CN103249273B - Stack board structure - Google Patents
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- CN103249273B CN103249273B CN201210028083.6A CN201210028083A CN103249273B CN 103249273 B CN103249273 B CN 103249273B CN 201210028083 A CN201210028083 A CN 201210028083A CN 103249273 B CN103249273 B CN 103249273B
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Abstract
The present invention proposes a kind of stack board structure, comprises a base board unit, one first framework, an electric conductor unit and a baffle element unit.Base board unit has a first substrate and a second substrate, first framework is between first substrate and second substrate, electric conductor unit has multiple first electric conductor and multiple second electric conductor, multiple first electric conductor is reached respectively by scolding tin and is connected first substrate and the first framework, multiple second electric conductor is reached respectively by scolding tin and is connected second substrate and the first framework, and those first electric conductors are then electrically connected those the second electric conductors.Baffle element unit has at least two the first baffle elements and at least two the second baffle elements, those first baffle elements are around the periphery of multiple first electric conductor, those second baffle elements are around the periphery of multiple second electric conductor, and those first baffle elements are sealed between first substrate and the first framework by scolding tin, those second baffle elements are sealed at by scolding tin between second substrate and the first framework.
Description
Technical field
The present invention relates to a kind of board structure, espespecially a kind of stack board structure for printed circuit board (PCB).
Background technology
Along with the fast development of electric consumers, the various electronic product according to the different demand of consumer is also and then constantly weeded out the old and bring forth the new.In order to make the function of general electronic products more powerful, and attract consumer's desire to purchase further, electronic product will gradually towards compactization development, and thus used printed circuit board (PCB) also just designs towards high density designs layout, stacking up layers structure, micro size, constantly increase function and thin plate.So how to fully take into account the formedness of electric connection in PCB design process, and guarantee that signal is complete, circuit abnormality or signal can not be produced and transmit bad, become the emphasis of present printed circuit board (PCB).
Please refer to shown in Fig. 1, on first substrate 11 and second substrate 12, layout goes out multiple electronic component 13, when first substrate 11 and second substrate 12 carry out storehouse, contact for preventing the electronic component 13 of first substrate 11 and the electronic component 13 of second substrate 12 from producing and cause short circuit, now a framework 14 can be set between first substrate 11 and second substrate 12, the shape of framework 14 is hollow shape, to make, between this first substrate 11 and second substrate 12, there is an accommodation space, the electronic component 13 of first substrate 11 is allowed to be placed in wherein with the electronic component 13 of second substrate 12.And framework about 14 has multiple weld pad 15 respectively, first substrate 11 reaches electric connection through weld pad 15, scolding tin 16 and framework 14 with second substrate 12.
In existing seal type shade (conformalshielding) technology, first substrate 11 is combined with framework 14 and second substrate 12 be combined with framework 14 and encapsulated layer be set after (not indicating encapsulated layer), during for preventing follow-up conductive layer coating process, conductive materials penetrates between first substrate 11 and framework 14 and between second substrate 12 and framework 14, therefore the colloid 17 of insulation can and be injected between first substrate 11 and framework 14 between second substrate 12 and framework 14, colloid 17 can be epoxy resin or thermosetting colloid etc., with the periphery and first making colloid 17 close weld pad 15, second substrate 11, gap between 12 and framework 14, and reach conductive materials when blocking follow-up conductive layer coating process and contact with weld pad 15.But owing to injecting the technique of colloid 17, need spend more several roads processing step, not meet Financial cost, and need the carrying out controlling injecting glue in injecting glue process, process is not easy to control.Therefore, propose energy Simplified flowsheet step and the technique without injecting glue, can significantly enhance productivity.
Summary of the invention
The object of the invention is to provide a kind of stack board structure, uses weld pad to be located between substrate and framework, replaces the colloid of prior art, can not need the technique of carrying out injecting glue in addition thus, can Simplified flowsheet step, increases the efficiency of producing.
The present invention proposes a kind of stack board structure, comprises a base board unit, one first framework, an electric conductor unit and a baffle element unit.Base board unit has a first substrate and a second substrate, and first substrate and second substrate have multiple electronic component respectively, and the first framework is between first substrate and second substrate.Electric conductor unit has multiple first electric conductor and multiple second electric conductor, and the first electric conductor connects first substrate and the first framework, and the second electric conductor connects second substrate and the first framework, and the first electric conductor is then electrically connected the second electric conductor.Baffle element unit has at least two the first baffle elements and at least two the second baffle elements, those first baffle elements are around the periphery of multiple first electric conductor, those second baffle elements are around the periphery of multiple second electric conductor, and those first baffle elements are sealed between first substrate and the first framework by scolding tin and those the first electric conductors, those second baffle elements are sealed between second substrate and the first framework by scolding tin and those the second electric conductors.The present invention uses scolding tin (metal alloy as containing tin, silver or copper) and by the first electric conductor on substrate and the second electric conductor, with the first electric conductor in framework and the second electric conductor, be electrically connected through SMT (surface installation technique) technique and form.
The present invention separately proposes a kind of stack board structure, comprise a first substrate, one first framework, multiple first electric conductor and at least two the first baffle elements, first substrate has multiple electronic component, first framework is positioned at the side of first substrate, multiple first electric conductor connects first substrate and the first framework, at least two the first baffle elements are around the periphery of multiple first electric conductor, and wherein those first baffle elements are sealed at by scolding tin between first substrate and the first framework.The present invention uses scolding tin (metal alloy as containing tin, silver or copper) and by the first electric conductor on substrate, with the first electric conductor in framework, is electrically connected forms through SMT technique.
In sum, stack board structure of the present invention is owing to being arranged between substrate and framework by baffle element, can fully prevent in follow-up conductive layer coating process, conductive materials penetrates between substrate and framework, and the situation that can reduce short circuit or exception occurs.In addition, baffle element and electric conductor can make in same technique, to replace the colloid of prior art, therefore can not need the technique of carrying out injecting glue in addition, can Simplified flowsheet step, and can significantly enhance productivity.
Further understand feature of the present invention and technology contents for enable, refer to following detailed description for the present invention and accompanying drawing, but accompanying drawing only provides reference and explanation use, is not used for being limited the present invention.
Accompanying drawing explanation
Fig. 1 is the generalized section of the stack board structure of prior art.
Fig. 2 is the decomposing schematic representation of stack board structure first embodiment of the present invention.
Fig. 3 is the generalized section of stack board structure first embodiment of the present invention.
Fig. 4 A is the generalized section of printing scolding tin on second electric conductor and the second baffle element of second substrate of stack board structure of the present invention.
Fig. 4 B is the generalized section after combination first framework of stack board structure of the present invention and second substrate.
Fig. 4 C is the generalized section of printing scolding tin on first electric conductor and the first baffle element of the first framework of stack board structure of the present invention.
Fig. 4 D is the generalized section after combination first framework of stack board structure of the present invention and first substrate.
Fig. 5 is the generalized section of the increase encapsulated layer of stack board structure of the present invention.
Fig. 6 is the generalized section of the increase electromagnetic shielding unit of stack board structure of the present invention.
Fig. 7 is the decomposing schematic representation of stack board structure second embodiment of the present invention.
Fig. 8 is the generalized section of stack board structure second embodiment of the present invention.
Fig. 9 is the decomposing schematic representation of stack board structure the 3rd embodiment of the present invention.
Figure 10 is the generalized section of stack board structure the 3rd embodiment of the present invention.
Wherein, description of reference numerals is as follows:
[prior art]
1 stack board structure
11 first substrates
12 second substrates
13 electronic components
14 frameworks
15 weld pads
16 scolding tin
17 colloids
[the present invention]
2 stack board structures
20 base board units
21 first substrates
22 second substrates
23 the 3rd substrates
24 electronic components
25 first frameworks
26 second frameworks
27 electric conductor unit
271 first electric conductors
272 second electric conductors
273 the 3rd electric conductors
28 baffle element unit
281 first baffle elements
282 second baffle elements
283 the 3rd baffle elements
29 scolding tin
30 encapsulated layers
40 electromagnetic shielding unit
Embodiment
[the first embodiment]
Please refer to shown in Fig. 2 and Fig. 3, a kind of stack board structure 2, it comprises base board unit 20,1 first framework 25, electric conductor unit 27 and a baffle element unit 28.First, base board unit 20 has first substrate 21 and a second substrate 22, first substrate 21 is as shown in Fig. 2 (a), second substrate 22 is shown in Fig. 2 (c), first substrate 21 is positioned at the top of second substrate 22, first substrate 21 and second substrate 22 have multiple electronic component 24 respectively, and first substrate 21 and second substrate 22 can be printed circuit board (PCB).
Wherein, one first framework 25 can be set between first substrate 21 and second substrate 22, the first framework 25 is as shown in Fig. 2 (b), that is, first substrate 21 is stacked over the top of the first framework 25, second substrate 22 is arranged at the below of the first framework 25, and forms laminated structure.In the present embodiment, the first framework 25 can be square shape, but the first framework 25 also can be polygon or circular arc, and the shape of the first framework 25 is not limited.And, first framework 25 is the kenel of hollow, therefore an accommodation space can be set up out via the first framework 25 between first substrate 21 and second substrate 22, with the electronic component 24 of accommodating first substrate 21 and second substrate 22, and the first framework 25 can be designed so that because of actual demand that first substrate 21 and second substrate 22 are electrically connected.
Electric conductor unit 27 has multiple first electric conductor 271 and multiple second electric conductor 272, multiple first electric conductor 271 is between first substrate 21 and the first framework 25, multiple second electric conductor 272 is between second substrate 22 and the first framework 25, therefore, first electric conductor 271 is electrically connected first substrate 21 and the first framework 25, second electric conductor 272 is electrically connected second substrate 22 and the first framework 25.Wherein, the first electric conductor 271 on first substrate 21 and the second electric conductor 272 on second substrate are respectively with first electric conductor 271 and second electric conductor 272 of scolding tin 29 (metal alloy containing tin, silver or copper) with the first framework about 25 both sides, be electrically connected through SMT (surface installation technique) technique and form, the first electric conductor 271 and the second electric conductor 272 such as can be weld pad.
In addition, because the first framework 25 has the character of conduction and signal transmission, the second electric conductor 272 is electrically connected to make the first electric conductor 271.Therefore, when circuit signal transmits out from first substrate 21, arrive the first framework 25 through the first electric conductor 271, then via the first framework 25, circuit signal is transferred to the second electric conductor 272, finally by the second electric conductor 272, circuit signal is transferred on second substrate 22.But, also can be the circuit signal transmission means in another kind of direction, that is circuit signal can transmit out from second substrate 22, more sequentially arrive first substrate 21 by the second electric conductor 272, first framework 25 and the first electric conductor 271.In addition, the first framework 25 also can have the function of circuit design, and with the effect making the first framework 25 can have circuit signal transmission and circuit design simultaneously, but the function of the first framework 25 is not limited.
Baffle element unit 28 has at least two the first baffle elements 281 and at least two the second baffle elements 282, and the present invention first baffle element 281 and the second baffle element 282 are the weld pad around framework and the continuous kenel of substrate surrounding.Two the first baffle elements 281 are centered around the periphery of multiple first electric conductor 271 respectively, and two the first baffle elements 281 are reached connection by scolding tin 29 and are thus sealed between first substrate 21 and the first framework 25.Two the second baffle elements 282 are centered around the periphery of multiple second electric conductor 272 respectively, and two the second baffle elements 282 are reached connection by scolding tin 29 and are thus sealed between second substrate 22 and the first framework 25.By the first baffle element 281 and the second baffle element 282 and the combination of scolding tin 29, first substrate 21 can be made and be rendered as closed state between second substrate 22 and the first framework 25, enter to block other penetration.
