CN107796820A - The method and device of automatic detection pad - Google Patents
The method and device of automatic detection pad Download PDFInfo
- Publication number
- CN107796820A CN107796820A CN201710923027.1A CN201710923027A CN107796820A CN 107796820 A CN107796820 A CN 107796820A CN 201710923027 A CN201710923027 A CN 201710923027A CN 107796820 A CN107796820 A CN 107796820A
- Authority
- CN
- China
- Prior art keywords
- pad
- hole
- circuit
- image
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
Landscapes
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Geophysics And Detection Of Objects (AREA)
Abstract
The present invention relates to a kind of method and device of automatic detection pad, wherein, the method for automatic detection pad includes step：Obtain the borehole data information of printed circuit board to be produced and the circuit image of each circuit layer in printed circuit board to be produced；According to borehole data information and each circuit image, the morphological image information respectively to be drilled in printed circuit board to be produced is obtained；According to morphological image information, pad detection is carried out to each circuit image respectively, obtains pad testing result.Instant invention overcomes artificial detection is carried out to the circuit image of printed circuit board in conventional art, cause the technical problem of flase drop or missing inspection, and then improve product qualification rate, reduce product rejection probability, optimize artificial detection operation so that detection operation automation, improving production efficiency.Further, ensure that the quality of production of printed circuit board, at the same meet nowadays electronic product to the process requirements of printed circuit board.
Description
Technical field
The present invention relates to printed circuit board characterization processes technical field, method more particularly to automatic detection pad and
Device.
Background technology
With developing rapidly for electronic product, printed circuit board (PCB：Printed Circuit Board) plate sets
Meter becomes increasingly complex, engender blind buried via hole, HDI holes (High Density Interconnetction, high density interconnection),
The processing mode in metal control depth blind hole and back drill hole etc..
In implementation process, inventor has found that at least there are the following problems in conventional art：
In to there is the pcb board part in blind buried via hole, HDI holes, metal control depth blind hole and back drill hole etc. to design film file processes,
Can there is a situation where to omit or have more pad.The problem of flase drop or missing inspection are easily caused using traditional manual detection mode,
And be not modified in time, cause the circuit image on the film file pad mistake to be present, and then given birth to using the film file
Easily occur hole open circuit during production, on pcb board part or do not meet the quality problem of product demand, cause pcb board part to scrap, production effect
Rate is low.
The content of the invention
Based on this, it is necessary to the problem of for pcb board part low production efficiency, there is provided a kind of method of automatic detection pad with
And device.
To achieve these goals, on the one hand, the embodiments of the invention provide a kind of method of automatic detection pad, including
Following steps：
Obtain the borehole data information of printed circuit board to be produced and the line of circuit layer in printed circuit board to be produced
Road image；
According to borehole data information and each circuit image, the morphological image letter respectively to be drilled in printed circuit board to be produced is obtained
Breath；
According to morphological image information, pad detection is carried out to each circuit image respectively, obtains pad testing result.
The present invention have it is following a little and beneficial effect：
The method of automatic pad detection of the invention, passes through the borehole data information for obtaining printed circuit board to be produced and each electricity
Circuit image corresponding to the floor of road, the morphological image information that printed circuit board to be produced respectively drills is learned, each circuit image is carried out
Automatic pad detection.Instant invention overcomes artificial detection is carried out to the circuit image of printed circuit board in conventional art, cause to miss
Inspection or the technical problem of missing inspection, and then product qualification rate is improved, product rejection probability is reduced, optimization artificial detection operation, is made
Operation automation, improving production efficiency must be detected.Further, the quality of production of printed circuit board is ensure that, is met simultaneously
Nowadays process requirements of the electronic product to printed circuit board.
In a specific embodiment, according to borehole data information and each circuit image, printed circuit to be produced is obtained
Before the step of morphological image information of each drilling in plate, in addition to step：
According to borehole data information, each drilling in the printed circuit board is identified；
Category filter is carried out to each drilling, obtains plated through-hole and non-metallic hole.
In a specific embodiment, according to borehole data and each circuit image, obtain in printed circuit board to be produced
Each drilling morphological image information the step of include：
According to borehole data information, identify that plated through-hole, non-metallic hole run through the first floor circuit layer of circuit layer respectively
With tail layer circuit layer；
Morphological image information of the plated through-hole in first floor circuit layer, tail layer circuit layer is gathered respectively；Gather respectively non-
Morphological image information of the plated through-hole in first floor circuit layer, tail layer circuit layer.
In a specific embodiment, according to image information, pad detection is carried out to each circuit image respectively, obtains institute
The step of stating the result of pad detection, including：
When the result of pad detection omits pad plated through-hole to be present, confirm to omit corresponding to the plated through-hole of pad
The circuit image of circuit layer lacks pad data, and gives a warning.
In a specific embodiment, according to morphological image information, pad detection is carried out to each circuit image respectively, obtained
To pad detection result the step of, in addition to：
When the result of pad detection is with the presence of non-metallic hole pad, confirm that the non-metallic hole that pad be present is corresponding
Circuit layer the wrong pad data of circuit image, and give a warning.
On the other hand, the embodiment of the present invention additionally provides a kind of device of automatic detection pad, including：
Data obtaining module, for obtaining the borehole data information of printed circuit board to be produced and the line of each circuit layer
Road image；
Borehole image acquisition module, for according to borehole data information and each circuit image, obtaining printed circuit to be produced
The morphological image information respectively to be drilled in plate；
Detection module, for according to morphological image information, carrying out pad detection to each circuit image respectively, obtaining pad inspection
Survey result.
In a specific embodiment, in addition to：
Drill identification module, for according to borehole data information, identifying each drilling in printed circuit board；
Drill screening module, for carrying out category filter to each drilling, obtains plated through-hole and non-metallic hole.
In a specific embodiment, drill hole information module, including：
Circuit layer recognition unit, for according to borehole data information, identifying plated through-hole, nonmetallic hole through each respectively
First floor circuit and tail layer circuit in circuit layer；
Peripheral form collecting unit, for gathering plated through-hole respectively in first floor circuit layer, the aspect graph of tail layer circuit layer
As information；Morphological image information of the non-metallic hole in first floor circuit layer, tail layer circuit layer is gathered respectively.
On the other hand, the embodiment of the present invention additionally provides a kind of detector of automatic detection pad, including memory, processing
Device, wherein memory storage have computer program, and automatic detection pad can be realized when computer program is executed by processor
Each step of method.
On the other hand, the embodiment of the present invention additionally provides a kind of computer-readable recording medium, is stored thereon with computer
Program, the program processor realize each step of method of automatic detection pad when performing.
The invention has the advantages that and beneficial effect：
The method and device of automatic detection pad of the present invention, are classified by the drilling to printed circuit board, screening
Go out plated through-hole and non-metallic hole.The first floor circuit layer and tail layer electricity run through to plated through-hole, non-metallic hole in circuit layer
Road floor carries out morphological image information gathering, and pad is completed in the circuit image of each corresponding circuit layer according to morphological image information
Detection, and obtain result.The present invention improves weldering by bore process attribute and combined circuit image with printed circuit board
The efficiency of disk detection operation, reduces error rate.
Brief description of the drawings
Fig. 1 is the schematic flow sheet of the embodiment of the method 1 of automatic detection pad of the present invention；
Fig. 2 is the method idiographic flow schematic diagram of automatic detection pad of the present invention；
Fig. 3 is the schematic flow sheet that the method for automatic detection pad of the present invention obtains each drilling morphological image information；
Fig. 4 is the circuit image schematic diagram of printed circuit board provided by the invention；
Fig. 5 is plated through-hole testing result schematic diagram in the method for automatic detection pad of the present invention；
Fig. 6 is non-metallic hole testing result schematic diagram in the method for automatic detection pad of the present invention；
Fig. 7 is the structural representation of device embodiment 1 of automatic detection pad of the present invention.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing
Give the preferred embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to this paper institutes
The embodiment of description.On the contrary, the purpose for providing these embodiments is made to the disclosure more thorough and comprehensive.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more phases
The arbitrary and all combination of the Listed Items of pass.
Referring to Fig. 1, Fig. 1 is the schematic flow sheet of the embodiment of the method 1 of invention automatic detection pad, as illustrated, including
Following steps：
Step S110：Obtain printed circuit board to be produced borehole data information and printed circuit board to be produced in it is each
The circuit image of circuit layer.
In printed circuit board manufacture, the circuit design process of PCB printed circuit boards can generate film file, and drilling
File.Wherein film file contains the circuit image of printed circuit board to be produced, and printed circuit board actually has multiple electricity
Road floor, each circuit layer have corresponding circuit image, therefore are corresponding with a film file, are produced in printed circuit board
When, it is necessary to which the circuit image in each film file is transferred on printed circuit board so that formed on printed circuit board complete
Circuit image.In addition, contain the hole number such as the type of each drilling, position and size on printed circuit board in drilling file
It is believed that breath.Therefore, can by drill file and film file acquisition to printed circuit board to be produced borehole data information and
The circuit image of each circuit layer.
The method of the above-described circuit image for obtaining borehole data information and each circuit layer is automatic inspection of the invention
More preferably mode, but be not limited to which in the embodiment of the method 1 of pad is surveyed, those skilled in the art can also pass through it
He realizes mode.Such as borehole data information can also obtain from the program file of drilling machine, each circuit layer circuit image
It can also be obtained from the circuit design drawing of design printed circuit board.
Step S120：According to borehole data information and each circuit image, obtain what is respectively drilled in printed circuit board to be produced
Morphological image information.
Because it is different, the drilling such as its size and shape to drill that different types of drilling, which runs through the circuit layer passed through,
Data message is also different.And the position for each drilling that borehole data information includes, run through the circuit passed through with drilling
Borehole image position in the circuit image of layer is corresponding overlapping.Therefore, borehole data information and each circuit image are combined,
Target detection position can be effectively positioned, printed circuit board can be therefrom obtained and respectively drill the aspect graph on corresponding circuit image
As information.Wherein, morphological image information includes the combination of one or both of the appearance profile of drilling, shape size.
