JP2006344887A - Printed-wiring board and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To attempt to make thinner a printed-wiring board as well as simplifying its manufacturing method, the printed-wiring board that has electronic elements built in and has a shield structure for shielding radiation noises arising from the electronic elements and the board's wiring pattern. <P>SOLUTION: Two boards 1a and 1b with electronic elements 3a and 3b mounted thereon are faced with their surfaces opposed where the electronic elements 3a and 3b are mounted, insulating adhesive sheets 5a and 5b having a copper foil or an electromagnetic shield sheet 6 in between are inserted and heat-crimped between the upper and lower boards 1a and 1b, and the copper foil or the electromagnetic shield sheet 6 is laid along the irregularities of the electronic elements 3a and 3b mounted on the boards 1a, 1b. Then, a through-hole 7 is formed at a part in which a ground pattern 4 of the upper and lower boards 1a and 1b is formed, to connect the copper foil or the electromagnetic shield sheet 6 and the ground pattern 4 of the boards 1a and 1b. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a printed wiring board, and more particularly to a printed wiring board containing electronic components and a manufacturing method thereof.

  2. Description of the Related Art Conventionally, attempts have been made to prevent noise radiated from built-in electronic components and electromagnetic interference between printed circuit boards arranged above and below in printed wiring boards incorporating electronic components. For example, in FIG. 1 of Japanese Patent Application Laid-Open No. 2004-56144 (see Patent Document 1), an electrical insulating layer is used to manufacture a printed circuit board that can control electromagnetic noise generated from a built-in electronic component without deterioration of high-frequency characteristics in a high-frequency signal. The signal transmission wiring 105 is provided in 103, and the auxiliary wiring 104 is provided in the electrical insulating layer 103 in an electrically insulated state from the signal transmission wiring 105. Further, at least a part of the auxiliary wiring 104 is covered with an electromagnetic shielding layer 106. Thus, there is described a printed wiring board that suppresses radiation noise from inside or outside the printed wiring board without deteriorating the characteristics of signals transmitted through the signal transmission wiring 105.

  Moreover, in FIG. 7 (refer patent document 2) of Unexamined-Japanese-Patent No. 11-150391, in the electronic circuit module in which several small blocks of electronic circuits are laminated | stacked adjacently, both the reinforcement of the shield between each block and thin weight reduction are achieved. Therefore, a thin-film shield layer reflecting the surface irregularities of the opposing surface of the first small block 1 between the first small block 1 and the second small block 2 electrically connected by the connectors 14 and 24 By interposing 17, both blocks can be opposed at a minimum interval.

  The shield layer 17 is formed of a coating film obtained by spraying a conductive paint after forming a thin insulating film 15 on the first small block 1 and is connected to the ground electrode of the first block through the opening 16. The The insulation between the shield layer 17 and the second small block 2 is performed by the insulating film 25 formed on the surface of the second small block 2.

JP 2004-56144 A (FIG. 1)

Japanese Patent Laid-Open No. 11-150391 (FIG. 7)

  However, in the thing of patent document 1, the planar conductor layer is necessarily needed between the printed wiring boards which mounted the electronic component up and down, and there also exists a subject that the thickness of the printed wiring board after integration cannot be made thin.

  Moreover, in the thing of patent document 2, after apply | coating an insulating resin to the printed wiring board which mounted the electronic component up and down and hardening | curing, after coating a conductive paste further, the printed wiring board which mounted the electronic component up and down is provided. There is also a problem that the structure is superposed and the manufacturing process is complicated.

  The present invention was made to solve the above-described problems and problems, and it is possible to reduce the thickness of the printed wiring board with the built-in electronic components and simplify the manufacturing process, and to reliably prevent electromagnetic interference, It is an object of the present invention to provide a printed wiring board and a method for manufacturing the same that can improve the dielectric strength between layers.

  According to a first aspect of the present invention, there is provided a printed wiring board having a first substrate on which a first electronic component is mounted and having a first wiring pattern connected to the first electronic component, and the first electronic component of the first substrate. And a second substrate having a second wiring pattern connected to the second electronic component, wherein the second electronic component is disposed so as not to overlap the first electronic component, Between the first substrate and the second substrate, the first and second insulators provided on the first electronic component and the second electronic component, respectively, and between the first and second insulators A conductive sheet interposed between the first insulator, the second insulator, and a through hole penetrating the conductive sheet, and the first and second wiring patterns and the conductive sheet through the through hole. Connection means for electrically connecting Those were.

  A printed wiring board according to a second aspect of the present invention is the printed wiring board according to the first aspect, wherein the conductive sheet is grounded.

  The printed wiring board according to a third aspect of the present invention is the printed wiring board according to the first or second aspect, wherein the conductive sheet includes a copper foil.

  The printed wiring board according to a fourth aspect of the present invention is the printed wiring board according to the first to third aspects, wherein the conductive sheet is provided with insulating sheets containing glass cloth on the upper and lower sides of the copper foil.

  According to a fifth aspect of the present invention, in the printed wiring board according to the second aspect, the first and second wiring patterns have a signal pattern and a ground pattern, respectively, and the ground patterns are electrically connected to the conductive sheet. As described.

  According to a sixth aspect of the present invention, there is provided a printed wiring board manufacturing method in which the first electronic component is mounted on the first substrate having the first wiring pattern connected to the first electronic component. The second electronic component is disposed on the side where the first electronic component is mounted, and the second electronic component is disposed so as not to overlap the first electronic component, and a second substrate having a second wiring pattern connected to the second electronic component is opposed to the second substrate. A first and second insulators are respectively disposed on the first electronic component and the second electronic component between the first substrate and the second substrate between the first substrate and the second substrate. A conductive sheet arranging step of interposing a conductive sheet between the second insulators, an integration step of laminating the first and second substrates by pressing the first and second substrates together, and the first and second 2 insulators and through holes passing through the conductive sheet Forming a hole, after which the first wiring pattern via the through hole, in which the second wiring pattern, and the conductive sheet and a connection step of electrically connecting to each other.

  As described above, according to the first aspect of the present invention, the conductive sheet is arranged along the unevenness of the electronic component mounted on the upper and lower substrates facing the surface on which the electronic component is mounted. When the sheet is curved, the thickness between the upper and lower substrates can be reduced.

  According to the invention of claim 2, since the conductive sheet is grounded, electromagnetic interference between electronic components can be prevented.

  According to the invention which concerns on Claim 3, since the electromagnetic shielding sheet comprised with copper foil or copper foil is used for a conductive sheet, electroplating etc. are easy.

  According to the invention of claim 4, since the conductive sheet is provided with insulating sheets containing glass cloth on the upper and lower sides of the copper foil, electrical short-circuit prevention and insulation between the electronic component and the copper foil or electromagnetic shielding sheet are provided. Improvement can be achieved.

  According to the fifth aspect of the present invention, since only the ground pattern is electrically connected to the conductive sheet, signal patterns can be connected between the upper and lower substrates.

  According to the invention which concerns on Claim 6, the board | substrate arrangement | positioning process which opposes an electronic component, the arrangement | positioning process which embeds an electroconductive sheet, the integration process which laminates | stacks a board | substrate, a drilling (through hole) process, and the connection process by metal plating are provided. In addition to the effect of claim 1, in manufacturing, the copper foil or electromagnetic shield sheet and the upper and lower substrates can be thermocompression bonded together, and the connection between the upper and lower substrate ground patterns and the copper foil or electromagnetic shield sheet is as follows: Since it is possible with a general printed wiring board manufacturing method, the manufacturing process can be simplified.

Embodiment 1 FIG.
Embodiment 1 of the present invention will be described below with reference to FIG. FIG. 1 is a cross-sectional configuration diagram of a printed wiring board according to the first embodiment. In FIG. 1, 1 is a substrate, 1a is a first substrate having a first wiring pattern, and 1b is a second substrate having a second wiring pattern. It is a substrate. 2 is a conductor pad connected to the wiring pattern formed on the first substrate 1a and the second substrate 1b, 3a is a first electronic component mounted on the conductor pad 2 of the first substrate 1a by soldering, etc., 3b is the first 2nd electronic components mounted on the conductor pads 2 of the 2 substrate 1b by soldering or the like, 4 is a ground (ground) pattern provided on the first substrate 1a and the second substrate 1b, 5a is bonded to the first substrate 1a The first insulator using the insulating adhesive sheet 5b is a second insulator using the insulating adhesive sheet adhering the second substrate 1b, and 6 is embedded in the insulating adhesive sheets 5a and 5b. Copper foil (copper plate) or a conductive sheet such as an electromagnetic shield sheet made of copper foil, 7 is a through-hole portion that penetrates the first substrate 1a and the second substrate 1b bonded by the insulating adhesive sheets 5a and 5b. , 8 is su A hole provided to form the Horu portion 7. In the drawings, the same reference numerals indicate the same or corresponding parts.

