CN108875232B - Method, device and equipment for checking welding-proof windowing and readable storage medium - Google Patents
Method, device and equipment for checking welding-proof windowing and readable storage medium Download PDFInfo
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- CN108875232B CN108875232B CN201810677097.8A CN201810677097A CN108875232B CN 108875232 B CN108875232 B CN 108875232B CN 201810677097 A CN201810677097 A CN 201810677097A CN 108875232 B CN108875232 B CN 108875232B
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- 238000000034 method Methods 0.000 title claims abstract description 50
- 229910000679 solder Inorganic materials 0.000 claims abstract description 76
- 238000003466 welding Methods 0.000 claims abstract description 52
- 238000013461 design Methods 0.000 claims abstract description 50
- 238000012360 testing method Methods 0.000 claims abstract description 40
- 238000007689 inspection Methods 0.000 claims abstract description 18
- 230000002265 prevention Effects 0.000 claims description 38
- 238000005553 drilling Methods 0.000 claims description 10
- 238000004590 computer program Methods 0.000 claims description 4
- 230000007547 defect Effects 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
Abstract
The embodiment of the invention discloses a method, a device and equipment for checking solder mask windowing and a computer readable storage medium. Judging whether solder-resisting windows with front and back surfaces overlapped exist according to the position information of each solder-resisting window in the PCB design document; if yes, further judging whether test points are drilled on the mutually overlapped anti-welding windowing windows or not; and if so, recording the coordinate information of the drill hole of the test point to serve as the welding-proof windowing which does not meet the requirement. The technical scheme that this application provided has realized that the automatic check is prevented welding and is windowed whether meet the demands through comparing the position of preventing welding and windowing on the positive back, has effectively solved the defect that artifical inspection efficiency is low, the degree of accuracy is low, has improved Layout efficiency, can effectively shorten PCB design cycle, promotes PCB design efficiency, and can guarantee PCB's design quality.
Description
Technical Field
The embodiment of the invention relates to the technical field of printed circuit board design, in particular to a method, a device and equipment for checking solder mask windowing and a computer readable storage medium.
Background
With the development of printing technology and the development of electronic products towards multi-functionalization, modularization, partial miniaturization and high sensitivity, the quality requirement of a Printed Circuit Board (PCB) for a user is higher and higher.
In the PCB design stage, whether solder mask windowing meets requirements needs to be checked to prevent the drilling back side of a part pad from windowing after the PCB is tinned, and solder paste exposes tin through the drilling to influence the appearance and the function of the PCB.
Among the prior art, generally whether meet the demands by the artifical inspection anti-welding windowing of Layout engineer, because anti-welding windowing position is more, to large-scale PCB board especially large-scale server mainboard, the number of anti-welding windowing is more, artifical manual detection not only speed is slower, still easily detects the omission, leads to whole PCB design cycle longer, and design efficiency is lower, and the PCB quality is difficult to guarantee.
Disclosure of Invention
The embodiment of the invention aims to provide a method, a device, equipment and a computer readable storage medium for checking solder-mask windowing, which effectively shorten the PCB design period, improve the PCB design efficiency and ensure the PCB design quality.
In order to solve the above technical problems, embodiments of the present invention provide the following technical solutions:
the embodiment of the invention provides a method for checking solder-mask windowing, which is based on a skill and comprises the following steps:
acquiring position information of a solder-open-proof window in a PCB design document;
judging whether the welding prevention windows with the front and back surfaces overlapped with each other exist or not according to the position information of each welding prevention window;
if yes, judging whether target test points are drilled on the mutually overlapped anti-welding windowing windows or not;
and if so, recording the coordinate information of the target test point drill hole to serve as the welding-proof windowing which does not meet the requirement.
Optionally, the obtaining of the position information of the solder opening prevention window in the PCB design document includes:
and acquiring the areas of the coverage areas of the solder-open windows on the front and back sides of the drilling holes of the pads and the test points in the PCB design document to serve as the position information of each solder-open window.