Step S130：According to morphological image information, pad detection is carried out to each circuit image respectively, obtains pad detection knot
Fruit.
Drilling is distributed with each circuit image, because the different circuit layer differences for drilling run through are, it is necessary to respectively to each line
Road image carries out pad detection, i.e., the circuit image of the circuit layer where each drilling is detected respectively.Further, will be from
Morphological image feature, such as the group of one or both of appearance profile, shape size are extracted in the morphological image information of drilling
Close, contrasted with pad morphological image feature, and then learn and whether there is pad defect in the circuit image where each drilling.
The method of automatic detection pad of the present invention, pass through the borehole data information for obtaining printed circuit board to be produced and each electricity
Circuit image corresponding to the floor of road, the morphological image information that printed circuit board to be produced respectively drills is learned, each circuit image is carried out
Automatic pad detection.Further, the pad defect in the circuit image of printed circuit board can be modified by the present invention, and then
Improve film file so that in process of production, be transferred to from film file on printed circuit board and include drilling morphological image
Circuit image be correct, improve the quality of production of printed circuit board.
Referring to Fig. 2, Fig. 2 is the idiographic flow schematic diagram of the method for automatic detection pad of the present invention, as shown in the figure.
In a specific embodiment, comprise the following steps：
Step S210：Obtain printed circuit board to be produced borehole data information and printed circuit board to be produced in it is each
The circuit image of circuit layer.
Step S220：According to borehole data information, each drilling in printed circuit board is identified.
In borehole data information, include the type respectively to be drilled in printed circuit board, position and shape size.Therefore root
According to borehole data information, the species respectively to be drilled in printed circuit board, and the position in printed circuit board can be identified, and
Its mode of appearance.Further, the test position on the circuit image of each circuit layer of printed circuit board can be learnt.
Step S230：Category filter is carried out to each drilling, obtains plated through-hole and non-metallic hole.
Drilling in printed circuit board includes plated through-hole and non-metallic hole, by category filter, by the brill of two major classes
Hole makes a distinction.Plated through-hole refers to there is plating vestige on hole wall, for connecting and turning on the element between printed circuit board,
On the other hand, the copper foil circuit penetrated between multiple circuit layers, because in actual applications, printed circuit board is by multiple circuit layers
Stack accumulation to form, copper foil circuit is furnished with each circuit layer, and a layer insulating can be laid with again between each circuit layer, because
This needs plated through-hole connection to realize conducting.Non-metallic hole is not usually required to be electroplated in hole wall, and the overwhelming majority is used for solid
The interface unit of fixed periphery.Therefore, plated through-hole usually requires to increase amount of copper on connecting terminal, increases conductive area, and non-
The mode of appearance of plated through-hole is variant.By both differentiations, when being detected to circuit image, according to different drilling
Type calls different testing conditions.
Step S240：According to borehole data information and each circuit image, obtain what is respectively drilled in printed circuit board to be produced
Morphological image information.
Step S250：According to morphological image information, pad detection is carried out to each circuit image respectively, obtains pad detection knot
Fruit.
Each embodiment of method of automatic detection pad of the present invention, by borehole data information and circuit image to printing
The drilling of circuit board carries out Classification and Identification, so as to effectively navigate to drilling target test position in circuit image, and
Testing conditions corresponding to calling carry out pad detection to drilling.The automaticity of further perfect detection pad, improves inspection
The accuracy of survey so that the pad defect of the film file for producing printed circuit board is improved.
Referring to Fig. 3, Fig. 3 is that the method for automatic detection pad of the present invention obtains the schematic flow sheet of each borehole image information,
As shown in the figure.
In a specific embodiment, according to borehole data information and each circuit image, printed circuit to be produced is obtained
The step of morphological image information of each drilling in plate, includes：
Step S310：According to borehole data information, identify that plated through-hole, non-metallic hole run through in each circuit layer respectively
First floor circuit layer and tail layer circuit layer.
Plated through-hole includes blind hole, buried via hole, (High Density Interconnection, " high density is mutual in HDI holes
Even "), metal depth sounding blind hole, back drill hole etc..
Wherein, blind hole：It is the via type that PCB internal layers cabling is connected with PCB top layers cabling, this hole does not penetrate whole plate
Son.Buried via hole：Then only connect internal layer between cabling via type, so can't see from pcb board surface.Metal depth sounding is blind
Hole：Using a kind of a kind of bore mode of high-precision control depth, reach each electricity of pcb board part by electroplating hole copper
The connection of performance, to reach the purpose of pcb board part high-density wiring.Back drill hole：The through hole of electroplated completion is passed through secondary
Drilling, reduce hole wall unnecessary in through hole, to reduce STUB (stub) length and capacity effect, so as to improve high speed signal
Transmission characteristic, improve the transmission rate of high speed connector.
Thus, according to the difference of drilling kind, the circuit layer that drilling runs through printed circuit board is different, and phase is turned in connection
Answer needs to carry out plating realization electrical connection in hole wall during circuit layer, and need to make bond pad shapes in the upper and lower surface of drilling, increases
Strong electric conductivity.In the circuit layer that drilling is passed through through printed circuit board, the circuit layer at its head and the tail both ends is respectively first floor circuit
Layer and tail layer circuit layer, in actual production manufacture, the welding disking area of the upper and lower surface of drilling be arranged at the first floor circuit layer and
In tail layer circuit layer.According to borehole data information, plated through-hole and the nonmetallic first floor electricity run through in each circuit layer are identified
Road floor and tail floor circuit layer, and then orient plated through-hole and non-metallic detection range.
Step S320：Morphological image information of the plated through-hole in first floor circuit layer, tail layer circuit layer is gathered respectively；Adopt respectively
Collect morphological image information of the non-metallic hole in first floor circuit layer, tail layer circuit layer.
The upper and lower surface welding disking area of plated through-hole in the first floor circuit layer through passed through circuit layer and tail layer circuit layer,
Therefore the morphological image information of plated through-hole can be gathered in two circuit layer.In practice, non-metallic hole portion big absolutely
Divide and do not possess electrical connection performance, pad can not be set up, unnecessary pad be present to prevent non-metallic hole, influence the work of finished product
Skill demand, non-metallic hole need to be gathered respectively through the first floor circuit layer of place circuit layer and the morphological image letter of tail layer circuit layer
Breath.
Each embodiment of method of automatic detection pad of the present invention, by identifying the plated through-hole of printed circuit board and nonmetallic
Change hole, and first floor circuit layer and tail layer circuit layer in the circuit layer of place, so obtain plated through-hole, it is non-metallic on
Morphological image information corresponding to lower two sides.The present invention can effectively navigate to plated through-hole and non-in the circuit image of each circuit layer
The morphological image information of plated through-hole, improve the efficiency of automatic detection pad.
In a specific embodiment, according to morphological image information, pad detection is carried out to each circuit image respectively, obtained
To pad result the step of include：
When the result of pad detection omits pad plated through-hole to be present, the plated through-hole pair of pad is left described in confirmation
The circuit image for the circuit layer answered lacks pad data, and gives a warning.
In practice, plated through-hole includes the pad area around the hole, when detecting that plated through-hole lacks pad,
Then give a warning information, to add pad to the plated through-hole that pad is omitted in circuit image in time so that the film of output
File improves.
In a specific embodiment, according to morphological image information, pad detection is carried out to each circuit image respectively, obtained
To pad detection result the step of, in addition to：
When the result of pad detection is with the presence of non-metallic hole pad, confirm that the non-metallic hole that pad be present is corresponding
Circuit layer the vicious pad data of circuit image, and give a warning.
In practice, non-metallic hole does not possess electrical connection performance, and pad can need not be set up around the hole, when
When detecting that non-metallic hole has pad, then give a warning, so as in time to the pad in the non-metallic hole in circuit image
It is modified according to the actual requirements.
To further illustrate the method for automatic detection pad provided by the invention, referring to Fig. 4, Fig. 5 and Fig. 6, Fig. 4 is this hair
The circuit image schematic diagram of the printed circuit board of bright offer；Fig. 5 examines for plated through-hole in the method for automatic detection pad of the present invention
Survey result schematic diagram；Fig. 6 is non-metallic hole testing result schematic diagram in the method for automatic detection pad of the present invention.
In a specific embodiment, as shown in figure 4, there are plated through-hole and non-metallic in printed circuit board
Hole, and both mode of appearance are different, plated through-hole there are welding disking area, rather than plated through-hole can not then set up pad area
Domain.
In a specific embodiment, referring to Fig. 5 and Fig. 6, with reference to Fig. 4.
Drl represents through hole；SzbzM (t/b) represents back drill hole；KsM-N (t/b) represents metal depth sounding hole；DrlM-N is represented
The blind buried via hole of machinery；LaserM-N represents the blind buried via holes of HDI.
It is assumed that drill file and film file are obtained from printed circuit board to be produced, by drilling file and Ge Fei
Woods file is imported into automatic pad inspection software, therefrom obtains the circuit image of borehole data information and each circuit layer.Automatically
Detection pad software is analyzed in the borehole data information and obtained, the printed circuit board to be produced include through hole, back drill hole,
Metal depth sounding hole, the blind buried via hole of machinery and the blind buried via holes of HDI, and non-metallic hole.Wherein, through hole is corresponding in printed circuit board top layer
Pad be present with bottom.The drilling of back drill hole and metal depth sounding blind hole includes " t " or " b ", then it represents that from printed circuit board
Top layer or bottom start through drilling.The drilling of the blind buried via hole of machinery and the blind buried via holes of HDI includes drl2-5, then it represents that this two kinds pass through
The second layer of printed circuit board is worn to layer 5.
