CN205726658U

CN205726658U - A kind of LED batten flex circuit application

Info

Publication number: CN205726658U
Application number: CN201620562692.3U
Authority: CN
Inventors: 王家宏; 张江惠
Original assignee: Yangzhou Huameng Electronics Co Ltd
Current assignee: Yangzhou Huameng Electronics Co Ltd
Priority date: 2016-06-13
Filing date: 2016-06-13
Publication date: 2016-11-23
Anticipated expiration: 2026-06-13

Abstract

The utility model discloses a kind of LED batten flex circuit application, coverlay I is included successively in longitudinal direction, backing material plate, coverlay II and stiffening plate, described coverlay I, backing material plate, coverlay II and stiffening plate are fixing successively to be pasted, described coverlay I and coverlay II is respectively overlay in the upper and lower surface of backing material plate, described stiffening plate is positioned over the right-hand end of film II lower surface, the length ratio 3: 4 of described coverlay I and backing material plate, described coverlay II is 1: 1 with the length ratio of backing material plate, the 1/4 of a length of coverlay II length of described stiffening plate, described coverlay I upper surface left end is pasted with electronic devices and components.This utility model LED batten flex circuit application has the advantages such as simple in construction, resistance to bending, pressure, heat-resisting, easy to use, high sensitivity, life-span length.

Description

A kind of LED batten flex circuit application

Technical field

This utility model relates to a kind of flex circuit application, particularly relates to a kind of LED batten flex circuit application.

Background technology

Flex circuit application, also known as FPC or flexible printed circuit board, flexible printed circuit board (Flexible Printed Circuit Board) printed circuit made with flexible insulating substrate, there is many rigid printed circuit boards The advantage not possessed.Such as it can with free bend, wind, fold, can require arbitrarily to arrange according to space layout, and in three-dimensional Space is arbitrarily moved and stretches, thus reaches components and parts assembling and the integration of wire connection.Utilize FPC can be substantially reduced electronics The volume of product, is suitable for the needs that electronic product develops to high density, miniaturization, highly reliable direction.Therefore, FPC is in space flight, army It is widely used on the fields such as thing, mobile communication, laptop computer, computer peripheral equipment, PDA, digital camera or product. FPC Flexible Printed Circuit flexible electric circuit board is also known as flexible circuit board；With mylar or polyimides For base material, by being etched on Copper Foil the one forming circuit and make, there is height reliability, the printing electricity of excellent flexibility Road.

FPC also has good thermal diffusivity and solderability and is prone to the advantages such as load, integrated cost be relatively low, and soft or hard combines Design compensate for slightly not enough in element bearing capacity of flexible parent metal the most to a certain extent.

Flexible print circuit board have one side, two-sided and multi-layer sheet point.The base material used with polyimide copper clad lamination is Main.This kind of material thermal resistance height, good stability of the dimension, pass through with the coverlay having mechanical protection and good electrical insulating properties concurrently Compacting forms final products.Two-sided, the top layer of multilayer printed wiring board and inner conductor realize ectonexine circuit by metallization Electrical connection.

Utility model content

Technical problem to be solved in the utility model is to provide the LED batten of a kind of low cost, high-performance stability Use flex circuit application.

For solving above-mentioned technical problem, the technical scheme that this utility model is used is:

A kind of LED batten flex circuit application, longitudinal direction includes coverlay I, backing material plate, coverlay II and reinforcement successively Plate, described coverlay I, backing material plate, coverlay II and stiffening plate are fixing successively to be pasted, and described coverlay I and coverlay II is respectively Covering the upper and lower surface at backing material plate, described stiffening plate is positioned over the right-hand end of film II lower surface, described covering The length ratio 3: 4 of film I and backing material plate, described coverlay II is 1: 1 with the length ratio of backing material plate, and a length of of described stiffening plate is covered The 1/4 of epiphragma II length, described coverlay I upper surface left end is pasted with electronic devices and components.

Further preferably, described stiffening plate is polyimides stiffening plate or polyester stiffening plate, and the thickness of described stiffening plate is 20～35 μm.

Further preferably, described backing material plate is polyimide copper clad lamination, and the thickness of described backing material plate is 125 μm.

Further preferably, described coverlay I and coverlay II is polyester resin film, described coverlay I and coverlay II Thickness be 9～18 μm.

Further preferably, described coverlay I, backing material plate and the alignment of coverlay II left end, described backing material plate, coverlay II and the alignment of stiffening plate right-hand end.

Compared to prior art, this utility model LED batten flex circuit application has the beneficial effect that

This utility model LED batten flex circuit application has simple in construction, resistance to bending, pressure, heat-resisting, user Just, the advantage such as high sensitivity, life-span length, backing material plate of the present utility model uses polyimide copper clad lamination, and this copper coin purity is high, knot Structure is uniform, and its crystal orientation is parallel to line alignment, thus substantially increases the toughness of backing material plate, simultaneously to base material before circuit makes Plate carries out high-temperature heat treatment, makes the flexural property of backing material plate again strengthen, thus is effectively improved flexure of the present utility model Ability.

Accompanying drawing explanation

Fig. 1 is the structural representation of this utility model LED batten flex circuit application.

Detailed description of the invention

With specific embodiment, technical solutions of the utility model are described further below in conjunction with the accompanying drawings.

As it is shown in figure 1, LED batten flex circuit application of the present utility model, longitudinal direction includes coverlay I2, base successively Material plate 1, coverlay II3 and stiffening plate 5, coverlay I2, backing material plate 1, coverlay II3 and stiffening plate 5 are fixing successively to be pasted, and covers Film I2 and coverlay II3 is respectively overlay in the upper and lower surface of backing material plate 1, and stiffening plate 5 is positioned over film II3 lower surface Right-hand end, coverlay I2, backing material plate 1 and the alignment of coverlay II3 left end, backing material plate 1, coverlay II3 and stiffening plate 5 are right Side end aligns, and the length ratio 3: 4 of coverlay I2 and backing material plate 1, coverlay II3 is 1: 1 with the length ratio of backing material plate 1, reinforcement The 1/4 of a length of coverlay II3 length of plate 5, coverlay I2 upper surface left end is pasted with electronic devices and components 4.

LED batten flex circuit application stiffening plate 5 of the present utility model is polyimides stiffening plate or polyester stiffening plate, Can also be SUS stiffening plate, the thickness of stiffening plate 5 be 20～35 μm；Backing material plate 1 is polyimide copper clad lamination, the thickness of backing material plate 1 Degree is 125 μm, and backing material plate 1 selects the rolled copper foil material of high-purity, even structure so that it is crystal orientation is parallel to line alignment, carries The high toughness of backing material plate 1, carries out high-temperature heat treatment to backing material plate 1 before circuit makes simultaneously, makes Copper Foil flexural property again Strengthen, also eliminate contraction and stress that polyimide film (PI) produces because of the moisture absorption, further increase the flexure of backing material plate 1 Ability；Coverlay I2 and coverlay II3 is polyester resin film, and the thickness of coverlay I2 and coverlay II3 is 9～18 μm, covers Epiphragma I2 and coverlay II3 can carry out hands weldering or low melting point welding, has excellent adhesive property and prominent flexibility, can enter Row alternating bending folds.

LED batten flex circuit application simple in construction of the present utility model, resistance to bending, pressure, heat-resisting, easy to use, High sensitivity, life-span are long；Stiffening plate 5 in structure, coverlay I2, backing material plate 1, coverlay II3 all use halogen-free material；Soft Degree height, compact, use flexibly, are conducive to transport warehousing and reduce manufacturing cost.

Obviously, above-described embodiment is only for clearly demonstrating this utility model example, and is not to this reality Restriction with novel embodiment.For those of ordinary skill in the field, the most also may be used To make other changes in different forms.Here without also cannot all of embodiment be given exhaustive.And these Belong to obvious change or variation that spirit of the present utility model extended out still in protection domain of the present utility model Among.

Claims

1. a LED batten flex circuit application, it is characterised in that: include coverlay I, backing material plate, covering in longitudinal direction successively Film II and stiffening plate, described coverlay I, backing material plate, coverlay II and stiffening plate are fixing successively to be pasted, described coverlay I and covering Epiphragma II is respectively overlay in the upper and lower surface of backing material plate, and described stiffening plate is positioned over the right-hand end of film II lower surface Portion, the length ratio 3: 4 of described coverlay I and backing material plate, described coverlay II is 1: 1 with the length ratio of backing material plate, described reinforcement The 1/4 of a length of coverlay II length of plate, described coverlay I upper surface left end is pasted with electronic devices and components.

LED batten flex circuit application the most according to claim 1, it is characterised in that: described stiffening plate is that polyamides is sub- Amine stiffening plate or polyester stiffening plate, the thickness of described stiffening plate is 20～35 μm.

LED batten flex circuit application the most according to claim 1, it is characterised in that: described backing material plate is that polyamides is sub- Amine copper-clad plate, the thickness of described backing material plate is 125 μm.

LED batten flex circuit application the most according to claim 1, it is characterised in that: described coverlay I and coverlay II is polyester resin film, and the thickness of described coverlay I and coverlay II is 9～18 μm.

LED batten flex circuit application the most according to claim 1, it is characterised in that: described coverlay I, backing material plate Align with coverlay II left end, described backing material plate, coverlay II and the alignment of stiffening plate right-hand end.