CN201601891U - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN201601891U CN201601891U CN2010201127026U CN201020112702U CN201601891U CN 201601891 U CN201601891 U CN 201601891U CN 2010201127026 U CN2010201127026 U CN 2010201127026U CN 201020112702 U CN201020112702 U CN 201020112702U CN 201601891 U CN201601891 U CN 201601891U
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- Prior art keywords
- pad
- area
- insert hole
- circuit board
- printed circuit
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Abstract
The utility model belongs to the field of electronic products, and discloses a printed circuit board, which comprises insert holes and bonding pads, wherein the area of the bonding pads is 1-7 times of the area of the corresponding insert holes. When more than three insert holes are arranged in a single row, the middle insert hole is arranged in the middle of one corresponding bonding pad, and the insert holes on two sides can be arranged on inner side of the corresponding bonding pad. Further, the insert holes are at least arranged in three rows, the area of outer-circle bonding pads is 1-7 times of the area of the corresponding insert holes while the area of inner-circle bonding pads is 1-3.5times of the area of the corresponding insert holes. The bonding pads are connected with large copper foil via wires, and particularly, the bonding pads are connected with the large copper foil on at least three layers of substrates. One portion of the upper side of each bonding pad is exposed while the other portion is covered with a solder mask which extends to the surfaces of the substrates. By optimizing the bonding pads and adopting the form of defining the bonding pads via the solder masks, peeling off of the bonding pads during repairing of inserts is reduced, repair yield of inserts is increased, and scrap rate of single boards and cost are reduced.
Description
Technical field
The utility model relates to the electronic product field, particularly a kind of printed circuit board (PCB).
Background technology
PCB (Printed Circuit Board, printed circuit board (PCB)) is to be aided with the formed structural member of conductor wirings with insulating material.When making final products, integrated circuit, electric crystal, diode, passive device (as: resistance, electric capacity, connector etc.) and other various electronic components can be installed on it.Be communicated with by cabling, can form the electric signal binding and function should be arranged.
Printed circuit board (PCB) comprises insert hole and pad, and plug-in unit is plugged in the insert hole, the time regular meeting run into the problem that plug-in unit is reprocessed.
When plug-in unit is reprocessed, at first break away from printed circuit board (PCB), the area of pad is generally less, be easy to occur the phenomenon that pad comes off, especially product this moment is reprocessing of lead-free process, and the probability that pad comes off is bigger, the veneer that pad comes off can only be scrapped, and makes the inefficacy cost very high.
The utility model content
In order to improve the acceptance rate that plug-in unit is reprocessed, reduce scrapping of veneer, reduce cost, the utility model embodiment provides a kind of printed circuit board (PCB).Described technical scheme is as follows:
A kind of printed circuit board (PCB) comprises substrate, is located at insert hole and pad on the substrate, and the area of described pad is 1-7 a times of corresponding insert hole area.
Described pad is circular or square.
Described pad is oval, and when described insert hole is more than three, and during single the setting, the insert hole in the middle of being positioned at is located at the centre position of corresponding oval pad, and the insert hole that is positioned at both sides is located at the inboard of corresponding oval pad.
Described insert hole is more than three rows, and wherein, the area that is positioned at the outer ring pad is 1-7 a times of corresponding insert hole area, and the area that is positioned at the inner ring pad is 1-3.5 a times of corresponding insert hole area.
Described outer ring pad is oval, and the insert hole that is positioned at the outer ring is located at the inboard of corresponding oval pad.
Described pad is provided with big Copper Foil outward, and described pad links to each other with described big Copper Foil by cabling, and described pad connects the big Copper Foil on other number of plies substrate, and the described number of plies is no more than 3 layers.
The length of described cabling is 1.5-2.0mm.
A part is exposed above the described pad, covers solder mask above another part, and described solder mask extends to substrate surface.
Described solder mask is green oil layer or green oil enamelled coating.
The beneficial effect of the technical scheme that the utility model embodiment provides is: the utility model improves the acceptance rate that plug-in unit is reprocessed mainly by pad optimization, reduces scrapping of veneer, reduces cost.
Description of drawings
In order to be illustrated more clearly in the technical scheme of the utility model embodiment, to do one to the accompanying drawing that uses among the embodiment below introduces simply, apparently, below listed accompanying drawing only be embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of circular pad on the substrate that provides of the utility model embodiment;
Fig. 2 is the structural representation of the single insert hole that provides of the utility model embodiment;
Fig. 3 is the structural representation of many rows insert hole of providing of the utility model embodiment;
Fig. 4 is the structural representation that the insert hole that provides of the utility model embodiment is connected with big Copper Foil;
Fig. 5 is the structural representation that insert hole that the utility model embodiment provides connects the big Copper Foil on other number of plies substrate;
Fig. 6 is the schematic cross-section that pad that the utility model embodiment provides is provided with solder mask.
