CN101489359A - Method for avoiding solder bridge - Google Patents
Method for avoiding solder bridge Download PDFInfo
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- CN101489359A CN101489359A CNA2008100012959A CN200810001295A CN101489359A CN 101489359 A CN101489359 A CN 101489359A CN A2008100012959 A CNA2008100012959 A CN A2008100012959A CN 200810001295 A CN200810001295 A CN 200810001295A CN 101489359 A CN101489359 A CN 101489359A
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- solder bridge
- avoiding solder
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Abstract
The present invention relates to a method for avoiding solder bridging. A plurality of insulation strips are respectively placed among a plurality of component holes of printed circuit board to be welded for insulating the adjacent component hole. Then welding is executed so that the component pins placed in the component hole are respectively combined fixedly with the printed circuit board through tin liquor, wherein the tin liquor is obstructed by the insulating strip. Thereby the improper solder bridging of two adjacent welding points on the component pins and component holes with small distance. Furthermore the welding pass rate can be increased and the maintenance cost of product in future is reduced.
Description
Technical field
The present invention relates to the scolding tin operation between the electronic component, particularly avoid taking place between the two adjacent pads method of solder bridge (connecting tin) improperly.
Background technology
The various patented technologies of solder bridge improperly of avoiding taking place between the two adjacent pads are arranged, ground pad structure that prevents the scolding tin seepage that routine TaiWan, China publication discloses for No. 200504981 and semiconductor package part with described ground pad structure; The printed circuit board (PCB) that can in welding procedure, avoid electric short circuit that the TaiWan, China patent announcement discloses for No. 488198; The tin soldering machine stable chute structure that the surplus tin of minimizing circuit board that the TaiWan, China patent announcement discloses for No. 483647 produces etc.
During welding, the part pin is plugged in the corresponding hole in piece part of printed circuit board (PCB).Present solder technology, if spacing (the Pitch)≤2mm (millimeter) of part pin, and when the space between two adjacent parts holes (Airgap)≤0.6mm, the bad phenomenon of the easy company's of formation tin (bridge joint) between the two adjacent pads when welding.
As shown in Figure 5, the grafting runners, for example the spacing between two of the central processing unit runners part pin 11,12 is 1.16mm, the space between two hole in piece part 21,22 adjacent with the corresponding printed circuit board (PCB) of two part pin 11,12 20 is 0.36mm.As Fig. 6, shown in Figure 7, when wave soldering, because the too approaching relation of distance of adjacent two hole in piece part 21,22 can make adjacent two hole in piece part, 21,22 company's of causing tin (bridge joint) states of last row.
As shown in Figure 8, some adopts tin design steathily to industry when PCB design, the method that promptly increases detin point 23 prevents to connect tin, but this method is only applicable to part pin spacing 〉=2mm, and the space 〉=0.6mm between adjacent two hole in piece part 24,25 of printed circuit board (PCB), but its solder yield is approximately about 60%.
As shown in Figure 9, in assembly technology, use the method for detin sheet 26 to be only applicable to part pin spacing 〉=2mm in addition, and the space 〉=0.6mm between adjacent two hole in piece part 27,28 of printed circuit board (PCB), but its solder yield is about about 80%.
Summary of the invention
The objective of the invention is to propose the scolding tin operation between a kind of electronic component, between the two adjacent pads solder bridge improperly takes place when the welding with the part pin of avoiding fine and closely woven spacing and hole in piece part.
Main purpose of the present invention is to provide a kind of method of avoiding solder bridge, is below the 2mm (millimeter) to solve part pin spacing, and the space between the adjacent parts hole is following company's tin (bridge joint) problem of 0.6mm.
Another object of the present invention is providing a kind of method of avoiding solder bridge, can promote the first-pass yield (Rolled Throughput Yield) of product at weld job, shortens the time of weld job and promotes production effect.
Another purpose of the present invention in that a kind of method of avoiding solder bridge is provided, can promote solder yield, reduce product in the future maintenance cost and reduce the negative effect that product causes because of maintenance.
The present invention avoids the method for solder bridge, between a plurality of hole in piece part that comprise the steps: to make a plurality of isolating bars place printed circuit board (PCB) to be welded respectively, to isolate adjacent described a plurality of hole in piece part; Carry out weld job, make the part pin that places in described a plurality of hole in piece part respectively by tin liquor and described printed circuit board (PCB) secure bond; Wherein said tin liquor is subjected to stopping of described a plurality of isolating bars, and the phenomenon of bridge joint can not take place between two therefore adjacent described a plurality of hole in piece part.The present invention can promote solder yield and reduce product maintenance cost in the future.
The aforesaid method of avoiding solder bridge, the spacing between wherein said a plurality of isolating bars are 1.0 to 2.0 millimeters.
The aforesaid method of avoiding solder bridge, the thickness between wherein said a plurality of isolating bars are 0.1 to 0.2 millimeter.
The aforesaid method of avoiding solder bridge, the width between wherein said a plurality of isolating bars are 0.15 to 0.2 millimeter.
The aforesaid method of avoiding solder bridge further comprises the steps: to make described a plurality of isolating bar to break away from described printed circuit board (PCB).
The aforesaid method of avoiding solder bridge, wherein said a plurality of isolating bars are located on the isolated location.
The aforesaid method of avoiding solder bridge, wherein said isolated location be selected from anti-welding material steel disc, epoxy sheet and cover plate formula the isolation cover cap one of them.
The aforesaid method of avoiding solder bridge, wherein said weld job be selected from reflow soldering operation, wave soldering operation and flatiron weld job one of them.
The aforesaid method of avoiding solder bridge, wherein said a plurality of isolating bars place the centre of two adjacent described hole in piece part.
The aforesaid method of avoiding solder bridge, wherein said a plurality of isolating bars are located on the isolated location.
The aforesaid method of avoiding solder bridge, wherein said isolated location be selected from anti-welding material steel disc, epoxy sheet and cover plate formula the isolation cover cap one of them.
The aforesaid method of avoiding solder bridge, wherein said weld job be selected from reflow soldering operation, wave soldering operation and flatiron weld job one of them.
The aforesaid method of avoiding solder bridge, wherein said a plurality of isolating bars place the centre of two adjacent described hole in piece part.
Therefore, the present invention can reach following effect:
1. can solve part pin spacing is 2mm following (minimum reaches 1.16mm), and the space is company's tin problem of 0.6mm following (minimum 0.36mm) between adjacent two hole in piece part.
2. can use at runners/socket (Socket), the connector weld job of fine and closely woven spacing (FinePitch) part in assembly technology such as (Connector).
3. can promote the First Pass Yield of product, thereby shorten the time lifting production efficiency that printed circuit board (PCB) stops on the weld job line.
4. can reduce because of failure welding causes in the future maintenance cost, can reduce the negative effect that product causes because of maintenance simultaneously.
Other purposes of the present invention, effect see also drawings and Examples, are described in detail as follows.
Description of drawings
Fig. 1 is the schematic diagram of isolated location of the present invention and general printed circuit board (PCB) to be welded.
Fig. 2 a is placed in the schematic diagram between two hole in piece part of printed circuit board (PCB) for the isolating bar of isolated location of the present invention.
Fig. 2 b is placed in the schematic diagram that welds between two hole in piece part of printed circuit board (PCB) for the isolating bar of isolated location of the present invention.
Fig. 2 c removes the schematic diagram of printed circuit board (PCB) after for isolated location of the present invention welding.
Fig. 3 avoids the flow chart of the method for solder bridge for the present invention.
Fig. 4 isolates the schematic diagram of cover cap for the present invention.
Fig. 5 is plugged in the interior schematic diagram of two hole in piece part respectively for known two part pin.
The schematic diagram of tin (bridge joint) state takes place to connect in Fig. 6 for known circuit board welding back.
Fig. 7 is the enlarged diagram that the tin part takes place to connect among Fig. 6.
Fig. 8 is the schematic diagram of known detin design.
Fig. 9 is the schematic diagram of known use detin sheet design.
And each description of reference numerals in the above-mentioned accompanying drawing is as follows:
11,12 part pin
20 printed circuit board (PCB)s
21,22,24,25,27,28 hole in piece part
23 detins point
26 detin sheets
30 isolated locations
31,41 isolating bars
40 isolate cover cap
(1), (2), (3) are respectively the sign symbol of each step
Embodiment
According to soldering theory, the distance between the hole in piece part is more little, the phenomenon of the easy more company of causing tin (bridge joint).In order to prevent that the present invention uses anti-welding material to be isolated when causing the phenomenon that connects tin (bridge joint) during in welding during corresponding to the space between the hole in piece part of part pin≤0.6mm on part pin spacing≤2mm and the printed circuit board (PCB) between two hole in piece part.For example making thickness is that to set up many width be dykes and dams or the barricade of 0.15～0.20mm for the steel disc of 0.1～0.2mm, be isolating bar (line), when welding, tin liquor is produced the effect that isolation stops, prevent that effectively two adjacent hole in piece part from the phenomenon of tin (bridge joint) taking place to connect.
See also shown in Figure 1.For solving electronic product, for example the runners of CPU is in wave soldering, its last row's part pin is welded in company's tin phenomenon that printed circuit board (PCB) 20 corresponding hole in piece part 21,22 produce, the present invention adopts the isolated location 30 of 0.15mm thickness, stainless steel substrates for example, use laser-engraving technique, making many width is that 0.15mm is an isolating bar 31, and the spacing between adjacent two isolating bars 31 is 1.16mm.
See also Fig. 2 a, Fig. 2 b, Fig. 2 c, shown in Figure 3.The present invention avoids the method for solder bridge, comprises the steps:
(1) many isolating bars 31 of isolated location 30 are placed between many hole in piece part 21,22 of printed circuit board (PCB) to be welded 20, to isolate adjacent hole in piece part 21,22, shown in Fig. 2 a respectively;
(2) carry out weld job, make the part pin 11,12 that places in the hole in piece part 21,22 respectively by tin liquor and printed circuit board (PCB) 20 secure bond, shown in Fig. 2 b;
(3) remove isolated location 30, make isolating bar 31 break away from printed circuit board (PCB) 20, shown in Fig. 2 c;
Wherein tin liquor is subjected to stopping of isolating bar, and therefore the phenomenon of bridge joint can not take place between adjacent two hole in piece part 21,22.
Feature of the present invention is that the central authorities that isolating bar 31 are placed on corresponding two hole in piece part 21,22 when welding weld again, at this moment, isolating bar 31 is similar to one and stops up wall to intercept in the middle of two hole in piece part 21,22, effectively block two part pin 11,12 and hole in piece part 21,22 by the tin liquor bridge joint, shown in Fig. 2 c, can significantly promote the qualification rate of welding.
The present invention can be used for SMD (surface mount part) reflow soldering, DIP (dual in-line package) wave soldering and flatiron welding.
Usually the height of the solder joint of product is approximately 0.6mm～0.8mm, in order to prevent that shadow effect from causing hole in piece part that empty weldering takes place, the present invention has defined the relation between the space between the part pin spacing, isolating bar (line) spacing, isolating bar (line) thickness, isolating bar (line) width, hole in piece part of the fine and closely woven spacing part of this class, as shown in Table 1:
Table one
| The spacing of part pin (mm) | 1.20 | 1.60 | 2.00 |
| Spacing between the isolating bar (mm) | 1.20 | 1.60 | 2.00 |
| Make the steel plate thickness (mm) of isolating bar | 0.15 | 0.18 | 0.20 |
| Space between the hole in piece part (mm) | 0.30 | 0.45 | 0.60 |
| The width of isolating bar (mm) | 0.15 | 0.18 | 0.20 |
Isolated location of the present invention also can use the thin slice of other anti-welding material except steel disc, as FR4 (epoxy resin, the material of printed circuit board (PCB)) sheet etc., or be the isolation cover cap 40 of the cover plate formula of the isolating bar 41 that has heterogeneous interval as shown in Figure 4.
The present invention can solve part pin spacing≤2mm, and the space≤0.6mm between adjacent two insert hole, the company's tin problem in the electronic component welding procedure.The I of part pin spacing of the present invention reaches 1.16mm; Space minimum range on the printed circuit board (PCB) between adjacent two hole in piece part can reach 0.36mm.
The present invention can reach following effect:
1. can solve part pin spacing is 2mm following (minimum reaches 1.16mm), and the space is company's tin problem of 0.6mm following (minimum 0.36mm) between adjacent two hole in piece part.
2. can use at runners/socket (Socket), the connector weld job of fine and closely woven spacing (FinePitch) part in assembly technology such as (Connector).
3. can promote the first-pass yield of product, thereby shorten the time lifting production efficiency that printed circuit board (PCB) stops on the weld job line.
4. can reduce because of failure welding causes in the future maintenance cost, can reduce the negative effect that product causes because of maintenance simultaneously.
The above record only is the embodiment that utilizes the technology of the present invention content, and modification and variation that any those skilled in the art use the present invention to do all belong to the claim that the present invention advocates, and are not limited to the scope that embodiment discloses.
Claims (13)
1. a method of avoiding solder bridge comprises the steps:
A plurality of isolating bars are placed between a plurality of hole in piece part of printed circuit board (PCB) to be welded, to isolate adjacent hole in piece part respectively;
Carry out weld job, make the part pin that places in described a plurality of hole in piece part respectively by tin liquor and described printed circuit board (PCB) secure bond;
Wherein said tin liquor is subjected to stopping of described a plurality of isolating bars, and the phenomenon of bridge joint can not take place between two therefore adjacent hole in piece part.
2. the method for avoiding solder bridge as claimed in claim 1, the spacing between wherein said a plurality of isolating bars are 1.0 to 2.0 millimeters.
3. the method for avoiding solder bridge as claimed in claim 2, the thickness between wherein said a plurality of isolating bars are 0.1 to 0.2 millimeter.
4. the method for avoiding solder bridge as claimed in claim 3, the width between wherein said a plurality of isolating bars are 0.15 to 0.2 millimeter.
5. as claim 1,2, the 3 or 4 described methods of avoiding solder bridge, further comprise the steps:
Make described a plurality of isolating bar break away from described printed circuit board (PCB).
6. as claim 1,2, the 3 or 4 described methods of avoiding solder bridge, wherein said a plurality of isolating bars are located on the isolated location.
7. the method for avoiding solder bridge as claimed in claim 6, wherein said isolated location be selected from anti-welding material steel disc, epoxy sheet and cover plate formula the isolation cover cap one of them.
8. the method for avoiding solder bridge as claimed in claim 7, wherein said weld job be selected from reflow soldering operation, wave soldering operation and flatiron weld job one of them.
9. the method for avoiding solder bridge as claimed in claim 8, wherein said a plurality of isolating bars place the centre of two adjacent hole in piece part.
10. the method for avoiding solder bridge as claimed in claim 5, wherein said a plurality of isolating bars are located on the isolated location.
11. the method for avoiding solder bridge as claimed in claim 10, wherein said isolated location be selected from anti-welding material steel disc, epoxy sheet and cover plate formula the isolation cover cap one of them.
12. the method for avoiding solder bridge as claimed in claim 11, wherein said weld job be selected from reflow soldering operation, wave soldering operation and flatiron weld job one of them.
13. the method for avoiding solder bridge as claimed in claim 12, wherein said a plurality of isolating bars place the centre of two adjacent hole in piece part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100012959A CN101489359B (en) | 2008-01-17 | 2008-01-17 | Method for avoiding solder bridge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100012959A CN101489359B (en) | 2008-01-17 | 2008-01-17 | Method for avoiding solder bridge |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101489359A true CN101489359A (en) | 2009-07-22 |
| CN101489359B CN101489359B (en) | 2011-11-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100012959A Active CN101489359B (en) | 2008-01-17 | 2008-01-17 | Method for avoiding solder bridge |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102469695A (en) * | 2010-10-29 | 2012-05-23 | 海尔集团公司 | Printed circuit board, tinning line thereof and tinning method thereof |
| CN105355575A (en) * | 2015-11-17 | 2016-02-24 | 常州市武进区半导体照明应用技术研究院 | Method for protecting welding spots against pollution in semiconductor packaging process |
| CN111545856A (en) * | 2020-05-15 | 2020-08-18 | 宁波奥克斯电气股份有限公司 | Method for preventing wave soldering from being connected and welded, printing screen and electric control board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1190116C (en) * | 2001-10-19 | 2005-02-16 | 华硕电脑股份有限公司 | Method for preventing production of tin ball and its mould |
| JP4196191B2 (en) * | 2003-09-09 | 2008-12-17 | セイコーエプソン株式会社 | Nonvolatile semiconductor memory device and control method thereof |
| CN100362640C (en) * | 2004-06-04 | 2008-01-16 | 英业达股份有限公司 | Method for preventing semiconductor assembly pin welding from shorting circuit |
-
2008
- 2008-01-17 CN CN2008100012959A patent/CN101489359B/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102469695A (en) * | 2010-10-29 | 2012-05-23 | 海尔集团公司 | Printed circuit board, tinning line thereof and tinning method thereof |
| CN102469695B (en) * | 2010-10-29 | 2016-09-21 | 海尔集团公司 | Printed circuit board (PCB) and tining circuit thereof and tining method |
| CN105355575A (en) * | 2015-11-17 | 2016-02-24 | 常州市武进区半导体照明应用技术研究院 | Method for protecting welding spots against pollution in semiconductor packaging process |
| CN111545856A (en) * | 2020-05-15 | 2020-08-18 | 宁波奥克斯电气股份有限公司 | Method for preventing wave soldering from being connected and welded, printing screen and electric control board |
| CN111545856B (en) * | 2020-05-15 | 2022-03-22 | 宁波奥克斯电气股份有限公司 | Method for preventing wave soldering from being connected and welded, printing screen and electric control board |
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| Publication number | Publication date |
|---|---|
| CN101489359B (en) | 2011-11-23 |
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