CN206283716U - A kind of pad structure of circuit board and a kind of circuit board - Google Patents
A kind of pad structure of circuit board and a kind of circuit board Download PDFInfo
- Publication number
- CN206283716U CN206283716U CN201621252754.7U CN201621252754U CN206283716U CN 206283716 U CN206283716 U CN 206283716U CN 201621252754 U CN201621252754 U CN 201621252754U CN 206283716 U CN206283716 U CN 206283716U
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- China
- Prior art keywords
- circuit board
- pad
- hole
- plated
- layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model discloses a kind of pad structure of circuit board and a kind of circuit board, circuit board is dual platen or multi-layer sheet, circuit board top layer is provided with solder pad, plated through-hole is provided with solder pad, plated through-hole at least reaches the adjacent layer on circuit board top layer, on each layer that plated through-hole is reached, connection pad is respectively arranged with around plated through-hole, the solder pad on circuit board top layer is connected by plated through-hole with pad is connected, and is provided with around connection pad and is forbidden applying copper region.The utility model leads in prior art by punching, the internal connection pad of connection is fixed on the basis of solder pad, has been connected around pad to set in each layer and has been forbidden applying copper region, reduces the radiating of each layer connection pad during welding, so that solder pad is being easier to be welded to connect, weldability is improve.
Description
Technical field
The utility model is related to circuit board making technical field, more particularly to a kind of pad structure of circuit board and a kind of circuit
Plate.
Background technology
Pcb board (printed circuit board) is widely used in electronic product, between pcb board, pcb board and external devices
Between generally use wire rod realize connection.Soldering wires usually use human weld, there is that weld interval is uncertain, rewelding
Situation about connecing.This just proposes the requirement of certain firmness and weldability to solder pad.
In order to increase the firmness of solder pad, as shown in figure 1, increase connection pad 3 in solder pad 1 sometimes,
Connection pad 3 is all set in each layer of pcb board and is connected by 1 hole of metallizing, except top layer solder pad 1 and pcb board top layer
Be connected outer between deposited copper with identical network, the connection pad 3 set at solder pad 1 also can pcb board other are each
Layer connects completely with the deposited copper of same network.
Although this structure disclosure satisfy that the requirement for improving fastness, but heat scatters and disappears soon when can cause welding, increases
Activity duration, and easily cause the failure weldings such as rosin joint, it is impossible to meet the requirement of solder pad weldability.
Utility model content
In view of the solder pad of prior art is unsatisfactory for the problem of weldability requirement when fastness is improved, it is proposed that this reality
With new a kind of pad structure of circuit board and a kind of circuit board, to overcome above mentioned problem or to solve at least in part above-mentioned
Problem.
According to one side of the present utility model, there is provided a kind of pad structure of circuit board, the circuit board is dual platen
Or multi-layer sheet, the circuit board top layer is provided with solder pad, plated through-hole, the metallization is provided with the solder pad
Hole at least reaches the adjacent layer on the circuit board top layer, on each layer that the plated through-hole is reached, around the plated through-hole
Surrounding is respectively arranged with connection pad, and the solder pad on the circuit board top layer is by the plated through-hole and the connection pad
Connection, is provided with around the connection pad and forbids applying copper region.
Alternatively, the plated through-hole is through hole.
Alternatively, the circuit board is multi-layer sheet, and the plated through-hole is blind hole.
Alternatively, electrodeposited coating is provided with the plated through-hole, the electrodeposited coating welds the welding on the circuit board top layer
Disk links together with the connection pad.
Alternatively, it is cross connection or word connection between the circuit on the solder pad and the circuit board top layer.
According to other side of the present utility model, it is proposed that a kind of circuit board, the circuit board is provided with as above any
Pad structure of circuit board described in.
The beneficial effects of the utility model are：
In prior art by punching, the internal connection pad of connection is fixed on the basis of solder pad, is connected in each layer and welded
Set around disk and forbid applying copper region, reduce the radiating that each layer during welding connects pad, so that solder pad is being easier
It is welded to connect, improves weldability.
Brief description of the drawings
Fig. 1 is a kind of pad structure of circuit board of prior art；
A kind of pad structure of circuit board that Fig. 2 is provided for the utility model one embodiment；
In figure, 1. solder pad；2. plated through-hole；3. pad is connected；4. forbid applying copper region.
Specific embodiment
Core concept of the present utility model is, by setting plated through-hole at the solder pad on top layer, by the weldering on top layer
The connection pad for connecing pad and being arranged on around other layer of plated through-hole links together, meanwhile, in the connection pad week of each layer
Enclose setting to forbid applying copper region, heat is lost when slowing down welding, makes solder pad be easier welding.
It is new to this practicality below in conjunction with accompanying drawing to make the purpose of this utility model, technical scheme and advantage clearer
Type implementation method is described in further detail.
A kind of pad structure of circuit board that Fig. 2 is provided for the utility model one embodiment, the circuit board be dual platen or
Multi-layer sheet, circuit board top layer is provided with solder pad 1, and plated through-hole 2 is provided with solder pad 1, and plated through-hole 2 is at least reached
The adjacent layer on circuit board top layer, as shown in Fig. 2 the plated through-hole 2 is deep into the third layer of circuit board, reaches in plated through-hole 2
Each layer on, connection pad 3 is respectively arranged with around plated through-hole 2, the solder pad 1 on circuit board top layer is by metallization
Hole 2 connects with pad 3 is connected, and is provided with around connection pad 3 and forbids applying copper region 4.
Under the connection function of plated through-hole 2 and connection pad 3, between the solder pad 1 and circuit board on circuit board top layer
Bonding strength it is higher, the occurrence of can effectively prevent solder pad 1 from departing from welding process and maintenance process, together
When, forbid applying copper region 4 due to being provided with around connection pad 3, there is no good leading between connection pad 3 and the deposited copper of surrounding
The passage of heat, therefore will not cause too fast radiating in welding, be conducive to keeping welding temperature, it is easy to welding.
Preferably, plated through-hole 2 is through hole, through all layers of circuit of circuit board, fastening effect is improved to greatest extent.When
So, intensive for some circuits, it has not been convenient to make the multilayer circuit board of through hole, plated through-hole 2 may be alternatively provided as blind hole, extend only through
If the dried layer in circuit board, the fixing intensity of solder pad 1 is improved in the range of board design permission.
Preferably, electrodeposited coating, such as copper electroplating layer are provided with plated through-hole 2, electrodeposited coating is by the welding on circuit board top layer
The connection pad 3 set on other each layers outside pad 1 and circuit board top layer links together.
Preferably, in order to further reduce the diffusion velocity of heat during welding, the line on solder pad 1 and circuit board top layer
Using cross connection or word connection between road, so as to limit the heat transfer that solder pad 1 and top layer are applied between copper, further improve
Weldability.
The invention also discloses a kind of circuit board, the electricity as above described in any one embodiment is provided with the circuit board
Road plate pad structure, so that the solder pad of the circuit board has more preferable connective stability and weldability.
In sum, the utility model solder pad and will be set by setting plated through-hole at the solder pad on top layer
The connection pad put around plated through-hole links together, and improves the intensity of the connection of solder pad, also, in each layer
Set around connection pad and forbid copper-clad, reduce the diffusion of welding process heat, realized and improve solder pad simultaneously
The purpose of fastness and weldability.
Preferred embodiment of the present utility model is the foregoing is only, protection model of the present utility model is not intended to limit
Enclose.All any modification, equivalent substitution and improvements made within spirit of the present utility model and principle etc., are all contained in this reality
With in new protection domain.
Claims (6)
1. a kind of pad structure of circuit board, the circuit board is dual platen or multi-layer sheet, and the circuit board top layer is provided with welding
Pad, is provided with plated through-hole at the solder pad, the plated through-hole at least reaches the adjacent layer on the circuit board top layer,
On each layer that the plated through-hole is reached, connection pad, the circuit board are respectively arranged with around the plated through-hole
The solder pad on top layer is connected by the plated through-hole with the connection pad, it is characterised in that around the connection pad
It is provided with and forbids applying copper region.
2. pad structure of circuit board as claimed in claim 1, it is characterised in that the plated through-hole is through hole.
3. pad structure of circuit board as claimed in claim 1, it is characterised in that the circuit board is multi-layer sheet, the metal
Change hole is blind hole.
4. pad structure of circuit board as claimed in claim 1, it is characterised in that be provided with electrodeposited coating in the plated through-hole,
The electrodeposited coating links together the solder pad on the circuit board top layer with the connection pad.
5. pad structure of circuit board as claimed in claim 1, it is characterised in that the solder pad and the circuit board top layer
Circuit between for cross connection or a word connection.
6. a kind of circuit board, it is characterised in that the circuit board sets and welded just like the circuit board described in claim any one of 1-5
Dish structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621252754.7U CN206283716U (en) | 2016-11-22 | 2016-11-22 | A kind of pad structure of circuit board and a kind of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621252754.7U CN206283716U (en) | 2016-11-22 | 2016-11-22 | A kind of pad structure of circuit board and a kind of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206283716U true CN206283716U (en) | 2017-06-27 |
Family
ID=59083650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621252754.7U Active CN206283716U (en) | 2016-11-22 | 2016-11-22 | A kind of pad structure of circuit board and a kind of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206283716U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110740589A (en) * | 2019-09-29 | 2020-01-31 | 苏州浪潮智能科技有限公司 | Design method, device and medium for multi-layer PCB |
| CN114245612A (en) * | 2021-11-30 | 2022-03-25 | 浪潮(山东)计算机科技有限公司 | PCB design method for reducing copper separation of metallized hole |
-
2016
- 2016-11-22 CN CN201621252754.7U patent/CN206283716U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110740589A (en) * | 2019-09-29 | 2020-01-31 | 苏州浪潮智能科技有限公司 | Design method, device and medium for multi-layer PCB |
| CN114245612A (en) * | 2021-11-30 | 2022-03-25 | 浪潮(山东)计算机科技有限公司 | PCB design method for reducing copper separation of metallized hole |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |