CN105682378A - ICD (Internal Connection Defect) detection method for PCB - Google Patents
ICD (Internal Connection Defect) detection method for PCB Download PDFInfo
- Publication number
- CN105682378A CN105682378A CN201610224961.XA CN201610224961A CN105682378A CN 105682378 A CN105682378 A CN 105682378A CN 201610224961 A CN201610224961 A CN 201610224961A CN 105682378 A CN105682378 A CN 105682378A
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- China
- Prior art keywords
- internal layer
- copper
- pcb
- copper ring
- hole
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an ICD detection method for a PCB. The method comprises the flowing steps that a vertical slice of a PCB sample is made, and a metallographic microscope is used to observe whether there is a crack between an electro-coppering layer and an internal copper ring in the vertical slice; if there is, an outside force is used to separate the whole electro-coppering layer from the internal copper ring, an unthreaded hole is formed in the PCB; if there is not, it is shown that no residual glue exists between the electro-coppering layer and the internal copper ring, and no detection is needed any longer; and a scanning electron microscope is used to detect the internal copper ring to observe whether residual glue exists on the internal copper ring. Vertical slicing and copper wire pulling are carried out on the circuit board sample, the electro-coppering layer is directly separated from the internal copper ring, and the scanning electron microscope is used to directly observe whether residual glue exists on the electro-coppering layer; and thus, the detection method can be used to detect whether cracks and residual glue exist between the electro-coppering layer and the internal copper ring is a more direct, effectively and accurate manner, and the ICD detection efficiency of the PCB is greatly improved.
Description
Technical field
The present invention relates to the detection method of a kind of interconnected defect of PCB internal layer.
Background technology
Metal through hole plays the effect connecting each sandwich circuit in the pcb, is connected with hole copper by internal layer circuit. the Making programme of metal through hole is: make internal layer circuit → layer pressure → boring → deburring → heavy copper → electro-coppering, due to Gao Re and bigger stress in boring procedure, make the copper ring of internal layer circuit can be stained with a large amount of glue (epoxy resin), remaining glue on copper ring is removed by the glue step of removing in heavy copper, in actual production process, owing to remaining glue too much or removes glue poor effect, after completing the step of electro-coppering, the copper electroplating layer with conducting effect is formed between through-hole wall and copper ring, remaining glue is there is between copper electroplating layer and internal layer copper ring, in the heat treatment process in later stage, owing to bonding force herein is poor, cause occurring between the copper ring of copper electroplating layer and internal layer circuit hole wall crackle, the i.e. interconnected defect of internal layer (ICD).
The interconnected defect analysis method of traditional internal layer is: first whether making terrace cut slice observation copper electroplating layer and internal memory copper ring exist crackle, as existed, production technique section again, then use between microscopic examination copper electroplating layer and copper ring and whether there is remaining glue, but this method is higher to the section level requirement of analyzer, the manufacture difficulty of dropping cut slice is bigger, and the image that the crackle that this method obtains presents under the microscope is black, the amount being still difficult to judge whether to exist between copper electroplating layer and internal layer copper ring remaining glue and remaining glue is roughly how many, in the process using dropping cut slice detection, need to be ground by through hole, its detected result also easily is subject to grinding the impact of chip.
Summary of the invention
For prior art Problems existing, it is an object of the invention to provide the detection method of a kind of interconnected defect of PCB internal layer, more directly, effectively between detection hole wall and internal layer copper ring whether can there is remaining glue.
A detection method for the interconnected defect of PCB internal layer, comprises the steps:
Steps A: to PCB sample making terrace cut slice, it may also be useful to whether there is crackle between copper electroplating layer and internal layer copper ring on metallography microscope sem observation terrace cut slice;
, if there is crackle in step B:B1, it may also be useful to whole copper electroplating layer is separated by external force with internal layer copper ring, and forms unthreaded hole on PCB;
B2, if there is not crackle, illustrates there is not remaining glue between copper electroplating layer and internal layer copper ring;
Step C: use scanning electron microscope to be detected by internal layer copper ring, observes whether there is remaining glue on internal layer copper ring.
Preferably, in stepb, as there is crackle, one is used to be less than the copper wire of through-hole aperture to be detected through through hole to be detected, and carry out through hole to be detected filling with tin so that copper wire and through-hole wall to be detected weld together, after solder cools, pull copper wire so that whole copper electroplating layer is separated with internal layer copper ring.
Preferably, in step B, it may also be useful to diameter is less than the copper wire of through-hole diameter 0.15mm to be detected through through hole to be detected.
Preferably, after completing steps B, it may also be useful to ultrasonic cleaning unthreaded hole inwall, remove and pull in copper wire process the chip dropped, unthreaded hole is blown dry.
Compared to prior art, the useful effect of the present invention is: by wiring board sample making terrace cut slice, can directly judge whether copper electroplating layer exists crackle, by pullling copper wire, copper electroplating layer is directly separated with internal layer copper ring, and then directly observe whether internal layer copper ring exists remaining glue by scanning electron microscope, can be more direct by this detection method, effectively and accurately detect between copper electroplating layer and internal layer copper ring and whether there is crackle and remaining glue, substantially increase the detection efficiency to layer defects in PCB, also without the need to dropping cut slice that use difficulty is big, save the time, this detection method has stronger practicality in actually operating.
Accompanying drawing explanation
Fig. 1 is the sectional view of the detection method terrace cut slice of the present invention's a kind of PCB interconnected defect of internal layer;
Fig. 2 is the sectional view after the detection method through hole filling tin of the present invention's a kind of PCB interconnected defect of internal layer;
Fig. 3 is the sectional view after copper electroplating layer of the present invention is separated with internal layer copper ring;
Fig. 4 is that scanning electron microscope of the present invention is to internal layer copper ring detected result schematic diagram.
Wherein, 10, copper electroplating layer; 20, internal layer copper ring; 30, through hole to be detected; 40, remaining glue; 50, copper wire; 60, unthreaded hole.
Embodiment
Below, by reference to the accompanying drawings and embodiment, the present invention is described further:
As Figure 1-3, the detection method of a kind of interconnected defect of PCB internal layer, comprises the steps:
Steps A: to PCB sample making terrace cut slice, serial section schematic diagram is as shown in Figure 1, it may also be useful to whether there is crackle between copper electroplating layer 10 and internal layer copper ring 20 on metallography microscope sem observation terrace cut slice; If there is not crackle, illustrating there is not remaining glue 40 between copper electroplating layer 10 and internal layer copper ring 20, this kind of situation does not affect the character of whole circuit, it is not necessary to detect again, if there is crackle to carry out next step;
Refer to Fig. 2, step B: as there is crackle, external force is used to be separated with internal layer copper ring 20 by whole copper electroplating layer 10, and on PCB, form unthreaded hole 60, specifically, use a copper wire 50 being less than through hole 30 aperture to be detected through through hole 30 to be detected, and carry out through hole 30 to be detected filling with tin, copper wire 50 and through hole 30 inwall to be detected are welded together, after solder cools, pull copper wire 50, whole copper electroplating layer 10 is separated with internal layer copper ring 20 and forms unthreaded hole 60, specifically, after through hole 30 to be detected is carried out fills with tin, copper wire 50 is welded together by the inwall of scolding tin and through hole to be detected 30, now, copper wire 50 is greater than the bonding force of copper electroplating layer 10 with internal layer copper ring 20 with the bonding force of copper electroplating layer 10, therefore, in the process pullling copper wire 50, copper electroplating layer 10 is forced to be separated with internal layer copper ring 20.In addition, here it should be noted that, remaining glue 40 between copper electroplating layer 10 and internal layer copper ring 20 is formed in the heat treated process of circuit board manufacturing, remaining glue 40 adheres on internal layer copper ring 20 closely, remaining glue 40 is greater than and the bonding force of remaining glue 40 with copper electroplating layer 10 with the bonding force of internal layer copper ring 20, therefore, in the process pullling copper wire 50, remaining glue 40 still sticks on internal layer copper ring 20, ensure that and can not affect last detected result because of the loss of remaining glue 40;
Preferably, the copper wire 50 using diameter to be less than through hole 30 diameter 0.15mm to be detected passes through hole 30 to be detected, if the diameter of copper wire 50 is excessive, filling with in tin process, can cause the inwall of scolding tin and through hole to be detected 30 and copper wire 50 in conjunction with undertighten, in step C, copper electroplating layer 10 may be caused cannot to be separated completely with internal layer copper ring 20 because of scolding tin not with the inwall bonding force of through hole 30 to be detected, thus detection cannot be completed, if the diameter of copper wire 50 is excessively little, the process pullled easily is torn, by test, when copper wire 50 diameter is less than through hole 30 diameter 0.15mm to be detected, effect is best.
After completing steps B, it may also be useful to ultrasonic cleaning unthreaded hole 60 inwall, remove and pull in copper wire 50 process the chip dropped, unthreaded hole 60 is blown dry;
Make in the process of wiring board, after completing the step of electro-coppering, copper electroplating layer 10 with the inwall of unthreaded hole 60 be also be combined in closely together with, therefore, in the process pullling copper wire 50, the part epoxy of unthreaded hole 60 inwall comes off in the process pullled, and the chip of epoxy resin likely drops on internal layer copper ring 20, if it does not cleared up, detected result can be affected, ultrasonic wave is used its unification to be cleaned, simple to operate, cleaning efficiency height.
Refer to Fig. 4, step C: use scanning electron microscope to be detected by internal layer copper ring 20, observe whether internal layer copper ring 20 exists remaining glue 40. In figure, white portion is internal layer copper ring 20, the black part sticked in white portion is divided into remaining glue 40, by steps A-D, copper electroplating layer 10 is separated completely with internal layer copper ring 20, remaining glue 40 on internal layer copper ring 20 exposes completely, it may also be useful to scanning electron microscope can directly, clearly detect whether there is remaining glue 40 on internal layer copper ring 20.
So, pass through above-mentioned steps, more directly, effectively between detection copper electroplating layer 10 and internal layer copper ring 20 whether can there is crackle and remaining glue 40, compared to the method using dropping cut slice in prior art, the operation of this detection method is simpler, can judge whether to exist between copper electroplating layer 10 and internal layer copper ring 20 remaining glue 40 more accurately, simultaneously, also reduce the technical requirements to behaviour personnel, operability improves, detection efficiency height, it is not necessary to make again and require higher dropping cut slice, save a large amount of time.
To one skilled in the art, according to technical scheme described above and design, other various corresponding change and deformation can be made, and these all changes and deformation all should belong within the protection domain of the claims in the present invention.
Claims (4)
1. the detection method of the interconnected defect of PCB internal layer, it is characterised in that, comprise the steps:
Steps A: to PCB sample making terrace cut slice, it may also be useful to whether there is crackle between copper electroplating layer and internal layer copper ring on metallography microscope sem observation terrace cut slice;
, if there is crackle in step B:B1, it may also be useful to the whole copper electroplating layer of through hole to be detected is separated by external force with internal layer copper ring, and forms unthreaded hole on PCB;
, if there is not crackle, between copper electroplating layer and internal layer copper ring, there is not remaining glue in B2;
Step C: use scanning electron microscope to be detected by internal layer copper ring, observes whether there is remaining glue on internal layer copper ring.
2. the detection method of the interconnected defect of PCB internal layer according to claim 1, it is characterized in that, in stepb, as there is crackle, it may also be useful to one is less than the copper wire of through-hole aperture to be detected through through hole to be detected, and carries out through hole to be detected filling with tin, copper wire and through-hole wall to be detected are welded together, after solder cools, pull copper wire so that whole copper electroplating layer is separated with internal layer copper ring.
3. the detection method of the interconnected defect of PCB internal layer according to claim 2, it is characterised in that, in step B, it may also be useful to diameter is less than the copper wire of through-hole diameter 0.15mm to be detected through through hole to be detected.
4. the detection method of the interconnected defect of PCB internal layer according to claim 1, it is characterised in that, after completing steps B, it may also be useful to ultrasonic cleaning unthreaded hole inwall, remove and pull in copper wire process the chip dropped, unthreaded hole is blown dry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610224961.XA CN105682378B (en) | 2016-04-11 | 2016-04-11 | A kind of detection method of PCB internal layers interconnection defect |
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| CN201610224961.XA CN105682378B (en) | 2016-04-11 | 2016-04-11 | A kind of detection method of PCB internal layers interconnection defect |
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| CN105682378A true CN105682378A (en) | 2016-06-15 |
| CN105682378B CN105682378B (en) | 2018-08-31 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107036891A (en) * | 2017-05-25 | 2017-08-11 | 深圳崇达多层线路板有限公司 | A kind of method that whether micro-via interconnects failure in detection wiring board |
| CN109444471A (en) * | 2018-11-22 | 2019-03-08 | 阔智科技（广州）有限公司 | A kind of detection method of blind hole black pad exception |
| CN110763699A (en) * | 2019-10-12 | 2020-02-07 | 广州兴森快捷电路科技有限公司 | Analysis method of inner layer interconnection defect of circuit board and circuit board |
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| EP0254200A1 (en) * | 1986-07-18 | 1988-01-27 | Siemens Aktiengesellschaft | Method for detecting defective plated-through holes in printed circuit boards |
| CN103698152A (en) * | 2013-12-13 | 2014-04-02 | 电子科技大学 | Method for preparing gold-phase section samples aiming at embedded printed-circuit board |
| CN104596925A (en) * | 2015-01-22 | 2015-05-06 | 深圳崇达多层线路板有限公司 | Method for detecting binding force of metallized blind hole bottom and inner-layer base copper of HDI (High Density Interconnect) plate |
| CN104918423A (en) * | 2015-06-19 | 2015-09-16 | 深圳崇达多层线路板有限公司 | Manufacturing method for circuit board capable of detecting inner-layer pore ring |
| CN105043828A (en) * | 2015-06-03 | 2015-11-11 | 洛阳伟信电子科技有限公司 | Method for properly and accurately polishing and grinding metallographic phase slice of PCB |
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2016
- 2016-04-11 CN CN201610224961.XA patent/CN105682378B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| EP0254200A1 (en) * | 1986-07-18 | 1988-01-27 | Siemens Aktiengesellschaft | Method for detecting defective plated-through holes in printed circuit boards |
| CN103698152A (en) * | 2013-12-13 | 2014-04-02 | 电子科技大学 | Method for preparing gold-phase section samples aiming at embedded printed-circuit board |
| CN104596925A (en) * | 2015-01-22 | 2015-05-06 | 深圳崇达多层线路板有限公司 | Method for detecting binding force of metallized blind hole bottom and inner-layer base copper of HDI (High Density Interconnect) plate |
| CN105043828A (en) * | 2015-06-03 | 2015-11-11 | 洛阳伟信电子科技有限公司 | Method for properly and accurately polishing and grinding metallographic phase slice of PCB |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107036891A (en) * | 2017-05-25 | 2017-08-11 | 深圳崇达多层线路板有限公司 | A kind of method that whether micro-via interconnects failure in detection wiring board |
| CN109444471A (en) * | 2018-11-22 | 2019-03-08 | 阔智科技（广州）有限公司 | A kind of detection method of blind hole black pad exception |
| CN110763699A (en) * | 2019-10-12 | 2020-02-07 | 广州兴森快捷电路科技有限公司 | Analysis method of inner layer interconnection defect of circuit board and circuit board |
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| CN105682378B (en) | 2018-08-31 |
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