According to the result analyzed in the above-mentioned information from borehole data, then drilled each through the circuit layer pair of printed circuit board
Carry out detecting target positioning in the circuit image answered, that is, navigate to the line map of top layer, bottom, the second layer and layer 5 circuit layer
Picture, the image information of drilling is therefrom obtained, carry out automatic pad detection, it is corresponding with pad by software automation contrast drilling
Relation.Testing result is sent by automatic detection pad software upon completion of the assays, in Fig. 5, alerts, that is, detects for testing result
Go out to have plated through-hole pad omission on the circuit image of top layer circuit layer to be present in CS layers.Such as Fig. 6, that is, it is tested with non-gold
Categoryization hole there are pad in CS layers, and in practice, non-metallic hole can be without pad in circuit layer.
The method of automatic detection pad of the present invention, pad detection can be carried out in automatic detection pad software, but do not limited to
In the automatic detection pad software, can be carried out in other systems or equipment that can realize automatic pad detection.
Each embodiment of method of pad detection of the invention automatic, by according to borehole data information, to printed circuit board
Drilling carries out category filter, and detection positioning is carried out in the circuit image of each circuit layer, and then completes automatic pad detection.Enter one
The scrappage walked in printed circuit board manufacture production reduces, and improves product qualification rate, has saved material and cost of labor.
Referring to Fig. 7, Fig. 7 is the structural representation of device embodiment 1 of automatic detection pad of the present invention, as shown in the figure.
The device of automatic detection pad of the present invention, include data obtaining module 710, borehole image acquisition module 720 with
And detection module 730.
Data obtaining module 710, for the borehole data information for obtaining printed circuit board to be produced and each circuit layer
Circuit image.
In printed circuit board manufacture, the circuit design process of PCB printed circuit boards can generate film file, and drilling
File.Wherein film file contains the circuit image of printed circuit board to be produced, and printed circuit board actually has multiple electricity
Road floor, each circuit layer have corresponding circuit image, therefore are corresponding with a film file, are produced in printed circuit board
When, it is necessary to which the circuit image in each film file is transferred on printed circuit board so that formed on printed circuit board complete
Circuit image.In addition, contain the hole number such as the type of each drilling, position and size on printed circuit board in drilling file
It is believed that breath.Therefore, can by drill file and film file acquisition to printed circuit board to be produced borehole data information and
The circuit image of each circuit layer.
The method of the above-described circuit image for obtaining borehole data information and each circuit layer is automatic inspection of the invention
More preferably mode, but be not limited to which in the device embodiment 1 of pad is surveyed, those skilled in the art can also pass through it
He realizes mode.Such as borehole data information can also obtain from the program file of drilling machine, each circuit layer circuit image
It can also be obtained from the circuit design drawing of design printed circuit board.
Borehole image acquisition module 720, for according to borehole data information and each circuit image, obtaining print to be produced
The morphological image information respectively to be drilled in circuit board processed.
Because it is different, the drilling such as its size and shape to drill that different types of drilling, which runs through the circuit layer passed through,
Data message is also different.And the position for each drilling that borehole data information includes, run through the circuit passed through with drilling
Borehole image position in the circuit image of layer is corresponding overlapping.Therefore, borehole data information and each circuit image are combined,
Target detection position can be effectively positioned, printed circuit board can be therefrom obtained and respectively drill the aspect graph on corresponding circuit image
As information.Wherein, morphological image information includes the combination of one or both of the appearance profile of drilling, shape size.
Detection module 730, for according to morphological image information, carrying out pad detection to each circuit image respectively, being welded
Disk testing result.
Drilling is distributed with each circuit image, because the different circuit layer differences for drilling run through are, it is necessary to respectively to each line
Road image carries out pad detection, i.e., the circuit image of the circuit layer where each drilling is detected respectively.Further, will be from
Morphological image feature, such as the group of one or both of appearance profile, shape size are extracted in the morphological image information of drilling
Close, contrasted with pad morphological image feature, and then learn and whether there is pad defect in the circuit image where each drilling.
Each embodiment of device of automatic pad detection of the invention, printed circuit board to be produced is obtained by data obtaining module
Borehole data information and each circuit layer corresponding to circuit image, printed circuit to be produced is learned using borehole image acquisition module
The morphological image information that plate respectively drills, automatic pad detection is carried out to each circuit image by detection module.The present invention will can print
Pad defect in the circuit image of circuit board is modified, and then improves film file, by using revised film text
Part, improve the production efficiency of printed circuit board.
In a specific embodiment, in addition to drilling screening module 750 and drilling identification module 740.
Drill screening module 750, for according to borehole data information, identifying each drilling in printed circuit board.
Drill identification module 740, for carrying out category filter to each drilling, obtains plated through-hole and non-metallic hole.
This hair automatic pad detection device, by borehole data information and circuit image to printed circuit board
Drilling carries out Classification and Identification, so as to effectively navigate to drilling target test position in circuit image, and calls corresponding
Testing conditions to drilling carry out pad detection.The automaticity of further perfect detection pad, improves the accurate of detection
Property so that the pad defect of the film file for producing printed circuit board is improved.
In a specific embodiment, borehole image acquisition module 720, in addition to：
Circuit layer recognition unit 7202, for according to borehole data information, identifying plated through-hole, non-metallic hole respectively
First floor circuit and tail layer circuit in each circuit layer；
According to the difference of drilling kind, the circuit layer that drilling runs through printed circuit board is different, and corresponding electricity is turned in connection
Need to carry out plating realization electrical connection in hole wall during the floor of road, and bond pad shapes need to be made in the upper and lower surface of drilling, enhancing is led
Electrically.In the circuit layer that drilling is passed through through printed circuit board, the circuit layer at its head and the tail both ends be respectively first floor circuit layer and
Tail layer circuit layer, in actual production manufacture, the welding disking area of the upper and lower surface of drilling is arranged at the first floor circuit layer and tail layer
In circuit layer.According to borehole data information, plated through-hole and the nonmetallic first floor circuit layer run through in each circuit layer are identified
With tail layer circuit layer, and then plated through-hole and non-metallic detection range are oriented.
Morphological image collecting unit 7206, for gathering the plated through-hole respectively in first floor circuit layer, tail layer circuit layer
Morphological image information；Morphological image information of the non-metallic hole in first floor circuit layer, tail layer circuit layer is gathered respectively.
The upper and lower surface welding disking area of plated through-hole in the first floor circuit layer through passed through circuit layer and tail layer circuit layer,
Therefore the morphological image information of plated through-hole can be gathered in two circuit layer.In practice, non-metallic hole portion big absolutely
Divide and do not possess electrical connection performance, pad can not be set up, unnecessary pad be present to prevent non-metallic hole, influence the work of finished product
Skill demand, non-metallic hole need to be gathered respectively through the first floor circuit layer of place circuit layer and the morphological image letter of tail layer circuit layer
Breath.
Each embodiment of device of automatic pad detection of the invention, by identifying printed circuit board in circuit layer recognition unit
Plated through-hole and non-metallic hole, and first floor circuit layer and tail layer circuit layer in the circuit layer of place, and then scheming
As obtaining plated through-hole, morphological image information corresponding to non-metallic hole upper and lower surface in collecting unit.The present invention can effectively exist
The morphological image information in plated through-hole and non-metallic hole is navigated in the circuit image of each circuit layer, improves automatic detection pad
Efficiency.
In a specific embodiment, present invention also offers a kind of detector of automatic detection pad, including storage
Device, processor, wherein memory storage have computer program, and automatic detection can be realized when computer program is executed by processor
Each step of the method for pad, will not be repeated here.Thus, can be by the detector of automatic detection pad, to printed circuit board
Circuit image carry out automatic pad detection, and then the pad defect in the film file of printed circuit board to be produced is carried out
Amendment, improve the accuracy of printed circuit board circuit image.
In a specific embodiment, the invention provides a kind of computer-readable recording medium, is stored thereon with meter
Calculation machine program, the program realize each step of the method for automatic detection pad when being executed by processor.Thus, it is easy to automatic inspection
The method for surveying pad is effectively imported into processor, and is performed automatic pad according to the program and detected, and effectively optimizes pad detection
Operation, improve production efficiency.
The method and device of pad detection of the invention automatic, by obtain printed circuit board to be produced hole number it is believed that
Circuit image corresponding to breath and each circuit layer, learns the morphological image information that printed circuit board to be produced respectively drills, to each circuit
Image carries out automatic pad detection.Instant invention overcomes the circuit image of printed circuit board is manually examined in conventional art
Survey, cause the technical problem of flase drop or missing inspection, and then improve product qualification rate, reduce product rejection probability, optimize artificial inspection
Survey operation so that detection operation automation, improving production efficiency.Further, the quality of production of printed circuit board is ensure that, together
When meet nowadays electronic product to the process requirements of printed circuit board.
Further, the present invention is classified by the drilling to printed circuit board, filters out plated through-hole and nonmetallic
Change hole.The first floor circuit layer and tail layer circuit layer run through to plated through-hole, non-metallic hole in circuit layer carries out morphological image letter
Breath collection, pad detection is completed in the circuit image of each corresponding circuit layer according to morphological image information, and obtain result.This
Invention improves the efficiency of pad detection operation by the bore process attribute with printed circuit board and combined circuit image,
Production error rate is reduced, has saved material and cost of labor.
Each technical characteristic of above example can be combined arbitrarily, to make description succinct, not to above-described embodiment
In each technical characteristic it is all possible combination be all described, as long as however, lance is not present in the combination of these technical characteristics
Shield, all it is considered to be the scope of this specification record.One of ordinary skill in the art will appreciate that realize above-described embodiment side
All or part of step in method is by program the hardware of correlation can be instructed to complete, and described program can be stored in
In one computer read/write memory medium, the program upon execution, including the step of above method, described storage medium, such as：
ROM/RAM, magnetic disc, CD etc..
