the integrator part, single branching include polyimide insulation layer and range upon range of the copper unit is covered to last at least one of polyimide insulation layer, cover the copper unit by the copper layer and range upon range of polyimide insulation layer on the copper layer constitutes. The utility model discloses when realizing the integrated device, can accomplish 0.05mm's flexible thin layer again in the branching region, flexible and independent each layer can extend to each installation orientation according to installation needs, and realize bending and the three -dimensional is installed. Can extensively use in fields such as medical treatment, communication, consumer electronics, when needing the integrated device, realize bending and three -dimensional installation, space -saving application.
Description
Technical field
The utility model belongs to wiring board techniques field, especially a kind of flexible bifurcated multilayer circuit board.
Background technology
Because electronic equipment is constantly to light, thin, short, little future development, conventional rigid wiring board presents that thickness is too thick gradually, volume is too large, can not the defect such as bending, the further volume that cannot meet product reduces and becomes more meticulous to require that flexible circuit board can realize miniaturization and bending preferably; But because material is softer on integrated device, attachment difficulty is larger.
Utility model content
In order to solve the problem, the purpose of this utility model is to provide a kind of flexible bifurcated multilayer circuit board; This wiring board has rigid line plate Mount Device advantage easily concurrently, and having again flexible board can the advantage of bending, just better meets the needs of production development.
The utility model is achieved through the following technical solutions:
A kind of flexible bifurcated multilayer circuit board, comprise integrator parts and bifurcated, forked section alignment bonding described in two forms described integrator parts, described single bifurcated comprises polyimide insulative layer, with be layered in described polyimide insulative layer at least one cover copper unit, cover copper unit and be made up of layers of copper and the polyimide insulative layer be layered in described layers of copper.
Preferably, described single bifurcated comprises the first polyimide insulative layer, the first layers of copper, the second polyimide insulative layer, the second layers of copper and the 3rd polyimide insulative layer that stack gradually.
Preferably, described single bifurcated being also provided with can the through hole of conducting first layers of copper and the second layers of copper.
Preferably, forked section alignment bonding described in described two forms described integrator parts, and described in two, bifurcated is bonded by modified epoxy.
Preferably, described integrator parts are also provided with the through hole of each layers of copper of conducting.
Preferably, described integrator parts are also provided with strengthening course.Be communicated with each sandwich circuit, and by the mode of reinforcement, increase hardness, be convenient to assembly device.
Wherein, the thickness of layers of copper and polyimide substrate layer is this area Commonly Used Size.
Certainly exposed copper outer surface can also cover the conductive layer that one deck prevents it to be oxidized, such as nickel adds gold, or other coatings.
The utility model comprises integrator parts and bifurcated, forked section alignment bonding described in two forms described integrator parts, described single bifurcated comprises polyimide insulative layer, with be layered in described polyimide insulative layer at least one cover copper unit, cover copper unit and be made up of layers of copper and the polyimide insulative layer be layered in described layers of copper.Wherein, integrator parts are multiple-layer overlapped region, be mainly used in realizing device attachment, bifurcated has the feature of easily bending and multidimensional installation, while making the utility model realize integrated device, can accomplish again the flexible thin layer of 0.05mm at bifurcation region, flexible and separate layers, according to installation needs, each installation direction can be extended to, realize bending and three-dimensional installation.Extensively the fields such as medical treatment, communication, consumer electronics be can be applied in, while needing integrated device, bending and three-dimensional installation realized, the application of joint space-efficient.
Accompanying drawing explanation
Fig. 1 of the present utility modelly cuts open schematic diagram,
Fig. 2 is structural representation of the present utility model.
Embodiment
Below in conjunction with embodiment, the utility model is described in further detail, understands the utility model to help those skilled in the art.
