CN201039580Y - A PCB board and corresponding circuit board printing device and steel mesh - Google Patents
A PCB board and corresponding circuit board printing device and steel mesh Download PDFInfo
- Publication number
- CN201039580Y CN201039580Y CNU2006200151676U CN200620015167U CN201039580Y CN 201039580 Y CN201039580 Y CN 201039580Y CN U2006200151676 U CNU2006200151676 U CN U2006200151676U CN 200620015167 U CN200620015167 U CN 200620015167U CN 201039580 Y CN201039580 Y CN 201039580Y
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- steel mesh
- cabling
- pcb board
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- test point
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Abstract
The utility model discloses a PCB board and a corresponding circuit board typer and steel mesh, wherein, the PCB board comprises routings, each routing is provided with at least one bulging point, and all the bulging points are arranged at the routings. The utility model overcomes the defects of the prior art, and adopts bulging point type welded seam test point, thereby avoiding separation and bending of the signal routing, ultimately eliminating the uncontinuity of the resistance value of the signal routing and the negative impact for the quality of the high-speed signal after the welded seam test point is added.
Description
Technical field
The utility model relates to the single-board testing technical field, refers more particularly to a kind of pcb board and corresponding circuit board printing equipment, steel mesh.
Background technology
ICT (In-Circuit test on-line testing) is to the electrical property of online components and parts and be electrically connected and test, to check defective and the bad a kind of standard testing means of components and parts manufactured by the contact Detection Techniques.Wherein, the desired node of contact Detection Techniques contact visit, need be on each network node of PCB (PrintedCircuit Board printed circuit board) the design test pad as test point.
Owing to contacted the restriction of detection accuracy, when the conventionally test pad size less than 32mil (mil, 1mil=0.0254mm), solder pad space length is less than 50mil, test probe will be difficult to carry out reliability contact visit.
Development along with the high speed signal design, a large amount of high-speed differential signal cablings appear on the pcb board, ideally all difference cablings all are uniformities, but in order to satisfy test request, need on the high-speed differential signal cabling, add testing weld pad, because the live width of normal difference cabling, line-spacing is often less than 10mil, then be subjected to conventionally test pad size and spacing requirement, the local signal lead of adjusting of will having to, thereby cause the crooked of signal lead and separate, and when a large amount of difference cabling is arranged on the pcb board, extra testing weld pad of every increase all will cause the crooked of cabling and separate, and adjacent with it cabling is also will be thereupon crooked, thereby causes the crooked of a large amount of cablings and separate, as shown in Figure 1.
Again because the impedance operator of difference cabling depends on cabling at interval substantially, so the conventionally test pad can have a strong impact on the high speed signal quality, makes to support on-line testing and cause signal quality to bear great risk; Be illustrated in figure 3 as interpolation conventionally test point front and back signal lead emulation S parameter reflection comparison diagram, wherein the curve at m1 place is the S parameter reflection of the cabling emulation of no test point, and the curve at m2 place is the S parameter reflection of the cabling emulation behind the interpolation conventionally test point; Judge that with the S parameter signal quality promptly reflects the smaller the better.
At this Frequency point of 3.6GHz, as can be seen from Figure 3 the curve at m2 place is obviously than the curve height at m1 place, illustrate that adding conventionally test point back reflection strengthens, and as a whole, use curve that the cabling S parameter curve of the signal lead actual measurement S parameter curve of conventionally test point and no test point differs the more m2 of being place generally than the curve height at m1 place among this figure, obviously increased reflection, the high speed signal quality has bigger deterioration thereby proof is added conventionally test point back.
Therefore, in test, the signal that originally can point-to-point on PCB directly links to each other in order to satisfy test request, has to add the conventionally test point on holding wire, and formation impedance discontinuity point on holding wire causes that signal quality worsens in various degree like this.Especially for the test of high speed signal, the degree of conventionally test signal quality deteriorates that pad causes becomes more obvious along with the raising of signal frequency.
The utility model content
The utility model provides a kind of pcb board and corresponding circuit board printing equipment, steel mesh, solving the bending of adding signal lead that conventionally test point is caused and to separate, thereby signal quality is caused the problem of negative effect.
For achieving the above object, the utility model adopts following technical scheme:
A kind of pcb board includes cabling, and described every cabling is provided with at least one protruding point, and described protruding point all is positioned on the described cabling.
The utility model also provides a kind of steel mesh that is used to make described protruding point, and this steel mesh is provided with at least one opening, and the sectional area of described steel mesh opening obtains in the following manner:
And the utility model also provides a kind of circuit board printing equipment, includes steel mesh, and described steel mesh is used to make described protruding point, and this steel mesh is provided with at least one opening, and the sectional area of described steel mesh opening obtains in the following manner:
By adopting above-mentioned technical scheme, the utlity model has following beneficial effect:
By utilizing steel mesh of the present utility model, circuit board printing equipment, a kind of pcb board with projection point type weld seam test point is provided, thereby the interpolation of having avoided conventionally test point causes the separation and the bending of high speed signal cabling, fundamentally eliminate the discontinuity of the resistance value of signal lead, and fundamentally eliminated the influence of adding after the weld seam test point the high speed signal quality.
Description of drawings
Fig. 1 is prior art is added conventionally test point on cabling a schematic diagram;
Fig. 2 is the detection operations principle schematic of existing pcb board;
Fig. 3 is for adding conventionally test point front and back emulation S comparative bid parameter;
Fig. 4 is the structural representation of testing weld pad encapsulation embodiment one of the present invention;
Fig. 5 is the structural representation of testing weld pad encapsulation embodiment two of the present invention;
Fig. 6 is the structural representation of testing weld pad encapsulation embodiment three of the present invention;
Fig. 7 is the structural representation of steel mesh opening embodiment one of the present invention;
Fig. 8 is the structural representation of steel mesh opening embodiment two of the present invention;
Fig. 9 is the side view of weld seam test point on the pcb board of the present invention;
Figure 10 is the end view drawing of weld seam test point on the pcb board of the present invention;
Figure 11 is the detection operations principle schematic of pcb board of the present invention;
Figure 12 is for adding test point front and back emulation S comparative bid parameter of the present invention.
Embodiment
Below in conjunction with accompanying drawing, will carry out comparatively detailed explanation to each preferred embodiment of the present utility model.
Technical scheme for clarity, the utility model provide a kind of testing weld pad encapsulation earlier, and this testing weld pad encapsulation is used to add the signal lead that is arranged at pcb board, finish the weld seam test point of design phase and add; This testing weld pad encapsulation comprises: the pad body, and the width of this pad body and the signal lead width on the pcb board are complementary, and length is to be several times as much as trace width, and concrete multiple can be determined according to practical situations; The welding resistance that this testing weld pad body the has respective shapes portion of windowing;
Be the embodiment one of the utility model testing weld pad encapsulation as shown in Figure 4 and Figure 5, one or more testing weld pad encapsulation 10 are arranged on the signal lead 13 among the figure, this testing weld pad encapsulation 10 is rectangle, comprise pad body 11 and the welding resistance portion 12 of windowing, wherein pad body 11 is a rectangle, its width is consistent with the width of cabling 13, and length is 6 times of cabling 13 width in Fig. 4, and length is 3 times of cabling 13 width in Fig. 5; Two welding resistances window portion 12 for and pad body 11 corresponding shapes, link to each other with the long limit of pad body 11 respectively;
Be illustrated in figure 6 as the embodiment two of the utility model testing weld pad encapsulation, this testing weld pad encapsulates 20 ovalizes, be arranged between two parties on the signal lead 13, comprise pad body 21 and the welding resistance portion 22 of windowing, wherein pad body 21 is the part of this testing weld pad encapsulation 20 on cabling, welding resistance window portion 22 for respective shapes, the part on cabling 13 not.The testing weld pad encapsulation is not limited to the foregoing description, can design according to practical situations.
Accordingly, the utility model also provides a kind of pcb board, and this pcb board includes PCB base material, cabling, solder mask, and this cabling is provided with at least one protruding point, and this protruding point all is positioned on this cabling.Wherein, this protruding point surperficial curved, Fig. 9 and Figure 10 are respectively the side view and the end view drawing of the utility model pcb board; As shown in the figure, this pcb board is provided with signal lead 13, specifically be that PCB base material 31 is provided with signal lead 13, this signal lead 13 is provided with protruding point 30, by side view 9 as can be known, the lateral cross section of this protruding point 30 is oval, and PCB base material 31 is provided with signal lead 13, also is provided with solder mask 32 on this signal lead 13 except that protruding point 30 residing positions; By end face Figure 10 as can be known, the crowd of this protruding point 30 also is oval to the cross section, and protruding point 30 all is positioned on the cabling 13, and promptly the part that contacts with cabling 13 of this protruding point 30 does not exceed cabling 13, and this protruding point 30 is embedded in pad body in the solder mask 32.
Wherein, the quantity of cabling can be one or more, should be according to the practical application request setting; On every cabling, at least one protruding point can be set;
This protruding point 30 is as the weld seam test point, because the key of weld seam test point contact reliability is the radian and the height of weld seam test point, therefore the occurrence of height, radian can be determined according to practical situations; The height that protruding point generally can be set is in 4-7 mil scope; The lateral length of the part that protruding point is connected with cabling can be 3-8 doubly to this trace width, but be not limited to this, can determine according to practical situations.
Accordingly, the utility model also provides a kind of steel mesh, and this steel mesh is provided with at least one opening, is used in the veneer production and processing stage, tin cream is applied on the corresponding testing weld pad by the opening on this steel mesh, and be the weld seam test point with the configured protrusion point.
In order to guarantee to survey the reliability of contact, protruding point is that the weld seam test point need have certain radian and height, constant according to the soldering tin amount before and after refluxing, by calculating the protruding point volume after making up, ratio value divided by scolding tin in steel mesh thickness and the tin cream, can calculate the steel mesh opening size is the steel mesh opening sectional area
The sectional area that is described steel mesh opening obtains in the following manner:
When steel mesh thickness not being made improvements (promptly when steel mesh thickness is identical with existing steel mesh thickness), then steel mesh opening size and the radian of described protruding point with highly become corresponding relation; Wherein, the cross sectional shape of steel mesh opening is not limit, but the main body of steel mesh opening needs to overlap with the weld seam testing weld pad;
Be illustrated in figure 7 as the embodiment one of the utility model steel mesh split shed, the cross sectional shape ovalize of steel mesh opening 40 among the figure, and the weld seam testing weld pad that constitutes corresponding to window by welding resistance portion 12 and pad body 11 between two parties.According to practical situations, the lateral length of general steel mesh opening is less than the length of described weld seam testing weld pad.
Be illustrated in figure 8 as the embodiment two of the utility model steel mesh split shed, the cross sectional shape of steel mesh opening 41 is square among the figure, and the weld seam testing weld pad that constitutes corresponding to windowed by welding resistance portion 12 and pad body 11 between two parties.According to practical situations, the lateral length of general steel mesh opening is less than the length of described weld seam testing weld pad.
The similar steel mesh opening that also can use circle, rhombus prismatic shapes.
After making corresponding steel mesh, tin cream is applied on the corresponding testing weld pad by the opening on the steel mesh by normal printing; During reflow soldering, because scolding tin has affinity to the Copper Foil of pad body, scolding tin can be adsorbed on the pad body.Under tiny size, surface tension is much larger than gravity, thereby forms the weld seam test point of curved surfaces protruding point in scolder and Copper Foil cohesive process.
Accordingly, the utility model also provides a kind of circuit board printing equipment, includes the utility model steel mesh.
As shown in figure 11, when ICT tested, the protruding point that is built into was that weld seam test point 50 exceeds solder mask.When test fixture moves, the test probe 51 that is positioned on the test fixture will contact with weld seam test point 50.
As shown in Figure 2, conventional detection method is to be pad 60 on the protruding point pressure contact pcb board with test probe 61, and existing weld seam is surveyed and changed into weld seam test point on the pcb board is the syringe needle pressure contact of the tested test point of protruding point.
Survey by the test veneer that design has been added the utility model weld seam test point and conventionally test point, the situation that adopts the utility model test point and the signal lead actual measurement S parameter comparison that adopts conventionally test point not to have the test point cabling is as follows:
As shown in figure 12 for adding the utility model weld seam test point front and back signal lead emulation S comparative bid parameter, wherein the curve at m1 place is the S parameter of the cabling emulation of no test point, the S parameter of the cabling emulation of the curve at m3 place after for the weld seam test point of interpolation the utility model projection point type;
As can be seen from Figure 12, the curve at m3 place overlaps substantially with the curve at m1 place, especially this frequency range of 6-9.3GHz, adopt the cabling and the reflection case basically identical that does not have the cabling of test point of the utility model weld seam test point, promptly pass through true verification experimental verification, because do not cause the high speed signal cabling to separate and bending, the weld seam test point all is in perfect condition for the influence value of impedance, capacitive reactance and transmission delay.The normal high speed signal difference cabling of the no test point of its contrast, its frequency domain, time domain influence all in tolerance interval, therefore can not impact high speed signal;
The utility model provides avoids causing the high speed signal cabling to separate and crooked test point design, influence to high speed signal performance or quality under this test point normal running can be ignored, and makes the contact Detection Techniques of on-line testing can be applied to the high speed circuit of speed at 1G～10G;
Weld seam test point modes of emplacement of the present utility model, little to the pcb board design constraint, greatly reduce the difficulty of design test point.Especially under the situation of the high density layouts design that accompanies closely with high speed circuit.
Should be understood that; above-mentioned description at specific embodiment is comparatively detailed and concrete; can not therefore be interpreted as restriction to the utility model scope of patent protection; can change and replace as steel mesh opening geomery etc., and all these changes or replace all should belong within the protection range that claims are as the criterion.
Claims (8)
1. a pcb board includes cabling, it is characterized in that, described every cabling is provided with at least one protruding point, and described protruding point all is positioned on the described cabling.
2. pcb board according to claim 1 is characterized in that, the cross section of described protruding point is a half elliptic.
3. pcb board according to claim 1 and 2 is characterized in that the height of described protruding point is in the scope of 4-7 mil.
4. pcb board according to claim 1 and 2 is characterized in that, the lateral length of the part that described protruding point is connected with cabling is 3-8 a times of described trace width.
5. one kind is used to make as weighing the steel mesh of protruding point as described in 1, and this steel mesh is provided with at least one opening, it is characterized in that, the sectional area of described steel mesh opening obtains in the following manner:
6. steel mesh according to claim 5 is characterized in that, the cross sectional shape of described opening is circle, ellipse, square or rhombus.
7. a circuit board printing equipment includes steel mesh, and described steel mesh is used for making as protruding point as described in weighing 1, and this steel mesh is provided with at least one opening, it is characterized in that, the sectional area of described steel mesh opening obtains in the following manner:
8. circuit board printing equipment according to claim 7 is characterized in that, the cross sectional shape of described opening is circle, ellipse, square or rhombus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006200151676U CN201039580Y (en) | 2006-10-09 | 2006-10-09 | A PCB board and corresponding circuit board printing device and steel mesh |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006200151676U CN201039580Y (en) | 2006-10-09 | 2006-10-09 | A PCB board and corresponding circuit board printing device and steel mesh |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201039580Y true CN201039580Y (en) | 2008-03-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2006200151676U Expired - Fee Related CN201039580Y (en) | 2006-10-09 | 2006-10-09 | A PCB board and corresponding circuit board printing device and steel mesh |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201039580Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102107552A (en) * | 2010-12-30 | 2011-06-29 | 昶虹电子(苏州)有限公司 | Surface mount technology (SMT) printing steel mesh |
| CN104754856A (en) * | 2013-12-30 | 2015-07-01 | 深圳市共进电子股份有限公司 | Method for arranging solder ball on printed circuit board |
| CN106851963A (en) * | 2017-02-28 | 2017-06-13 | 奇酷互联网络科技（深圳）有限公司 | The method and device of printing board PCB and its non-destructive testing |
| CN106954337A (en) * | 2017-05-02 | 2017-07-14 | 广东欧珀移动通信有限公司 | A kind of pcb board, pcb board preparation method and terminal |
-
2006
- 2006-10-09 CN CNU2006200151676U patent/CN201039580Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102107552A (en) * | 2010-12-30 | 2011-06-29 | 昶虹电子(苏州)有限公司 | Surface mount technology (SMT) printing steel mesh |
| CN102107552B (en) * | 2010-12-30 | 2012-05-23 | 昶虹电子(苏州)有限公司 | Surface mount technology (SMT) printing steel mesh |
| CN104754856A (en) * | 2013-12-30 | 2015-07-01 | 深圳市共进电子股份有限公司 | Method for arranging solder ball on printed circuit board |
| CN104754856B (en) * | 2013-12-30 | 2018-05-01 | 深圳市共进电子股份有限公司 | The method that tin ball is set on a printed circuit |
| CN106851963A (en) * | 2017-02-28 | 2017-06-13 | 奇酷互联网络科技（深圳）有限公司 | The method and device of printing board PCB and its non-destructive testing |
| CN106851963B (en) * | 2017-02-28 | 2019-06-07 | 奇酷互联网络科技（深圳）有限公司 | The method and device of printing board PCB and its non-destructive testing |
| CN106954337A (en) * | 2017-05-02 | 2017-07-14 | 广东欧珀移动通信有限公司 | A kind of pcb board, pcb board preparation method and terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080319 Termination date: 20101009 |