CN112672543B - Method for separating electroplated copper layer - Google Patents
Method for separating electroplated copper layer Download PDFInfo
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- CN112672543B CN112672543B CN202011449382.8A CN202011449382A CN112672543B CN 112672543 B CN112672543 B CN 112672543B CN 202011449382 A CN202011449382 A CN 202011449382A CN 112672543 B CN112672543 B CN 112672543B
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Abstract
The invention discloses a method for separating an electroplated copper layer, which comprises the following steps: drilling holes in the production plate and forming a conductive layer on the hole wall; pasting a film on a production plate, sequentially carrying out window opening at the positions corresponding to the holes through exposure and development, forming a plurality of dot patterns distributed in an array on the plate, forming a hole ring pattern at the periphery of the window opening, and forming a isolation belt pattern at the position 5-50mm away from the plate edge, so that the conducting layer film at the pattern is covered; electroplating the production plate, thickening the thickness of the copper plating layer of the hole copper, and forming a netlike copper foil by additionally plating the conductive layer except the dot pattern, the hole ring pattern and the isolation belt pattern; after film stripping, the reticular copper foil on the inner side and the outer side of the isolation belt pattern is stripped through gaps between the conductive layer and the reticular copper foil. The method of the invention sets the isolation belt pattern at the position 5-50mm away from the plate edge, thereby conveniently stripping the netlike copper foil through the isolation belt, reducing the edging process, improving the production efficiency and reducing the workload of personnel.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for separating electroplated copper layers.
Background
Modern PCBs require small size, high wiring density, and finer circuit designs; while the wiring density is contradictory to the surface copper thickness, the higher the wiring density, the thinner the surface copper thickness needs to be, and vice versa, the surface copper thickness is typically less than half the minimum line pitch, e.g., 50 μm, and then less than 25 μm, depending on empirical values and etch factor constraints.
In order to ensure the reliability of the through hole, the thickness of copper in the through hole of the circuit board is generally required to be 25 microns, the through hole has better uniformity only when the whole board is electroplated during electroplating, the surface can be electroplated by more than 25 microns when the through hole is electroplated by 25 microns, and the thickness of copper on the surface can be more than 43 microns when the copper on the bottom is 18 microns, so that the spacing between the surface lines can only be limited to 86 microns.
In the printed circuit board industry, in order to ensure that the copper thickness in the hole is higher than 25 mu m and the line width and line distance of the manufactured printed circuit board are smaller than 50 mu m, copper reduction treatment is needed for the printed circuit board, the aim is to reduce copper on the surface after electroplating to be below 25 mu m, and the main technical scheme is to adopt a grinding plate to reduce copper on the surface after electroplating at present; however, in order to ensure the reliability of the circuit board, a dry film plating hole process and a strippable netlike copper foil technology are also proposed in the industry to achieve the purpose of copper reduction, and the dry film plating hole process only plates through holes during electroplating, thereby achieving the purpose of reducing surface copper. The specific implementation process is that a layer of dry film resist is stuck on a substrate before electroplating, patterns are transferred in an exposure mode, the dry film at the position of a plated through hole is removed in a development mode, electroplating is carried out, and the dry film resist on the substrate is removed after electroplating; the technology of the strippable netlike copper foil is based on a dry film plating hole technology, a dry film resist is made into a square, a spacer ring is manufactured at the hole edge, a layer of netlike copper foil is formed after electroplating, and the plated netlike copper foil can be stripped by using a tool, so that the purpose of reducing surface copper is achieved.
The method adopting the dry film hole plating process and the strippable netlike copper foil technology has the following defects:
1. the dry film plating hole technology has uneven current distribution during electroplating, which is easy to cause overlarge local current, rough copper electroplating crystallization in holes and easy to cause the problems of hole blocking and small holes at the orifice of plated holes;
2. the plating of the copper plating layer can plate the edges of the production plate together and cover the bottom copper on the inner side, so that the bottom copper on the inner side of the copper plating layer on the edges of the plate is not exposed, the strippable netlike copper foil technology needs to edging the edges of the production plate after plating, and the bottom copper is exposed and exposes gaps between the bottom copper and the copper plating layer, so that the electroplated copper can be stripped, and the whole process is complex and inconvenient; in addition, manual edging of the edges is often required, resulting in high personnel effort and inefficiency.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method for separating an electroplated copper layer, and a pattern of a separation strip is arranged at a position 5-50mm away from the edge of a plate, so that a reticular copper foil is conveniently stripped through the separation strip, the process of edging is reduced, the production efficiency is improved, and the workload of personnel is reduced.
In order to solve the technical problems, the invention provides a method for separating an electroplated copper layer, which comprises the following steps:
s1, drilling holes in a production plate and forming a conductive layer on the plate surface and the hole wall;
s2, pasting a film on a production board, sequentially carrying out exposure and development, then carrying out windowing at the positions corresponding to the holes, forming a plurality of dot patterns distributed in an array on the board, forming a hole ring pattern at the periphery of the windowing, and forming a ring-shaped isolation belt pattern at the position 5-50mm away from the edge of the board, so that the conductive layer at the positions of the dot patterns, the hole ring pattern and the isolation belt pattern are covered by the film;
s3, carrying out full-plate electroplating on the production plate, thickening the thickness of a copper plating layer of the hole copper, and additionally plating on the conductive layers except the dot pattern, the hole ring pattern and the isolation belt pattern to form a netlike copper foil;
s4, after film stripping, exposing the conductive layer at the bottom of the isolation belt pattern, and inserting a tool into a gap between the conductive layer and the netlike copper foil in the isolation belt so as to strip the netlike copper foil on the inner side and the outer side of the isolation belt pattern.
Further, in step S1, after drilling holes in the production board, a conductive layer is deposited on the board surface and the hole wall by a shadow process or a black hole process, and the micro etching process is not performed in the shadow process or the black hole process.
Further, the step S4 further includes the following steps:
s5, removing the conductive layer deposited on the plate surface by a shadow process or a black hole process through microetching.
Further, the following steps are included between the steps S1 and S2:
s11, carrying out ultrasonic cleaning and drying on the production plate.
Further, in the step S2, a dry film with the thickness of 15-65 mu m is stuck on the production plate; in the step S3, the thickness of the netlike copper foil is less than or equal to the thickness of the dry film.
Further, the following steps are included between the steps S2 and S3:
s21, drying the production plate, wherein the temperature during drying is 130 ℃, and the time is 20min.
Further, in step S2, the dot pattern is a disk pattern having a diameter of 50-300 μm.
Further, in step S2, the dot pattern is a regular hexagonal pattern or a regular octagonal pattern with a maximum length and width of 50-200 μm.
Further, in step S2, the distance between adjacent dot patterns is 50-300 μm.
Further, in step S2, the width of the isolation belt pattern is 50-500 μm, and the isolation belt pattern is 25mm from the plate edge of the production plate.
Further, in step S2, the radius of the opening is 50-200 μm larger than the radius of the hole, and an annular pattern with an annular width of 100 μm is formed by arranging an anti-plating film on the periphery of the opening, so as to separate the hole copper plated on the whole plate in the later stage from the mesh copper foil.
Furthermore, the production board is a multilayer board formed by laminating the core board and the outer copper foil into a whole by the prepreg, and the core board is provided with an inner layer circuit before lamination.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the isolation belt patterns are arranged at the positions 5-50mm away from the edges of the plate, the net-shaped copper foil is divided into the inner part and the outer part through the isolation belt after being electroplated to form the net-shaped copper foil, and the step difference is formed at the isolation belt after film withdrawal, so that gaps between the conductive layer and the net-shaped copper foil can be seen at the isolation belt, and the inner part and the outer part of the net-shaped copper foil are peeled off at the gaps at the isolation belt by using a tool; in addition, after drilling, a conductive layer is formed in the plate surface and the hole through a shadow process or a black hole process, so that graphite or carbon black is utilized to separate the bottom copper of the plate surface from the copper plating layer (namely, the reticular copper foil), the binding force of the copper plating layer can be reduced, the reticular copper foil can be conveniently stripped in the later stage, and secondly, a black conductive layer personnel can better distinguish gaps between the copper plating layer (namely, the reticular copper foil) and the copper plating layer, and the reticular copper foil can be conveniently stripped; the conductive layer formed by graphite or carbon black on the board surface is etched and removed through microetching after the reticular copper foil is stripped, so that the influence on etching operation in the process of manufacturing a circuit in the later period is avoided, the influence on the bonding force between a plating layer and the copper at the bottom of the board surface in the process of electroplating or surface treatment of the pattern in the later period is avoided, and the production quality of the circuit board is improved; compared with the square shape in the prior art, the invention designs the dot-shaped patterns into the disc shape, the regular hexagon or the regular octagon shape, so that the dot-shaped patterns are not easy to tear when the reticular copper foil is peeled off, the problem that the reticular copper foil is not peeled off cleanly is avoided, and the yield of the circuit board is improved.
Drawings
Fig. 1 is a schematic view showing the formation of a pattern of isolation strips and a pattern of dots on a board in the embodiment.
Detailed Description
In order to more fully understand the technical content of the present invention, the technical solution of the present invention will be further described and illustrated with reference to specific embodiments.
Examples
The manufacturing method of the circuit board, which is shown in the embodiment, can conveniently separate the electroplated copper layer, and sequentially comprises the following processing procedures:
(1) Cutting: and (3) opening a core plate according to the size of 520mm multiplied by 620mm of the jointed board, wherein the thickness of the core plate is 0.5mm, and the thicknesses of copper layers on the two surfaces of the core plate are 0.5oz.
(2) Inner layer circuit fabrication (negative film process): transferring the inner layer pattern, coating a photosensitive film by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing the inner layer line exposure by using a full-automatic exposure machine by using a 5-6 grid exposure rule (a 21 grid exposure rule); etching the inner layer, namely etching the core plate after exposure and development into an inner layer circuit, wherein the line width of the inner layer is measured to be 3mil; and (3) inner-layer AOI, and then checking defects such as open and short circuit, line notch, line pinhole and the like of the inner-layer line, carrying out defective scrapping treatment, and outputting a defect-free product to the next flow.
(3) Pressing: and (3) sequentially laminating the core plate, the prepreg and the outer copper foil according to requirements at the browning speed according to the thickness of the copper foil of the base copper, wherein the thickness of the outer copper foil is 0.5oz, and then laminating the laminated plates according to the Tg of the plate by selecting proper laminating conditions to form the production plate.
(4) Drilling: according to the existing drilling technology, drilling processing is carried out on the production plate according to design requirements.
(5) Shadow or black hole: depositing a conductive layer on the plate surface and the hole wall through a shadow process or a black hole process, testing the plate surface and the hole wall in a backlight mode for 10 stages, wherein the thickness of the conductive layer in the hole is 0.5 mu m, and the micro etching process is not performed in the shadow process or the black hole process; wherein, the conductive layer formed by the black shadow process is graphite, and the conductive layer formed by the black hole process is carbon black.
(6) Cleaning: and carrying out ultrasonic cleaning and drying on the production plate to remove oxidation, greasy dirt and the like on the plate surface, and improving the binding force between the later stage and the dry film.
(7) Plating hole patterns: as shown in fig. 1, a dry film 15-65 μm thick is stuck on a production board, after exposure and development, window opening is carried out at the positions corresponding to the holes in sequence, a plurality of dot patterns 1 distributed in an array are formed on the board, hole ring patterns (not shown in the figure) are formed at the periphery of the window opening, and annular isolation belt patterns 2 are formed at the positions 5-50mm (preferably 25 mm) away from the board edge, so that the conductive layers at the dot patterns, the hole ring patterns and the isolation belt patterns are covered by the dry film; the exposure is carried out once by adopting a laser imaging mode during exposure, and compared with the traditional mode of using film exposure, the process of drawing an exposure negative film by an optical plotter is reduced.
The dot patterns are disc patterns with the diameter of 50-300 mu m, the distance between every two adjacent dot patterns is 50-300 mu m, and by arranging the disc patterns with proper size and interval, the combination area of a later copper plating layer (netlike copper foil) and a board surface can be maximally reduced while the uniform distribution of electroplating current is ensured, the combination force between the later copper plating layer (netlike copper foil) and the board surface is reduced, and the later stripping is facilitated; the width of the isolation belt pattern is 50-500 mu m, and the width can be well used for stripping the netlike copper foil, and the problem that electroplating current is unevenly distributed due to the overlarge width or the later stripping tool is inconvenient due to the overlarge width can be avoided.
The radius of the opening window is 50-200 mu m larger than that of the hole, thus forming a certain orifice ring copper after electroplating, the bonding force between the orifice ring copper and the production plate is improved like a riveting structure, and an orifice ring graph with the ring width of 100 mu m is formed by arranging an anti-plating film on the periphery of the opening window, thereby separating the orifice ring copper and the plate surface copper layer (namely the netlike copper foil) of the later full-plate electroplating, and avoiding the phenomenon that burrs are left at the orifice to influence the quality of the orifice ring copper when the netlike copper foil is stripped.
(8) Baking: and (3) drying the production plate, wherein the temperature during drying is 130 ℃ and the time is 20min, so that the drying plate is used for removing water on the plate and improving the binding force between the dry film and the plate surface.
(9) Full plate electroplating: and (3) carrying out full-plate electroplating for 120min at the current density of 18ASF, thickening the thickness of the hole copper to more than 25 mu m, and carrying out additional plating on the conductive layers except the dot patterns, the hole ring patterns and the isolation belt patterns to form a netlike copper foil, wherein the thickness of the netlike copper foil is less than or equal to the thickness of the dry film.
(10) Copper stripping: after film stripping, the conducting layer at the bottom of the isolation belt pattern is exposed, and then a tool (such as a fin) is inserted into a gap between the conducting layer and the reticular copper foil in the isolation belt so as to strip the reticular copper foil at the inner side and the outer side of the isolation belt pattern.
(11) Microetching: and removing the conductive layer deposited on the plate surface by a shadow process or a black hole process through microetching, so that the thickness of the copper layer on the plate surface is the thickness of the copper foil on the outer layer during lamination.
(12) Outer layer circuit (negative film process) was made: transferring the outer layer pattern, coating a photosensitive film by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing outer layer line exposure by using a full-automatic exposure machine by using a 5-6 grid exposure rule (a 21 grid exposure rule); etching the outer layer, namely etching the exposed and developed production plate into an outer layer circuit, wherein the linewidth of the outer layer is measured to be 3mil; an outer layer AOI, and then inspecting the defects of open and short circuit, circuit notch, circuit pinhole, etc. of the outer layer circuit, and the defective scrapping treatment is carried out, and the non-defective product is discharged to the next process
(13) Solder resist, silk-screen character: after spraying solder resist ink on the surface of the production plate, sequentially performing pre-curing, exposure, development and heat curing treatment to cure the solder resist ink into a solder resist layer; specifically, the TOP surface solder resist ink is sprayed and printed, and the UL mark is added on the TOP surface character, so that a layer of protective layer which can prevent bridging between lines during welding, provide permanent electrical environment and resist chemical corrosion is coated on the lines and the base material which do not need to be welded, and simultaneously, the effect of beautifying the appearance is achieved.
(14) Surface treatment (nickel-gold plating): the chemical principle is communicated with the copper surface of the welding pad of the solder mask windowing position, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(15) Electric test: the electrical conductivity of the finished board is tested, and the board is tested by the following steps: and (5) flying probe testing.
(16) And (5) forming: according to the prior art, the appearance is milled according to the design requirement, and the appearance tolerance is +/-0.05mm, so that the circuit board is manufactured.
(17) FQC: and checking the appearance of the circuit board according to the customer acceptance standard and the I department inspection standard, and if the circuit board is defective, repairing the circuit board in time, thereby ensuring that the circuit board provides excellent quality control for customers.
(18) FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not.
(19) Packaging: and (5) sealing and packaging the circuit board according to the packaging mode and the packaging quantity required by the customer, placing the drier and the humidity card, and then delivering.
In other embodiments, the dot pattern may be a regular hexagonal pattern or a regular octagonal pattern having a maximum length and width of 50-200 μm.
The foregoing has described in detail the technical solutions provided by the embodiments of the present invention, and specific examples have been applied to illustrate the principles and implementations of the embodiments of the present invention, where the above description of the embodiments is only suitable for helping to understand the principles of the embodiments of the present invention; meanwhile, as for those skilled in the art, according to the embodiments of the present invention, there are variations in the specific embodiments and the application scope, and the present description should not be construed as limiting the present invention.
Claims (9)
1. A method of separating an electroplated copper layer comprising the steps of:
s1, after drilling holes on a production plate, depositing a conductive layer on the plate surface and the hole wall through a shadow process or a black hole process, wherein a microetching process is not performed in the shadow process or the black hole process;
s2, pasting a film on a production board, sequentially carrying out exposure and development, then carrying out windowing at the positions corresponding to the holes, forming a plurality of dot patterns distributed in an array on the board, forming a hole ring pattern at the periphery of the windowing, and forming a ring-shaped isolation belt pattern at the position 5-50mm away from the edge of the board, so that the conductive layer at the positions of the dot patterns, the hole ring pattern and the isolation belt pattern are covered by the film;
s3, carrying out full-plate electroplating on the production plate, thickening the thickness of a copper plating layer of the hole copper, and additionally plating on the conductive layers except the dot pattern, the hole ring pattern and the isolation belt pattern to form a netlike copper foil;
s4, after film stripping, exposing the conductive layer at the bottom of the isolation belt pattern, and stripping the reticular copper foil at the inner side and the outer side of the isolation belt pattern through gaps between the conductive layer and the reticular copper foil.
2. The method of separable electrolytic copper plating according to claim 1, further comprising the step of, after step S4:
s5, removing the conductive layer deposited on the plate surface by a shadow process or a black hole process through microetching.
3. The method of separable electrolytic copper plating according to claim 1, further comprising the steps of, between steps S1 and S2:
s11, carrying out ultrasonic cleaning and drying on the production plate.
4. The method of separable electrolytic copper plating according to claim 1, wherein in step S2, a dry film 15 to 65 μm thick is attached to the production board; in the step S3, the thickness of the netlike copper foil is less than or equal to the thickness of the dry film.
5. The method of separable electrolytic copper plating according to claim 1, further comprising the steps of, between steps S2 and S3:
s21, drying the production plate, wherein the temperature during drying is 130 ℃, and the time is 20min.
6. The method of separable electrolytic copper plating layer according to claim 1, wherein in the step S2, the dot pattern is a disk pattern having a diameter of 50 to 300 μm, and a distance between adjacent dot patterns is 50 to 300 μm.
7. The method of claim 1, wherein in the step S2, the dot pattern is a regular hexagonal pattern or a regular octagonal pattern having a maximum length-width dimension of 50-200 μm, and a distance between adjacent dot patterns is 50-300 μm.
8. The method of separable electrolytic copper plating according to claim 1, wherein in the step S2, the width of the barrier rib pattern is 50 to 500 μm, and the barrier rib pattern is 25mm from the plate edge of the production plate.
9. The method of claim 1, wherein in the step S2, the radius of the opening is 50-200 μm larger than the radius of the hole, and an annular pattern of 100 μm in annular width is formed on the periphery of the opening to separate the hole copper plated in the subsequent full-plate from the net copper foil.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002069686A (en) * | 2000-09-01 | 2002-03-08 | Airex Inc | Method and apparatus for manufacturing electrodeposited extremely-thin metal foil, and method for manufacturing printed circuit board using the same |
| JP2010183013A (en) * | 2009-02-09 | 2010-08-19 | Alps Electric Co Ltd | Method of manufacturing circuit board |
| CN106852026A (en) * | 2016-11-29 | 2017-06-13 | 深圳崇达多层线路板有限公司 | Suitable for the black holes production technology of HDI products |
| CN108718485A (en) * | 2018-06-07 | 2018-10-30 | 珠海元盛电子科技股份有限公司 | A kind of semi-additive process technology of the two-sided FPC of manufacture filament thickness copper |
| CN108934130A (en) * | 2017-05-24 | 2018-12-04 | 庆鼎精密电子（淮安）有限公司 | The manufacturing method of rigid-flexible circuit board |
| CN110582167A (en) * | 2019-10-23 | 2019-12-17 | 四会富仕电子科技股份有限公司 | Method for manufacturing strippable mesh copper foil |
-
2020
- 2020-12-09 CN CN202011449382.8A patent/CN112672543B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002069686A (en) * | 2000-09-01 | 2002-03-08 | Airex Inc | Method and apparatus for manufacturing electrodeposited extremely-thin metal foil, and method for manufacturing printed circuit board using the same |
| JP2010183013A (en) * | 2009-02-09 | 2010-08-19 | Alps Electric Co Ltd | Method of manufacturing circuit board |
| CN106852026A (en) * | 2016-11-29 | 2017-06-13 | 深圳崇达多层线路板有限公司 | Suitable for the black holes production technology of HDI products |
| CN108934130A (en) * | 2017-05-24 | 2018-12-04 | 庆鼎精密电子（淮安）有限公司 | The manufacturing method of rigid-flexible circuit board |
| CN108718485A (en) * | 2018-06-07 | 2018-10-30 | 珠海元盛电子科技股份有限公司 | A kind of semi-additive process technology of the two-sided FPC of manufacture filament thickness copper |
| CN110582167A (en) * | 2019-10-23 | 2019-12-17 | 四会富仕电子科技股份有限公司 | Method for manufacturing strippable mesh copper foil |
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