CN107796820B - Method and device for automatically detecting bonding pad - Google Patents
Method and device for automatically detecting bonding pad Download PDFInfo
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- CN107796820B CN107796820B CN201710923027.1A CN201710923027A CN107796820B CN 107796820 B CN107796820 B CN 107796820B CN 201710923027 A CN201710923027 A CN 201710923027A CN 107796820 B CN107796820 B CN 107796820B
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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Abstract
The invention relates to a method and a device for automatically detecting a bonding pad, wherein the method for automatically detecting the bonding pad comprises the following steps: acquiring drilling data information of a printed circuit board to be produced and circuit images of circuit layers in the printed circuit board to be produced; acquiring form image information of each drill hole in the printed circuit board to be produced according to the drill hole data information and each circuit image; and respectively carrying out pad detection on each line image according to the form image information to obtain a pad detection result. The invention overcomes the technical problem of false detection or missed detection caused by manual detection of the circuit image of the printed circuit board in the traditional technology, thereby improving the product percent of pass, reducing the product rejection rate, optimizing the manual detection operation, automating the detection operation and improving the production efficiency. Furthermore, the production quality of the printed circuit board is ensured, and the process requirements of the electronic products on the printed circuit board are met.
Description
Technical Field
The invention relates to the technical field of printed circuit board detection processes, in particular to a method and a device for automatically detecting a bonding pad.
Background
With the rapid development of electronic products, the design of Printed Circuit Board (PCB) boards is more and more complex, and processing modes such as blind buried vias, HDI (High Density interconnection), metal depth control blind vias, back drilling holes, and the like gradually occur.
In the implementation process, the inventor finds that at least the following problems exist in the conventional technology:
in the process of designing a film file for a PCB with a blind buried hole, an HDI hole, a metal depth control blind hole, a back drilling hole and the like, the condition of omitting or increasing bonding pads exists. Adopt traditional manual detection mode to cause the problem of false retrieval or hourglass inspection easily, and do not in time revise, lead to the circuit image on the film file to have the pad mistake, and then when utilizing this film file production, the quality problem that the hole was opened a way or is not conform to the product demand easily appears on the PCB plate, causes the PCB plate to scrap, and production efficiency is low.
Disclosure of Invention
In view of the above, it is necessary to provide a method and an apparatus for automatically inspecting a pad in order to solve the problem of low production efficiency of PCB board.
In order to achieve the above object, in one aspect, an embodiment of the present invention provides a method for automatically detecting a pad, including the following steps:
acquiring drilling data information of a printed circuit board to be produced and a circuit image of a circuit layer in the printed circuit board to be produced;
acquiring form image information of each drill hole in the printed circuit board to be produced according to the drill hole data information and each circuit image;
and respectively carrying out pad detection on each line image according to the form image information to obtain a pad detection result.
The invention has the following advantages and beneficial effects:
according to the automatic pad detection method, the drilling data information of the printed circuit board to be produced and the line images corresponding to all circuit layers are obtained, the form image information of all drilling holes of the printed circuit board to be produced is obtained, and automatic pad detection is carried out on all line images. The invention overcomes the technical problem of false detection or missed detection caused by manual detection of the circuit image of the printed circuit board in the traditional technology, thereby improving the product percent of pass, reducing the product rejection rate, optimizing the manual detection operation, automating the detection operation and improving the production efficiency. Furthermore, the production quality of the printed circuit board is ensured, and the process requirements of the electronic products on the printed circuit board are met.
In a specific embodiment, before the step of obtaining morphological image information of each drill hole in the printed circuit board to be produced according to the drill hole data information and each circuit image, the method further comprises the following steps:
identifying each drill hole in the printed circuit board according to the drill hole data information;
and classifying and screening the drill holes to obtain metallized holes and non-metallized holes.
In a specific embodiment, the step of obtaining morphological image information of each drill hole in the printed circuit board to be produced according to the drill hole data and each line image comprises:
identifying a head layer circuit layer and a tail layer circuit layer of a circuit layer through which metallized holes and non-metallized holes penetrate according to the drilling data information;
respectively collecting the shape image information of the metallized holes on the first layer circuit layer and the tail layer circuit layer; form image information of the non-metallized holes on the first layer circuit layer and the tail layer circuit layer is collected respectively.
In a specific embodiment, the step of performing pad inspection on each line image according to the image information to obtain the result of the pad inspection includes:
and when the detection result of the bonding pad shows that the metalized hole missing bonding pad exists, confirming that the circuit image of the circuit layer corresponding to the metalized hole of the missing bonding pad lacks bonding pad data, and giving a warning.
In a specific embodiment, the step of performing pad inspection on each line image according to the morphological image information to obtain a pad inspection result further includes:
and when the detection result of the bonding pad shows that the non-metallized hole exists in the bonding pad, confirming that the circuit image of the circuit layer corresponding to the non-metallized hole with the bonding pad has wrong bonding pad data, and giving a warning.
On the other hand, an embodiment of the present invention further provides an apparatus for automatically detecting a pad, including:
the information acquisition module is used for acquiring drilling data information of the printed circuit board to be produced and circuit images of all circuit layers;
the drilling image acquisition module is used for acquiring the form image information of each drilling hole in the printed circuit board to be produced according to the drilling data information and each line image;
and the detection module is used for respectively detecting the bonding pads of the line images according to the form image information to obtain bonding pad detection results.
In a specific embodiment, the method further comprises the following steps:
the drilling identification module is used for identifying each drilling hole in the printed circuit board according to the drilling data information;
and the drilling screening module is used for classifying and screening the drilling holes to obtain metallized holes and non-metallized holes.
In a particular embodiment, a drilling information module includes:
the circuit layer identification unit is used for respectively identifying a first layer circuit and a tail layer circuit of each circuit layer, wherein the metallized holes and the nonmetallic holes penetrate through the circuit layers;
the peripheral form acquisition unit is used for respectively acquiring form image information of the metallized holes on the first layer circuit layer and the tail layer circuit layer; form image information of the non-metallized holes on the first layer circuit layer and the tail layer circuit layer is collected respectively.
On the other hand, the embodiment of the invention also provides a detector for automatically detecting the bonding pad, which comprises a memory and a processor, wherein the memory stores a computer program, and the computer program can realize the steps of the method for automatically detecting the bonding pad when being executed by the processor.
In another aspect, an embodiment of the present invention further provides a computer-readable storage medium, on which a computer program is stored, where the program, when executed by a processor, implements the steps of the method for automatically detecting a pad.
The invention has the following advantages and beneficial effects:
the method and the device for automatically detecting the bonding pad screen the metalized holes and the non-metalized holes by classifying the drilled holes of the printed circuit board. And acquiring form image information of the first layer circuit layer and the tail layer circuit layer of the circuit layers through which the metallized holes and the non-metallized holes penetrate, completing pad detection in the circuit image of each corresponding circuit layer according to the form image information, and obtaining results. According to the invention, by applying the drilling process attribute of the printed circuit board and combining the line image, the efficiency of the pad detection operation is improved, and the error rate is reduced.
Drawings
FIG. 1 is a schematic flow chart of a method for automatically inspecting a bonding pad according to an embodiment 1 of the present invention;
FIG. 2 is a schematic flow chart of a method for automatically inspecting a bonding pad according to the present invention;
FIG. 3 is a schematic flow chart of the method for automatically detecting a pad according to the present invention for obtaining image information of each drilling pattern;
FIG. 4 is a schematic diagram of a circuit pattern of a printed circuit board according to the present invention;
FIG. 5 is a schematic diagram illustrating a result of detecting a plated-through hole in the method for automatically detecting a bonding pad according to the present invention;
FIG. 6 is a schematic diagram illustrating a non-metallized hole detection result in the method for automatically detecting a bonding pad according to the present invention;
fig. 7 is a schematic structural diagram of an apparatus for automatically inspecting a pad according to an embodiment 1 of the present invention.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, fig. 1 is a schematic flow chart of embodiment 1 of the method for automatically inspecting a pad of the present invention, and as shown in the figure, the method includes the following steps:
step S110: and acquiring the drilling data information of the printed circuit board to be produced and the circuit image of each circuit layer in the printed circuit board to be produced.
In the manufacture of printed circuit boards, the circuit design process of a PCB generates a film file, and a drilling file. The film file contains a circuit image of a printed circuit board to be produced, the printed circuit board actually has a plurality of circuit layers, and each circuit layer has a corresponding circuit image, so that a corresponding film file is provided, and when the printed circuit board is produced, the circuit images in the film files are required to be transferred to the printed circuit board, so that a complete circuit image is formed on the printed circuit board. In addition, the drilling file contains drilling data information such as the type, position and size of each drilling hole on the printed circuit board. Therefore, the drilling data information of the printed circuit board to be produced and the circuit image of each circuit layer can be obtained through the drilling file and the film file.
The method for acquiring the drilling data information and the line image of each circuit layer is a preferred mode in embodiment 1 of the method for automatically detecting the bonding pad of the present invention, but is not limited to this mode, and those skilled in the art can also implement this mode in other ways. For example, the drilling data information may be obtained from a program file for a drilling machine, and the circuit layer circuit images may be obtained from a circuit layout for designing a printed circuit board.
Step S120: and acquiring the form image information of each drill hole in the printed circuit board to be produced according to the drill hole data information and each circuit image.
Because different types of boreholes extend through different layers of circuitry, the borehole data information, such as the size and shape of the borehole, may vary. The position of each drill hole included in the drill hole data information is correspondingly overlapped with the position of the drill hole image in the circuit layer circuit image through which the drill hole passes. Therefore, the drilling data information is combined with the circuit images, the target detection position can be effectively positioned, and the form image information of each drilling hole of the printed circuit board on the corresponding circuit image can be obtained. Wherein the morphological image information includes one or a combination of a contour, a shape size, or both of the borehole.
Step S130: and respectively carrying out pad detection on each line image according to the form image information to obtain a pad detection result.
The drilling holes are distributed in each circuit image, and because the circuit layers penetrated by different drilling holes are different, the pad detection needs to be carried out on each circuit image respectively, namely the detection needs to be carried out on the circuit image of the circuit layer where each drilling hole is located respectively. Further, morphological image features, such as one or a combination of an outline and a shape size, are extracted from the morphological image information of the drill holes and compared with the pad morphological image features, and then whether a pad defect exists in the line image where each drill hole is located or not is known.
According to the method for automatically detecting the bonding pad, the drilling data information of the printed circuit board to be produced and the circuit image corresponding to each circuit layer are obtained, the form image information of each drilling hole of the printed circuit board to be produced is obtained, and automatic bonding pad detection is carried out on each circuit image. Furthermore, the invention can correct the pad defect in the circuit image of the printed circuit board, thereby perfecting the film file, ensuring that the circuit image which is transferred from the film file to the printed circuit board and contains the drilling shape image is correct in the production process, and improving the production quality of the printed circuit board.
Referring to fig. 2, fig. 2 is a detailed flowchart of the method for automatically inspecting a pad according to the present invention, as shown in the figure.
In a particular embodiment, the method comprises the following steps:
step S210: and acquiring the drilling data information of the printed circuit board to be produced and the circuit image of each circuit layer in the printed circuit board to be produced.
Step S220: identifying each borehole in the printed circuit board based on the borehole data information.
The drilling data information includes the type, position and shape and size of each drilling hole in the printed circuit board. Therefore, according to the drilling data information, the types of the drilling holes in the printed circuit board, the positions in the printed circuit board and the appearance form of the drilling holes can be identified. Further, the detection positions on the line images of the circuit layers of the printed circuit board can be known.
Step S230: and classifying and screening the drill holes to obtain metallized holes and non-metallized holes.
The drill holes in the printed circuit board comprise metallized holes and non-metallized holes, and the two types of drill holes are distinguished through classification and screening. The metallized hole is characterized in that a plated trace is formed on the hole wall and used for connecting and conducting elements between the printed circuit boards, and on the other hand, the plated trace penetrates through copper foil lines among a plurality of circuit layers. The non-metallized holes generally do not require plating of the walls of the holes, and are mostly used to secure peripheral connectors. Thus, the metallized holes generally require an increased amount of copper on the connection contacts, increasing the conductive area, and having a different appearance than the non-metallized holes. By distinguishing the two types, different detection conditions are called according to different drilling types when the line image is detected.
Step S240: and acquiring the form image information of each drill hole in the printed circuit board to be produced according to the drill hole data information and each circuit image.
Step S250: and respectively carrying out pad detection on each line image according to the form image information to obtain a pad detection result.
According to the method for automatically detecting the bonding pad, the drill holes of the printed circuit board are classified and identified in the drill hole data information and the circuit image, so that the drill hole target detection position can be effectively positioned in the circuit image, and the corresponding detection condition is called to carry out bonding pad detection on the drill holes. The automation degree of the detection of the bonding pad is further improved, the detection accuracy is improved, and the defects of the bonding pad of a film file for producing a printed circuit board are improved.
Referring to fig. 3, fig. 3 is a schematic flow chart of the method for automatically detecting a pad according to the present invention for obtaining image information of each drilled hole, as shown in the figure.
In a specific embodiment, the step of obtaining morphological image information of each drill hole in the printed circuit board to be produced according to the drill hole data information and each line image comprises:
step S310: and respectively identifying the metallized holes and the non-metallized holes penetrating through the first layer circuit layer and the tail layer circuit layer in each circuit layer according to the drilling data information.
The metallized holes include blind holes, buried holes, HDI (High Density Interconnection), metal deep vias, back drilled holes, and the like.
Wherein, the blind hole: the PCB is a through hole type connecting the inner layer wire of the PCB and the surface layer wire of the PCB, and the hole does not penetrate through the whole board. Hole burying: only the type of via connecting the traces between the inner layers is visible from the surface of the PCB board. Metal probing of a blind hole: the drilling mode of controlling the depth with high precision is adopted, and the connection of various electrical properties of the PCB is achieved by electroplating the copper of the blind hole, so that the purpose of high-density wiring of the PCB is achieved. Back drilling: and (3) drilling the electroplated through hole for the second time to reduce the redundant hole wall in the through hole so as to reduce the length and the capacitance effect of the STUB (STUB), thereby improving the transmission characteristic of the high-speed signal and improving the transmission rate of the high-speed connector.
Therefore, according to the different types of the drilled holes, the circuit layers of the printed circuit board penetrated by the drilled holes are different, when the corresponding circuit layers are connected and conducted, electroplating needs to be carried out on the hole walls to realize electrical connection, and the upper surface and the lower surface of the drilled holes need to be made into the shapes of the bonding pads, so that the conductivity is enhanced. In the circuit layer that printed circuit board passed through is run through in the drilling, the circuit layer at its head and the tail both ends is head layer circuit layer and tail layer circuit layer respectively, and in actual production manufacturing, the pad region of the upper and lower two sides of drilling sets up in this head layer circuit layer and tail layer circuit layer. According to the drilling data information, identifying the metallized holes and the nonmetal penetrating through the first layer circuit layer and the tail layer circuit layer in each circuit layer, and further positioning the detection range of the metallized holes and the nonmetal.
Step S320: respectively collecting the form image information of the metallized holes on the first layer circuit layer and the tail layer circuit layer; form image information of the non-metallized holes on the first layer circuit layer and the tail layer circuit layer is collected respectively.
The upper and lower surface pad areas of the metallized hole penetrate through the first layer circuit layer and the tail layer circuit layer of the circuit layer, so that the form image information of the metallized hole can be collected in the two circuit layers. In practical application, most of the non-metallized holes do not have electrical connection performance, no bonding pad can be set, and in order to prevent redundant bonding pads from existing in the non-metallized holes and influence the process requirements of finished products, morphological image information of a first layer circuit layer and a tail layer circuit layer of a circuit layer where the non-metallized holes penetrate through needs to be collected respectively.
According to the method for automatically detecting the bonding pad, the metallized holes and the non-metallized holes of the printed circuit board are identified, and the first layer circuit layer and the tail layer circuit layer in the circuit layer are penetrated through, so that the form image information corresponding to the metallized holes and the non-metallized upper and lower surfaces is obtained. The invention can effectively position the form image information of the metallized holes and the non-metallized holes in the circuit image of each circuit layer, and improve the efficiency of automatically detecting the bonding pads.
In a specific embodiment, the step of performing pad detection on each line image according to the morphological image information to obtain a result of the pad includes:
and when the detection result of the bonding pad shows that the metalized hole missing bonding pad exists, confirming that the circuit image of the circuit layer corresponding to the metalized hole of the left bonding pad lacks bonding pad data, and sending out a warning.
In practical application, the metalized hole comprises a pad area around the hole, and when the defect of a pad in the metalized hole is detected, warning information is sent out so as to add the pad to the metalized hole with the missing pad in the line image in time, so that the output film file is improved.