See Fig. 1 and Fig. 2, a kind of flexible bifurcated multilayer circuit board, comprise integrator parts 2 and two bifurcateds, upper fork 11 and lower fork 12, upper fork 11 is by downwardly pitching on 12 the first polyimides stacked gradually on insulating barrier 1111, first on layers of copper 1121, second polyimides on insulating barrier 1112, second insulating barrier 1113 in layers of copper 1122 and the 3rd polyimides.Lower fork 12 upwards to pitch under 11 the first polyimides stacked gradually under insulating barrier 1211, first time layers of copper 1221, second polyimides insulating barrier 1213 under insulating barrier 1212, second time layers of copper 1222 and the 3rd polyimides by outer surface.The wherein preferred rolled copper foil of layers of copper, layers of copper and the polyimide insulative layer be layered in layers of copper are formed and cover copper unit as one, bifurcated of the present utility model covers copper unit by polyimide insulative layer and two and forms.Certainly, as other structures of the present utility model, copper unit can be covered for multiple.Upper fork 11 is also provided with can the through hole 110 of layers of copper in layers of copper and second in conducting first; Lower fork 12 is also provided with can the through hole 120 of conducting first time layers of copper and second time layers of copper, and these vias are arranged needed for reality, can one side conducting first polyimide insulative layer, the first layers of copper, the second polyimide insulative layer, the second layers of copper; Also can one side conducting first layers of copper, the second polyimide insulative layer, the second layers of copper and the 3rd polyimide insulative layer; Can also the polyimide insulative layer of conducting first simultaneously, the first layers of copper, the second polyimide insulative layer, the second layers of copper and the 3rd polyimide insulative layer.Upper fork 11 and the bonding of lower fork 12 section aligned form described integrator parts, and bifurcated described in two is bonded by modified epoxy 3.Integrator parts are also provided with the through hole 20 of each layers of copper of conducting, integrator parts are also provided with strengthening course 4.Through hole connects each sandwich circuit by element, and by the mode of reinforcement, increases hardness, be convenient to assembly device.
Certainly exposed copper outer surface can also cover the conductive layer that one deck prevents it to be oxidized, such as nickel adds gold, or other coatings.
The utility model is by techniques such as development, exposure, etchings, and adopt modified epoxy as interlayer pressure and material, vacuum pressing-combining forms.
Above-described embodiment, just preferred embodiment of the present utility model, not be used for limiting the utility model practical range, therefore all equivalences done with the feature described in the utility model claim and principle change or modify, and all should be included within the utility model right.
Claims (6)
1. a flexible bifurcated multilayer circuit board, it is characterized in that, comprise integrator parts and bifurcated, forked section alignment bonding described in two forms described integrator parts, described single bifurcated comprises polyimide insulative layer, with be layered in described polyimide insulative layer at least one cover copper unit, cover copper unit and be made up of layers of copper and the polyimide insulative layer be layered in described layers of copper.
2. flexible bifurcated multilayer circuit board as claimed in claim 1, it is characterized in that, described single bifurcated comprises the first polyimide insulative layer, the first layers of copper, the second polyimide insulative layer, the second layers of copper and the 3rd polyimide insulative layer that stack gradually.
3. flexible bifurcated multilayer circuit board as claimed in claim 2, is characterized in that, described single bifurcated is also provided with can the through hole of conducting first layers of copper and the second layers of copper.
4. flexible bifurcated multilayer circuit board as claimed in claim 3, is characterized in that, forked section alignment bonding described in described two forms described integrator parts, and described in two, bifurcated is bonded by modified epoxy.
5. flexible bifurcated multilayer circuit board as claimed in claim 4, is characterized in that, described integrator parts are also provided with the through hole of each layers of copper of conducting.
6. flexible bifurcated multilayer circuit board as claimed in claim 5, is characterized in that, described integrator parts are also provided with strengthening course.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520576736.3U CN204810683U (en) | 2015-07-31 | 2015-07-31 | Flexible branching multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520576736.3U CN204810683U (en) | 2015-07-31 | 2015-07-31 | Flexible branching multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204810683U true CN204810683U (en) | 2015-11-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520576736.3U Active CN204810683U (en) | 2015-07-31 | 2015-07-31 | Flexible branching multilayer circuit board |
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| CN (1) | CN204810683U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106027711A (en) * | 2016-07-28 | 2016-10-12 | 广东欧珀移动通信有限公司 | Circuit board component and mobile terminal |
-
2015
- 2015-07-31 CN CN201520576736.3U patent/CN204810683U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106027711A (en) * | 2016-07-28 | 2016-10-12 | 广东欧珀移动通信有限公司 | Circuit board component and mobile terminal |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |