CN112467356B - Antenna assembly and terminal - Google Patents
Antenna assembly and terminal Download PDFInfo
- Publication number
- CN112467356B CN112467356B CN201910847945.XA CN201910847945A CN112467356B CN 112467356 B CN112467356 B CN 112467356B CN 201910847945 A CN201910847945 A CN 201910847945A CN 112467356 B CN112467356 B CN 112467356B
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- antenna radiator
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- 239000000463 material Substances 0.000 claims abstract description 72
- 229920000106 Liquid crystal polymer Polymers 0.000 claims abstract description 65
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims abstract description 64
- 238000000034 method Methods 0.000 claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 claims abstract description 22
- 239000004642 Polyimide Substances 0.000 claims abstract description 18
- 229920001721 polyimide Polymers 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims description 60
- 239000002184 metal Substances 0.000 claims description 59
- 238000004891 communication Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 22
- 239000000758 substrate Substances 0.000 description 19
- 230000005540 biological transmission Effects 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Details Of Aerials (AREA)
Abstract
The disclosure discloses an antenna assembly and a terminal, and belongs to the technical field of terminal communication. The antenna assembly includes: impedance line, matching circuit and antenna radiator; the impedance line is electrically connected with the matching circuit, the matching circuit is electrically connected with the antenna radiator, the base material of the matching circuit is made of liquid crystal polymer LCP, and the base material of the antenna radiator is made of polyimide PI. According to the antenna assembly, the base material of the impedance line and the matching circuit is made of the LCP material, the base material of the antenna radiator is made of the PI material with low dielectric constant and relatively simple process, and on the premise that the performance of the antenna made of the LCP material is guaranteed, the manufacturing process of the antenna based on the LCP base material is simplified, and the production efficiency of the antenna using the LCP as the base material is improved.
Description
Technical Field
The disclosure relates to the technical field of terminal communication, and in particular relates to an antenna assembly and a terminal.
Background
As the terminal screen enters the full screen era, the arrangement space reserved for the antenna is smaller and smaller, and the arrival of the 5G era brings higher requirements to the communication technology.
In order to satisfy the requirement of arranging antennas with high antenna efficiency in a limited space, in the related art, a liquid crystal polymer (Liquid Crystal Polymer, LCP) material is introduced to replace a conventional Polyimide (PI) material as a circuit board substrate, and the LCP material has good electrical characteristics and good flexibility, so that the LCP material is widely used in the field of antennas.
In the above related art, the production efficiency of antennas using LCP as a substrate is low due to the high process difficulty of LCP film processing.
Disclosure of Invention
The disclosure provides an antenna assembly and a terminal. The technical scheme is as follows:
according to a first aspect of embodiments of the present disclosure, there is provided an antenna assembly comprising: impedance line, matching circuit and antenna radiator;
the impedance line is electrically connected with the matching circuit;
the matching circuit is electrically connected with the antenna radiator, and the base material of the matching circuit is made of liquid crystal polymer LCP;
the base material of the antenna radiator is polyimide PI material.
Optionally, the feeding point of the antenna radiator is electrically connected with the feeding point of the matching circuit, and the grounding point of the antenna radiator is electrically connected with the grounding point of the matching circuit.
Optionally, the feeding point of the antenna radiator and the feeding point of the matching circuit are welded through a metal pad;
and the grounding point of the antenna radiator and the grounding point of the matching circuit are welded through a metal bonding pad.
Optionally, the feeding point of the antenna radiator is connected with the feeding point of the matching circuit through a metal elastic sheet;
the grounding point of the antenna radiator is connected with the grounding point of the matching circuit through a metal elastic sheet.
Optionally, the feeding point of the antenna radiator and the feeding point of the matching circuit are welded through a metal pad; the grounding point of the antenna radiator is connected with the grounding point of the matching circuit through a metal elastic sheet;
or,
the feed point of the antenna radiator is connected with the feed point of the matching circuit through a metal elastic sheet; and the grounding point of the antenna radiator and the grounding point of the matching circuit are welded through a metal bonding pad.
Optionally, the impedance line, the matching circuit and the antenna radiator are arranged in a three-layer folded manner, and the matching circuit is between the impedance line and the antenna radiator.
Optionally, the impedance line includes a signal line, a dielectric layer, and a ground layer from inside to outside.
Optionally, the material of the dielectric layer is LCP material.
Optionally, the manufacturing process of the antenna radiator is a Flexible printed circuit board (Flexible PrintedCircuit, FPC) process or a laser direct structuring (Laser Direct Structuring, LDS) process.
According to a second aspect of embodiments of the present disclosure, there is provided a terminal comprising: an antenna assembly;
the antenna assembly is the antenna assembly of the first aspect or any of the alternatives of the first aspect.
The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects:
by using the LCP material to manufacture the base material of the impedance line and the matching circuit and using the PI material with low dielectric constant and relatively simple process to manufacture the base material of the antenna radiator, the manufacturing process of the antenna based on the LCP base material can be simplified and the production efficiency of the antenna using the LCP as the base material can be improved on the premise of ensuring the performance of the antenna based on the LCP material.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a schematic diagram of an antenna assembly according to an exemplary embodiment;
fig. 2 is a circuit diagram of electrical connection of an antenna assembly according to the embodiment shown in fig. 1;
fig. 3 is a schematic structural view of an antenna assembly according to another exemplary embodiment;
fig. 4 is a schematic diagram of an antenna radiator and matching circuit soldering of an antenna assembly according to an embodiment of the present disclosure;
fig. 5 is a schematic diagram of an antenna radiator and matching circuit soldering of another antenna assembly according to an embodiment of the present disclosure;
fig. 6 is a schematic diagram of connection between an antenna radiator and a matching circuit shrapnel of an antenna assembly according to an embodiment of the present disclosure;
fig. 7 is a schematic diagram of connection between an antenna radiator and a matching circuit shrapnel of another antenna assembly according to an embodiment of the disclosure;
fig. 8 is a schematic diagram of an antenna radiator and matching circuit connection of an antenna assembly according to an embodiment of the present disclosure;
fig. 9 is a schematic diagram of an antenna radiator and matching circuit connection of another antenna assembly according to an embodiment of the present disclosure;
fig. 10 is a schematic diagram of another arrangement of an antenna assembly according to an embodiment of the present disclosure;
fig. 11 is a schematic diagram of an impedance line structure of an antenna assembly according to an embodiment of the present disclosure;
fig. 12 is a schematic structural view of a terminal according to an exemplary embodiment.
Detailed Description
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present disclosure as detailed in the accompanying claims.
It should be understood that references herein to "a number" means one or more, and "a plurality" means two or more. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship.
The present disclosure provides an antenna assembly, which is applied to a terminal and can effectively solve the problem of low antenna production efficiency using LCP as a base material, and the antenna assembly according to embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. For ease of understanding, several terms referred to in this disclosure are first explained below.
1) Aerial (antanna)
An antenna is a device that radiates electromagnetic waves to or receives electromagnetic waves from a space in a radio transmission and reception system. The antenna is connected with the radio frequency front end, and also serves as the last stage of the transmitting end and the first stage of the receiving end; and is also a device for converting energy by electromagnetic wave signals and electric signals.
2) Impedance line
The impedance line is an antenna transmission line, and is used for connecting the radio frequency module and the antenna module (which may include a matching circuit and an antenna radiator), and simultaneously for implementing impedance matching between the radio frequency module and the antenna module so as to obtain maximum power transmission.
The impedance matching refers to a specific matching relation between load impedance and internal impedance of an information source in a signal transmission process, when the impedance of an input end is matched, the transmission line obtains maximum power, when the impedance of an output end is matched, only the transmission object is transmitted with voltage waves and current waves on the transmission line, and all carried energy is absorbed by the load, so that the transmission object obtains maximum transmission power.
3) Matching circuit
The matching circuit, namely the antenna tuner, is an impedance matching network for connecting the radio frequency device and the antenna radiator, is a first-stage circuit of the terminal receiving circuit and is also a last-stage circuit of the transmitting circuit, and is used for matching the impedance and the like of the antenna radiator, and the antenna radiator has the maximum radiation power at any frequency so as to ensure the quality of the transmitted and received signals of the antenna.
4) Antenna radiator
The antenna radiator is composed of an antenna pattern and a connecting end, wherein the antenna pattern is used for sending or receiving electromagnetic wave signals, and the connecting end is used for electrically connecting the antenna pattern and the matching circuit.
5) Liquid crystalline polymers
The liquid crystal polymer LCP is a novel material suitable for microwave and millimeter wave equipment, has the advantages of good electrical property, good ductility and good sealing property, and the electrical property is represented by low dielectric constant, low dielectric loss, low hygroscopicity and the like of the LCP.
6) LCP soft board
The LCP flexible board is a flexible circuit board which replaces a base material in a traditional FPC flexible board with an LCP material. The conventional Flexible Printed Circuit (FPC) board is a multi-layer structure comprising copper foil, an insulating substrate, a cover layer and the like, wherein the copper foil is used as a material of a conductor circuit, a PI film is used as a circuit insulating substrate, a PI film and an epoxy resin adhesive are used as a cover layer for protecting and isolating the circuit, the PI flexible printed circuit is processed into the PI flexible printed circuit through a certain process, and the copper foil and the insulating substrate are combined together through the adhesive. The LCP soft board replaces the PI substrate of the traditional soft board with the LCP material, and the LCP material can finally achieve the performance similar to that of the copper foil by adjusting the thermal expansion coefficient, so that the LCP substrate and the copper foil can be bonded together by hot pressing, and the LCP soft board is thinner than the traditional FPC soft board.
7) Antenna efficiency
Antenna efficiency refers to the ratio of the power radiated by the antenna (i.e., the power that effectively converts the electromagnetic wave portion) to the active power input to the antenna. Antenna efficiency is an important indicator for measuring antenna performance.
Fig. 1 is a schematic diagram illustrating the structure of an antenna assembly according to an exemplary embodiment. Referring to fig. 1, the antenna assembly may be applied to a terminal, and the antenna assembly includes: an impedance line 110, a matching circuit 120, and an antenna radiator 130;
the impedance line 110 is electrically connected to the matching circuit 120;
the matching circuit 120 is electrically connected with the antenna radiator 130, and the material of the substrate of the matching circuit 120 is a liquid crystal polymer LCP material;
the material of the base material of the antenna radiator 130 is a material having a low dielectric constant other than the material of the liquid crystal polymer LCP.
Optionally, the feeding point of the antenna radiator 130 is electrically connected to the feeding point of the matching circuit 120, and the grounding point of the antenna radiator 130 is electrically connected to the grounding point of the matching circuit.
Optionally, the feeding point of the antenna radiator 130 is soldered with the feeding point of the matching circuit through a metal pad;
the grounding point of the antenna radiator 130 and the grounding point of the matching circuit are soldered by metal pads.
Optionally, the feeding point of the antenna radiator 130 is connected with the feeding point of the matching circuit through a metal elastic sheet;
the grounding point of the antenna radiator 130 is connected with the grounding point of the matching circuit through a metal spring sheet.
Optionally, the feeding point of the antenna radiator 130 and the feeding point of the matching circuit 120 are soldered by a metal pad; the grounding point of the antenna radiator 130 is connected with the grounding point of the matching circuit 120 through a metal spring sheet;
or,
the feeding point of the antenna radiator 130 is connected with the feeding point of the matching circuit 120 through a metal spring sheet; the grounding point of the antenna radiator 130 and the grounding point of the matching circuit 120 are soldered by metal pads.
Optionally, the impedance line 110, the matching circuit 120, and the antenna radiator 130 are arranged in a three-layer folded manner, with the matching circuit 120 between the impedance line 110 and the antenna radiator 130.
Optionally, the impedance line 110 includes, from inside to outside, a signal line, a dielectric layer, and a ground layer.
Optionally, the dielectric layer is made of LCP.
Optionally, the manufacturing process of the antenna radiator 130 is a flexible printed circuit board FPC process or a laser direct structuring technology LDS process.
The matching circuit 120 is an LCP flexible board printed with a matching circuit pattern.
The antenna pattern portion of the antenna radiator 130 may be bent, and is generally injection molded using a metal material having good electrical properties and good ductility, such as copper, so as to ensure that the electrical length of the antenna, which is the ratio of the physical length of the antenna to the wavelength of the electromagnetic wave signal, can be ensured to radiate the radio signal into the air effectively in a limited terminal space, and in order to achieve the purpose of radiating the radio signal into the air effectively, the physical length of the antenna pattern of the antenna radiator 130 needs to be at least one fourth of the physical length of the radio signal, and meanwhile, due to the flexibility of the antenna pattern, the occupation of the antenna to the internal space of the terminal can be reduced to a certain extent.
Optionally, the connection end of the antenna radiator 130 includes a feeding point and a grounding point, so as to be electrically connected to the matching circuit 120.
Optionally, the material of the substrate of the antenna radiator 130 is a low dielectric constant material, which may be PI material, or a material with low dielectric constant, such as glass fiber, ceramic or other fillers, and the substrate is used to improve electrical and mechanical stability.
Optionally, referring to fig. 2, fig. 2 is a circuit diagram illustrating an electrical connection of an antenna assembly according to the present embodiment, as shown in fig. 2, the antenna radiator 130 is electrically connected to the matching circuit 120, and the matching circuit 120 is electrically connected to the impedance line 110.
It should be noted that the structural distribution and circuit connection of the impedance line 110, the matching circuit 120, and the antenna radiator 130 shown in fig. 1 and 2 are only one illustrative type, and the present disclosure is not limited to the structural distribution and circuit connection of the impedance line 110, the matching circuit 120, and the antenna radiator 130.
In summary, in the antenna assembly provided by the embodiment of the disclosure, the base material of the impedance line and the matching circuit is made of the LCP material, and the base material of the antenna radiator is made of the PI material with a low dielectric constant and a relatively simple process, so that the manufacturing process of the antenna based on the LCP base material can be simplified and the production efficiency of the antenna using the LCP as the base material can be improved on the premise of ensuring the performance of the antenna based on the LCP material.
Fig. 3 is a schematic diagram illustrating the structure of an antenna assembly according to an exemplary embodiment. As shown in fig. 3, the antenna assembly may be applied to a terminal, and the antenna assembly includes: an impedance line 110, a matching circuit 120, and an antenna radiator 130;
the impedance line 110 is electrically connected to the matching circuit 120;
the matching circuit 120 is electrically connected with the antenna radiator 130, and the material of the substrate of the matching circuit 120 is a liquid crystal polymer LCP material;
the material of the base material of the antenna radiator 130 is PI material;
the feeding point 310 of the antenna radiator 130 is electrically connected to the feeding point 310 of the matching circuit 120, and the grounding point 320 of the antenna radiator 130 is electrically connected to the grounding point 320 of the matching circuit 120.
Optionally, the feeding point of the antenna radiator 130 and the feeding point of the matching circuit 120 are soldered by a metal pad;
the grounding point of the antenna radiator 130 and the grounding point of the matching circuit 120 are soldered by metal pads.
Referring to fig. 4 and 5, fig. 4 is a schematic diagram illustrating welding of an antenna radiator and a matching circuit of an antenna assembly according to an embodiment of the disclosure, and fig. 5 is a schematic diagram illustrating welding of an antenna radiator and a matching circuit of another antenna assembly according to an embodiment of the disclosure, wherein, as shown in fig. 4 and 5, a metal pad 410 is used to electrically connect the matching circuit 120 and the antenna radiator 130 together.
As shown in fig. 5, the metal pad used for the feeding point of the matching circuit 120 corresponds to the metal pad used for the feeding point of the antenna radiator 130, and the metal pad used for the grounding point of the matching circuit 120 corresponds to the metal pad used for the grounding point of the antenna radiator 130.
The connection mode of the antenna radiator and the matching circuit by using two sets of welding points as an example in fig. 4 and fig. 5 is described, and optionally, the antenna radiator and the matching circuit may be connected through more welding points according to actual needs, and the number and positions of the welding points between the antenna radiator and the matching circuit are not limited in the embodiment of the present disclosure.
Optionally, the feeding point of the antenna radiator 130 is connected with the feeding point of the matching circuit through a metal elastic sheet;
the grounding point of the antenna radiator 130 is connected with the grounding point of the matching circuit through a metal spring sheet.
Referring to fig. 6 and 7, fig. 6 is a schematic diagram of connection between an antenna radiator and a matching circuit shrapnel of an antenna assembly according to an embodiment of the disclosure, and fig. 7 is a schematic diagram of connection between an antenna radiator and a matching circuit shrapnel of another antenna assembly according to an embodiment of the disclosure, as shown in fig. 6 and 7, a metal shrapnel 610 and a metal shrapnel 620 are used for electrically connecting the matching circuit 120 and the antenna radiator 130 together.
One end of the metal elastic sheet 610 is connected with a feeding point of the matching circuit, and the other end is connected with a feeding point of the antenna radiator; one end of the metal spring 620 is connected to the ground point of the matching circuit, and the other end is connected to the ground point of the antenna radiator, so that the matching circuit is electrically connected to the antenna radiator.
The metal spring plate can be made of copper, aluminum, stainless steel and other metals, and can be selectively plated with gold, silver, nickel and other metals on the surface of the metal to prevent corrosion. Because the metal shrapnel has various kinds and different shapes, the matching circuit and the antenna radiator can be connected according to the characteristics of different metal shrapnels, and fig. 6 and 7 only provide two schematic connection modes of the matching circuit and the antenna radiator by the metal shrapnel, and the embodiment of the disclosure does not limit the types, the number and the positions of the metal shrapnels and the arrangement of the matching circuit and the antenna radiator.
Optionally, the feeding point of the antenna radiator 130 and the feeding point of the matching circuit 120 are soldered by a metal pad; the grounding point of the antenna radiator 130 is connected with the grounding point of the matching circuit 120 through a metal spring sheet;
or,
the feeding point of the antenna radiator 130 is connected with the feeding point of the matching circuit 120 through a metal spring sheet; the grounding point of the antenna radiator 130 and the grounding point of the matching circuit 120 are soldered by metal pads.
Referring to fig. 8, fig. 8 is a schematic diagram of connection between an antenna radiator and a matching circuit of an antenna assembly according to an embodiment of the disclosure, as shown in fig. 8, a metal pad 810 is used to connect a feeding point of the antenna radiator 130 and a feeding point of the matching circuit 120, and a metal spring piece 820 is used to connect a grounding point of the antenna radiator 130 and a grounding point of the matching circuit 120, so that the matching circuit is electrically connected to the antenna radiator.
Or,
referring to fig. 9, fig. 9 is a schematic diagram of connection between an antenna radiator and a matching circuit of another antenna assembly according to an embodiment of the present disclosure, as shown in fig. 9, a metal pad 910 is used to connect a ground point of the antenna radiator 130 and a ground point of the matching circuit 120, and a metal spring sheet 920 is used to connect a feeding point of the antenna radiator 130 and a feeding point of the matching circuit 120, so that the matching circuit is electrically connected to the antenna radiator.
It should be noted that fig. 8 and fig. 9 only provide two schematic connection modes for connecting the matching circuit and the antenna radiator by using the metal spring plate and the metal pad, and the embodiments of the present disclosure do not limit the number and positions of the connection points of the metal pad and the metal spring plate and the arrangement of the matching circuit and the antenna radiator.
Optionally, the impedance line 110, the matching circuit 120, and the antenna radiator 130 are arranged in a three-layer folded manner, with the matching circuit 120 between the impedance line 110 and the antenna radiator 130.
Based on the flexibility of the electrical connection and the bendability of the LCP material, as shown in fig. 1, the impedance line 110, the matching circuit 120, and the antenna radiator 130 are three-layer folded and vertically arranged.
In another case, referring to fig. 10, fig. 10 is a schematic diagram illustrating another arrangement mode of an antenna assembly according to an embodiment of the present disclosure, as shown in fig. 10, the impedance line 110, the matching circuit 120 and the antenna radiator 130 may be arranged in any form on any plane under the premise of ensuring that the impedance line 110, the matching circuit 120 and the antenna radiator are electrically connected according to the circuit shown in fig. 2. For example, in the case shown in fig. 10, the antenna radiator 130, the matching circuit 120, and the impedance line 110 are arranged in a three-dimensional manner.
Optionally, the impedance line 110 includes, from inside to outside, a signal line, a dielectric layer, and a ground layer.
Referring to fig. 11, fig. 11 is a schematic diagram of an impedance line structure of an antenna assembly according to an embodiment of the disclosure. As shown in fig. 11, the impedance line 110 includes, from inside to outside, a signal line 1110, a dielectric layer 1120 and a ground layer 1130, where the ground layer 1130 is grounded to shield external electromagnetic waves and prevent the external electromagnetic waves from interfering with the transmission signal, and the conductor is generally made of copper. The signal line is mainly used for transmitting signals, and the material of the signal line is copper.
Optionally, the dielectric layer is made of LCP.
Among them, LCP is a liquid crystal polymer having excellent electrical characteristics, for example, almost constant dielectric constant in all radio frequency ranges up to 110GHz, and good consistency; the tangent loss is very small and is only 0.002, and even at 110GHz, the tangent loss is only increased to 0.0045, so that the millimeter wave antenna is suitable for millimeter wave application; the thermal expansion characteristic is very small, and the material can be used as an ideal high-frequency packaging material. Based on the advantages, the dielectric layer of the impedance line made of the LCP material can reduce the loss of signals in the transmission process, and further improve the transmission efficiency of the antenna.
Optionally, the manufacturing process of the antenna radiator 130 is a flexible printed circuit board FPC process or a laser direct structuring technology LDS process.
The FPC process is a process for manufacturing a printed circuit board with patterns by using a flexible substrate, wherein the substrate of the traditional FPC circuit board is mainly made of PI material or polyester film, the FPC circuit board is composed of an insulating substrate and a conductive layer, and an adhesive can be arranged between the insulating substrate and the conductive layer.
The LDS technology is a technology for forming a metal antenna pattern directly on a molded plastic bracket by utilizing a laser technology, or directly laser the antenna pattern on a terminal shell.
Based on the above process, the antenna pattern of the antenna radiator may be an antenna pattern printed on an FPC flexible board mounted inside the terminal, or may be an antenna pattern chemically plated on an antenna bracket, or may be an antenna pattern directly laser-irradiated on the terminal housing.
Because the two processes are mature, the manufacturing process is simple, and compared with the LCP process, the LCP process is easy to realize and has lower cost.
In summary, in the antenna assembly provided by the embodiment of the disclosure, the base material of the impedance line and the matching circuit is made of the LCP material, and the base material of the antenna radiator is made of the PI material with a low dielectric constant and a relatively simple process, so that the manufacturing process of the antenna based on the LCP base material can be simplified and the production efficiency of the antenna using the LCP as the base material can be improved on the premise of ensuring the performance of the antenna based on the LCP material.
Referring to fig. 12, fig. 12 is a schematic structural diagram of a terminal according to an exemplary embodiment, and as shown in fig. 12, the terminal 120 includes an antenna assembly 1210, where the antenna assembly 1210 may be an antenna assembly according to any of the foregoing embodiments shown in fig. 1 to 11.
The terminal 120 may be a terminal smart phone, a terminal tablet computer, a notebook computer, a terminal handheld device with a screen, a vehicle-mounted device, etc. An antenna assembly 1210 is mounted within the terminal.
Optionally, the antenna assembly has a clearance area in the terminal, where the clearance area refers to a clean area where the antenna is placed, i.e. the antenna assembly is kept at a distance or isolated from metal elements in the terminal, a printed circuit board (Printed Circuit Board, PCB), a battery, an oscillator, a shielding case, a camera, etc., and because the conductive metal reflects, absorbs and counteracts electromagnetic waves, it is necessary to meet the clearance requirement as much as possible when the antenna assembly is installed in the terminal, so as to improve the antenna efficiency.
It should be noted that the antenna assembly mounting area shown in fig. 12 is only one exemplary, and the present disclosure is not limited to the antenna mounting area.
In summary, in the terminal provided by the embodiments of the present disclosure, by designing the antenna system in the terminal, the antenna system uses the LCP material to manufacture the impedance line and the substrate of the matching circuit, and uses the PI material with a low dielectric constant and a relatively simple process to manufacture the substrate of the antenna radiator, so that the manufacturing process of the antenna based on the LCP substrate can be simplified and the production efficiency of the antenna using the LCP as the substrate can be improved on the premise of ensuring the performance of the antenna based on the LCP material.
Other aspects of the present application will be readily apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (6)
1. An antenna assembly, the antenna assembly comprising: impedance line, matching circuit and antenna radiator;
the impedance line is electrically connected with the matching circuit;
the matching circuit is electrically connected with the antenna radiator, and the base material of the matching circuit is made of liquid crystal polymer LCP; the matching circuit is an LCP soft board printed with a matching circuit pattern;
the base material of the antenna radiator is polyimide PI material;
the impedance line comprises a signal line, a dielectric layer and a grounding layer from inside to outside, and the dielectric layer is made of LCP (liquid crystal polymer);
the manufacturing process of the antenna radiator is a flexible printed circuit board FPC process or a Laser Direct Structuring (LDS) process;
the impedance line, the matching circuit, and the antenna radiator are arranged in a three-layer folded manner with the matching circuit between the impedance line and the antenna radiator.
2. The antenna assembly of claim 1 wherein,
the feed point of the antenna radiator is electrically connected with the feed point of the matching circuit, and the grounding point of the antenna radiator is electrically connected with the grounding point of the matching circuit.
3. The antenna assembly of claim 2 wherein,
the feeding point of the antenna radiator is welded with the feeding point of the matching circuit through a metal bonding pad;
and the grounding point of the antenna radiator and the grounding point of the matching circuit are welded through a metal bonding pad.
4. The antenna assembly of claim 2 wherein,
the feed point of the antenna radiator is connected with the feed point of the matching circuit through a metal elastic sheet;
the grounding point of the antenna radiator is connected with the grounding point of the matching circuit through a metal elastic sheet.
5. The antenna assembly of claim 2 wherein,
the feeding point of the antenna radiator is welded with the feeding point of the matching circuit through a metal bonding pad; the grounding point of the antenna radiator is connected with the grounding point of the matching circuit through a metal elastic sheet;
or,
the feed point of the antenna radiator is connected with the feed point of the matching circuit through a metal elastic sheet; and the grounding point of the antenna radiator and the grounding point of the matching circuit are welded through a metal bonding pad.
6. A terminal, the terminal comprising: an antenna assembly;
the antenna assembly is an antenna assembly as claimed in any one of the preceding claims 1 to 5.
Priority Applications (1)
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| CN201910847945.XA CN112467356B (en) | 2019-09-09 | 2019-09-09 | Antenna assembly and terminal |
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| CN201910847945.XA CN112467356B (en) | 2019-09-09 | 2019-09-09 | Antenna assembly and terminal |
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| CN112467356A CN112467356A (en) | 2021-03-09 |
| CN112467356B true CN112467356B (en) | 2024-01-02 |
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