In a specific embodiment, the step of performing pad inspection on each line image according to the morphological image information to obtain a pad inspection result further includes:
and when the detection result of the bonding pad shows that the non-metallized hole exists in the bonding pad, confirming that the circuit image of the circuit layer corresponding to the non-metallized hole of the bonding pad has wrong bonding pad data, and giving a warning.
In practical application, the non-metallized hole has no electrical connection performance, a bonding pad is not required to be arranged around the hole, and when the bonding pad in the non-metallized hole is detected, a warning is given out so as to correct the bonding pad in the non-metallized hole in the line image according to practical requirements.
For further explanation of the method for automatically inspecting the bonding pads provided by the present invention, referring to fig. 4, fig. 5 and fig. 6, fig. 4 is a schematic diagram of a circuit image of the printed circuit board provided by the present invention; FIG. 5 is a schematic diagram illustrating a result of detecting a plated-through hole in the method for automatically detecting a bonding pad according to the present invention; fig. 6 is a schematic diagram illustrating a non-metallized hole detection result in the method for automatically detecting a pad of the present invention.
In a specific embodiment, as shown in fig. 4, a metalized hole and a non-metalized hole are present in the printed circuit board, and the appearance forms of the metalized hole and the non-metalized hole are different, the metalized hole has a pad area, and the non-metalized hole does not have the pad area.
In a specific embodiment, see fig. 5 and 6, in conjunction with fig. 4.
drl denotes a through hole; szbzM (t/b) represents a backborehole; ksM-N (t/b) denotes a metal-probed hole; drlM-N represents a mechanical blind buried via; LasherM-N represents a HDI blind buried via.
Suppose that a drilling file and a film file are obtained from a printed circuit board to be produced, the drilling file and the film files are imported into automatic pad detection software, and drilling data information and circuit images of circuit layers are obtained from the drilling file and the film files. And the automatic detection pad software is analyzed and obtained in the drilling data information, and the printed circuit board to be produced comprises a through hole, a back drilling hole, a metal deep probing hole, a mechanical blind buried hole, an HDI blind buried hole and a non-metallized hole. Wherein the through holes are corresponding to the pads on the top layer and the bottom layer of the printed circuit board. The drill strip for back drilling and metal-deepening blind vias includes "t" or "b", which means that the through-drilling is started from the top layer or the bottom layer of the printed circuit board. The drill tape for mechanical blind vias and HDI blind vias includes drl2-5, which means that the two types extend through the second layer to the fifth layer of the printed circuit board.
According to the analysis result from the drilling data information, positioning a detection target in the line image corresponding to the circuit layer of the printed circuit board penetrated by each drilling, namely positioning the line image to the top layer, the bottom layer, the second layer and the fifth layer of the circuit layer, obtaining the image information of the drilling from the line image, performing automatic pad detection, and automatically comparing the corresponding relation between the drilling and the pad through software. After the detection is completed, the automatic detection pad software sends out a detection result, as shown in fig. 5, which is a warning for the detection result, that is, a pad omission is detected on the circuit image of the CS layer, that is, the top circuit layer. As shown in fig. 6, the presence of the non-metallized hole in the CS layer is detected, and in actual use, the non-metallized hole does not need a pad in the circuit layer.
The method for automatically detecting the bonding pad can be used for detecting the bonding pad in automatic bonding pad detection software, but is not limited to the automatic bonding pad detection software and can be used in other systems or equipment capable of realizing automatic bonding pad detection.
According to the embodiments of the automatic pad detection method, the drill holes of the printed circuit board are classified and screened according to the drill hole data information, and detection and positioning are carried out in the circuit images of all circuit layers, so that the automatic pad detection is completed. Further, the rejection rate in the manufacturing production of the printed circuit board is reduced, the product percent of pass is improved, and the material and labor cost are saved.
Referring to fig. 7, fig. 7 is a schematic structural diagram of an apparatus for automatically inspecting a pad according to an embodiment 1 of the present invention, as shown in the drawing.
The device for automatically detecting the bonding pad comprises an information acquisition module 710, a drilling image acquisition module 720 and a detection module 730.
And the information acquisition module 710 is used for acquiring drilling data information of the printed circuit board to be produced and circuit images of each circuit layer.
In the manufacture of printed circuit boards, the circuit design process of a PCB generates a film file, and a drilling file. The film file contains a circuit image of a printed circuit board to be produced, the printed circuit board actually has a plurality of circuit layers, and each circuit layer has a corresponding circuit image, so that a corresponding film file is provided, and when the printed circuit board is produced, the circuit images in the film files are required to be transferred to the printed circuit board, so that a complete circuit image is formed on the printed circuit board. In addition, the drilling file contains drilling data information such as the type, position and size of each drilling hole on the printed circuit board. Therefore, the drilling data information of the printed circuit board to be produced and the circuit image of each circuit layer can be obtained through the drilling file and the film file.
The method for acquiring the drilling data information and the line image of each circuit layer is a preferred mode in the device embodiment 1 for automatically detecting the bonding pad of the present invention, but is not limited to this mode, and those skilled in the art can also realize this mode in other modes. For example, the drilling data information may be obtained from a program file for a drilling machine, and the circuit layer circuit images may be obtained from a circuit layout for designing a printed circuit board.
And the drilling image acquisition module 720 is used for acquiring the form image information of each drilling hole in the printed circuit board to be produced according to the drilling data information and each circuit image.
Because different types of boreholes extend through different layers of circuitry, the borehole data information, such as the size and shape of the borehole, may vary. The position of each drill hole included in the drill hole data information is correspondingly overlapped with the position of the drill hole image in the circuit layer circuit image through which the drill hole passes. Therefore, the drilling data information is combined with the circuit images, the target detection position can be effectively positioned, and the form image information of each drilling hole of the printed circuit board on the corresponding circuit image can be obtained. Wherein the morphological image information includes one or a combination of a contour, a shape size, or both of the borehole.
And the detection module 730 is configured to perform pad detection on each line image according to the form image information, so as to obtain a pad detection result.
The drilling holes are distributed in each circuit image, and because the circuit layers penetrated by different drilling holes are different, the pad detection needs to be carried out on each circuit image respectively, namely the detection needs to be carried out on the circuit image of the circuit layer where each drilling hole is located respectively. Further, morphological image features, such as one or a combination of an outline and a shape size, are extracted from the morphological image information of the drill holes and compared with the pad morphological image features, and then whether a pad defect exists in the line image where each drill hole is located or not is known.
According to the embodiments of the automatic pad detection device, the drilling data information of the printed circuit board to be produced and the line images corresponding to the circuit layers are obtained through the information obtaining module, the drilling image obtaining module is adopted to obtain the form image information of the drilling holes of the printed circuit board to be produced, and the detection module is used for carrying out automatic pad detection on the line images. The invention can correct the pad defect in the circuit image of the printed circuit board, thereby perfecting the film file, and improving the production efficiency of the printed circuit board by adopting the corrected film file.
In a particular embodiment, a borehole screening module 750 and a borehole identification module 740 are also included.
And a bore screening module 750 for identifying each bore in the printed circuit board based on the bore data information.
And the drilling hole identification module 740 is used for classifying and screening the drilling holes to obtain metallized holes and non-metallized holes.
According to the automatic pad detection device, the drilled holes of the printed circuit board are classified and identified in the drilled hole data information and the circuit image, so that the drilled hole target detection position can be effectively positioned in the circuit image, and the corresponding detection condition is called to perform pad detection on the drilled holes. The automation degree of the detection of the bonding pad is further improved, the detection accuracy is improved, and the defects of the bonding pad of a film file for producing a printed circuit board are improved.
In a specific embodiment, the borehole image acquisition module 720 further includes:
the circuit layer identification unit 7202 is configured to identify a first-layer circuit and a last-layer circuit in each circuit layer, where a metalized hole and a non-metalized hole penetrate through the circuit layers, according to the drilling data information;
according to the difference of drilling types, circuit layers of the printed circuit board penetrated through by the drilling holes are different, when the corresponding circuit layers are connected and conducted, electroplating needs to be carried out on hole walls to realize electrical connection, and the upper surface and the lower surface of each drilling hole need to be made into a pad shape, so that the conductivity is enhanced. In the circuit layer that printed circuit board passed through is run through in the drilling, the circuit layer at its head and the tail both ends is head layer circuit layer and tail layer circuit layer respectively, and in actual production manufacturing, the pad region of the upper and lower two sides of drilling sets up in this head layer circuit layer and tail layer circuit layer. According to the drilling data information, identifying the metallized holes and the nonmetal penetrating through the first layer circuit layer and the tail layer circuit layer in each circuit layer, and further positioning the detection range of the metallized holes and the nonmetal.
The form image acquisition unit 7206 is configured to acquire form image information of the metalized holes on the first layer circuit layer and the tail layer circuit layer respectively; and respectively collecting the form image information of the non-metallized holes on the first layer circuit layer and the tail layer circuit layer.
The upper and lower surface pad areas of the metallized hole penetrate through the first layer circuit layer and the tail layer circuit layer of the circuit layer, so that the form image information of the metallized hole can be collected in the two circuit layers. In practical application, most of the non-metallized holes do not have electrical connection performance, no bonding pad can be set, and in order to prevent redundant bonding pads from existing in the non-metallized holes and influence the process requirements of finished products, morphological image information of a first layer circuit layer and a tail layer circuit layer of a circuit layer where the non-metallized holes penetrate through needs to be collected respectively.
According to the embodiments of the automatic pad detection device, the metalized holes and the non-metalized holes of the printed circuit board are identified in the circuit layer identification unit, and the first layer circuit layer and the tail layer circuit layer in the circuit layer are penetrated through, so that the corresponding form image information of the upper surface and the lower surface of the metalized holes and the non-metalized holes is obtained in the image acquisition unit. The invention can effectively position the form image information of the metallized holes and the non-metallized holes in the circuit image of each circuit layer, and improve the efficiency of automatically detecting the bonding pads.
In a specific embodiment, the present invention further provides a detector for automatically detecting a pad, including a memory and a processor, where the memory stores a computer program, and the computer program, when executed by the processor, can implement the steps of the method for automatically detecting a pad, and is not described herein again. Therefore, the circuit image of the printed circuit board can be automatically subjected to pad detection through the detector for automatically detecting the pad, so that the pad defect in the film file of the printed circuit board to be produced is corrected, and the accuracy of the circuit image of the printed circuit board is improved.
In a particular embodiment, the invention provides a computer-readable storage medium having stored thereon a computer program which, when executed by a processor, performs the steps of a method for automatically inspecting a pad. Therefore, the method for automatically detecting the bonding pad is conveniently and effectively led into the processor, and the automatic bonding pad detection is executed according to the program, so that the bonding pad detection operation is effectively optimized, and the production efficiency is improved.
According to the method and the device for automatically detecting the bonding pad, the drilling data information of the printed circuit board to be produced and the circuit image corresponding to each circuit layer are obtained, the form image information of each drilling hole of the printed circuit board to be produced is obtained, and automatic bonding pad detection is carried out on each circuit image. The invention overcomes the technical problem of false detection or missed detection caused by manual detection of the circuit image of the printed circuit board in the traditional technology, thereby improving the product percent of pass, reducing the product rejection rate, optimizing the manual detection operation, automating the detection operation and improving the production efficiency. Furthermore, the production quality of the printed circuit board is ensured, and the process requirements of the electronic products on the printed circuit board are met.
Further, the invention screens out metallized holes and non-metallized holes by classifying the drilled holes of the printed circuit board. And acquiring form image information of the first layer circuit layer and the tail layer circuit layer of the circuit layers through which the metallized holes and the non-metallized holes penetrate, completing pad detection in the circuit image of each corresponding circuit layer according to the form image information, and obtaining results. According to the invention, by applying the drilling process attribute of the printed circuit board and combining the line image, the efficiency of the pad detection operation is improved, the production error rate is reduced, and the material and labor cost are saved.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features. Those skilled in the art will appreciate that all or part of the steps in the method for implementing the above embodiments may be implemented by hardware instructions related to a program, the program may be stored in a computer-readable storage medium, and when executed, the program includes the steps of the above method, and the storage medium, such as: ROM/RAM, magnetic disk, optical disk, etc.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A method for automatically detecting a bonding pad is characterized by comprising the following steps:
acquiring drilling data information of a printed circuit board to be produced and circuit images of circuit layers in the printed circuit board to be produced;
acquiring form image information of each drill hole in the printed circuit board to be produced according to the drill hole data information and each line image;
and respectively carrying out pad detection on each line image according to the form image information, and comparing the form image information with the pad form image characteristics to obtain a pad detection result.
