CN203951678U - Circuit board soldering tin integrated structure - Google Patents
Circuit board soldering tin integrated structure Download PDFInfo
- Publication number
- CN203951678U CN203951678U CN201420343522.7U CN201420343522U CN203951678U CN 203951678 U CN203951678 U CN 203951678U CN 201420343522 U CN201420343522 U CN 201420343522U CN 203951678 U CN203951678 U CN 203951678U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- insulating barrier
- integrated structure
- perforation
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 238000005476 soldering Methods 0.000 title claims abstract description 18
- 230000004888 barrier function Effects 0.000 claims abstract description 38
- 239000006071 cream Substances 0.000 claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 230000007717 exclusion Effects 0.000 claims description 3
- 238000002788 crimping Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of circuit board soldering tin integrated structure, comprise first circuit board and second circuit board, described first circuit board comprises that the first insulating barrier and interval be located at some first weld pads of described the first insulating barrier inner surface side by side, described second circuit board comprises that the second insulating barrier and interval be located at some second weld pads of described the second insulating barrier inner surface side by side, described the first weld pad and the second bond pad locations are corresponding also by tin cream adhesion, described first circuit board is provided with some perforations through described the first insulating barrier and the first weld pad, described tin cream injects described perforation inside.The utility model, by perforation is set on first circuit board, makes tin cream can infiltrate through perforation, and can observe via perforation top, conveniently finds that in advance scolding tin is bad and can therefrom repair, and has avoided the loose contact of product.
Description
[technical field]
The utility model relates to circuit board fabrication field, particularly a kind of circuit board soldering tin integrated structure that can reduce loose contact rate.
[background technology]
Soldering is the method that different conducting wires are electrically connected.Generally just adopt the mode of soldering by welded together the port on two circuit boards at circuit board in to the welding of circuit board.Prior art has in technology common circuit board soldering tin connected mode with reference to Fig. 1, the first weld pad 112 of some parallel interval is printed on the inner surface of a first complete insulating barrier 111, the second weld pad 122 of some parallel interval is printed on the inner surface of a second complete insulating barrier 121, together with the first weld pad 112 is crimped on by tin cream 13 with the second weld pad 122.But there are two problems in this structure:
1. two weld pads are welded in the inner surface of two circuit boards, are difficult to see through the welding situation of surface observation to the inside after crimping, if the molten tin of tin cream bad occurred to open circuit also cannot repair, can only scrap.
2. the amount of tin cream is wayward, extrude unavoidably, and limited space in two insulating barrier gaps can be full of between weld pad in the time that tin cream consumption is excessive in crimping between weld pad, causes the bad of short circuit.
Therefore, be necessary to provide a kind of new circuit board soldering tin integrated structure to avoid above problem.
[utility model content]
Main purpose of the present utility model is to provide a kind of circuit board soldering tin integrated structure that can reduce loose contact rate.
The utility model is achieved through the following technical solutions above-mentioned purpose: a kind of circuit board soldering tin integrated structure, comprise first circuit board and second circuit board, described first circuit board comprises that the first insulating barrier and interval be located at some first weld pads of described the first insulating barrier inner surface side by side, described second circuit board comprises that the second insulating barrier and interval be located at some second weld pads of described the second insulating barrier inner surface side by side, described the first weld pad and the second bond pad locations are corresponding also by tin cream adhesion, described first circuit board is provided with some perforations through described the first insulating barrier and the first weld pad, described tin cream injects described perforation inside.
Preferably, described perforation aperture is 0.25mm.
Preferably, the exclusion region hollow out of described first circuit board between adjacent the first weld pad.
In some embodiments, on the outer surface of described the first insulating barrier, be also provided with back pad with respect to the first bond pad locations, described perforation is simultaneously through back pad.
In some embodiments, the outer surface of described the second insulating barrier is provided with one deck Copper Foil printed layers.
Compared with prior art, the beneficial effect of the utility model circuit board soldering tin integrated structure is:
1, the perforation on first circuit board can make tin cream and being connected of the first weld pad directly observe, and can repair from perforation in the time that tin cream and being connected of the first weld pad are bad, has got rid of the hidden danger that opens circuit, and has improved product yield;
2, perforation aperture 0.25mm had both met detection needs, made again tin cream can overcome surface tension and normally infiltrated via;
3, the solderless pad area hollow out of first circuit board, when making first circuit board and second circuit board crimping, even if tin cream amount is too much also difficult for making parallel circuit short circuit;
4, back pad provides outside holding power can to the first insulating barrier, prevents that the first insulating barrier from damaging in the process of rushing perforation;
5, Copper Foil printed layers can be used for printing the circuit in the second insulating barrier outside, makes full use of the space surface of second circuit board.
[brief description of the drawings]
Fig. 1 is the cross-sectional schematic of prior art circuits boards solder integrated structure;
Fig. 2 is the sectional schematic diagram before the crimping of the utility model circuit board soldering tin integrated structure;
Fig. 3 is the partial view of A direction in Fig. 2.
Numeral in figure:
11, first circuit board, 111, the first insulating barrier, 112, the first weld pad; 12, second circuit board, 121, the second insulating barrier, 122, the second weld pad; 13, tin cream.
21, first circuit board, 211, the first insulating barrier, 212, the first weld pad, 213, back pad, 214, perforation; 22, second circuit board, 221, the second insulating barrier, 222, the second weld pad, 223, Copper Foil printed layers; 23, tin cream.
[embodiment]
Below in conjunction with accompanying drawing, the utility model is described in further detail.
As shown in Figure 2, circuit board soldering tin integrated structure comprises first circuit board 21 and second circuit board 22.Between first circuit board 21 and second circuit board 22, bond by tin cream 23.
With reference to figure 3, some the first weld pads 212 that first circuit board 21 comprises the first insulating barrier 211, be arranged side by side at the first insulating barrier 211 intervals, inner surface top and be located at the back pad 213 that relative the first weld pad 212 of the first insulating barrier 211 outer surfaces arranges.The exclusion region hollow out of first circuit board 21 between adjacent the first weld pad 212.On first circuit board 21, be also provided with the some perforations 214 that penetrate each the first weld pad 212, the first insulating barrier 211 and back pad 213, perforation 214 apertures are 0.25mm.The aperture of 0.25mm neither affects conducting, and makes tin cream 23 be enough to overcome surface tension through perforation 214.
With reference to Fig. 3, second circuit board 22 comprises the second insulating barrier 221, some the second weld pads 222 that are arranged side by side at the second insulating barrier 221 inner surface intervals and the Copper Foil printed layers 223 of being located at the second insulating barrier 221 outer surfaces.The second corresponding the first weld pad 212 positions, weld pad 222 positions, both bond by tin cream 23.Can printed wiring in Copper Foil printed layers 223, the surface of the second insulating barrier 221 is made full use of.
When scolding tin, the tin cream 23 of melting is applied on each the second weld pad 222, then the first weld pad 212 correspondences is crimped onto on the second weld pad 222.Because first circuit board 21 is provided with perforation 214, so part tin cream 23 can overflow through perforation 213 and from the lateral surface of back pad 213 when crimping, connect the first weld pad 212 circuit.Whether overflow and can verify whether tin cream 23 has carried out effective contact with each the first weld pad 212 from each perforation 213 by observing tin cream 23, if do not overflow tin cream 23 in certain perforation 214, can repair it from the lateral surface of the first insulating barrier 211, prevent circuit breaker.In addition, because the both sides of the first weld pad 212 become hollow out, so unnecessary tin cream 23 can not be contaminated parallel circuit and produce short circuit problem.
Above-described is only execution modes more of the present utility model.For the person of ordinary skill of the art, not departing under the prerequisite of the utility model creation design, can also make some distortion and improvement, these all belong to protection range of the present utility model.
Claims (5)
1. a circuit board soldering tin integrated structure, comprise first circuit board and second circuit board, described first circuit board comprises that the first insulating barrier and interval be located at some first weld pads of described the first insulating barrier inner surface side by side, described second circuit board comprises that the second insulating barrier and interval be located at some second weld pads of described the second insulating barrier inner surface side by side, described the first weld pad and the second bond pad locations are corresponding also by tin cream adhesion, it is characterized in that: described first circuit board is provided with some perforations through described the first insulating barrier and the first weld pad, described tin cream injects described perforation inside.
2. circuit board soldering tin integrated structure according to claim 1, is characterized in that: described perforation aperture is 0.25mm.
3. circuit board soldering tin integrated structure according to claim 1, is characterized in that: the exclusion region hollow out of described first circuit board between adjacent the first weld pad.
4. circuit board soldering tin integrated structure according to claim 1, is characterized in that: on the outer surface of described the first insulating barrier, be also provided with back pad with respect to the first bond pad locations, described perforation is simultaneously through back pad.
5. circuit board soldering tin integrated structure according to claim 1, is characterized in that: the outer surface of described the second insulating barrier is provided with one deck Copper Foil printed layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420343522.7U CN203951678U (en) | 2014-06-25 | 2014-06-25 | Circuit board soldering tin integrated structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420343522.7U CN203951678U (en) | 2014-06-25 | 2014-06-25 | Circuit board soldering tin integrated structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203951678U true CN203951678U (en) | 2014-11-19 |
Family
ID=51893691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420343522.7U Expired - Lifetime CN203951678U (en) | 2014-06-25 | 2014-06-25 | Circuit board soldering tin integrated structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203951678U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107027246A (en) * | 2015-10-20 | 2017-08-08 | 日本航空电子工业株式会社 | Fixed structure and fixing means |
-
2014
- 2014-06-25 CN CN201420343522.7U patent/CN203951678U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107027246A (en) * | 2015-10-20 | 2017-08-08 | 日本航空电子工业株式会社 | Fixed structure and fixing means |
| US10193241B2 (en) | 2015-10-20 | 2019-01-29 | Japan Aviation Electronics Industry, Ltd. | Fixing structure and fixing method |
| US10312603B2 (en) | 2015-10-20 | 2019-06-04 | Japan Aviation Electronics Industry, Ltd. | Fixing structure and fixing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141119 |
|
| CX01 | Expiry of patent term |