  Next, the manufacturing method of a printed wiring board is demonstrated using FIG. FIG. 2 is a process cross-sectional view illustrating a method of manufacturing a printed wiring board according to the first embodiment, 9 is a metal plating portion subjected to electroless plating, 14 is a stacking jig, and 14a is an upper stacking jig. , 14b are lower stacking jigs. Reference numeral 15 denotes a protrusion provided on the lower stacking jig 14b. 2, the same reference numerals as those in FIG. 1 denote the same or corresponding parts.

  As shown in FIG. 2A, the first electronic component 3a and the second electronic component 3b of the first substrate 1a and the second substrate 1b on which the first electronic component 3a and the second electronic component 3b are mounted, respectively. A first insulator composed of an insulating adhesive sheet on both sides of a conductive sheet 6 such as an electromagnetic shield sheet composed of a copper foil (copper plate) between the first substrate 1a and the second substrate 1b. 5a and the second insulator 5b are inserted and overlapped.

  Next, as shown in FIG.2 (b), what was piled up in Fig.2 (a) is thermocompression-bonded using lamination jig | tool 14a, 14b. In this case, the thickness is controlled to a desired thickness by the protrusion 15 provided on the lower stacking jig 14b. By performing thermocompression bonding in FIG. 2B, the conductive sheet 6 is made to follow the unevenness of the mounted electronic component 3 as shown in FIG. 2C.

  Next, as shown in FIG. 2 (d), holes 8 are formed in the upper and lower first substrate 1a and second substrate 1b where the ground pattern 4 is formed by drilling or the like.

  Next, as shown in FIG. 2 (e), metal plating such as copper is applied to the inside of the hole 8 and the surface on which the first electronic component 3a and the second electronic component 3b of the first substrate 1a and the second substrate 1b are not mounted. Apply.

  Next, as shown in FIG. 2 (f), the metal plating portion 9 applied to the surface of the first substrate 1a and the second substrate 1b where the electronic component 3 is not mounted is etched, leaving the through-hole portion 7, Electrical connection between the upper and lower ground patterns 4 and the conductive sheet 6 is performed.

  Next, the operation will be described. In FIG. 1, the electronic components 3a and 3b mounted on the first substrate 1a and the second substrate 1b are arranged so as not to overlap when the first substrate 1a and the second substrate 1b are opposed to each other. The conductive sheet 6 embedded in the insulating adhesive sheets 5a and 5b between the first substrate 1a and the second substrate 1b is along the unevenness of the electronic components 3a and 3b mounted on the first substrate 1a and the second substrate 1b. When the conductive sheet 6 is curved, the thickness between the first substrate 1a and the second substrate 1b is reduced. In addition, the conductive sheet 6 is connected to the ground pattern 4 of the first substrate 1a and the second substrate 1b in order to form the through-hole portion 7 in the portion of the first substrate 1a and the second substrate 1b where the ground pattern 4 is formed. The hole 8 is metal plated. In addition, although the electroless plating method using a resist or the like is given as an example for the through-hole portion 7, as a combined use of electroless plating and electrolytic plating or other electrical connection means, a conductive material composed of a polymer material in the hole 8 is used. The paste may be filled and the conductive paste may be solidified by a thermocompression bonding process.

  As described above, the electromagnetic waves radiated from the first substrate 1a, the second substrate 1b, the first electronic component 3a, and the second electronic component 3b can be blocked by the conductive sheet 6. For example, in a printed wiring board such as a high-frequency module, by arranging a control circuit on the second substrate 1b and a transmission / reception circuit on the first substrate 1a, radiation noise generated from the control circuit of the second substrate 1b located on the lower side is A good electromagnetic shielding characteristic is obtained without affecting the transmission / reception circuit blocked by the conductive sheet 6 located in the center and mounted on the upper first substrate 1a.

Embodiment 2. FIG.
A second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a cross-sectional configuration diagram of the printed wiring board according to the second embodiment. In FIG. 3, reference numeral 10 denotes an insulating sheet containing glass cloth (insulating adhesive sheet containing glass cloth). In the figure, the same reference numerals as those in FIG. 1 denote the same or corresponding parts.

  The conductive sheet 6 provided in the insulating adhesive sheet 5 between the first substrate 1a and the second substrate 1b was a copper foil or an electromagnetic shield sheet, but the conductive sheet 6 was insulated with glass cloth on the top and bottom of the copper foil or the like. In this case, an insulating adhesive sheet 10 with glass cloth is interposed between the first electronic component 3a and the second electronic component 3b and the copper foil or electromagnetic shield sheet. There is a short circuit prevention effect. That is, the insulating cloth sheet 10 with glass cloth can obtain heat resistance and high insulating properties as compared with the insulating adhesive sheet 5, and is thermally stable even when brought into direct contact with the electronic component 3, and has high insulating properties. Is also retained, so that electrical shorts can be prevented and insulation can be improved.

  Next, the manufacturing method of a printed wiring board is demonstrated using FIG. FIG. 4 is a process cross-sectional view illustrating a method for manufacturing a printed wiring board according to the second embodiment. In FIG. 4, the same reference numerals as those in FIG. 2 denote the same or corresponding parts. In the first embodiment, the conductive sheet 6 in the insulating adhesive sheet 5 between the first substrate 1a and the second substrate 1b is a copper foil or an electromagnetic shield sheet. In the second embodiment, the conductive sheet is a copper foil. The insulating adhesive sheet 10 with glass cloth is installed on the top and bottom of the above. In this case, since there is an insulating adhesive sheet 10 with glass cloth between the first electronic component 3a and the second electronic component 3b and the copper foil in the thermocompression bonding step shown in FIG. The upper and lower glass cloth-containing insulating adhesive sheets 10 and the insulating adhesive sheet 5 located on both sides thereof have a structure along the unevenness of the electronic component 3.

Embodiment 3 FIG.
Embodiment 3 of the present invention will be described with reference to FIG. FIG. 5 is a cross-sectional configuration diagram of the printed wiring board according to the third embodiment. In FIG. 5, 11 is an opening formed in a predetermined position of the conductive sheet, 12 is a signal pattern of the substrate 1 in the drilled area, Reference numeral 60 denotes a conductive sheet that has been punched. In the figure, the same reference numerals as those in FIG. 1 denote the same or corresponding parts.

  Next, a method for manufacturing a printed wiring board will be described with reference to FIG. In the first embodiment, the connection between the first substrate 1a and the second substrate 1b is such that only the ground pattern 4 provided on the first substrate 1a and the second substrate 1b is connected to the conductive sheet 6 through the through-hole portion 7. As shown in FIG. 5, the signal pattern 12 of the first substrate 1 a and the second substrate 1 b may be connected by the through hole portion 7. In the third embodiment, the first substrate 1a, the second substrate 1b, the insulating adhesive sheet 5 and the conductive sheet 6 are in the initial step corresponding to FIG. A conductive sheet 60 provided with an opening 11 larger than the through-hole portion 7 is overlapped in advance by a punching process or the like on the portion where the signal pattern 12 between the two substrates 1b is connected, and thermocompression bonding equivalent to the first embodiment is performed. It is. Thereafter, the through-hole portion 7 is formed to connect the ground pattern 4 of the first substrate 1a and the second substrate 1b and the conductive sheet 60 and the signal pattern 12 between the first substrate 1a and the second substrate 1b.

  From the above, a connector or the like for connecting the signal pattern 12 between the first substrate 1a and the second substrate 1b becomes unnecessary, and the cost can be reduced.

Embodiment 4 FIG.
Embodiment 4 of the present invention will be described with reference to FIG. 6 is a cross-sectional configuration diagram of a printed wiring board according to the fourth embodiment. In FIG. 6, 13 is a wiring pattern, 20 is a conductor pad, 30 is an electronic component, and 30a is the first electronic component 3a of the first substrate 1a. The third electronic component 30b mounted on the opposite surface of the second substrate 30b is a fourth electronic component mounted on the opposite surface of the second electronic component 3b of the second substrate 1b. In the figure, the same reference numerals as those in FIG. 1 denote the same or corresponding parts.

  Next, a method for manufacturing a printed wiring board will be described with reference to FIG. In the first embodiment, the electronic component 3 is mounted on one side of the first substrate 1a and the second substrate 1b. However, as shown in FIG. 6, the electronic component is mounted on both sides of the first substrate 1a and the second substrate 1b. But it ’s okay. 2E showing the manufacturing process of the first embodiment, metal plating 9 such as copper is applied to the inside of the hole 8 and the surface of the first substrate 1a and the second substrate 1b where the electronic component 3 is not mounted. Thereafter, at the time of etching the metal plating portion 9 applied to the surface of the first substrate 1a and the second substrate 1b on which the electronic component 3 is not mounted in FIG. 2 (f), the wiring pattern 13, the conductor pad 20, and the through The hole portion 7 is formed, and the electronic components 30a and 30b are mounted on the conductor pad 20 by soldering or the like.

  From the above, a large number of electronic components can be mounted on the first substrate 1a and the second substrate 1b, and the density can be increased.

It is a section lineblock diagram of a printed wiring board by Embodiment 1 of this invention. It is process sectional drawing of the printed wiring board by Embodiment 1 of this invention. It is a cross-sectional block diagram of the printed wiring board by Embodiment 2 of this invention. It is process block diagram of the printed wiring board by Embodiment 2 of this invention. It is a cross-sectional block diagram of the printed wiring board by Embodiment 3 of this invention. It is a cross-sectional block diagram of the printed wiring board by Embodiment 4 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 board | substrate, 1a 1st board | substrate, 1b 2nd board | substrate, 2 conductor pad, 3 electronic component, 3a 1st electronic component, 3b 2nd electronic component, 4 grounding pattern, 5 insulating adhesive sheet, 5a top insulating adhesive sheet ( 1st insulator), 5b lower insulating adhesive sheet (second insulator), 6 conductive sheet, 7 through-hole part, 8 hole, 9 metal plating part, 10 insulating sheet with glass cloth, 11 opening, 12 signal pattern , 13 Wiring pattern, 14a Upper lamination jig, 14b Lower lamination jig, 15 Protrusion, 20 Conductor pad, 30 Electronic component, 30a 3rd electronic component, 30b 4th electronic component, 60 Conductive sheet.

Claims (6)

A first substrate having a first wiring pattern mounted thereon and having a first wiring pattern connected to the first electronic component; and a side of the first substrate on which the first electronic component is mounted, wherein the first electronic component Between the first substrate and the second substrate, a second substrate having a second wiring pattern mounted with a second electronic component arranged so as not to overlap the component, and connected to the second electronic component , First and second insulators respectively provided on the first electronic component and the second electronic component, a conductive sheet interposed between the first and second insulators, and the first insulation A through hole penetrating the conductive sheet, the second insulator, and the conductive sheet, and the first and second wiring patterns and the connection means for electrically connecting the conductive sheet through the through hole. Printed wiring board. The printed wiring board according to claim 1, wherein the conductive sheet is grounded. The printed wiring board according to claim 1, wherein the conductive sheet includes a copper foil. The printed wiring board according to any one of claims 1 to 3, wherein the conductive sheet is provided with insulating sheets containing glass cloth on top and bottom of a copper foil. The printed wiring board according to claim 2, wherein the first and second wiring patterns have a signal pattern and a ground pattern, respectively, and the ground patterns are electrically connected to the conductive sheet. A first substrate having a first wiring pattern mounted thereon and having a first wiring pattern connected to the first electronic component, on the side of the first substrate on which the first electronic component is mounted, A substrate disposing step of disposing a second electronic component so as not to overlap the electronic component and disposing a second substrate having a second wiring pattern connected to the second electronic component; and the first substrate and the second substrate Conductive sheet arrangement in which first and second insulators are respectively disposed on the first electronic component and the second electronic component between the substrate and a conductive sheet is interposed between the first and second insulators Forming a through hole penetrating the first and second insulators and the conductive sheet, and an integration step of laminating the first and second substrates by pressing the first and second substrates together And, after that, the through ho Via said Le first wiring pattern, the second wiring pattern, and connecting step and the method of manufacturing the printed wiring board having a connecting the conductive sheet electrically to each other.

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