2. The method for automatically inspecting bonding pads according to claim 1, wherein before the step of obtaining morphological image information of each drilled hole in the printed circuit board to be produced according to the drilled hole data information and each line image, further comprising the step of;
identifying each of the drill holes in the printed circuit board according to the drill hole data information;
and classifying and screening the drill holes to obtain metallized holes and non-metallized holes.
3. The method of claim 2, wherein the step of obtaining the shape image information of each hole in the printed circuit board to be produced according to the hole data information and each line image comprises:
identifying the metallized holes and the non-metallized holes penetrating through a first layer circuit layer and a tail layer circuit layer in each circuit layer respectively according to the drilling data information;
respectively collecting the form image information of the metallized holes on the first layer circuit layer and the tail layer circuit layer; and respectively collecting the form image information of the non-metallized holes on the first layer circuit layer and the tail layer circuit layer.
4. The method for automatically detecting a pad according to claim 2 or 3, wherein the step of performing pad detection on each line image according to each form image information to obtain the result of pad detection comprises:
and when the detection result of the bonding pad shows that the metalized hole missing bonding pad exists, confirming that the circuit image of the circuit layer corresponding to the metalized hole of the missing bonding pad lacks bonding pad data, and sending out a warning.
5. The method for automatically detecting a pad according to claim 2 or 3, wherein the step of performing pad detection on each of the line images according to each of the form image information to obtain a result of the pad detection further comprises:
and when the detection result of the bonding pad shows that a non-metallized hole exists in the bonding pad, confirming that the circuit image of the circuit layer corresponding to the non-metallized hole with the bonding pad has wrong bonding pad data, and giving a warning.
6. An apparatus for automatically inspecting a pad, comprising:
the information acquisition module is used for acquiring drilling data information of the printed circuit board to be produced and circuit images of all circuit layers;
the drilling image acquisition module is used for acquiring the form image information of each drilling hole in the printed circuit board to be produced according to the drilling data information and each line image;
and the detection module is used for respectively detecting the bonding pads of the circuit images according to the form image information and obtaining the bonding pad detection result by comparing the bonding pad form image characteristics with the bonding pad form image characteristics.
7. The apparatus for automatically inspecting a pad according to claim 6, further comprising:
the drilling identification module is used for identifying each drilling hole in the printed circuit board according to the drilling data information;
and the drilling screening module is used for classifying and screening the drilling holes to obtain metallized holes and non-metallized holes.
8. The apparatus for automatically inspecting a pad according to claim 7, wherein the drilling image obtaining module comprises:
the circuit layer identification unit is used for respectively identifying the metallized holes and the non-metallized holes penetrating through a first layer circuit and a tail layer circuit in each circuit layer according to the drilling data information;
the image acquisition unit is used for respectively acquiring the form image information of the metallized holes on the first layer circuit layer and the tail layer circuit layer; and respectively collecting the form image information of the non-metallized holes on the first layer circuit layer and the tail layer circuit layer.
9. A tester for automatically testing pads, comprising a memory, a processor, wherein said memory stores a computer program which, when executed by said processor, is capable of carrying out the steps of the method according to any one of claims 1 to 5.
10. A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the steps of the method according to any one of claims 1 to 5.
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| CN109063294A (en) * | 2018-07-20 | 2018-12-21 | 郑州云海信息技术有限公司 | A kind of angle automatic check method and device based at PCB power supply or Horizon facial contour |
| CN111239156B (en) * | 2020-01-15 | 2023-01-06 | 广州兴森快捷电路科技有限公司 | Method, device and equipment for identifying patterned bonding pad blocking area and storage medium |
| CN112326667A (en) * | 2020-10-27 | 2021-02-05 | 惠州市特创电子科技有限公司 | Copper-clad detection method and device for conductive connecting hole |
| CN112328554B (en) * | 2020-11-23 | 2022-09-13 | 迈普通信技术股份有限公司 | Method and device for generating secondary drilling file, electronic equipment and storage medium |
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| CN102338754A (en) * | 2010-07-22 | 2012-02-01 | 牧德科技股份有限公司 | Method for detecting defects of power supply layer and ground layer of circuit board |
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