Above example only expresses the several embodiments of the present invention, and its description is more specific and detailed, but can not
Therefore it is construed as limiting the scope of the patent.It should be pointed out that for the person of ordinary skill of the art,
On the premise of not departing from present inventive concept, various modifications and improvements can be made, these belong to protection scope of the present invention.
Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
- A kind of 1. method of automatic detection pad, it is characterised in that comprise the following steps：Obtain the borehole data information of printed circuit board to be produced and each circuit layer in the printed circuit board to be produced Circuit image；According to the borehole data information and each circuit image, the shape respectively to be drilled in the printed circuit board to be produced is obtained State image information；According to the morphological image information, pad detection is carried out to each circuit image respectively, obtains the pad detection knot Fruit.
- 2. the method for automatic detection pad according to claim 1, it is characterised in that according to the borehole data information and Each circuit image, before the step of obtaining the morphological image information of each drilling in the printed circuit board to be produced, also Including step；According to the borehole data information, each drilling in the printed circuit board is identified；Category filter is carried out to each drilling, obtains plated through-hole and nonmetallic hole.
- 3. the method for automatic detection pad according to claim 2, it is characterised in that according to the borehole data information and Each circuit image, include the step of the body image information for obtaining each drilling in the printed circuit board to be produced：According to the borehole data information, identify that the plated through-hole, the non-metallic hole run through each circuit respectively First floor circuit layer and tail layer circuit layer in layer；The morphological image information of the plated through-hole in the first floor circuit layer, the tail layer circuit layer is gathered respectively；Point The morphological image information of the non-metallic hole in the first floor circuit layer, the tail layer circuit layer is not gathered.
- 4. the method for the automatic detection pad according to Claims 2 or 3, it is characterised in that according to each morphological image The step of information, carrying out pad detection to each circuit image respectively, obtaining the result of the pad detection includes：When the result of pad detection omits pad plated through-hole to be present, the plated through-hole pair for omitting pad is confirmed The circuit image for the circuit layer answered lacks pad data, and gives a warning.
- 5. the method for the automatic detection pad according to Claims 2 or 3, it is characterised in that according to each morphological image Information, pad detection is carried out to each circuit image respectively, the step of obtaining the result of the pad detection, in addition to：When the result of pad detection is with the presence of non-metallic hole pad, the non-metallic hole that pad be present is confirmed The wrong pad data of circuit image of the corresponding circuit layer, and give a warning.
- A kind of 6. device of automatic detection pad, it is characterised in that including：Data obtaining module, for obtaining the borehole data information of printed circuit board to be produced and the line map of each circuit layer Picture；Borehole image acquisition module, for according to the borehole data information and each circuit image, obtaining described to be produced The morphological image information respectively to be drilled in printed circuit board；Detection module, for according to the morphological image information, carrying out pad detection to each circuit image respectively, obtaining institute State pad testing result.
- 7. the device of automatic detection pad according to claim 6, it is characterised in that also include：Drill identification module, for according to the borehole data information, identifying each drilling in the printed circuit board；Drill screening module, for carrying out category filter to each drilling, obtains plated through-hole and non-metallic hole.
- 8. the device of automatic detection pad according to claim 6, it is characterised in that the borehole image acquisition module bag Include：Circuit layer recognition unit, for according to the borehole data information, identifying the plated through-hole, described nonmetallic respectively Change first floor circuit and tail layer circuit that hole is run through in each circuit layer；Image acquisition units, for gathering institute of the plated through-hole in the first floor circuit layer, the tail layer circuit layer respectively State morphological image information；The shape of the non-metallic hole in the first floor circuit layer, the tail layer circuit layer is gathered respectively State image information.
- 9. a kind of detector of automatic detection pad, it is characterised in that including memory, processor, wherein the memory is deposited Computer program is contained, the computer program can be realized claim 1 to 5 any one institute during the computing device The step of stating method.
- 10. a kind of computer-readable recording medium, is stored thereon with computer program, it is characterised in that the program is by processor The step of claim 1 to 5 any one methods described is realized during execution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710923027.1A CN107796820B (en) | 2017-09-30 | 2017-09-30 | Method and device for automatically detecting bonding pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710923027.1A CN107796820B (en) | 2017-09-30 | 2017-09-30 | Method and device for automatically detecting bonding pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107796820A true CN107796820A (en) | 2018-03-13 |
| CN107796820B CN107796820B (en) | 2020-08-18 |
Family
ID=61532796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710923027.1A Active CN107796820B (en) | 2017-09-30 | 2017-09-30 | Method and device for automatically detecting bonding pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107796820B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108595839A (en) * | 2018-04-25 | 2018-09-28 | 郑州云海信息技术有限公司 | A kind of generation method and system of the crimp back drill via file based on Cadence Skill |
| CN109063294A (en) * | 2018-07-20 | 2018-12-21 | 郑州云海信息技术有限公司 | A kind of angle automatic check method and device based at PCB power supply or Horizon facial contour |
| CN111239156A (en) * | 2020-01-15 | 2020-06-05 | 广州兴森快捷电路科技有限公司 | Method, device and equipment for identifying patterned bonding pad blocking area and storage medium |
| CN112326667A (en) * | 2020-10-27 | 2021-02-05 | 惠州市特创电子科技有限公司 | Copper-clad detection method and device for conductive connecting hole |
| CN112328554A (en) * | 2020-11-23 | 2021-02-05 | 迈普通信技术股份有限公司 | Method and device for generating secondary drilling file, electronic equipment and storage medium |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102297871A (en) * | 2010-06-24 | 2011-12-28 | 松下电器产业株式会社 | Test data generation method |
| JP2012002681A (en) * | 2010-06-17 | 2012-01-05 | Panasonic Corp | Solder inspection method |
| CN102338754A (en) * | 2010-07-22 | 2012-02-01 | 牧德科技股份有限公司 | Method for detecting defects of power supply layer and ground layer of circuit board |
| CN103366036A (en) * | 2012-04-04 | 2013-10-23 | 松下电器产业株式会社 | Method for generating demonstration data used for welding inspection, and method for welding inspection |
-
2017
- 2017-09-30 CN CN201710923027.1A patent/CN107796820B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012002681A (en) * | 2010-06-17 | 2012-01-05 | Panasonic Corp | Solder inspection method |
| CN102297871A (en) * | 2010-06-24 | 2011-12-28 | 松下电器产业株式会社 | Test data generation method |
| CN102338754A (en) * | 2010-07-22 | 2012-02-01 | 牧德科技股份有限公司 | Method for detecting defects of power supply layer and ground layer of circuit board |
| CN103366036A (en) * | 2012-04-04 | 2013-10-23 | 松下电器产业株式会社 | Method for generating demonstration data used for welding inspection, and method for welding inspection |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108595839A (en) * | 2018-04-25 | 2018-09-28 | 郑州云海信息技术有限公司 | A kind of generation method and system of the crimp back drill via file based on Cadence Skill |
| CN108595839B (en) * | 2018-04-25 | 2021-11-02 | 郑州云海信息技术有限公司 | Method and system for generating compression joint back drilling via file based on Cadence skip |
| CN109063294A (en) * | 2018-07-20 | 2018-12-21 | 郑州云海信息技术有限公司 | A kind of angle automatic check method and device based at PCB power supply or Horizon facial contour |
| CN111239156A (en) * | 2020-01-15 | 2020-06-05 | 广州兴森快捷电路科技有限公司 | Method, device and equipment for identifying patterned bonding pad blocking area and storage medium |
| CN112326667A (en) * | 2020-10-27 | 2021-02-05 | 惠州市特创电子科技有限公司 | Copper-clad detection method and device for conductive connecting hole |
| CN112328554A (en) * | 2020-11-23 | 2021-02-05 | 迈普通信技术股份有限公司 | Method and device for generating secondary drilling file, electronic equipment and storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107796820B (en) | 2020-08-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107796820A (en) | The method and device of automatic detection pad | |
| CN105184778B (en) | Detection method and device | |
| CN105005997A (en) | Multi-type BGA chip visual identification method based on row and column linear clustering | |
| CN105510348A (en) | Flaw detection method and device of printed circuit board and detection equipment | |
| CN103293170B (en) | Territorial classification device, base board checking device and territorial classification method | |
| CN113410154B (en) | Intelligent detection method for chip | |
| CN106961796B (en) | A kind of production method convenient for detecting the PCB of back drill hole precision | |
| CN113409245A (en) | Automatic identification method for X-ray inspection defects of electronic components | |
| CN116385770A (en) | PCB defect board marking and storing method, system, electronic equipment and storage medium | |
| CN115495055B (en) | RPA element matching method and system based on interface region identification technology | |
| CN111356290A (en) | PCB capable of detecting back drilling depth and detection method | |
| CN109933931B (en) | Method for detecting whether back drilling target layer is set correctly | |
| CN118011190B (en) | Printed circuit board reliability analysis method, system and storage medium | |
| CN106503735B (en) | The recognition methods of wiring board item number and device | |
| Caliskan et al. | Design and realization of an automatic optical inspection system for PCB solder joints | |
| CN108875232B (en) | Method, device and equipment for checking welding-proof windowing and readable storage medium | |
| Gore et al. | A novel methodology for health assessment in printed circuit boards | |
| Anitha et al. | SMT component inspection in PCBA’s using image processing techniques | |
| CN101908082B (en) | Impedance design method and device for printed circuit board | |
| CN109029225A (en) | A kind of Microvia laser pore-forming quality periodic sensing approach | |
| JPH055772A (en) | Printed-circuit board test system | |
| CN115372793B (en) | Circuit detection method for integrated circuit | |
| CN107908873B (en) | Method and device for checking high-speed line across reference planes | |
| CN109769347A (en) | A kind of measurement judgment method for PCB drilling depth | |
| WO2001040770A2 (en) | Adaptive tolerance reference inspection system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |