CN104754856A - Method for arranging solder ball on printed circuit board - Google Patents
Method for arranging solder ball on printed circuit board Download PDFInfo
- Publication number
- CN104754856A CN104754856A CN201310750023.XA CN201310750023A CN104754856A CN 104754856 A CN104754856 A CN 104754856A CN 201310750023 A CN201310750023 A CN 201310750023A CN 104754856 A CN104754856 A CN 104754856A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- steel mesh
- circular open
- layer
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a method for arranging a solder ball on a printed circuit board. The method for arranging the solder ball on the printed circuit board includes that step A, designing at least one round opening in a steel mesh layer; step B, comparing the steel mesh layer with a printed circuit board pattern layer with a hole, and deleting the round openings which are overlapped with the hole or away from the hole by the clearance smaller than a pin safety clearance; C, manufacturing a steel mesh according to a steel mesh layer design drawing of the step B; step D, using the steel mesh to coat solder paste on a substrate, and forming the solder ball at the round opening position of the steel mesh after performing reflow soldering. The method for arranging the solder ball on the printed circuit board can form the solder ball for cooling, the cost is low, the operation is easy to perform, and the method is realized through opening a window on the steel mesh. Through comparing with the hole in the PCB board and deleting the round openings which are overlapped with the hole or away from the hole by the clearance smaller than the pin safety clearance, the solder ball forming at the hole is avoided, and the solder leakage phenomenon can be avoided.
Description
Technical field
The present invention relates to printed circuit field, particularly relate to a kind of method that tin ball is set on a printed circuit.
Background technology
For the printed circuit board (pcb) design of multilayer, as four laminates (signal/ground/power supply/signal), when there being multiple thermal source (as DC-DC, AP etc.), needing for Printed Circuit Board Design radiator structure, windowing such as effects on surface.
But for the printed circuit board that caloric value is larger, the heat radiation windowed in surface is still inadequate.
Summary of the invention
Based on this, in order to solve heat dissipation problem, be necessary to provide a kind of method arranging tin ball on a printed circuit.
A method for tin ball is set on a printed circuit, comprises the following steps: steps A, steel mesh layer designs at least one circular open; Step B, compares described steel mesh layer and the printed circuit board (PCB) layer designing via hole, deletes overlapping with via hole and be less than the circular open of pin safe spacing with the spacing of via hole; Step C, manufactures steel mesh according to the steel mesh layer design drawing that step B obtains; Step D, uses described steel mesh to be coated with tin cream on substrate, has the position formation tin ball of circular open after reflow soldering at steel mesh.
Wherein in an embodiment, described steps A arranges circular open on the position that the Liang Tong district with described printed circuit board (PCB) is corresponding.
Wherein in an embodiment, also comprise the step of deleting the circular open be positioned at outside Liang Tong district.
Wherein in an embodiment, described step B comprises: B1, sets up the first layer, places the circular open identical with described steel mesh layer in described first layer front; B2, sets up forbidding wiring area attribute and being set to permission covering copper sheet of the first layer, and described first layer is saved as PCB encapsulation in order to calling; B3, the layer of described printed circuit board (PCB) is called described PCB and encapsulates, and described PCB encapsulation is placed on the Liang Tong district of the layer of described printed circuit board (PCB) and arranges pin safe spacing; B4, deletes the circular open being less than described pin safe spacing with the spacing of described via hole.
Wherein in an embodiment, the diameter of described circular open is 10 mils.
Wherein in an embodiment, described pin safe spacing is 10 mils.
Wherein in an embodiment, described step B4 also comprises the step of deleting the circular open be positioned at outside Liang Tong district.
Wherein in an embodiment, be also included in the bottom surface of described printed circuit board (PCB) by the step of described circular open mirror image remaining after step B4.
The above-mentioned method arranging tin ball on a printed circuit, form tin ball and dispel the heat, cost is low, simple to operate, by realizing at steel mesh uplifting window.And by comparing with the hole site of crossing on PCB, deleting overlapping with via hole and being less than the circular open of pin safe spacing with the spacing of via hole, avoid forming tin ball at via hole place, can anti-leak-stopping tin phenomenon.
Accompanying drawing explanation
Fig. 1 is the flow chart of the method arranging tin ball in an embodiment on a printed circuit;
Fig. 2 is the flow chart of a specific implementation of step S120 in an embodiment.
Embodiment
For enabling object of the present invention, feature and advantage more become apparent, and are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.
The present invention, by arranging tin ball at the correct position on printed circuit board (PCB) (PCB) surface, utilizes the good thermal conductivity of tin ball to strengthen the heat radiation of printed circuit board (PCB).Fig. 1 is the flow chart of the method arranging tin ball in an embodiment on a printed circuit, comprising:
S110, steel mesh layer designs at least one circular open.
In the manufacture process of printed circuit board (PCB), need to be coated with tin cream (paste) at least one side of PCB, and steel mesh can cover on PCB when being coated with tin cream, shape and the size of the tin therefore PCB formed determined by the opening of steel mesh.
Circular open on steel mesh forms tin ball after making coating tin cream on a printed circuit, in the present embodiment, be 10mil by the diameter design of circular open, those skilled in the art can select according to actual product demand the size designing circular open voluntarily in other embodiments.Understandable, the quantity of circular open can be selected according to radiating requirements, and the more radiating effects of general quantity are stronger.
In the present embodiment, circular open is arranged on position corresponding in the Liang Tong district of printed circuit board (PCB).Printed circuit board (PCB) can be covered with large-area copper sheet (not covering green oil) as zone network, as the large area Fu Tongjiliang copper district of zone network.Position beyond Liang Tong district should not be formed heat radiation tin ball.
S120, compares steel mesh layer and the PCB layer designing via hole, deletes the circular open being less than pin safe spacing with the spacing of via hole.
Liang Tong district can offer via hole, if circular open overlaps with via hole, then can cause leakage tin, forms potential safety hazard.Therefore should, by selecting suitable aperture position, tin ball and via area can be staggered when designing steel mesh layer.Time relatively can by steel mesh layer and printed circuit board diagram stacked together, this makes it possible to find out easily the circular open that/spacing overlapping with via hole is less than pin safe spacing.In order to raise the efficiency, also can judge by software.Pin safe spacing (GAP spacing) can be set to 10mil when judging by software.
In a preferred embodiment, also need to delete the circular open be positioned at outside Liang Tong district.
S130, manufactures steel mesh according to steel mesh layer design drawing.
In step S120 after the inappropriate circular open in delete position, just can manufacture steel mesh according to the design drawing of this steel mesh layer.
S140, uses steel mesh to be coated with tin cream on substrate, has the position formation heat radiation tin ball of circular open after reflow soldering at steel mesh.
Steel mesh covers on the substrate of PCB when being coated with tin cream, carries out spacing and shaping to tin cream.
The above-mentioned method arranging tin ball on a printed circuit, form tin ball and dispel the heat, cost is low, simple to operate, can realize at steel mesh uplifting window.And by comparing with the hole site of crossing on PCB, avoid forming tin ball at via hole place, can anti-leak-stopping tin phenomenon.
Fig. 2 is the flow chart of a specific implementation of step S120 in an embodiment, comprising:
S121, sets up a layer, places the circular open identical with steel mesh layer in this layer front.
All identical with the steel mesh layer circular open such as size, position is placed at the top layer of route keepout.
S122, set up layer forbid wiring area attribute and this setup of attribute for allow cover copper sheet, and layer is saved as PCB encapsulation in order to calling.
In the present embodiment, can encapsulate software for editing by using allegro, the shapes allowed function arranging the layer keepout set up in S121 realizes.Namely PCB encapsulation can be saved as after being provided with.
S123, calls PCB encapsulation on a printed circuit, and PCB encapsulation is placed on the Liang Tong district of printed circuit board (PCB) and arranges pin safe spacing.
The layer of printed circuit board (PCB) is called this PCB encapsulate, Liang Tongqu designs via hole, and pin safe spacing is set to 10mil.
S124, deletes the circular open being less than pin safe spacing with the spacing of via hole, and is positioned at the circular open outside Liang Tong district.
Call PCB to encapsulate and after setting pin safe spacing, software meeting reports an error to the circular open that the spacing with via hole is less than pin safe spacing automatically, and the circular open be positioned at outside Liang Tong district is reported an error, these circular opens can be stamped error flag, therefore can delete by the circular open stamping error flag easily.
S125, in the bottom surface of printed circuit board (PCB) by remaining circular open mirror image.
For some pcb boards, need all to add tin ball at tow sides.Therefore for Bottom face, need by step S124 delete after PCB encapsulation in also remaining circular open (tin ball) carry out mirror image.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (8)
1. a method for tin ball is set on a printed circuit, comprises the following steps:
Steps A, steel mesh layer designs at least one circular open;
Step B, compares described steel mesh layer and the printed circuit board (PCB) layer designing via hole, deletes overlapping with via hole and be less than the circular open of pin safe spacing with the spacing of via hole;
Step C, manufactures steel mesh according to the steel mesh layer design drawing that step B obtains;
Step D, uses described steel mesh to be coated with tin cream on substrate, has the position formation tin ball of circular open after reflow soldering at steel mesh.
2. the method arranging tin ball on a printed circuit according to claim 1, is characterized in that, described steps A arranges circular open on the position that the Liang Tong district with described printed circuit board (PCB) is corresponding.
3. the method arranging tin ball on a printed circuit according to claim 2, is characterized in that, also comprises the step of deleting the circular open be positioned at outside Liang Tong district.
4. the method arranging tin ball on a printed circuit according to claim 1, is characterized in that, described step B comprises:
B1, sets up the first layer, places the circular open identical with described steel mesh layer in described first layer front;
B2, sets up forbidding wiring area attribute and being set to permission covering copper sheet of the first layer, and described first layer is saved as PCB encapsulation in order to calling;
B3, the layer of described printed circuit board (PCB) is called described PCB and encapsulates, and described PCB encapsulation is placed on the Liang Tong district of the layer of described printed circuit board (PCB) and arranges pin safe spacing;
B4, deletes the circular open being less than described pin safe spacing with the spacing of described via hole.
5. according to the method arranging tin ball on a printed circuit in claim 1-4 described in any one, it is characterized in that, the diameter of described circular open is 10 mils.
6. the method arranging tin ball on a printed circuit according to claim 5, is characterized in that, described pin safe spacing is 10 mils.
7. the method arranging tin ball on a printed circuit according to claim 4, is characterized in that, described step B4 also comprises the step of deleting the circular open be positioned at outside Liang Tong district.
8. the method arranging tin ball on a printed circuit according to claim 7, is characterized in that, is also included in the bottom surface of described printed circuit board (PCB) by the step of described circular open mirror image remaining after step B4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310750023.XA CN104754856B (en) | 2013-12-30 | 2013-12-30 | The method that tin ball is set on a printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310750023.XA CN104754856B (en) | 2013-12-30 | 2013-12-30 | The method that tin ball is set on a printed circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104754856A true CN104754856A (en) | 2015-07-01 |
| CN104754856B CN104754856B (en) | 2018-05-01 |
Family
ID=53593776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310750023.XA Active CN104754856B (en) | 2013-12-30 | 2013-12-30 | The method that tin ball is set on a printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104754856B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105025653A (en) * | 2015-08-20 | 2015-11-04 | 广东威创视讯科技股份有限公司 | Printed circuit board and preparation method thereof |
| CN107885950A (en) * | 2017-11-24 | 2018-04-06 | 郑州云海信息技术有限公司 | A kind of method that overlapping via is deleted in PCB design |
| CN108901143A (en) * | 2018-08-31 | 2018-11-27 | 郑州云海信息技术有限公司 | Web plate processing method for Through-hole reflow |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1460293A (en) * | 2001-04-09 | 2003-12-03 | 株式会社住友金属电设备 | Radiation type BGA package and production method therefor |
| JP2004172514A (en) * | 2002-11-22 | 2004-06-17 | Ngk Spark Plug Co Ltd | Wiring board and its manufacturing method |
| CN201039580Y (en) * | 2006-10-09 | 2008-03-19 | 华为技术有限公司 | A PCB board and corresponding circuit board printing device and steel mesh |
| CN103094234A (en) * | 2012-12-14 | 2013-05-08 | 华天科技（西安）有限公司 | Extension pin Fan-out Panel Level ball grid array (BGA) package part and manufacture process thereof |
| CN203120303U (en) * | 2012-12-14 | 2013-08-07 | 深圳市共进电子股份有限公司 | Apparatus used for manufacturing heat dissipation structure of printed circuit board |
-
2013
- 2013-12-30 CN CN201310750023.XA patent/CN104754856B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1460293A (en) * | 2001-04-09 | 2003-12-03 | 株式会社住友金属电设备 | Radiation type BGA package and production method therefor |
| JP2004172514A (en) * | 2002-11-22 | 2004-06-17 | Ngk Spark Plug Co Ltd | Wiring board and its manufacturing method |
| CN201039580Y (en) * | 2006-10-09 | 2008-03-19 | 华为技术有限公司 | A PCB board and corresponding circuit board printing device and steel mesh |
| CN103094234A (en) * | 2012-12-14 | 2013-05-08 | 华天科技（西安）有限公司 | Extension pin Fan-out Panel Level ball grid array (BGA) package part and manufacture process thereof |
| CN203120303U (en) * | 2012-12-14 | 2013-08-07 | 深圳市共进电子股份有限公司 | Apparatus used for manufacturing heat dissipation structure of printed circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105025653A (en) * | 2015-08-20 | 2015-11-04 | 广东威创视讯科技股份有限公司 | Printed circuit board and preparation method thereof |
| CN105025653B (en) * | 2015-08-20 | 2018-05-08 | 广东威创视讯科技股份有限公司 | Printed wiring board and preparation method thereof |
| CN107885950A (en) * | 2017-11-24 | 2018-04-06 | 郑州云海信息技术有限公司 | A kind of method that overlapping via is deleted in PCB design |
| CN108901143A (en) * | 2018-08-31 | 2018-11-27 | 郑州云海信息技术有限公司 | Web plate processing method for Through-hole reflow |
| CN108901143B (en) * | 2018-08-31 | 2021-03-23 | 苏州浪潮智能科技有限公司 | Screen processing method for through hole reflow soldering |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104754856B (en) | 2018-05-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202285232U (en) | Printed circuit board (PCB) radiating pad structure for quad flat no lead (QFN) encapsulated component | |
| CN201601891U (en) | Printed circuit board | |
| US20160157346A1 (en) | Printed Circuit Board, Ball Grid Array Package and Wiring Method of Printed Circuit Board | |
| CN205282221U (en) | Transformer bearing and use electron device of this transformer bearing | |
| CN104602446A (en) | Substrate structure and manufacturing method thereof | |
| CN206851157U (en) | A kind of welding resistance fenestration, printed circuit board (PCB) and electronic equipment | |
| CN104754856A (en) | Method for arranging solder ball on printed circuit board | |
| CN104302097A (en) | Multilayer printed circuit board | |
| US20140027162A1 (en) | Printed circuit board and method for manufacturing a printed circuit board | |
| CN105873363A (en) | Welding structure | |
| CN111800957B (en) | Method for increasing current capacity of aluminum substrate circuit board | |
| WO2020224480A1 (en) | Package capable of preventing layered channeling of tin and manufacturing method therefor | |
| CN109561644B (en) | Preparation method of circuit board assembly, circuit board assembly and mobile terminal | |
| CN202103945U (en) | Circuit board for assembling LED (light-emitting diode) | |
| KR102488402B1 (en) | Printed circuit board, manufacturing method of printed circuit board and mobile terminal | |
| CN204887685U (en) | Printed circuit board and terminal with heat radiation structure | |
| CN206004999U (en) | Pcb board | |
| CN204335161U (en) | Pcb board | |
| CN104582307A (en) | Device packaging method and system | |
| CN205789927U (en) | Reduce the power supply chip encapsulating structure of heat radiation interference | |
| CN204707347U (en) | A kind of printed circuit board (PCB) | |
| CN204518212U (en) | The pcb board of current carrying capacity can be increased | |
| CN103050475B (en) | Anti-warping packaging substrate | |
| CN207354702U (en) | Pad structure and its PCB components of welding | |
| CN202385400U (en) | Novel high-efficiency automatic-radiating PCB (printed circuit board) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |