CN104596925A - Method for detecting binding force of metallized blind hole bottom and inner-layer base copper of HDI (High Density Interconnect) plate - Google Patents
Method for detecting binding force of metallized blind hole bottom and inner-layer base copper of HDI (High Density Interconnect) plate Download PDFInfo
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- CN104596925A CN104596925A CN201510033618.2A CN201510033618A CN104596925A CN 104596925 A CN104596925 A CN 104596925A CN 201510033618 A CN201510033618 A CN 201510033618A CN 104596925 A CN104596925 A CN 104596925A
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Abstract
The invention relates to the technical field of manufacturing of a PCB (Printed Circuit Board) and particularly relates to a method for detecting a binding force of a metallized blind hole bottom and inner-layer base copper of an HDI (High Density Interconnect) plate. According to the method, one end of a spindle-shaped metal ring and a metallized testing blind hole are welded and the other end of the spindle-shaped metal ring is connected with a tension tester; the spindle-shaped metal ring is pulled so that a copper layer in the plate is broken; then whether the bonding force between the metallized blind hole bottom and the inner-layer base copper is good or not can be detected according to the breaking position of the copper layer, so that the product which has good contact between the metallized blind hole bottom and the inner-layer base copper and bad binding force can be detected, and the problem that the binding force between the metallized blind hole bottom and the inner-layer base copper is not good so that an open circuit problem is caused is effectively reduced after a patch is mounted, and the loss of customers is reduced; and the method is simple to operate and feasible, and the production cost is not increased.
Description
Technical field
The present invention relates to PCB manufacture technology field, particularly relating to the method for detecting HDI sheetmetal blind via bottom and internal layer base copper adhesion.
Background technology
PCB (Printed Circuit Board) is one of vitals of electronics industry, is the carrier of the supporter of electronic devices and components, electrical connection.Increase along with electronic product function, the reduction of volume, impel PCB constantly to multifunction, densification, miniaturization development.And HDI (High DensityInterconnect) is due to advantages such as its wiring density are high, volume is little, function is many, be more and more subject to the favor of the electronic digital such as smart mobile phone, panel computer product.Therefore, PCB market will be increasing to the demand of HDI plate, and HDI plate will be the main development direction of PCB market.
The HDI plate that prior art is produced, easily occurs being combined not good problem with internal layer base copper bottom metalized blind vias.And for this problem, whether existing detection method, normally after the filling perforation plating completing blind hole, by slice analysis method, utilizes microsection electron microscope observation HDI sheetmetal blind via bottom to be separated with internal layer base copper.But this detection method can only detect the contact condition with internal layer base copper bottom metalized blind vias, can not really reflect bottom metalized blind vias with internal layer base copper in conjunction with situation.To be combined not good HDI plate bottom metalized blind vias to go out assemble to client if exist with internal layer base copper, owing to needing through wave-soldering furnace (temperatures as high 270 degree) when carrying out attachment components and parts, will make bottom metalized blind vias and between internal layer base copper, occur the problem (i.e. metalized blind vias de-pads) on crack road, thus cause product rejection, this not only brings unnecessary loss to client, and the product of client to us also can be made to lose the confidence.
Summary of the invention
The present invention is directed to prior art adopts slice analysis method to detect the contact situation of HDI sheetmetal blind via bottom and internal layer base copper, really cannot reflect the problem with internal layer base copper adhesion bottom metalized blind vias, a kind of method for detecting HDI sheetmetal blind via bottom and internal layer base copper adhesion is provided.
For achieving the above object, the present invention by the following technical solutions, for detecting the method for HDI sheetmetal blind via bottom and internal layer base copper adhesion, comprises the following steps:
S1, on multilayer boards drilling testing blind hole, the region that multilayer board is provided with test blind hole is blind hole test module; Then through heavy copper and filling perforation electroplating processes, test blind hole is metallized, obtained metallization test blind hole.
Preferably, design a blind hole test module respectively on multiple-plate four limits, design two blind hole test modules at multiple-plate middle part; The size of described blind hole test module is 6mm × 6mm, and each test module bores a test blind hole, the aperture of test blind hole is consistent with the pore size of blind hole on multilayer board.
S2, get the blind hole test module being provided with metallization test blind hole, above pad one end of spindle becket being welded on blind hole test module, the other end of spindle becket is connected with tension tester.
Preferably, the anchor ring of spindle becket tests the bottom vertical of blind hole with metallization.Described spindle becket is copper ring.
S3, plate is fixing after, pull spindle becket to the layers of copper of plate interiors to tear by tension tester.
S4, slice analysis is carried out to plate, observe the position that plate interiors generation layers of copper is torn; If tear between metallization test blind via bottom and internal layer base copper, then represent that the adhesion of metallization test blind via bottom and internal layer base copper is bad; If layers of copper occurs in other position tear, then represent that the adhesion of metallization test blind via bottom and internal layer base copper is good.
Compared with prior art, the invention has the beneficial effects as follows: the present invention welds by making spindle becket one end test blind hole with metallization, the other end is connected with tension tester, by pulling spindle becket, layers of copper in plate is torn, whether the adhesion that blind via bottom and internal layer base copper are tested in the position judgment metallization of then tearing according to generation layers of copper is good, can detect according to this bottom metalized blind vias with internal layer base copper contact is good and the product that adhesion is bad, effective minimizing paster install after because of bad and cause the appearance of open circuit problem with internal layer base copper adhesion bottom metalized blind vias, reduce the loss of client.Further, operation is simple for the inventive method, do not increase production cost.
Accompanying drawing explanation
Fig. 1 is the schematic diagram torn between metallization test blind via bottom and internal layer base copper;
Fig. 2 be metallization test blind via bottom below internal layer base copper and sheet material between tear, with internal layer base copper one piece of schematic diagram deviate from bottom metalized blind vias;
Fig. 3 tears between internal layer base copper and sheet material, with internal layer base copper one piece of schematic diagram deviate from bottom metalized blind vias;
Fig. 4 is the schematic diagram that metallization test blind hole hole wall layers of copper is torn.
Embodiment
In order to more fully understand technology contents of the present invention, below in conjunction with specific embodiment, technical scheme of the present invention being described further and being illustrated.
Embodiment
The present embodiment provides a kind of method for detecting HDI sheetmetal blind via bottom and internal layer base copper adhesion, and concrete making step is as follows:
(1) pressing forms multilayer board
First as the production run of the HDI plate of prior art, sawing sheet is carried out to the raw material of HDI plate and obtains central layer, on central layer, then adopt negative film technique to make internal layer circuit.Detected by internal layer AOI, check whether internal layer circuit exists out the defects such as short circuit, circuit breach, circuit pin hole, flawless product introduction pressing flow process.
Brown process is carried out to central layer, then by design data, central layer, prepreg and outer copper foil is carried out lamination, then select suitable pressing condition according to the Tg of plate, folded plate pressing is integrated, form multilayer board.
(2) metallization test blind hole is made
According to borehole data drilling blind hole, through hole etc. on multilayer boards, comprising boring a test blind hole in four the blind hole test modules designed on multilayer board four limit respectively, and in design in the middle part of multilayer board two blind hole test modules, bore a test blind hole respectively, the aperture of test blind hole is consistent with the pore size of blind hole on multilayer board, and blind hole test module is of a size of 6mm × 6mm.Then successively heavy Copper treatment and filling perforation electroplating processes are carried out to multilayer board, slotted eye is metallized, the metalized blind vias that obtained metallization test blind hole and other design need and plated-through hole.
(3) test prepares
Get the plate being provided with metallization test blind hole, one end of spindle becket (copper ring) is welded on above the pad of blind hole test module, and make the anchor ring of spindle becket test the bottom vertical of blind hole with metallization, the other end of spindle becket is connected with tension tester.
(4) test
After plate is fixing, spindle becket to the layers of copper of plate interiors is pulled to tear by tension tester.
(5) analyze
Slice analysis is carried out to plate, observes the position that plate interiors generation layers of copper is torn; If tear between metallization test blind via bottom and internal layer base copper, as shown in Figure 1, then represent that the adhesion of metallization test blind via bottom and internal layer base copper is bad; If layers of copper occurs in other position tear, as in Figure 2-4, then represent that the adhesion of metallization test blind via bottom and internal layer base copper is good, good with the adhesion of internal layer base copper bottom the metalized blind vias namely in multilayer board.
After tested, multilayer board good with the adhesion of internal layer base copper bottom metalized blind vias proceeds to rear operation, namely conventionally makes outer-layer circuit, solder mask, surface treatment, test and packaging etc. on multilayer boards successively, obtains HDI panel products.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent embodiments of the present invention and is only limitted to this, and any technology done according to the present invention extends or recreation, all by protection of the present invention.
Claims (5)
1., for detecting a method for HDI sheetmetal blind via bottom and internal layer base copper adhesion, it is characterized in that, comprise the following steps:
S1, on multilayer boards drilling testing blind hole, the region that multilayer board is provided with test blind hole is blind hole test module; Then through heavy copper and filling perforation electroplating processes, test blind hole is metallized, obtained metallization test blind hole;
S2, get the blind hole test module being provided with metallization test blind hole, above pad one end of spindle becket being welded on blind hole test module, the other end of spindle becket is connected with tension tester;
S3, plate is fixing after, pull spindle becket to the layers of copper of plate interiors to tear by tension tester;
S4, slice analysis is carried out to plate, observe the position that plate interiors generation layers of copper is torn; If tear between metallization test blind via bottom and internal layer base copper, then represent that the adhesion of metallization test blind via bottom and internal layer base copper is bad; If layers of copper occurs in other position tear, then represent that the adhesion of metallization test blind via bottom and internal layer base copper is good.
2. a kind of method for detecting HDI sheetmetal blind via bottom and internal layer base copper adhesion according to claim 1, is characterized in that, the bottom vertical of blind hole is tested in anchor ring and the metallization of described spindle becket.
3. a kind of method for detecting HDI sheetmetal blind via bottom and internal layer base copper adhesion according to claim 2, it is characterized in that, described blind hole test module is of a size of 6mm × 6mm, and the aperture of test blind hole is consistent with the pore size of blind hole on multilayer board.
4. a kind of method for detecting HDI sheetmetal blind via bottom and internal layer base copper adhesion according to claim 3, is characterized in that, respectively bores a test blind hole on multiple-plate four limits, in multiple-plate drilled in middle two test blind hole.
5. a kind of method for detecting HDI sheetmetal blind via bottom and internal layer base copper adhesion according to claim 4, it is characterized in that, described spindle becket is copper ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510033618.2A CN104596925A (en) | 2015-01-22 | 2015-01-22 | Method for detecting binding force of metallized blind hole bottom and inner-layer base copper of HDI (High Density Interconnect) plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510033618.2A CN104596925A (en) | 2015-01-22 | 2015-01-22 | Method for detecting binding force of metallized blind hole bottom and inner-layer base copper of HDI (High Density Interconnect) plate |
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| CN104596925A true CN104596925A (en) | 2015-05-06 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105651787A (en) * | 2016-01-01 | 2016-06-08 | 广州兴森快捷电路科技有限公司 | Analysis method for opening of laser blind hole |
| CN105682378A (en) * | 2016-04-11 | 2016-06-15 | 广州兴森快捷电路科技有限公司 | ICD (Internal Connection Defect) detection method for PCB |
| CN105898993A (en) * | 2016-05-09 | 2016-08-24 | 广州美维电子有限公司 | Monitoring method for blind hole filling cavities |
| CN107036891A (en) * | 2017-05-25 | 2017-08-11 | 深圳崇达多层线路板有限公司 | A kind of method that whether micro-via interconnects failure in detection wiring board |
| CN108801743A (en) * | 2017-04-26 | 2018-11-13 | 贵州天义电器有限责任公司 | Cu/SnPb composite deposite detection methods |
| CN109297831A (en) * | 2018-11-30 | 2019-02-01 | 上海宇塚电子科技有限公司 | A kind of weld nugget intensity detection mechanism |
| CN109444471A (en) * | 2018-11-22 | 2019-03-08 | 阔智科技（广州）有限公司 | A kind of detection method of blind hole black pad exception |
| CN113945513A (en) * | 2021-09-09 | 2022-01-18 | 盐城维信电子有限公司 | Method for detecting copper plating binding force through hole stripping |
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| CN101827496A (en) * | 2010-04-08 | 2010-09-08 | 深南电路有限公司 | Method for machining PCB with step groove |
| EP2365741A1 (en) * | 2010-03-10 | 2011-09-14 | Commissariat à l'Énergie Atomique et aux Énergies Alternatives | Method for metallizing blind vias |
| CN102445412A (en) * | 2010-09-30 | 2012-05-09 | 北大方正集团有限公司 | Method for testing combination condition of internal coating of through hole with circuit board, and connecting element used for the same |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| EP2365741A1 (en) * | 2010-03-10 | 2011-09-14 | Commissariat à l'Énergie Atomique et aux Énergies Alternatives | Method for metallizing blind vias |
| CN101827496A (en) * | 2010-04-08 | 2010-09-08 | 深南电路有限公司 | Method for machining PCB with step groove |
| CN102445412A (en) * | 2010-09-30 | 2012-05-09 | 北大方正集团有限公司 | Method for testing combination condition of internal coating of through hole with circuit board, and connecting element used for the same |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105651787A (en) * | 2016-01-01 | 2016-06-08 | 广州兴森快捷电路科技有限公司 | Analysis method for opening of laser blind hole |
| CN105682378A (en) * | 2016-04-11 | 2016-06-15 | 广州兴森快捷电路科技有限公司 | ICD (Internal Connection Defect) detection method for PCB |
| CN105682378B (en) * | 2016-04-11 | 2018-08-31 | 广州兴森快捷电路科技有限公司 | A kind of detection method of PCB internal layers interconnection defect |
| CN105898993A (en) * | 2016-05-09 | 2016-08-24 | 广州美维电子有限公司 | Monitoring method for blind hole filling cavities |
| CN108801743A (en) * | 2017-04-26 | 2018-11-13 | 贵州天义电器有限责任公司 | Cu/SnPb composite deposite detection methods |
| CN107036891A (en) * | 2017-05-25 | 2017-08-11 | 深圳崇达多层线路板有限公司 | A kind of method that whether micro-via interconnects failure in detection wiring board |
| CN109444471A (en) * | 2018-11-22 | 2019-03-08 | 阔智科技（广州）有限公司 | A kind of detection method of blind hole black pad exception |
| CN109297831A (en) * | 2018-11-30 | 2019-02-01 | 上海宇塚电子科技有限公司 | A kind of weld nugget intensity detection mechanism |
| CN113945513A (en) * | 2021-09-09 | 2022-01-18 | 盐城维信电子有限公司 | Method for detecting copper plating binding force through hole stripping |
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Application publication date: 20150506 |