CN104754856B - The method that tin ball is set on a printed circuit - Google Patents
The method that tin ball is set on a printed circuit Download PDFInfo
- Publication number
- CN104754856B CN104754856B CN201310750023.XA CN201310750023A CN104754856B CN 104754856 B CN104754856 B CN 104754856B CN 201310750023 A CN201310750023 A CN 201310750023A CN 104754856 B CN104754856 B CN 104754856B
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- CN
- China
- Prior art keywords
- printed circuit
- circular open
- steel mesh
- pcb
- layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
Abstract
The invention discloses a kind of method for setting tin ball on a printed circuit, comprise the following steps：Step A, designs at least one circular open on steel mesh layer；Step B, by the steel mesh layer compared with the printed circuit board (PCB) figure layer for having designed via, deletes the circular open for being smaller than pin safe spacing overlapping with via and with via；Step C, the steel mesh layer design drawing obtained according to step B manufacture steel mesh；Step D, tin cream is coated with using the steel mesh on substrate, and formation tin ball at the position of circular open is provided with steel mesh after reflow soldering.The present invention can form tin ball and radiate, and cost is low, easy to operate, by can be achieved in steel mesh uplifting window.And by being compared with the hole site of crossing on PCB, delete the circular open for being smaller than pin safe spacing overlapping with via and with via, avoid forming tin ball at via, being capable of anti-leak-stopping tin phenomenon.
Description
Technical field
The present invention relates to printed circuit field, more particularly to a kind of method for setting tin ball on a printed circuit.
Background technology
For the printed circuit board of multilayer（PCB）For design, such as four laminates（Signal/ground/power supply/signal）, it is more when having
A heat source（Such as DC-DC, AP etc.）When, it is necessary to be Printed Circuit Board Design radiator structure, such as to outwardly opening a window.
But for the printed circuit board that caloric value is larger, the heat dissipation of surface windowing is still inadequate.
The content of the invention
Based on this, in order to solve heat dissipation problem, it is necessary to provide a kind of method for setting tin ball on a printed circuit.
A kind of method for setting tin ball on a printed circuit, comprises the following steps：Step A, designed on steel mesh layer to
A few circular open；Step B, by the steel mesh layer compared with the printed circuit board (PCB) figure layer for having designed via, is deleted
The circular open overlapping with via and with via for being smaller than pin safe spacing；Step C, the steel obtained according to step B
Stratum reticulare design drawing manufactures steel mesh；Step D, is coated with tin cream using the steel mesh on substrate, circle is provided with steel mesh after reflow soldering
Tin ball is formed at the position of shape opening.
In one of the embodiments, the step A is on position corresponding with the Liang Tongqu of the printed circuit board (PCB)
Circular open is set.
In one of the embodiments, the step of further including the circular open deleted and be located at outside Liang Tong areas.
In one of the embodiments, the step B includes：B1, establishes the first figure layer, is put in the first figure layer front
Put the circular open identical with the steel mesh layer；B2, adds forbidding wiring area attribute and being set to allow to cover for the first figure layer
Copper sheet, and first figure layer is saved as into PCB and is packaged for calling；B3, calls institute in the figure layer of the printed circuit board (PCB)
PCB encapsulation is stated, PCB encapsulation is placed on to the Liang Tong areas of the figure layer of the printed circuit board (PCB) and pin safe spacing is set；
B4, deletes the circular open for being smaller than the pin safe spacing with the via.
In one of the embodiments, a diameter of 10 mil of the circular open.
In one of the embodiments, the pin safe spacing is 10 mils.
In one of the embodiments, the step B4 further includes the step of deleting the circular open outside Liang Tong areas.
In one of the embodiments, the bottom surface of the printed circuit board (PCB) is additionally included in by the remaining circle after step B4
The step of shape opening mirror image.
The above-mentioned method for setting tin ball on a printed circuit, forms tin ball and radiates, and cost is low, easy to operate, leads to
Cross and can be achieved in steel mesh uplifting window.And by with PCB cross hole site be compared, delete it is overlapping with via and with mistake
The circular open for being smaller than pin safe spacing in hole, avoids forming tin ball at via, being capable of anti-leak-stopping tin phenomenon.
Brief description of the drawings
Fig. 1 is the flow chart for the method for setting tin ball in an embodiment on a printed circuit；
Fig. 2 is the flow chart of a specific implementation of step S120 in an embodiment.
Embodiment
It is understandable to enable objects, features and advantages of the present invention to become apparent, below in conjunction with the accompanying drawings to the tool of the present invention
Body embodiment is described in detail.
The present invention is by printed circuit board (PCB)（PCB）The suitable position on surface sets tin ball, utilizes the good heat conduction of tin ball
Property strengthens the heat dissipation of printed circuit board (PCB).Fig. 1 is the flow chart for the method for setting tin ball in an embodiment on a printed circuit,
Including：
S110, designs at least one circular open on steel mesh layer.
, it is necessary to be coated with tin cream at least one side of PCB in the manufacturing process of printed circuit board (PCB)（paste）, and steel mesh
It can be covered in when being coated with tin cream on PCB, therefore the shapes and sizes of the tin formed on PCB are determined by the opening of steel mesh.
Circular open on steel mesh forms tin ball on a printed circuit after causing coating tin cream, in the present embodiment,
It is 10mil by the diameter design of circular open, those skilled in the art can be according to actual product demand in other embodiments
The voluntarily size of selection design circular open.It should be understood that the quantity of circular open can be selected according to radiating requirements, generally
Quantity is more, and heat dissipation effect is stronger.
In the present embodiment, circular open is arranged in the Liang Tong areas of printed circuit board (PCB) on corresponding position.Printed circuit
The copper sheet of large area can be covered with plate（Do not cover green oil）As ground network, the large area Fu Tongjiliang copper area as ground network.
Heat dissipation tin ball should not be formed on position beyond Liang Tong areas.
S120, by steel mesh layer compared with the PCB figure layers for having designed via, deletion is smaller than pin with via
The circular open of safe spacing.
Liang Tong areas can offer via, if circular open is overlapped with via, it will cause leakage tin, it is hidden to form safety
Suffer from.Therefore should be by selecting suitable aperture position when designing steel mesh layer so that tin ball can stagger with via area.When comparing
Can be stacked together by steel mesh layer and printed circuit board diagram, this makes it possible to easily find out ,/spacing overlapping with via is small
In the circular open of pin safe spacing.In order to improve efficiency, can also be judged by software.Judged by software
When can be by pin safe spacing（GAP spacing）It is arranged to 10mil.
In a preferred embodiment, it is also necessary to delete the circular open being located at outside Liang Tong areas.
S130, steel mesh is manufactured according to steel mesh layer design drawing.
In step S120 after the inappropriate circular open in delete position, it is possible to manufacture steel according to the design drawing of this steel mesh layer
Net.
S140, is coated with tin cream using steel mesh on substrate, shape at the position of circular open is provided with steel mesh after reflow soldering
Into heat dissipation tin ball.
Steel mesh is covered on the substrate of PCB when being coated with tin cream, and spacing and shaping is carried out to tin cream.
The above-mentioned method for setting tin ball on a printed circuit, forms tin ball and radiates, and cost is low, easy to operate,
Steel mesh uplifting window can be achieved.And by being compared with the hole site of crossing on PCB, avoid forming tin ball at via, can
Anti- leak-stopping tin phenomenon.
Fig. 2 is the flow chart of a specific implementation of step S120 in an embodiment, including：
S121, establishes a figure layer, and the circular open identical with steel mesh layer is placed in figure layer front.
The top layers of route keepout place size, position etc. with the identical circular open of steel mesh layer.
S122, add figure layer forbid wiring area attribute and this attribute is positioned to allow for covering copper sheet, and figure layer is protected
PCB is saved as to be packaged for calling.
In the present embodiment, software for editing can be encapsulated by using allegro, the figure layer established in S121 is set
The shapes allowed functions of keepout are realized.PCB encapsulation can be saved as after being provided with.
S123, calls PCB encapsulation on a printed circuit, and PCB encapsulation is placed on the Liang Tong areas of printed circuit board (PCB) and is set
Put pin safe spacing.
This PCB is called to encapsulate in the figure layer of printed circuit board (PCB), Liang Tongqu has designed via, and pin safe spacing is set
For 10mil.
S124, deletes the circular open for being smaller than pin safe spacing with via, and the circle outside Liang Tong areas
Shape opening.
Call after PCB encapsulate and set pin safe spacing, software can the pin that is smaller than of automatic pair and via pacify
The circular open of full spacing reports an error, and the circular open being pointed to outside Liang Tong areas reports an error, these circular opens can be labeled with mistake
It is mis-marked, therefore easily can delete the circular open for being labeled with error flag.
S125, in the bottom surface of printed circuit board (PCB) by remaining circular open mirror image.
For some pcb boards, it is necessary to all add tin ball in tow sides.Therefore for Bottom faces, it is necessary to by step S124
Still remaining circular open in PCB encapsulation after deletion（Tin ball）Carry out mirror image.
Embodiment described above only expresses the several embodiments of the present invention, its description is more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (7)
1. a kind of method for setting tin ball on a printed circuit, comprises the following steps：
Step A, designs at least one circular open on steel mesh layer；
Step B, by the steel mesh layer compared with the printed circuit board (PCB) figure layer for having designed via, delete it is overlapping with via with
And the circular open for being smaller than pin safe spacing with via；
Step C, the steel mesh layer design drawing obtained according to step B manufacture steel mesh；
Step D, is coated with tin cream using the steel mesh on substrate, shape at the position of circular open is provided with steel mesh after reflow soldering
Cheng Xiqiu；
The step B includes：
B1, establishes the first figure layer, sets the identical circle of circular open with steel mesh layer to open in first figure layer front
Mouthful；
B2, adds forbidding wiring area attribute and being set to allow to cover copper sheet for the first figure layer, and first figure layer is preserved
It is packaged for calling for PCB；
B3, calls the PCB to encapsulate in the figure layer of the printed circuit board (PCB), and PCB encapsulation is placed on the printing electricity
The Liang Tong areas of the figure layer of road plate simultaneously set pin safe spacing；
B4, deletes the circular open for being smaller than the pin safe spacing with the via.
2. the method according to claim 1 that tin ball is set on a printed circuit, it is characterised in that the step A is
Circular open is set on position corresponding with the Liang Tongqu of the printed circuit board (PCB).
3. the method according to claim 2 that tin ball is set on a printed circuit, it is characterised in that further include and delete position
In the circular open outside Liang Tongqu the step of.
4. the method that tin ball is set on a printed circuit according to any one in claim 1-3, it is characterised in that
A diameter of 10 mil of the circular open.
5. the method according to claim 4 that tin ball is set on a printed circuit, it is characterised in that the pin safety
Spacing is 10 mils.
6. the method according to claim 1 that tin ball is set on a printed circuit, it is characterised in that the step B4 is also
The step of including deleting the circular open outside Liang Tong areas.
7. the method according to claim 6 that tin ball is set on a printed circuit, it is characterised in that be additionally included in described
The bottom surface of printed circuit board (PCB) is by after step B4 the step of the remaining circular open mirror image.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310750023.XA CN104754856B (en) | 2013-12-30 | 2013-12-30 | The method that tin ball is set on a printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310750023.XA CN104754856B (en) | 2013-12-30 | 2013-12-30 | The method that tin ball is set on a printed circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104754856A CN104754856A (en) | 2015-07-01 |
| CN104754856B true CN104754856B (en) | 2018-05-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310750023.XA Active CN104754856B (en) | 2013-12-30 | 2013-12-30 | The method that tin ball is set on a printed circuit |
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| Country | Link |
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| CN (1) | CN104754856B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105025653B (en) * | 2015-08-20 | 2018-05-08 | 广东威创视讯科技股份有限公司 | Printed wiring board and preparation method thereof |
| CN107885950A (en) * | 2017-11-24 | 2018-04-06 | 郑州云海信息技术有限公司 | A kind of method that overlapping via is deleted in PCB design |
| CN108901143B (en) * | 2018-08-31 | 2021-03-23 | 苏州浪潮智能科技有限公司 | Screen processing method for through hole reflow soldering |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1460293A (en) * | 2001-04-09 | 2003-12-03 | 株式会社住友金属电设备 | Radiation type BGA package and production method therefor |
| JP2004172514A (en) * | 2002-11-22 | 2004-06-17 | Ngk Spark Plug Co Ltd | Wiring board and its manufacturing method |
| CN201039580Y (en) * | 2006-10-09 | 2008-03-19 | 华为技术有限公司 | A PCB board and corresponding circuit board printing device and steel mesh |
| CN103094234A (en) * | 2012-12-14 | 2013-05-08 | 华天科技（西安）有限公司 | Extension pin Fan-out Panel Level ball grid array (BGA) package part and manufacture process thereof |
| CN203120303U (en) * | 2012-12-14 | 2013-08-07 | 深圳市共进电子股份有限公司 | Apparatus used for manufacturing heat dissipation structure of printed circuit board |
-
2013
- 2013-12-30 CN CN201310750023.XA patent/CN104754856B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1460293A (en) * | 2001-04-09 | 2003-12-03 | 株式会社住友金属电设备 | Radiation type BGA package and production method therefor |
| JP2004172514A (en) * | 2002-11-22 | 2004-06-17 | Ngk Spark Plug Co Ltd | Wiring board and its manufacturing method |
| CN201039580Y (en) * | 2006-10-09 | 2008-03-19 | 华为技术有限公司 | A PCB board and corresponding circuit board printing device and steel mesh |
| CN103094234A (en) * | 2012-12-14 | 2013-05-08 | 华天科技（西安）有限公司 | Extension pin Fan-out Panel Level ball grid array (BGA) package part and manufacture process thereof |
| CN203120303U (en) * | 2012-12-14 | 2013-08-07 | 深圳市共进电子股份有限公司 | Apparatus used for manufacturing heat dissipation structure of printed circuit board |
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| Publication number | Publication date |
|---|---|
| CN104754856A (en) | 2015-07-01 |
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