The manufacture of stack board structure 2, first, refer again to shown in Fig. 2, the first electric conductor 271 and the first baffle element 281 are formed at the downside of first substrate 21, and the first electric conductor 271 and the first baffle element 281 are also formed at the upper side of the first framework 25.And the second electric conductor 272 and the second baffle element 282 are formed at the downside (figure does not indicate) of the first framework 25, the second electric conductor 272 and the second baffle element 282 are also formed at the upper side of second substrate 22.Wherein, form the mode of above-mentioned electric conductor and baffle element, that the peripheral position respectively at substrate or framework prints scolding tin 29, the position that scolding tin 29 is positioned in substrate and framework is mutually corresponding, again by first and second electric conductor 271 above-mentioned, 272 with first and second baffle element 281, 282 are engaged on scolding tin 29, therefore first and second electric conductor 271, the position of 272 can be distinguished mutually corresponding, first and second baffle element 281, the position of 282 also can be distinguished mutually corresponding, via reflow (Reflow) technique, scolding tin 29 is formed afterwards solid-state, electric conductor and baffle element can be fixed on the precalculated position of substrate and framework.
Next, the mode printing scolding tin 29 and assembling substrates and framework can with reference to what follows, but the mode printing scolding tin 29 and assembling substrates and framework is not to be what follows limited.
Please refer to shown in Fig. 4 A, the surface of the second electric conductor 272 first on second substrate 22 and the surface of the second baffle element 282 can print scolding tin 29.Next, as shown in Figure 4 B, second substrate 22 and the first framework 25 are carried out storehouse, allow the second electric conductor 272 and the second baffle element 282 engage through scolding tin 29 respectively.Afterwards, carry out reflow process, also insert heating in high temperature furnace (such as can be IR stove) by it, between temperature range 150 DEG C to 300 DEG C, preferred temperature is 230 DEG C and carries out reflow process, is then cooled to room temperature again.Through reflow process and after being cooled to room temperature, scolding tin 29 can be made to be formed as solid-state, to reach through scolding tin 29 to make the second electric conductor 272 and connect second substrate 22 and the first framework 25, and the second baffle element 282 is reached through scolding tin 29 and is sealed between second substrate 22 and the first framework 25.
Please refer to shown in Fig. 4 C, next, the surface of the first electric conductor 271 in the first framework 25 and the surface of the first baffle element 281 can print scolding tin 29.Come again, please refer to shown in Fig. 4 D, first substrate 21 and the first framework 25 are carried out storehouse, allow the first electric conductor 271 and the first baffle element 281 engage through scolding tin 29 respectively.Afterwards, through reflow process and after being cooled to room temperature, scolding tin 29 can be made to be formed as solid-state, and to make the first electric conductor 271 connect first substrate 21 and the first framework 25 by scolding tin 29, and the first baffle element 281 is sealed between first substrate 21 and the first framework 25 by scolding tin 29.But, also order can be changed, be sequentially and first print first electric conductor 271 and first baffle element 281 of scolding tin 29 on first substrate 21, storehouse first substrate 21 and the first framework 25 carry out reflow process again, next carry out printing second electric conductor 272 and second baffle element 282 of scolding tin 29 in the first framework 25, storehouse second substrate 22 and the first framework 25 carry out reflow process afterwards, but its order is not limited.
Can be learnt by the first embodiment, such as baffle element is used between the substrate on printed circuit board (PCB) and framework, penetrate into prevent the conductive materials in subsequent conductive layer coating process, be all the extension of the first embodiment, but do not limit the quantity of substrate and framework, also do not limit the relative position that substrate and framework are positioned at printed circuit board (PCB).
In addition, as shown in Figure 5, more can arrange an encapsulated layer 30 to protect first substrate 21 and electronic component 24 on first substrate 21, encapsulated layer 30 can be different types of encapsulating material, such as: thermosetting colloid or epoxy resin etc.Afterwards, as shown in Figure 6, the outer surface of electromagnetic shielding unit 40 in encapsulated layer 30 and the side surface of stack board structure 2 can be set, wherein electromagnetic shielding unit 40 is conductive materials, its technique by sputter, plated film, plating, vapour deposition or coating and being formed, it can reach the effect of electromagnetic shielding.