In the accompanying drawing, the component list of each label representative is as follows:
1 insert hole, 2 original pads, 3 pads, 4 big Copper Foils, 5 cablings, 6 solder masks, 7 substrates.
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, the utility model execution mode is described in further detail below in conjunction with accompanying drawing.
Referring to Fig. 1, a kind of printed circuit board (PCB), substrate 7 is provided with insert hole 1, the pad outer ring is circular, the original pad 2 of representative in the dotted line, pad 3 is the pad behind the increase area, the pad outer ring can be designed as rectangle or square, the area of pad is 1-7 a times of corresponding insert hole area, and the area that is preferably pad is 1.07-6.91 a times of corresponding insert hole area.The area of pad 3 is 3 times of corresponding insert hole 1 area in the present embodiment.
For single insert hole, directly on the basis in encapsulation storehouse, increase bonding pad area, the pad of increase can have any shape, and is preferably circle or square, is convenient to draw and make.By increasing the area of pad, pad is optimized, do not influence the integral layout of PCB, do not increase other link and cost, reach coming off of pad when reducing plug-in unit and reprocessing, improve the acceptance rate that plug-in unit is reprocessed, reduce scrapping of veneer, reduce production costs; The change of pad can also can directly be revised on the PCB substrate by the encapsulation storehouse.
Referring to Fig. 2, a kind of printed circuit board (PCB), substrate 7 is provided with insert hole 1, and insert hole 1 is four, and single setting, the original pad 2 of representative in the dotted line, pad 3 is the pad behind the increase area, the area of pad 3 is 1.5 times of corresponding insert hole 1 area, the edge spacing is greater than 0.7mm between the pad 3, the outer ring of pad 3 is shaped as ellipse, and the insert hole 1 in the middle of being positioned at is located at the centre position of oval pad 3, and the insert hole 1 that is positioned at both sides is located at the inboard of oval pad 3; Two pad 2 enlarged areas that promptly mediate adopt expansion up and down, and pad 2 enlarged areas in both sides adopt the mode of expansion to the periphery, guarantee that the edge spacing is greater than 0.7mm between the pad 2.
For single insert hole, bond pad shapes does not limit, be preferably ellipse, need to guarantee the pad edge spacing greater than 0.7mm because the wave-soldering technological ability, less than the easy short circuit of 0.7mm, bonding pad area is 1-7 a times of corresponding insert hole area, increased bonding pad area, the arrangement mode of present embodiment has guaranteed the distance between the pad, easy cabling, and be difficult for short circuit, the coming off of pad when reducing plug-in unit and reprocessing has and improves the acceptance rate that plug-in unit is reprocessed, that reduces veneer scraps the advantage that reduces production costs.
Referring to Fig. 3, a kind of printed circuit board (PCB), substrate 7 is provided with insert hole 1, the original pad 2 of representative in the dotted line, pad 3 is the pad behind the increase area, the area of pad 3 is 1.5 times of pad 2 areas, insert hole 1 is 16, divides 4 rows to be provided with, and the edge spacing is greater than 0.7mm between the pad 3, wherein, the area of 14 pads 3 in outer ring is 1.5 times of corresponding insert hole 1 area, and the area of 2 pads 3 of inner ring is 1 times of corresponding insert hole 1 area, and the area of 14 pads in outer ring outwards expands to ellipse, the area of 2 pads of inner ring can be according to easy cabling between the pad 3, and the requirement that is difficult for short circuit is arbitrarily expanded.
For many rows insert hole, bond pad shapes does not limit, and guarantees the pad edge spacing greater than 0.7mm, is guaranteeing distance between the pad, and cabling is difficult under the prerequisite of short circuit easily, the bonding pad area outer ring pad of increase be 1-7 doubly, inner ring be 1-3.5 times.Increase coming off of pad when reducing plug-in unit behind the bonding pad area and reprocessing, reduce production costs.
Referring to Fig. 4, a kind of printed circuit board (PCB), substrate 7 are provided with insert hole 1 and pad 3, and pad 3 peripheries are provided with big Copper Foil, and pad 3 fuses the length 1.5mm of cabling 5 by cabling 5 and big Copper Foil 4.Referring to Fig. 5, the big Copper Foil 4 that pad 3 connects on other number of plies substrate 7, the number of plies is no more than 3 layers, and is the connection of flower pad.
