CN216437566U

CN216437566U - Mainboard and equipment

Info

Publication number: CN216437566U
Application number: CN202122857140.9U
Authority: CN
Inventors: 韩威巍
Original assignee: Shenzhen Skyworth RGB Electronics Co Ltd
Current assignee: Shenzhen Skyworth RGB Electronics Co Ltd
Priority date: 2021-11-19
Filing date: 2021-11-19
Publication date: 2022-05-03
Anticipated expiration: 2031-11-19

Abstract

The utility model discloses a mainboard and equipment, wherein, the mainboard includes base plate, integrated chip, bluetooth antenna and circuit wiring, integrated chip locates on the base plate for receive and handle WIFI and bluetooth signal; the Bluetooth antenna is arranged on the substrate; the circuit wiring is arranged on the substrate and used for connecting the Bluetooth antenna with the integrated chip. The mainboard that this application discloses is through with integrated chip and bluetooth antenna integrated equipment on the base plate, and it connects and replace conventional wire to connect to walk the line through the circuit, has improved the connection reliability when reducing material cost to satisfy the requirement of becoming more meticulous of modern manufacturing, save the time of assembling the mainboard, improved the production efficiency of mainboard.

Description

Mainboard and equipment

Technical Field

The utility model relates to an electronic product technical field especially relates to a mainboard and equipment.

Background

With the attention of people to the interactive functions of various devices in life in recent years, the research direction of electronic products increasingly tends to be capable of rapidly receiving and sending data information; for example, the existing smart television not only has the function of playing live pictures, but also can be matched and butted with a mobile phone, a computer and the like, so that the functions of playback, screen recording, screen projection and the like can be realized. In order to realize the interactive functions, the existing electronic equipment is provided with a WIFI structure, a Bluetooth structure and the like to realize the wireless matching function, and a user can remotely transmit a control signal to a control panel of the electronic equipment for control after successful pairing through a mobile phone or a computer.

However, in the manufacturing process, the WIFI structure and the bluetooth structure in the existing electronic device are all set as individual modules individually, and are fixed on the shell of the electronic device during assembly, and then are connected with the control panel of the electronic device through a wire.

Accordingly, the prior art is yet to be improved and developed.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned prior art not enough, an object of the present invention is to provide a motherboard and a device, which aims to solve the problem of low production efficiency of the motherboard in the existing electronic device.

The technical scheme of the utility model as follows:

a mainboard comprises a substrate, an integrated chip, a Bluetooth antenna and a circuit wire, wherein the integrated chip is arranged on the substrate and used for receiving and processing WIFI and Bluetooth signals; the Bluetooth antenna is arranged on the substrate; the circuit wiring is arranged on the substrate and used for connecting the Bluetooth antenna with the integrated chip.

The circuit trace comprises a matching circuit trace and a microstrip line, one end of the matching circuit trace is connected with the integrated chip, and the other end of the matching circuit trace is connected with the microstrip line; one end of the microstrip line, which is far away from the matching circuit wiring, is connected with the Bluetooth antenna.

The main board, wherein the microstrip line includes a first capacitor and a second capacitor connected in series, and a third capacitor connected in parallel with the first capacitor and the second capacitor.

The motherboard, wherein the integrated chip is arranged at the edge of the substrate; and/or the Bluetooth antenna is arranged at the edge position of the substrate.

The main board is provided with a first WIFI antenna and a second WIFI antenna which are both arranged at one end of the integrated chip close to the edge of the substrate; and the first WIFI antenna, the second WIFI antenna and the Bluetooth antenna are arranged on the substrate at intervals.

The main board, wherein the integrated chip is provided with a first pin; a first bonding pad is arranged on the substrate corresponding to the first pin; the first pin is welded with the first welding disc.

The integrated chip is provided with a power supply pin and a grounding pin, and the position of the substrate corresponding to the power supply pin is provided with a power supply interface bonding pad; and a grounding interface bonding pad is arranged on the substrate corresponding to the grounding pin.

The main board, wherein, the bluetooth antenna is provided with a second pin; a second bonding pad is arranged on the substrate corresponding to the second pin; and the second pin and the second bonding pad are welded through a reflow soldering process.

The mainboard, wherein, bluetooth antenna is stainless steel leather method antenna.

The application also discloses equipment, wherein the equipment comprises the mainboard.

Compared with the prior art, the embodiment of the utility model provides a have following advantage:

in the production process of the mainboard disclosed by the application, the circuit wiring is preset on the substrate, and then the integrated chip and the Bluetooth antenna are fixed at the preset positions at the two ends of the circuit wiring, so that the fixing and the connection of the integrated chip and the Bluetooth antenna are realized quickly, the assembly speed is high, the whole process can be operated mechanically, the labor is saved, the production speed is accelerated, and the high-efficiency and high-yield production is realized; in addition, the wire has been saved in the assembling process, and the circuit is walked the occupation space of line and is little, and material cost is low, but the connection effect can remain stable, can fix on the base plate with integrated chip and bluetooth antenna together, and the junction is difficult for producing and drops, can avoid producing the problem of opening circuit.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the description below are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural view of a main board of the present invention;

fig. 2 is a circuit wiring diagram of the main board of the present invention;

fig. 3 is the structure diagram of the middle bluetooth antenna of the present invention.

10, a substrate; 20. an integrated chip; 21. a first WIFI antenna; 22. a second WIFI antenna; 30. a Bluetooth antenna; 40. routing a circuit; 41. matching circuit routing; 42. a microstrip line.

Detailed Description

In order to make the technical solution of the present invention better understood, the following figures in the embodiments of the present invention are combined to clearly and completely describe the technical solution in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the prior art, the electronic equipment is more and more widely used, and the technology on the electronic equipment is continuously updated, which is just the embodiment of the progress of social science and technology. In order to increase the usability of electronic devices and achieve more flexible operation, in the existing internet of things system, a wireless communication module is apt to be arranged in the electronic devices so as to receive and send data. In traditional workshop, because of the consideration to relevant factors such as product combination degree of freedom, manufacturability, authentication, WIFI module and bluetooth module's modularization degree is high, so in order to ensure that WIFI module and bluetooth module can pass through authentication and enterprise mark requirement smoothly, original design method is for setting up the buckle position of WIFI module and bluetooth module respectively on the casing, then through manual assembly mode, assemble on the backshell earlier "connecting wire", "WIFI module" and "bluetooth module", then assemble on the mainboard "connecting wire".

However, this kind of assembly method needs to install a plurality of parts alone, and the efficiency of manual installation is low, and the manual assembly also can not ensure the equipment yield of "connecting wire", generally speaking, can lead to manufacturing cost to rise, causes the problem that production efficiency is influenced.

Referring to fig. 1 and fig. 2, in an embodiment of the present invention, a motherboard is disclosed, wherein the motherboard includes a substrate 10, an integrated chip 20, a bluetooth antenna 30 and a circuit trace 40, and the integrated chip 20 is disposed on the substrate 10 and is used for receiving and processing WIFI and bluetooth signals; the bluetooth antenna 30 is arranged on the substrate 10; the circuit trace 40 is disposed on the substrate 10 and is used for connecting the bluetooth antenna 30 and the integrated chip 20.

In the production process of the mainboard disclosed by the application, the circuit wiring 40 is preset on the substrate 10, and then the integrated chip 20 and the Bluetooth antenna 30 are fixed at the preset positions at the two ends of the circuit wiring 40, so that the fixing and the connection of the integrated chip 20 and the Bluetooth antenna 30 are realized rapidly, the assembly speed is high, the whole process can be mechanically operated, the labor is saved, the production speed is accelerated, and the production with high efficiency and high yield is realized; in addition, the wire has been saved in the assembling process, and the circuit is walked the occupation space of line 40 and is little, and material cost is low, but the connection effect can remain stable, can fix on base plate 10 with integrated chip 20 and bluetooth antenna 30 together, and the junction is difficult for producing and drops, can avoid producing the problem of opening circuit.

In the present embodiment, the substrate 10 is a Printed Circuit Board (PCB). First, a printed circuit can replace wiring on a PCB board, thereby simplifying the connection between electronic devices and reducing the manufacturing cost; secondly, the wiring shape of the printed circuit arranged on the PCB has reproducibility and consistency, and compared with the traditional connection by using a lead, the wiring and assembling errors are reduced, and the time for maintaining, debugging and checking the equipment is saved; thirdly, after a lead is omitted, all electronic devices are connected by a printed circuit on the board, so that the whole volume of the main board is reduced, the weight is lightened, and the miniaturization and the assembly into electronic equipment are facilitated; fourthly, the PCB is convenient to produce automatically, labor is saved, and meanwhile the accuracy and the manufacturing efficiency of products are improved.

Specifically, in an implementation manner of this embodiment, it is disclosed that the integrated chip 20 may include at least one of a bluetooth module, a WIFI module, or a GPRS module. Can launch and receive the WIFI signal, can also launch and receive the bluetooth signal, can launch and receive the GPRS signal even to convert these signals into the signal of telecommunication and give other parts on the base plate 10, for example integrated chip 20 on the TV mainboard can convert the WIFI signal into the signal of telecommunication and give the control unit of TV mainboard, controls the broadcast state of TV.

In this embodiment, the integrated chip 20 is preferably disposed at an edge of the substrate 10. Because the functions of the electronic device are always developing in a trend of being more diversified, a plurality of parts for realizing different functions are often arranged on a main board of the electronic device, if the integrated chip 20 is arranged in the middle of the substrate 10, and other parts surround the integrated chip 20, the influence on the WIFI signal is easily generated, and the efficiency of wireless signal transmission is reduced, therefore, the edge position of the integrated chip 20 on the substrate 10 is preferentially selected and arranged, so that the integrated chip 20 can directly emit or receive signals outwards, the interference on the WIFI signal is reduced, and a good communication function is maintained. For example, when the main board disclosed in this embodiment is applied to a flat panel television, since the keys, the connector ports, or the speaker ports are often disposed above and on the left and right sides of the flat panel television, the main board can be selectively disposed at the bottom of the flat panel television, so that the bluetooth antenna 30 is close to the bottom edge of the flat panel television, thereby obtaining a better signal receiving and transmitting effect.

As shown in fig. 1, in another embodiment of this embodiment, it is disclosed that a first WIFI antenna 21 and a second WIFI antenna 22 are disposed on the integrated chip 20, and both the first WIFI antenna 21 and the second WIFI antenna 22 are disposed on one end of the integrated chip 20 close to the edge of the substrate 10; and the first WIFI antenna 21, the second WIFI antenna 22 and the bluetooth antenna 30 are disposed on the substrate 10 at intervals. When integrated chip 20 includes the WIFI module, set up first WIFI antenna 21 and second WIFI antenna 22 synchronous working, can increase integrated chip 20's signal strength, more sensitive when making the user pass through wireless signal control electronic equipment, the scope that can control is bigger, facilitates the use. The first WIFI antenna 21 and the second WIFI antenna 22 are arranged at intervals, so that mutual interference between the first WIFI antenna 21 and the second WIFI antenna when the first WIFI antenna and the second WIFI antenna receive and send signals can be avoided, and the accuracy of signal transmission is improved.

Specifically, it sets up first WIFI antenna 21 and second WIFI antenna 22 respectively on integrated chip 20 to be close to the one end at the edge of base plate 10 to disclose in this embodiment, is favorable to first WIFI antenna 21 and the direct outside transmission signal of second WIFI antenna 22, prevents that first WIFI antenna 21 and second WIFI antenna 22 from receiving the influence of other parts on the base plate 10, improves integrated chip 20 signal transmission's the degree of accuracy and sensitivity.

In addition, the first WIFI antenna 21 and the second WIFI antenna 22 may be disposed at two sides of the integrated chip 20 away from each other, so as to increase the distance between the two WIFI antennas, thereby reducing the mutual interference between the two WIFI antennas.

Specifically, in another embodiment of the present embodiment, it is disclosed that a first pin (not shown in the drawings) is disposed on the integrated chip 20; a first bonding pad (not shown in the figures) is arranged on the substrate 10 at a position corresponding to the first pin; the first pin is welded with the first welding disc. The first pin can be fixedly connected to the first pad with high stability by reflow soldering, so that the integrated chip 20 is firmly connected with the substrate 10 into a whole, cannot fall off in the using process and keeps good connection; in addition, reflow soldering can be highly mechanized, and the scheme that integrated chip 20 and bluetooth antenna 30 are integrated on substrate 10 in this application with mechanization can realize the full automatization in the mainboard production process, reduces manual operation, improves the manufacturing accuracy, saves time cost moreover, the cost of using manpower sparingly.

Specifically, in another embodiment of the present embodiment, it is disclosed that a power pin (not shown in the drawings) and a ground pin (not shown in the drawings) are disposed on the integrated chip 20, and a power interface pad (not shown in the drawings) is disposed on the substrate 10 corresponding to the power pin; a ground interface pad (not shown in the drawings) is disposed on the substrate 10 at a position corresponding to the ground pin. In the working process, the integrated chip 20 needs to be communicated with the power supply wiring on the substrate 10, and the power supply pin and the grounding pin are arranged to be butted with the power supply interface pad and the grounding interface pad on the substrate 10 to form a stable connection relationship, so that the power supply circuit can supply power to the integrated chip 20 in real time; meanwhile, the power supply pin and the ground pin increase the contact area between the integrated chip 20 and the substrate 10, and further increase the connection strength between the integrated chip 20 and the substrate 10.

Specifically, in another embodiment of the present embodiment, it is disclosed that the bluetooth antenna 30 can transmit and receive bluetooth signals, and convert the signals into electrical signals to be transmitted to other components on the substrate 10. Bluetooth antenna 30 uses simultaneously with integrated chip 20, increases the mode that the user paired electronic equipment, and these two kinds of connected modes are not conflicted simultaneously, do not disturb the WIFI signal when sending the bluetooth signal, so can use Bluetooth antenna 30 and integrated chip 20 cooperation even, improve electronic equipment transceiver's efficiency.

Specifically, in another embodiment of the present embodiment, it is disclosed that the bluetooth antenna 30 is disposed at an edge position of the substrate 10. Like the principle of setting up integrated chip 20, set up bluetooth antenna 30 in the marginal position of base plate 10 also is in order to reduce the interference of other parts on the mainboard, makes bluetooth signal can be sent out fast, accurately, or receives, is favorable to maintaining bluetooth antenna 30 normal, good communication function.

It should be noted that in this embodiment, the bluetooth antenna 30 and the integrated chip 20 may be disposed side by side on one side of the substrate 10, which is convenient for assembly and for the shape of the circuit trace 40, so as to simplify the wiring on the substrate 10. In the actual production process, when the integrated chip 20 and the bluetooth antenna 30 are disposed side by side on the side of the substrate 10, the sensitivity performance of the motherboard to signal reception can be improved by more than 5 db.

Specifically, in another embodiment of this embodiment, it is disclosed that a second pin (not shown in the drawings) is provided on the bluetooth antenna 30; a second bonding pad (not shown in the drawings) is arranged on the substrate 10 at a position corresponding to the second pin; and the second pin and the second bonding pad are welded through a reflow soldering process. As above, the reflow soldering process has good soldering effect and high connection strength, and can stably fix the bluetooth antenna 30 on the substrate 10, and also can perform mechanical operation, thereby simplifying the production and processing processes.

It should be noted that in the present embodiment, the integrated chip 20 and the bluetooth antenna 30 may be soldered by using a reflow soldering process, preferably by using a Surface Mount Technology (SMT) reflow soldering process. The integrated chip 20 and the bluetooth antenna 30 are substantially sheet-shaped, are mounted according to the SMT basic process, are convenient to operate, do not need to replace processing equipment, and therefore are beneficial to improving the production rate and reducing the processing cost.

As shown in fig. 3, in another embodiment of the present embodiment, it is disclosed that the bluetooth antenna 30 is a stainless steel pico-antenna. A PIFA antenna, which is simply a quarter wavelength antenna and which has a ground plane already included in its structure, reduces the sensitivity to the ground plane in the module and is therefore very suitable for use in a bluetooth antenna 30. In this example, a stainless steel SUS201 type metal piece was selected and machined to a thickness of 0.3 mm, surface plated with solderable nickel 30U "Min for 12 hours under salt spray test, and a single weight of 0.19 kg. The PIFA antenna has low manufacturing cost only by utilizing the metal conductor to match with proper feed-in and antenna short circuit to the position of the ground plane, and the stainless steel material has good usability in the air environment, is not easy to corrode and has long service cycle; the PIFA antenna has small size, light weight and no space occupation, and has the advantages of process processing and cost under the same performance design; meanwhile, the PIFA antenna has small radiation damage to human bodies, more coverage frequency and small influence of surrounding environment, and is favorable for improving the stability of signals transmitted by the mainboard in various use environments.

As shown in fig. 1, in another embodiment of this embodiment, it is disclosed that the circuit trace 40 includes a matching circuit trace 41 and a microstrip line 42, where one end of the matching circuit trace 41 is connected to the integrated chip 20, and the other end is connected to the microstrip line 42; one end of the microstrip line 42, which is far away from the matching circuit trace 41, is connected to the bluetooth antenna 30. The impedance of the printed circuit on the substrate 10 is determined by the shape of the printed circuit, and the connection between the integrated chip 20 and the bluetooth antenna 30 is formed by the matching circuit trace 41 and the microstrip line 42, which is to match the impedance of each module, so that the receiving and transmitting power of the bluetooth signal is effectively improved, and the receiving and transmitting functions and the anti-interference capability of the bluetooth antenna 30 are stronger. In this embodiment, the matching circuit trace 41 may be set as a pi-type matching circuit trace, and the characteristic impedance of the microstrip line 42 may be selected in a range of 90 to 110 ohms according to the matching relationship between the corresponding integrated chip 20 and other components; preferably, the microstrip line 42 with the characteristic impedance of 100 ohms and the pi-type matching circuit trace 41 are combined, so that the enhancement effect of the signal receiving and sending function of the stainless steel pico-cell antenna can be improved.

Specifically, as shown in fig. 2, in another implementation manner of the present embodiment, it is disclosed that the microstrip line 42 includes a first capacitor and a second capacitor connected in series, and a third capacitor connected in parallel with the first capacitor and the second capacitor. Three capacitors (denoted by symbol C in fig. 2) are combined to form a pi-type matching circuit, so as to enhance the bluetooth signal receiving and transmitting performance of the bluetooth antenna 30.

As another embodiment of the present application, there is disclosed an apparatus including the main board as described in any one of the above. By using the mainboard, the produced equipment has good interaction function, and can be matched with a mobile phone and a computer of a user for signal transmission.

As shown in fig. 1, the shape of the main board disclosed in this embodiment may be a "knife-shaped" jointed board, which can reduce the material consumption of the substrate 10 and reduce the cost; and secondly, the occupied space can be reduced so as to avoid other parts in the equipment.

It should be noted that the present invention uses the motherboard of the tv as an example to introduce the specific structure and the working principle of the present invention, but the present invention is not limited to the tv, and can also be applied to the production and use of other similar workpieces.

In summary, the present application discloses a motherboard, wherein the motherboard includes a substrate 10, an integrated chip 20, a bluetooth antenna 30, and a circuit trace 40, and the integrated chip 20 is disposed on the substrate 10 and configured to receive and process WIFI and bluetooth signals; the bluetooth antenna 30 is arranged on the substrate 10; the circuit trace 40 is disposed on the substrate 10 and is used for connecting the bluetooth antenna 30 and the integrated chip 20. In the production process of the mainboard disclosed by the application, the circuit wiring 40 is preset on the substrate 10, and then the integrated chip 20 and the Bluetooth antenna 30 are fixed at the preset positions at the two ends of the circuit wiring 40, so that the fixing and the connection of the integrated chip 20 and the Bluetooth antenna 30 are realized rapidly, the assembly speed is high, the whole process can be mechanically operated, the labor is saved, the production speed is accelerated, and the production with high efficiency and high yield is realized; in addition, the wire has been saved in the assembling process, and the occupation space that circuit walked line 40 is little, and material cost is low, but the connection effect can remain stable, can fix on base plate 10 with integrated chip 20 and bluetooth antenna 30 together, and the junction is difficult for producing and drops, can avoid producing the problem of opening circuit.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. A motherboard, comprising:

a substrate;

the integrated chip is arranged on the substrate and used for receiving and processing WIFI and Bluetooth signals;

the Bluetooth antenna is arranged on the substrate; and

and the circuit wiring is arranged on the substrate and used for connecting the Bluetooth antenna with the integrated chip.

2. The motherboard of claim 1, wherein the circuit trace comprises a matching circuit trace and a microstrip line, the matching circuit trace having one end connected to the integrated chip and the other end connected to the microstrip line; one end of the microstrip line, which is far away from the matching circuit wiring, is connected with the Bluetooth antenna.

3. The motherboard of claim 2, wherein the microstrip line comprises a first capacitor and a second capacitor connected in series, and a third capacitor connected in parallel with the first capacitor and the second capacitor.

4. The motherboard of claim 1, wherein the integrated chip is disposed at an edge of the substrate; and/or the Bluetooth antenna is arranged at the edge position of the substrate.

5. The main board of claim 4, wherein a first WIFI antenna and a second WIFI antenna are arranged on the integrated chip, and are both arranged at one end of the integrated chip close to the edge of the substrate; and the first WIFI antenna, the second WIFI antenna and the Bluetooth antenna are arranged on the substrate at intervals.

6. The motherboard of claim 1, wherein the integrated chip is provided with a first pin; a first bonding pad is arranged on the substrate corresponding to the first pin; the first pin is welded with the first bonding pad.

7. The main board according to claim 6, wherein the integrated chip is provided with a power pin and a ground pin, and the substrate is provided with a power interface pad at a position corresponding to the power pin; and a grounding interface bonding pad is arranged on the substrate corresponding to the grounding pin.

8. The motherboard of claim 1, wherein the bluetooth antenna is provided with a second pin; a second bonding pad is arranged on the substrate corresponding to the second pin; and the second pin and the second bonding pad are welded through a reflow soldering process.

9. The motherboard of any one of claims 1 to 8, wherein the Bluetooth antenna is a stainless steel pico antenna.

10. A device comprising a motherboard as claimed in any one of claims 1 to 9.