[the second embodiment]
Please refer to shown in Fig. 7 and Fig. 8, the stack board structure 2 of the second embodiment can be extended by the first embodiment, also storehouse one laminar substrate and framework can be continued again in the structure of the first embodiment, so the lower of second substrate 22 can arrange one second framework 26 and one the 3rd substrate 23 again, form for three laminar substrates and two framework institute storehouses to make stack board structure 2.First substrate is as shown in Fig. 7 (a), the first framework is shown in Fig. 7 (b), be second substrate shown in Fig. 7 (c), shown in Fig. 7 (d), be the second framework, shown in Fig. 7 (e), be the 3rd substrate.
Furthermore, the second electric conductor 272 and scolding tin 29 can be set in the downside of second substrate 22 and connect the second framework 26, second framework 26 and connect the 3rd substrate 23 by the 3rd electric conductor 273 and scolding tin 29 again, and form laminated structure.Wherein, the scolding tin 29 of two the second baffle elements 282 and connection two the second baffle elements 282 is set between second substrate 22 and the second framework 26, two the second baffle elements 282 are centered around the periphery of multiple second electric conductor 272 respectively, two the 3rd baffle elements 283 are set between second framework 26 and the 3rd substrate 23 and connect the scolding tin 29 of two the 3rd baffle elements 283, two the 3rd baffle elements 283 are centered around the periphery of multiple 3rd electric conductor 273 respectively, to make all have baffle element to infiltrate to block other object between the substrate of the stack board structure 2 of the second embodiment and framework.In the present embodiment, the 3rd baffle element 283 is the weld pad around substrate and the continuous kenel of framework surrounding.
Wherein, the manufacture of the stack board structure 2 of the second embodiment can with reference to the first embodiment, also the first electric conductor 271, second electric conductor 272 and the 3rd electric conductor 273 can be arranged on framework and substrate respectively, and the first baffle element 281, second baffle element 282 and the 3rd baffle element 283 are arranged on framework and substrate respectively.Again by optionally in the surface of the first electric conductor 271, the surface of the surface of the second electric conductor 272 and the 3rd electric conductor 273 prints scolding tin 29, and optionally in the surface of the first baffle element 281, the surface of the surface of the second baffle element 282 and the 3rd baffle element 283 prints scolding tin 29, carry out storehouse first substrate 21, second substrate 22 and the 3rd substrate 23 afterwards, but its stacking order is not limited.Next by being cooled to room temperature after reflow process, that scolding tin 29 is formed is solid-state, to make the first electric conductor 271, second electric conductor 272 and the 3rd electric conductor 273 by scolding tin 29 connection substrate and framework respectively, two the first baffle elements, 281, two the second baffle elements 282 and two the 3rd baffle elements 283 are centered around the periphery of multiple first electric conductor 271, multiple second electric conductor 272 and multiple 3rd electric conductor 273 respectively, and are sealed between substrate and framework by scolding tin 29.
Therefore, other embodiment can be extended by the second embodiment, also can in the 3rd substrate 23 continue again storehouse at least more than one substrate and framework, to form the stack board structure 2 of storehouse four layers of above substrate, and the visual demand of the quantity of storehouse substrate decides, and is not limited.
Afterwards, more can arrange an encapsulated layer 30 to protect first substrate 21 and the 3rd substrate 23 on first substrate 21, encapsulated layer 30 can be different types of encapsulating material, such as: thermosetting colloid or epoxy resin etc.And the outer surface of electromagnetic shielding unit 40 in encapsulated layer 30 and the side surface of stack board structure 2 can be set again, wherein electromagnetic shielding unit 40 is conductive materials, its can pass through sputter, plated film, plating, vapour deposition or coating technique and formed, it can reach the effect of electromagnetic shielding.
[the 3rd embodiment]
Please refer to shown in Fig. 9 and Figure 10, the stack board structure 2 of the 3rd embodiment comprises first substrate 21,1 first framework 25, multiple first electric conductor 271 and at least two the first baffle elements 281.As Fig. 9 (a) is depicted as first substrate, Fig. 9 (b) is depicted as the first framework.First, first substrate 21 can be printed circuit board (PCB), and the first framework 25 is positioned at the side of first substrate 21, and the first framework 25 can be hollow shape, therefore the electronic component 24 of the accommodating first substrate 21 of energy, and the first framework 25 can have the character of conduction and signal transmission.
Wherein, multiple first electric conductor 271 connects first substrate 21 and the first framework 25, multiple first electric conductors 271 on first substrate 21 are by scolding tin 29 (metal alloy containing tin, silver or copper) and multiple first electric conductors 271 in the first framework 25, be electrically connected through SMT technique and form, the first electric conductor 271 can be weld pad.In addition, two the first baffle elements 281 are centered around the periphery of multiple first electric conductor 271 respectively, thus two the first baffle elements 281 are reached by scolding tin 29 connect and be sealed between first substrate 21 and the first framework 25, and in the present embodiment, the first baffle element 281 is the weld pad around substrate and the continuous kenel of framework surrounding.
The manufacture of the stack board structure 2 of the 3rd embodiment can with reference to the first embodiment, also the first electric conductor 271 can be arranged in first substrate 21 and the first framework 25 respectively, and the first baffle element 281 is arranged in first substrate 21 and the first framework 25 respectively.Afterwards, optionally print scolding tin 29 in the surface of the first electric conductor 271, and optionally print scolding tin 29 in the surface of the first baffle element 281, storehouse first substrate 21 and the first framework 25 again, next by being cooled to room temperature after reflow process, that scolding tin 29 is formed is solid-state, first substrate 21 and the first framework 25 is connected through scolding tin 29 to make the first electric conductor 271, first baffle element 281 is centered around the periphery of multiple first electric conductor 271, and is sealed between first substrate 21 and the first framework 25 by scolding tin 29.
Afterwards, more can arrange an encapsulated layer 30 to protect first substrate 21 and electronic component 24 on first substrate 21, encapsulated layer 30 can be different types of encapsulating material, such as: thermosetting colloid or epoxy resin etc.And the outer surface of electromagnetic shielding unit 40 in encapsulated layer 30 and the side surface of stack board structure 2 can be set again, wherein electromagnetic shielding unit 40 is conductive materials, its can pass through sputter, plated film, plating, vapour deposition or coating technique and formed, it can reach the effect of electromagnetic shielding.
In sum, the present invention has following advantages:
1, stack board structure of the present invention is owing to being arranged between substrate and framework by baffle element, and can fully prevent in follow-up conductive layer coating process, conductive materials penetrates between substrate and framework, and the situation that can reduce short circuit or exception occurs.
2, the present invention owing to can make baffle element and electric conductor in same technique, replaces the colloid of prior art, therefore can not need the technique of carrying out injecting glue in addition, can Simplified flowsheet step, and can significantly enhance productivity.
The foregoing is only preferred embodiment of the present invention, be not intended to limit to scope of patent protection of the present invention, therefore the equivalence change of such as using specification of the present invention and accompanying drawing content to do, be all in like manner all contained in the scope of the present invention.
Claims (10)
1. a stack board structure, comprise a base board unit and one first framework, this base board unit has a first substrate and a second substrate, and this first substrate and this second substrate have multiple electronic component respectively, and this first framework is between this first substrate and this second substrate; It is characterized in that, also comprise:
One electric conductor unit, have multiple the first electric conductor connecting this first substrate and this first framework of being reached by scolding tin and reached with multiple the second electric conductor being connected this second substrate and this first framework by scolding tin, the plurality of first electric conductor is electrically connected the plurality of second electric conductor respectively; And
One baffle element unit, there are at least two the first baffle elements and at least two the second baffle elements, described at least two the first baffle elements be around and with the plurality of first electric conductor coplanar in fact close conductive structure continuously, and described at least two the second baffle elements are close conductive structure around the continuous of the plurality of second electric conductor, and described at least two the first baffle elements are connected by scolding tin and are thus sealed between this first substrate and this first framework, described at least two the second baffle elements are connected by scolding tin and are thus sealed between this second substrate and this first framework.
2. stack board structure as claimed in claim 1, it is characterized in that, this first substrate and this second substrate are printed circuit board (PCB), the plurality of first electric conductor and the plurality of second electric conductor are weld pad, and described at least two the first baffle elements and described at least two the second baffle elements are the weld pad around framework and the continuous kenel of substrate surrounding.
3. stack board structure as claimed in claim 1, it is characterized in that, this first framework is hollow shape, and with the plurality of electronic component of this first substrate accommodating and this second substrate, and this first framework is the structure with electric connection and signal transmission.
4. stack board structure as claimed in claim 1, it is characterized in that, the plurality of first electric conductor and the plurality of second electric conductor are reach connection by the scolding tin of reflow process respectively, and described at least two the first baffle elements and described at least two the second baffle elements are reach connection by the scolding tin of reflow process respectively.
5. stack board structure as claimed in claim 1, is characterized in that, also comprise:
One is arranged at the encapsulated layer on this first substrate; And
The one electromagnetic shielding unit being arranged at the outer surface of this encapsulated layer and the side surface of this stack board structure.
6. a stack board structure, comprise a first substrate and one first framework, this first substrate has multiple electronic component, and this first framework is positioned at the side of this first substrate; It is characterized in that, also comprise:
Multiple first electric conductor, is reached by scolding tin and connects this first substrate and this first framework; And
At least two the first baffle elements closing continuously conduction, around and coplanar in fact with the plurality of first electric conductor, and described at least two the first baffle elements are connected by scolding tin and are thus sealed between this first substrate and this first framework.
7. stack board structure as claimed in claim 6, it is characterized in that, this first substrate is printed circuit board (PCB), and the plurality of first electric conductor is weld pad, and described at least two the first baffle elements are the weld pad around framework and the continuous kenel of substrate surrounding.
8. stack board structure as claimed in claim 6, it is characterized in that, this first framework is hollow shape, and with those electronic components of this first substrate accommodating, and this first framework is the structure with electric connection and signal transmission.
9. stack board structure as claimed in claim 6, it is characterized in that, the plurality of first electric conductor is reach connection by the scolding tin of reflow process respectively, and described at least two the first baffle elements reach connection by the scolding tin of reflow process.
10. stack board structure as claimed in claim 6, is characterized in that, also comprise:
One is arranged at the encapsulated layer on this first substrate; And
The one electromagnetic shielding unit being arranged at the outer surface of this encapsulated layer and the side surface of this stack board structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210028083.6A CN103249273B (en) | 2012-02-08 | 2012-02-08 | Stack board structure |
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|---|---|---|---|
| CN201210028083.6A CN103249273B (en) | 2012-02-08 | 2012-02-08 | Stack board structure |
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| CN103249273A CN103249273A (en) | 2013-08-14 |
| CN103249273B true CN103249273B (en) | 2016-04-13 |
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| CN110636701B (en) * | 2019-10-29 | 2021-01-08 | 维沃移动通信有限公司 | Circuit board device and electronic equipment |
| CN114582850A (en) * | 2020-11-30 | 2022-06-03 | 上海华为技术有限公司 | Electronic element and electronic equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201042750A (en) * | 2009-05-25 | 2010-12-01 | Phoenix Prec Technology Corp | Stack package substrate |
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| US7635914B2 (en) * | 2007-05-17 | 2009-12-22 | Texas Instruments Incorporated | Multi layer low cost cavity substrate fabrication for pop packages |
| JP4555369B2 (en) * | 2008-08-13 | 2010-09-29 | 富士通メディアデバイス株式会社 | Electronic component module and manufacturing method thereof |
| FR2939963B1 (en) * | 2008-12-11 | 2011-08-05 | St Microelectronics Grenoble | METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT CARRIER, SUPPORT AND SEMICONDUCTOR DEVICE |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TW201042750A (en) * | 2009-05-25 | 2010-12-01 | Phoenix Prec Technology Corp | Stack package substrate |
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