CN116867188A - Manufacturing method of sectional golden finger circuit board - Google Patents
Manufacturing method of sectional golden finger circuit board Download PDFInfo
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- CN116867188A CN116867188A CN202310719468.5A CN202310719468A CN116867188A CN 116867188 A CN116867188 A CN 116867188A CN 202310719468 A CN202310719468 A CN 202310719468A CN 116867188 A CN116867188 A CN 116867188A
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- gold
- golden finger
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- circuit board
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 80
- 229910052737 gold Inorganic materials 0.000 claims abstract description 69
- 239000010931 gold Substances 0.000 claims abstract description 69
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 66
- 238000007747 plating Methods 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims abstract description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 22
- 238000011161 development Methods 0.000 claims abstract description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000005530 etching Methods 0.000 claims abstract description 17
- 238000009713 electroplating Methods 0.000 claims abstract description 13
- UCHOFYCGAZVYGZ-UHFFFAOYSA-N gold lead Chemical compound [Au].[Pb] UCHOFYCGAZVYGZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 238000007650 screen-printing Methods 0.000 claims abstract description 11
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims abstract description 9
- 238000004381 surface treatment Methods 0.000 claims abstract description 5
- 239000011889 copper foil Substances 0.000 claims description 7
- ZBTDWLVGWJNPQM-UHFFFAOYSA-N [Ni].[Cu].[Au] Chemical compound [Ni].[Cu].[Au] ZBTDWLVGWJNPQM-UHFFFAOYSA-N 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 48
- 230000000052 comparative effect Effects 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000001723 curing Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000003814 drug Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000012795 verification Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a manufacturing method of a sectional golden finger circuit board, which comprises the following steps: when an outer layer circuit is manufactured on the production board, the golden finger body and the electrogilding lead are manufactured together; silk-screen printing anti-electrogilding ink on a production plate, and forming H-shaped anti-plating layers on two sides of the golden finger body and the positions of disconnection through exposure and development; electroplating copper, nickel and gold on the production plate to plate a nickel layer and a gold layer on the gold finger body except for the disconnection position; carrying out electro-thick gold treatment on the production plate, and removing the anti-electro-gold ink; pasting a film on a production board, windowing at positions corresponding to the disconnection position and the electrical gold lead, and removing a copper layer at the positions of the disconnection position and the electrical gold lead by etching to form a disconnection gold finger; and then sequentially carrying out the working procedures of manufacturing a solder mask layer, surface treatment and forming on the production board to obtain the sectional golden finger circuit board. The method effectively avoids the quality problem caused by silk-screen anti-electrogilding ink by optimizing the production process flow.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing method of a sectional golden finger circuit board.
Background
The golden finger is used for the contact part of related equipment such as a computer display card, a memory bank, a USB interface and the like and other substrates, has good wear resistance and low contact resistance, and can meet the requirement of repeated plugging. As shown in FIG. 1, the golden finger can be divided into a conventional golden finger (a), a long and short golden finger (b) and a segmented golden finger (c), and as shown in the segmented golden finger (c), a part of the circuit board needs to be provided with an unmetallized line in the middle part of the length direction of a part of the golden finger to cut off the golden finger, namely a disconnection position, so as to form a disconnection golden finger (namely a segmented golden finger).
In the prior art, the manufacturing flow of the disconnected golden finger is as follows: normal pre-process, full-plate electroplating, outer layer pattern transfer, pattern electroplating, etching, coating a solder mask, covering a position where a break joint is required on a gold finger body by using anti-gold ink, depositing gold, electroplating a gold finger, removing a film, covering a circuit board by using a dry film and exposing the break joint, etching the gold wire and the break joint, removing the film, screen printing characters and normal post-process. In the outer layer pattern transfer in the prior art, the disconnection position is not arranged on the gold finger body, but the position where the disconnection position is required to be arranged is covered by anti-electric gold ink before the gold finger is electroplated, so that gold is prevented from being plated on the disconnection position when the gold finger is electroplated; after the golden finger is electroplated, the copper foil at the disconnected position is removed by etching. In the manufacturing process of the broken gold fingers, the gold-plating process is long in gold plating time, the protection effect of the anti-electric gold ink is insufficient, firstly, gold permeation at the broken position often occurs, the edge of the broken position is not regular, even two sections of gold fingers at two sides of the broken position are communicated, especially when a gold-plating and electric-thickness gold plating process is adopted, the temperature of a gold-plating water tank is 90+/-5 ℃, the anti-gold ink is attacked by liquid medicine at high temperature, the ink is extremely easy to float off, the gold-plating phenomenon of a segmented lead occurs, secondly, the anti-electric gold ink only forms a covering film in a shape of a straight line at the broken position, the binding force between the anti-electric gold ink and a copper surface is small, the oil dropping phenomenon often occurs in the later electric-gold plating process, the broken position is plated with gold, and the problem of unclean ink is caused by improper manufacturing parameter treatment of the anti-electric gold ink.
Disclosure of Invention
The invention aims at the problems of the prior circuit board, and provides a manufacturing method of a sectional golden finger circuit board, which effectively avoids the quality problem caused by silk-screen anti-electrogilding ink by optimizing the production process flow.
In order to solve the technical problems, the invention provides a manufacturing method of a sectional golden finger circuit board, which comprises the following steps:
s1, manufacturing a golden finger body and an electrical gold lead together when manufacturing an outer layer circuit on a production board;
s2, silk-screen printing anti-electrogilding ink on a production plate, and forming H-shaped anti-plating layers on two sides of the golden finger body and the positions of disconnection through exposure and development;
s3, carrying out copper-nickel-gold electroplating treatment on the production plate so as to sequentially plate a nickel layer and a gold layer on the gold finger body except for the disconnection position;
s4, carrying out electric thickness gold treatment on the production plate to thicken the gold layer on the gold finger body;
s5, removing the anti-electrogilding ink;
s6, sticking a film on the production board, windowing at positions corresponding to the disconnection position and the electrical gold lead, and removing a copper layer at the positions of the disconnection position and the electrical gold lead through etching to form a disconnection gold finger;
s7, sequentially performing the working procedures of manufacturing a solder mask layer, surface treatment and forming on the production board to obtain the sectional golden finger circuit board.
In step S2, the anti-electric gold ink is first screen printed on the whole production board, then preliminarily cured by pre-baking, and then the H-shaped anti-plating layers are formed on the two sides and the disconnection position of the gold finger body by exposure and development.
Further, in step S2, the parameters of the pre-baking are: parameters for development at 74 ℃ x 20 min: 4.0m/min.
Further, in step S2, a step of baking the production plate again is further included between the exposure and the development.
Further, in step S2, parameters of the re-baking are: 74 ℃ 10min.
Further, in step S2, the exposure parameters are: 250-280mJ/cm 2 。
Further, in step S2, the exposure parameters are: 260mJ/cm 2 。
Furthermore, the production board is a core board or a multilayer board formed by laminating an inner core board and an outer copper foil into a whole by prepregs, and the multilayer board is sequentially subjected to the working procedures of drilling, copper deposition and full board electroplating.
In a second aspect, the present invention further provides a segmented golden finger circuit board manufactured by the method for manufacturing a segmented golden finger circuit board according to any one of the first aspect.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, through optimizing the production process flow, after silk-screen anti-electrogilding ink, H-shaped anti-plating layers are formed on the two sides of the golden finger body and the disconnection position after exposure and development, compared with the existing straight-line-shaped structure, the H-shaped structure can increase the coverage area of the anti-electrogilding ink so as to increase the adhesion degree, effectively improve the binding force between the anti-plating layers and the plate surface, and avoid the quality problem of gold plating on the disconnection position caused by falling of the anti-plating ink in the gold plating process; and the method adopts the modes of copper-nickel-gold electroplating and thick gold electroplating to carry out gold plating treatment, the highest temperature of an electroplating liquid medicine tank is 55+/-5 ℃, the attack of liquid medicine on gold-resisting ink in the production process is much smaller, the probability of ink floating off is smaller, and the defect of gold on a broken joint can be improved to a limited extent, so that the problem of gold infiltration at the broken joint caused by insufficient protection effect of the gold-resisting ink is solved.
Secondly, aiming at the H-shaped anti-plating layer, the invention is matched with proper exposure parameters and development parameters, firstly, the good curing effect of the anti-plating layer can be ensured, the problem of oil drop is avoided, secondly, the ink at the position of the broken joint on the golden finger body can be ensured to be removed cleanly during development, the difficulty of removing the ink is reduced, and the quality of post gold plating is improved.
Drawings
FIG. 1 is a schematic diagram of a conventional golden finger;
fig. 2 is a schematic view of the example after an H-shaped plating resist is formed on the board.
Detailed Description
For a more complete understanding of the present invention, reference should be made to the following descriptions of the embodiments and accompanying drawings.
Example 1
The manufacturing method of the sectional golden finger circuit board comprises the following processing procedures in sequence:
(1) And (3) cutting: and (3) opening a core plate according to the size of 320mm multiplied by 420mm of the jointed board, wherein the thickness of the core plate is 0.5mm, and the thickness of the copper surface of the outer layer of the core plate is 17 mu m.
(2) Inner layer circuit (negative film process) was fabricated: coating a photosensitive film on a core plate by using a vertical coating machine according to the pattern positioning holes, controlling the film thickness of the photosensitive film to be 8 mu m, completing the exposure of an inner layer circuit by using a 5-6 grid exposure rule (a 21 grid exposure rule) by using a full-automatic exposure machine, and forming an inner layer circuit pattern after development; etching the inner layer, namely etching the core plate after exposure and development to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mi; and the inner layer AO I is used for checking defects such as open and short circuit, line notch, line pinhole and the like of the inner layer line, carrying out defective scrapping treatment, and outputting a defect-free product to the next flow.
(3) Pressing: and (3) carrying out palm-hardening on the outer copper foil, the prepreg, the core board, the prepreg and the outer copper foil according to the thickness of the base copper, sequentially overlapping the outer copper foil, the prepreg, the core board and the outer copper foil according to requirements, and then carrying out lamination by selecting proper lamination conditions according to the Tg of the plate material to form the production plate.
(4) Drilling an outer layer: drilling the production plate by using drilling data.
(5) And depositing copper, namely metallizing holes on the production plate, and carrying out backlight test for 10 grades, wherein the thickness of the deposited copper in the holes is 0.5 mu m.
(6) Full plate plating: according to the prior art and according to the design requirement, the whole plate electroplating is carried out on the production plate, and the plate surface and the copper layer in the hole are thickened.
(7) Outer layer circuit fabrication (positive process): transferring the outer layer pattern, adopting a full-automatic exposure machine and a positive circuit film, completing outer layer circuit exposure by using a 5-7-grid exposure rule (a 21-grid exposure rule), and developing to form an outer layer circuit pattern and an electrogilding lead pattern on a production board; plating the outer layer pattern, and then plating copper and tin on the production board respectively, wherein the copper plating is that the whole board is plated with 60mi n at the current density of 1.8ASD, the tin plating is that the whole board is plated with 10mi n at the current density of 1.2ASD, and the tin thickness is 3-5 mu m; then sequentially removing the film, etching and removing tin, and etching an electric gold lead of an outer layer circuit on the production board, wherein the outer layer circuit comprises a gold finger body 1; and the outer layer AO I is used for checking defects such as open and short circuit, line notch, line pinhole and the like of the outer layer line, carrying out defective scrapping treatment, and outputting a defect-free product to the next flow.
(8) Silk screen ink: silk-screen printing anti-electrogilding ink on a production plate, and forming H-shaped anti-plating layers 2 (shown in figure 1) on two sides of the golden finger body and at the positions of disconnection through exposure and development; the method comprises the steps of screen printing anti-electrogalvanizing ink on a production plate, pre-baking to enable the anti-electrogalvanizing ink to be primarily solidified, and exposing and developing to form H-shaped anti-plating layers on two sides of a golden finger body and a broken joint position, namely removing the ink except the broken joint position on the golden finger body; the problem of low production efficiency caused by carefully coating the anti-electrogilding ink at the disconnection position in the prior art is also solved by adopting the whole plate silk screen printing anti-electrogilding ink mode.
Wherein, the parameters of the pre-baking are as follows: the temperature of 74 ℃ is 20min (namely the plate is baked at the temperature of 74 ℃ for 20 min), so that the anti-electrogalvanized ink can be prevented from being baked, the development and the removal and the later removal of the anti-electrogalvanized ink are convenient, and the problems that the ink is easy to drop and the ink cannot be removed in the prior art are solved; the parameters for development were: 4.0m/min, and the dimensional accuracy of the obtained H-shaped anti-plating layer is high.
In the actual production process, the problems that the finger sections are not regular, gaps appear on the finger sections and uneven etching is caused by gold seepage in the gold plating process are found after the gold finger sections of the photoelectric product are etched are common, in the process of the solder resist operation, photosensitive oil black reacts to a plate surface through absorbing ultraviolet light, scattering can occur when exposure energy is overlarge, so that the condition that the width of the finger sections (namely the width of a disconnection position) is overlarge is caused, meanwhile, the difficulty of ink withdrawal is increased, and when the exposure energy is too low, side etching is overlarge, and oil is generatedThe bonding force of the ink is poor, and the phenomena of notch and gold infiltration are easy to occur, so that the exposure energy and the product exposure quality are directly related. The exposure parameters employed in this embodiment are: 250-280mJ/cm 2 Preferably, it is: 260mJ/cm 2 And the plate is baked again after exposure, and the parameters of the baking again are as follows: 74 ℃ 10min to remove water in the ink, further improve the solidification stability and development effect of the anti-plating layer, and no exposure failure phenomenon is seen after development, and the single side etching of the ink is 7 mu m when developing, and the single side etching of the copper nickel gold and the electro-thick gold reaches 9 mu m.
(9) Electroplating copper, nickel and gold: the production board is electroplated with nickel and gold, namely copper is electroplated firstly, then nickel and gold are electroplated, so that a nickel layer and a gold layer are plated on the gold finger body except for the disconnection position in sequence.
(10) And (3) electric thick gold: and (3) carrying out electric thick gold treatment on the production plate, plating a thick gold layer with the thickness of 40 mu m on the gold finger body, and then removing the anti-electric gold ink.
(11) Etching: and pasting a dry film on the production board, windowing at the positions corresponding to the disconnection position and the electric gold lead, and removing the copper layer at the positions of the disconnection position and the electric gold lead through alkaline etching to form a sectional golden finger (namely the disconnection golden finger).
In the above, the characteristic that gold does not react with alkaline solution is utilized, and the whole golden finger position (including the broken joint position) can be windowed, so that the method is not limited to the windowing at the broken joint position, and the broken joint position is not easy to window because of smaller size, and the production efficiency can be improved by windowing the whole golden finger position (including the broken joint position).
(12) Solder resist, silk-screen character: after silk-screen printing the solder resist ink on the surface of the production plate, sequentially performing pre-curing, exposure, development and heat curing treatment to enable the solder resist ink to be cured into a solder resist layer; specifically, the TOP surface is coated with a protective layer for preventing bridging between lines during welding, providing a permanent electrical environment and resisting chemical corrosion, and beautifying appearance by adding 'UL mark' to TOP surface characters, so that the lines and the base material which do not need to be welded are coated with the protective layer.
(13) Surface treatment (nickel-gold plating): according to the prior art, surface treatment is carried out on the production plate according to the design requirement, the copper surface of the window opening position is welded, and a nickel layer and a gold layer with certain required thickness are uniformly deposited on the copper layer.
(14) And (5) forming: according to the prior art, the sectional golden finger circuit board is manufactured by routing the appearance according to the design requirement, wherein the appearance tolerance is +/-0.05 mm.
(15) And (3) testing electrical performance: detecting the electrical performance of the sectional golden finger circuit board, and detecting that the qualified circuit board enters the next processing link;
(16) And (3) final inspection: and (5) measuring the appearance, the thickness of the hole copper, the thickness of the dielectric layer, the thickness of green oil, the thickness of the inner copper and the like of the finished product in a pulling way respectively, and delivering the qualified product.
Comparative example 1
The method for manufacturing the segmented golden finger circuit board is basically the same as that described in the embodiment 1, except that the exposure parameters after silk-screen printing of the anti-electrogilding ink are different, and the exposure parameters are designed to be 100mJ/cm in the comparative example 2 Through actual production verification, 100mJ/cm is adopted 2 The energy exposure, the oil drop after development, the preliminary analysis is the poor exposure caused by the insufficient exposure energy.
Comparative example 2
The method for manufacturing the segmented golden finger circuit board is basically the same as that described in the embodiment 1, except that the exposure parameters after silk-screen printing of the anti-electrogilding ink are different, and the exposure parameters are designed to be 200mJ/cm in the comparative example 2 Through actual production verification, 200mJ/cm is adopted 2 The energy exposure does not show poor exposure, but after development, the side etching amount of the ink is measured to be 12-15 mu m, the phenomenon of gold plating is found at the position of the disconnection, the phenomenon of falling off of the anti-electric gold ink covered on the golden finger is also caused, the gold plating condition is fully detected after copper nickel gold plating, the yield is 76.8%, and the preliminary analysis is also poor exposure caused by insufficient exposure energy.
Comparative example 3
Manufacturing of sectional golden finger circuit board shown in comparative exampleThe method was substantially the same as the production method described in example 1, except that the exposure parameters after silk-screening of the anti-electrogilding ink were different, and in this comparative example, the exposure parameters were designed to be 300mJ/cm 2 Through actual production verification, 300mJ/cm is adopted 2 The method is characterized in that energy exposure is carried out, the condition of poor exposure is not seen, but after a copper layer at a break joint is etched off in the later period, the width of the break joint is measured to be larger than the designed width, namely, the width is larger, and preliminary analysis is that exposure scattering is caused by the overlarge exposure energy, so that the curing width of ink at the break joint is enlarged.
The foregoing has described in detail the technical solutions provided by the embodiments of the present invention, and specific examples have been applied to illustrate the principles and implementations of the embodiments of the present invention, where the above description of the embodiments is only suitable for helping to understand the principles of the embodiments of the present invention; meanwhile, as for those skilled in the art, according to the embodiments of the present invention, there are variations in the specific embodiments and the application scope, and the present description should not be construed as limiting the present invention.
Claims (9)
1. The manufacturing method of the sectional golden finger circuit board is characterized by comprising the following steps of:
s1, manufacturing a golden finger body and an electrical gold lead together when manufacturing an outer layer circuit on a production board;
s2, silk-screen printing anti-electrogilding ink on a production plate, and forming H-shaped anti-plating layers on two sides of the golden finger body and the positions of disconnection through exposure and development;
s3, carrying out copper-nickel-gold electroplating treatment on the production plate so as to sequentially plate a nickel layer and a gold layer on the gold finger body except for the disconnection position;
s4, carrying out electric thickness gold treatment on the production plate to thicken the gold layer on the gold finger body;
s5, removing the anti-electrogilding ink;
s6, sticking a film on the production board, windowing at positions corresponding to the disconnection position and the electrical gold lead, and removing a copper layer at the positions of the disconnection position and the electrical gold lead through etching to form a disconnection gold finger;
s7, sequentially performing the working procedures of manufacturing a solder mask layer, surface treatment and forming on the production board to obtain the sectional golden finger circuit board.
2. The method of manufacturing a segmented golden finger circuit board according to claim 1, wherein in step S2, the golden finger body is first subjected to screen printing of an entire production board with anti-golden ink, then subjected to preliminary curing by pre-baking, and then subjected to exposure and development in sequence to form an H-shaped anti-plating layer on both sides and at the disconnection position of the golden finger body.
3. The method for manufacturing a segmented golden finger circuit board according to claim 2, wherein in step S2, the parameters of pre-baking are: parameters for development at 74 ℃ for 20 min: 4.0m/min.
4. The method of claim 1, wherein in step S2, the step of baking the production board again is further included between the exposing and the developing.
5. The method for manufacturing a segmented golden finger circuit board according to claim 4, wherein in step S2, the parameters of re-baking are: 74 ℃ for 10min.
6. The method for manufacturing a segmented golden finger circuit board according to any one of claims 1-5, wherein in step S2, the exposure parameters are: 250-280mJ/cm 2 。
7. The method for manufacturing a segmented golden finger circuit board according to claim 6, wherein in step S2, the exposure parameters are: 260mJ/cm 2 。
8. The method for manufacturing the segmented golden finger circuit board according to claim 1, wherein the production board is a core board or a multilayer board formed by laminating an inner core board and an outer copper foil into a whole by prepregs, and the multilayer board is subjected to drilling, copper deposition and full board electroplating processes in sequence.
9. A segmented golden finger circuit board characterized by being manufactured by the manufacturing method of the segmented golden finger circuit board according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310719468.5A CN116867188A (en) | 2023-06-16 | 2023-06-16 | Manufacturing method of sectional golden finger circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310719468.5A CN116867188A (en) | 2023-06-16 | 2023-06-16 | Manufacturing method of sectional golden finger circuit board |
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| CN116867188A true CN116867188A (en) | 2023-10-10 |
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| CN202310719468.5A Pending CN116867188A (en) | 2023-06-16 | 2023-06-16 | Manufacturing method of sectional golden finger circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195323A (en) * | 2018-10-26 | 2019-01-11 | 深圳欣强智创电路板有限公司 | The disconnected cut position of optical module golden finger sets resist ink graphic structure |
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2023
- 2023-06-16 CN CN202310719468.5A patent/CN116867188A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195323A (en) * | 2018-10-26 | 2019-01-11 | 深圳欣强智创电路板有限公司 | The disconnected cut position of optical module golden finger sets resist ink graphic structure |
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