Optionally, the determining whether there is a solder mask window with front and back surfaces overlapping each other includes:
judging whether a first welding prevention window on the front side has a second welding prevention window located at a corresponding position on the back side;
and if so, judging whether the overlapping area ratio of the first welding prevention windowing and the second welding prevention windowing reaches a preset threshold value.
Optionally, the preset threshold is 100%.
Optionally, after the recording the coordinate information of the target test point drill hole, the method further includes:
adding the recorded coordinate information of the drill holes of the target test points into a solder mask windowing checking list;
and when the welding prevention windowing inspection is finished, displaying the welding prevention windowing inspection list.
Another aspect of an embodiment of the present invention provides an apparatus for inspecting solder mask windowing, including:
the information acquisition module is used for acquiring the position information of the anti-welding window in the PCB design document;
the overlapping area judging module is used for judging whether the welding prevention windows with the front and back surfaces overlapped exist or not according to the position information of each welding prevention window;
the drilling judging module is used for judging whether target test points are drilled on the mutually overlapped welding-proof windowing windows or not if the welding-proof windowing windows with mutually overlapped front and back surfaces exist;
and the position recording module is used for recording the coordinate information of the target test point drill hole as the solder-mask window which does not meet the requirement if the target test point drill hole is formed in the solder-mask windows which are overlapped with each other.
Optionally, the information obtaining module is a module for obtaining the area of the coverage area of the solder-open windows on the front and back sides of the pad and the test point drill hole in the PCB design document to serve as the position information of each solder-open window.
Optionally, the method further includes:
the adding module is used for adding the recorded coordinate information of the drilled holes of the target test points into the welding-prevention windowing inspection list;
and the display module is used for displaying the solder-mask window inspection list after the solder-mask windows are inspected.
An embodiment of the present invention further provides an apparatus for inspecting solder mask, including a processor, configured to implement the steps of the method for inspecting solder mask as described in any one of the preceding items when executing a computer program stored in a memory.
Finally, an embodiment of the present invention provides a computer-readable storage medium, on which a program for inspecting solder mask is stored, where the program for inspecting solder mask is executed by a processor to implement the steps of the method for inspecting solder mask as described in any of the previous items.
The embodiment of the invention provides a method for checking a solder mask window, which comprises the steps of judging whether the solder mask window with mutually overlapped front and back surfaces exists or not according to the position information of each solder mask window in a PCB design document; if yes, further judging whether test points are drilled on the mutually overlapped anti-welding windowing windows or not; and if so, recording the coordinate information of the drill hole of the test point to serve as the welding-proof windowing which does not meet the requirement. The advantage of this application technical scheme lies in, through comparing the positive back and preventing welding the position of windowing, has realized that the automatic check prevents welding the windowing and whether meets the requirements, has effectively solved the defect that artifical inspection efficiency is low, the degree of accuracy is low, has improved Layout efficiency, can effectively shorten PCB design cycle, promotes PCB design efficiency, and can guarantee PCB's design quality.
In addition, the embodiment of the invention also provides a corresponding implementation device, equipment and a computer readable storage medium for the method for checking the solder mask windowing, so that the method has higher practicability, and the device, the equipment and the computer readable storage medium have corresponding advantages.
Drawings
In order to more clearly illustrate the embodiments or technical solutions of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
FIG. 1 is a schematic flow chart of a method for inspecting solder mask windows according to an embodiment of the present invention;
FIG. 2 is a schematic illustration of an illustrative example provided by an embodiment of the invention;
FIG. 3 is a schematic flow chart illustrating another method for inspecting solder mask windows according to an embodiment of the present invention;
FIG. 4 is a diagram illustrating an exemplary inspection result list display according to an embodiment of the present invention;
FIG. 5 is a block diagram of an embodiment of an apparatus for inspecting solder mask windows according to an embodiment of the present invention;
fig. 6 is a structural diagram of another embodiment of an apparatus for inspecting a solder window according to an embodiment of the present invention.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms "first," "second," "third," "fourth," and the like in the description and claims of this application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may include other steps or elements not expressly listed.
Having described the technical solutions of the embodiments of the present invention, various non-limiting embodiments of the present application are described in detail below.