Insert hole is when big Copper Foil on other number of plies substrate is connected, and the heat radiation above three layers is very fast, manual welding and reprocess difficulty, it is few more good more to connect the number of plies, from present lead-free process result of the test, it is more little to connect the number of plies, and it is good more to weld and reprocess performance, the advantage that the flower pad connects is to reduce the conductor area, reduce radiating rate and efficient, thereby reduce welding temperature, welding temperature reduces, the thermal shock that pad and base material junction are subjected to is more little, and the possibility that pad comes off is more little.Present embodiment can reduce flatiron temperature by reducing radiating rate, can reduce the thermal shock at pad place, and the thermal shock that pad and base material junction are subjected to is more little, and pad is not easy to come off more; In addition on the one hand, radiating rate reduces, and the tin cream setting rate is slack-off, also can have the more time that plug-in unit is removed, and perhaps liquid solder is removed.The length of cabling is greater than 1.5mm, and preferably at 1.5-2.0mm, the control track lengths reduces radiating rate and efficient, thereby reduces the possibility that pad comes off.
Referring to Fig. 6, pad 3 is provided with solder mask 6, solder mask 6 preferred green oil layer or green oil enamelled coatings.A part is exposed above the pad 3, covers solder mask 6 above another part, and solder mask 6 extends to substrate 7 surfaces.
Adopt the mode of welding resistance definition to add large bonding pad, adopt the mode of welding resistance definition, be on pad, to cover green oil, be equivalent to one deck coverlay many, being solder mask covers the junction of pad and substrate, increases the pad adhesion, prevents coming off of pad when plug-in unit is reprocessed, PCB making ability is generally 10mil, wave-soldering working ability recommendation 〉=28mil.
Embodiment of the present utility model by increase bonding pad area, by the mode design of welding resistance definition, by adopting cabling and big Copper Foil ways of connecting, in the distance that guarantees between the pad, easy cabling, and be difficult under the prerequisite of short circuit, reduce the problem that pad comes off in the plug-in unit rework process, improve the acceptance rate that plug-in unit is reprocessed, reduce scrapping of veneer, reduce cost.
The above only is preferred embodiment of the present utility model, and is in order to restriction the utility model, not all within spirit of the present utility model and principle, any modification of being done, is equal to replacement, improvement etc., all should be included within the protection range of the present utility model.
Claims (9)
1. a printed circuit board (PCB) comprises substrate, is located at insert hole and pad on the substrate, it is characterized in that, the area of described pad is 1-7 a times of corresponding insert hole area.
2. printed circuit board (PCB) according to claim 1 is characterized in that, described pad is circular or square.
3. printed circuit board (PCB) according to claim 1, it is characterized in that, described pad is oval, when described insert hole is more than three, and during single the setting, insert hole in the middle of being positioned at is located at the centre position of corresponding oval pad, and the insert hole that is positioned at both sides is located at the inboard of corresponding oval pad.
4. printed circuit board (PCB) according to claim 1 is characterized in that, described insert hole is more than three rows, and wherein, the area that is positioned at the outer ring pad is 1-7 a times of corresponding insert hole area, and the area that is positioned at the inner ring pad is 1-3.5 a times of corresponding insert hole area.
5. printed circuit board (PCB) according to claim 4 is characterized in that, described outer ring pad is oval, and the insert hole that is positioned at the outer ring is located at the inboard of corresponding oval pad.
6. according to each described printed circuit board (PCB) of claim 1 to 5, it is characterized in that described pad is provided with big Copper Foil outward, described pad links to each other with described big Copper Foil by cabling, described pad connects the big Copper Foil on other number of plies substrate, and the described number of plies is no more than 3 layers.
7. printed circuit board (PCB) according to claim 6 is characterized in that, the length of described cabling is 1.5-2.0mm.
8. according to each described printed circuit board (PCB) of claim 1 to 5, it is characterized in that a part is exposed above the described pad, covers solder mask above another part, described solder mask extends to substrate surface.
9. printed circuit board (PCB) according to claim 8 is characterized in that, described solder mask is green oil layer or green oil enamelled coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201127026U CN201601891U (en) | 2010-02-08 | 2010-02-08 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201127026U CN201601891U (en) | 2010-02-08 | 2010-02-08 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201601891U true CN201601891U (en) | 2010-10-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201127026U Expired - Lifetime CN201601891U (en) | 2010-02-08 | 2010-02-08 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201601891U (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102458046A (en) * | 2011-09-28 | 2012-05-16 | 柏承科技(昆山)股份有限公司 | Structure and method for improving shape of bonding pad and limiting diffusion of solder paste |
| CN102651944A (en) * | 2011-02-22 | 2012-08-29 | 矢崎总业株式会社 | Wiring board and manufacturing method thereof |
| CN102937611A (en) * | 2012-12-06 | 2013-02-20 | 华为技术有限公司 | Corrosion risk prompting method and early warning system |
| CN103391680A (en) * | 2012-05-10 | 2013-11-13 | 珠海格力电器股份有限公司 | PCB (printed circuit board) welding pad assembly and PCB |
| CN103813625A (en) * | 2012-11-08 | 2014-05-21 | 上海斐讯数据通信技术有限公司 | Printed circuit board pad |
| CN104270887A (en) * | 2014-09-17 | 2015-01-07 | 惠州Tcl移动通信有限公司 | Combined land structure and BAG circuit board |
| CN104270903A (en) * | 2014-10-13 | 2015-01-07 | 浪潮(北京)电子信息产业有限公司 | PCB tinning method and device |
| CN104411088A (en) * | 2014-12-02 | 2015-03-11 | 青岛歌尔声学科技有限公司 | Anti-dropping bonding pad, circuit board, and circuit board printing method |
| CN105682349A (en) * | 2016-03-30 | 2016-06-15 | 广东欧珀移动通信有限公司 | Pad structure, circuit board using same and mobile terminal |
| CN106385762A (en) * | 2016-04-28 | 2017-02-08 | 上海斐讯数据通信技术有限公司 | PCB structure |
| CN112074082A (en) * | 2020-08-21 | 2020-12-11 | 苏州浪潮智能科技有限公司 | Capacitor Pin Pin structure based on tin soldering and PCB |
-
2010
- 2010-02-08 CN CN2010201127026U patent/CN201601891U/en not_active Expired - Lifetime
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102651944A (en) * | 2011-02-22 | 2012-08-29 | 矢崎总业株式会社 | Wiring board and manufacturing method thereof |
| US9693466B2 (en) | 2011-02-22 | 2017-06-27 | Yazaki Corporation | Wiring board and manufacturing method thereof |
| CN102458046A (en) * | 2011-09-28 | 2012-05-16 | 柏承科技(昆山)股份有限公司 | Structure and method for improving shape of bonding pad and limiting diffusion of solder paste |
| CN103391680B (en) * | 2012-05-10 | 2016-12-14 | 珠海格力电器股份有限公司 | PCB (printed circuit board) welding pad assembly and PCB |
| CN103391680A (en) * | 2012-05-10 | 2013-11-13 | 珠海格力电器股份有限公司 | PCB (printed circuit board) welding pad assembly and PCB |
| CN103813625A (en) * | 2012-11-08 | 2014-05-21 | 上海斐讯数据通信技术有限公司 | Printed circuit board pad |
| CN103813625B (en) * | 2012-11-08 | 2018-01-16 | 上海斐讯数据通信技术有限公司 | Printed circuit board pad |
| CN102937611A (en) * | 2012-12-06 | 2013-02-20 | 华为技术有限公司 | Corrosion risk prompting method and early warning system |
| CN104270887A (en) * | 2014-09-17 | 2015-01-07 | 惠州Tcl移动通信有限公司 | Combined land structure and BAG circuit board |
| CN104270903A (en) * | 2014-10-13 | 2015-01-07 | 浪潮(北京)电子信息产业有限公司 | PCB tinning method and device |
| CN104270903B (en) * | 2014-10-13 | 2017-05-31 | 浪潮(北京)电子信息产业有限公司 | A kind of method and apparatus for realizing tin on PCB |
| CN104411088A (en) * | 2014-12-02 | 2015-03-11 | 青岛歌尔声学科技有限公司 | Anti-dropping bonding pad, circuit board, and circuit board printing method |
| CN105682349A (en) * | 2016-03-30 | 2016-06-15 | 广东欧珀移动通信有限公司 | Pad structure, circuit board using same and mobile terminal |
| CN106385762A (en) * | 2016-04-28 | 2017-02-08 | 上海斐讯数据通信技术有限公司 | PCB structure |
| CN112074082A (en) * | 2020-08-21 | 2020-12-11 | 苏州浪潮智能科技有限公司 | Capacitor Pin Pin structure based on tin soldering and PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171106 Address after: Metro Songshan Lake high tech Industrial Development Zone, Guangdong Province, Dongguan City Road 523808 No. 2 South Factory (1) project B2 -5 production workshop Patentee after: HUAWEI terminal (Dongguan) Co., Ltd. Address before: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No. Patentee before: Huawei Device Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee after: Huawei Device Co., Ltd. Address before: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee before: HUAWEI terminal (Dongguan) Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101006 |