Referring to fig. 1, fig. 1 is a schematic flow chart of a method for inspecting solder mask windowing according to an embodiment of the present invention, and based on the SKILL, the embodiment of the present invention may include the following:
s101: and acquiring the position information of the anti-welding window in the PCB design document.
The solder mask windows can be all solder mask windows on the front and back surfaces of the drilling holes of the bonding pads and the test points in the PCB design document, and the position information of each solder mask window can be the area of a coverage area of the solder mask window. That is, in S101, the area of the coverage area of the solder-open windows on the front and back sides of the pad and the test point drill hole in the PCB design document is obtained to serve as the position information of each solder-open window.
The front and back surfaces of a common drill hole are not windowed and used for testing the test point drill hole added by the short circuit of the PCB, and the front and back surfaces are windowed to expose the copper sheet.
S102: and judging whether the welding prevention windows with the front and back surfaces overlapped with each other exist according to the position information of each welding prevention window, and if so, executing S103.
The welding prevention windows are mutually overlapped, namely the welding prevention windows on the same surface are mutually overlapped, and the welding prevention windows on the front surface and the back surface are mutually overlapped.
In a specific judging process, each solder mask window on one surface can be judged in sequence, for each solder mask window, whether the solder mask window exists on the back surface in the surrounding area can be seen, the size of the surrounding area can be searched, and the size can be determined according to the actual design condition of the PCB, which is not limited in any way. For example, whether the solder mask windows located at the positions (100, 200) on the front surface of the PCB overlap with each other is determined by determining the area surrounded by the abscissa 80-120 and the ordinate 160-240, and determining whether the solder mask windows overlap with each other exists in the area.
In a specific embodiment, the determination can be made according to the following:
judging whether a first welding prevention window on the front side has a second welding prevention window located at a corresponding position on the back side;
and if so, judging whether the overlapping area ratio of the first welding prevention windowing and the second welding prevention windowing reaches a preset threshold value.
The preset threshold value can be 100%, that is, the first solder mask opening window and the second solder mask opening window are overlapped, or the first solder mask opening window is arranged inside the second solder mask opening window, or the second solder mask opening window is arranged inside the first solder mask opening window. Of course, the preset threshold may be other values, such as 98%, and the present application does not limit this.
S103: and judging whether target test points are drilled on the mutually overlapped solder mask windows, if so, executing S104.
S104: and recording the coordinate information of the target test point drill hole to serve as the welding-proof windowing which does not meet the requirement.
The target test point bore is any one of the test point bores disposed on the mutually overlapping solder windows having the target test point bore therein, as can be seen in fig. 2.
According to the technical scheme provided by the embodiment of the invention, through comparing the positions of the front and back solder-open-proof windows, whether the solder-open-proof windows meet the requirements or not is automatically checked, the defects of low manual checking efficiency and low accuracy are effectively overcome, the Layout design efficiency is improved, the PCB design period can be effectively shortened, the PCB design efficiency is improved, and the PCB design quality can be ensured.
Referring to fig. 3, the present application further provides another embodiment, and based on the above embodiment, the present application may further include:
s105: and adding the recorded coordinate information of each target test point drill hole into a solder-mask windowing inspection list.
S106: and judging whether the check of each welding prevention windowing is finished, if so, executing S107, and if not, returning to S102.
S107: and displaying the solder mask windowing check list.
In a specific implementation process, a specific implementation method may be:
in the Cadence Layout design, by writing a program for checking solder mask windowing, and then putting the kill program into a kill menu, executing the kill program can check whether the solder mask windowing meets the requirements by aligning the solder mask position of the front side and the solder mask position of the back side, which specifically includes:
operating the Skill, and reading the position information of the front and back solder mask windowing in the PCB design document;
comparing whether the front and back welding-proof positions are overlapped, and adding the position coordinates of the drilling holes of the test points at the overlapped positions into an inspection result list;
displaying a list of inspection results (see fig. 4);
and (5) ending the Skill running and outputting a Done command.
Therefore, the embodiment of the invention effectively shortens the PCB design period, improves the PCB design efficiency and can ensure the PCB design quality.
The embodiment of the invention also provides a corresponding implementation device for the method for checking the solder mask windowing, so that the method has higher practicability. The apparatus for inspecting solder mask opening according to the embodiments of the present invention is described below, and the apparatus for inspecting solder mask opening described below and the method for inspecting solder mask opening described above may be referred to in correspondence with each other.
Referring to fig. 5, fig. 5 is a structural diagram of an apparatus for inspecting a solder-resisting window according to an embodiment of the present invention, in an embodiment, the apparatus may include:
an information obtaining module 501, configured to obtain position information of a solder opening prevention window in a PCB design document.
An overlapping area determining module 502, configured to determine whether there is a solder-open window with overlapping front and back surfaces according to the position information of each solder-open window.
And a drilling judgment module 503, configured to judge whether there is a target test point drilled on the mutually overlapped solder-mask windows if there is a solder-mask window with mutually overlapped front and back surfaces.
And the position recording module 504 is configured to record coordinate information of the target test point drill hole as an unsatisfactory anti-welding windowing window if the target test point drill hole is formed in the anti-welding windowing windows that are overlapped with each other.
Optionally, in some embodiments of this embodiment, referring to fig. 6, the apparatus may further include:
and an adding module 505, configured to add the recorded coordinate information of each target test point drill hole to the solder-cut-proof window inspection list.
And a display module 506, configured to display the solder mask inspection list after the solder mask inspection is completed.
Optionally, in other embodiments of this embodiment, the information obtaining module 501 may be a module that obtains an area of a coverage area of solder windows on front and back sides of a pad and a test point drilling hole in a PCB design document, so as to serve as position information of each solder window.
Specifically, the overlap area determining module 502 may include:
the first judgment submodule is used for judging whether a first welding prevention window on the front side has a second welding prevention window located at a corresponding position on the back side;
and the second judgment submodule is used for judging whether the overlapping area proportion of the first welding prevention window and the second welding prevention window reaches a preset threshold value or not when the first welding prevention window on the front side has the second welding prevention window located at the corresponding position on the back side.
The functions of the functional modules of the device for detecting solder-mask windowing in the embodiment of the present invention can be specifically implemented according to the method in the embodiment of the method, and the specific implementation process may refer to the related description of the embodiment of the method, which is not described herein again.
Therefore, the embodiment of the invention effectively shortens the PCB design period, improves the PCB design efficiency and can ensure the PCB design quality.
The embodiment of the invention also provides equipment for checking the solder mask windowing, which specifically comprises the following steps:
a memory for storing a computer program;
a processor for executing a computer program for implementing the steps of the method of inspecting solder mask windowing as described in any of the above embodiments.
The functions of the functional modules of the device for checking solder mask windowing according to the embodiment of the present invention can be specifically implemented according to the method in the embodiment of the method described above, and the specific implementation process may refer to the description related to the embodiment of the method described above, which is not described herein again.
Therefore, the embodiment of the invention effectively shortens the PCB design period, improves the PCB design efficiency and can ensure the PCB design quality.
The embodiment of the invention also provides a computer readable storage medium, which stores a program for checking the solder mask, wherein the program for checking the solder mask is executed by a processor, and the steps of the method for checking the solder mask are as described in any one of the above embodiments.
The functions of the functional modules of the computer-readable storage medium according to the embodiment of the present invention may be specifically implemented according to the method in the foregoing method embodiment, and the specific implementation process may refer to the related description of the foregoing method embodiment, which is not described herein again.
Therefore, the embodiment of the invention effectively shortens the PCB design period, improves the PCB design efficiency and can ensure the PCB design quality.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in Random Access Memory (RAM), memory, Read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
The method, apparatus, device and computer readable storage medium for inspecting solder mask windows provided by the present invention have been described in detail. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (10)
1. A method of inspecting solder mask windows, based on skill, comprising:
acquiring position information of a solder-open-proof window in a PCB design document;
judging whether the welding prevention windows with the front and back surfaces overlapped with each other exist or not according to the position information of each welding prevention window;
if yes, judging whether target test points are drilled on the mutually overlapped anti-welding windowing windows or not;
and if so, recording the coordinate information of the target test point drill hole to serve as the welding-proof windowing which does not meet the requirement.
2. The method of inspecting solder mask windows according to claim 1, wherein the obtaining of the location information of the solder mask windows in the PCB design document comprises:
and acquiring the areas of the coverage areas of the solder-open windows on the front and back sides of the drilling holes of the pads and the test points in the PCB design document to serve as the position information of each solder-open window.
3. The method of inspecting solder mask window of claim 2, wherein said determining whether there is a solder mask window whose front and back surfaces overlap each other comprises:
judging whether a first welding prevention window on the front side has a second welding prevention window located at a corresponding position on the back side;
and if so, judging whether the overlapping area ratio of the first welding prevention windowing and the second welding prevention windowing reaches a preset threshold value.
4. The method of inspecting solder mask windowing as set forth in claim 3, wherein the predetermined threshold is 100%.
5. The method of inspecting solder mask windows according to any of the claims 1 to 4, further comprising, after the recording of coordinate information of the target test point bore:
adding the recorded coordinate information of the drill holes of the target test points into a solder mask windowing checking list;
and when the welding prevention windowing inspection is finished, displaying the welding prevention windowing inspection list.
6. An apparatus for inspecting solder mask windows, comprising:
the information acquisition module is used for acquiring the position information of the anti-welding window in the PCB design document;
the overlapping area judging module is used for judging whether the welding prevention windows with the front and back surfaces overlapped exist or not according to the position information of each welding prevention window;
the drilling judging module is used for judging whether target test points are drilled on the mutually overlapped welding-proof windowing windows or not if the welding-proof windowing windows with mutually overlapped front and back surfaces exist;
and the position recording module is used for recording the coordinate information of the target test point drill hole as the solder-mask window which does not meet the requirement if the target test point drill hole is formed in the solder-mask windows which are overlapped with each other.
7. The apparatus for inspecting solder windows according to claim 6, wherein the information acquiring module is a module for acquiring an area of a solder window covering area of the front and back sides of the pads and the test point holes in the PCB design document as the position information of each solder window.
8. The apparatus for inspecting solder mask windows according to claim 6 or 7, further comprising:
the adding module is used for adding the recorded coordinate information of the drilled holes of the target test points into the welding-prevention windowing inspection list;
and the display module is used for displaying the solder-mask window inspection list after the solder-mask windows are inspected.
9. An apparatus for inspecting solder mask, comprising a processor for implementing the steps of the method for inspecting solder mask as claimed in any one of claims 1 to 5 when executing a computer program stored in a memory.
10. A computer-readable storage medium, characterized in that the computer-readable storage medium has stored thereon a program for inspecting solder-mask windowing, which program, when executed by a processor, carries out the steps of the method for inspecting solder-mask windowing as claimed in any one of claims 1 to 5.
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| CN201810677097.8A CN108875232B (en) | 2018-06-27 | 2018-06-27 | Method, device and equipment for checking welding-proof windowing and readable storage medium |
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| CN201810677097.8A CN108875232B (en) | 2018-06-27 | 2018-06-27 | Method, device and equipment for checking welding-proof windowing and readable storage medium |
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| CN112985333A (en) * | 2021-02-19 | 2021-06-18 | 上海闻泰信息技术有限公司 | Circuit board inspection method and device |
| CN114004193B (en) * | 2021-10-14 | 2024-01-19 | 苏州浪潮智能科技有限公司 | Identification method and related device for tin-plating risk of PCB |
| TWI795127B (en) * | 2021-12-16 | 2023-03-01 | 技嘉科技股份有限公司 | Marking method of tin point in the circuit board technical drawing and device thereof |
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| CAM350中实现自动修改阻焊开窗尺寸宏的一些研究;吴恒等;《印制电路信息》;20110610(第06期);39-42 * |
| The Design and Implementation of Auto-Changing Shade Welding Mask;Tao Ling等;《2009 International Forum on Information Technology and Applications》;20090904;624-627 * |
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| CN108875232A (en) | 2018-11-23 |
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