CN102445412A - Method for testing combination condition of internal coating of through hole with circuit board, and connecting element used for the same - Google Patents
Method for testing combination condition of internal coating of through hole with circuit board, and connecting element used for the same Download PDFInfo
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- CN102445412A CN102445412A CN201010503474XA CN201010503474A CN102445412A CN 102445412 A CN102445412 A CN 102445412A CN 201010503474X A CN201010503474X A CN 201010503474XA CN 201010503474 A CN201010503474 A CN 201010503474A CN 102445412 A CN102445412 A CN 102445412A
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Abstract
The invention provides a method for testing the combination condition of the internal coating of a through hole with a circuit board, and a connecting element used for the same, belonging to the technical field of testing circuit boards, wherein the problem that the existing testing method is not suitable for small-sized through holes. The method for testing the combination condition of the internal coating of the through hole with the circuit board provided in the invention comprises the following steps of: combining the connecting element with a soldering pad at one end of the internal coating of the through hole through a reflow soldering process; and exerting a pull to the internal coating of the through hole through the connecting element to perform a drawing test. The connecting element provided in the invention for testing the combination condition of the internal coating of the through hole with the substrate of the circuit board according to the method can be an integrated structure or a combined structure, and is provided with a contact part for contacting with a soldering paste and a connection part for connection with a drawing test apparatus. The method and the connecting device provided in the invention can be applied to testing the combination condition of the internal coating of the through hole in a chip package scale circuit board with the substrate of the circuit board.
Description
Technical field
The present invention relates to a kind of wiring board method of testing, relate in particular to the method and the used web member of interior coating of test through hole and wiring board bonding state.
Background technology
In wiring board, through hole (via hole) is a kind of common structure, and the device or the circuit that are mainly used in different layers are connected.As shown in Figure 1, in the through hole of wiring board, have coating 1 in the through hole that is used to conduct electricity, coating 1 can be as shown in Figure 1 round table-likely in the through hole, also can be other shapes such as terrace with edge shape, cylindric, prism-shaped, can be illustrated in figure 1 as solidly, also can be hollow; The upper and lower end of coating 1 combines with the pad that is used for CC or device 2 in the through hole.Obviously, the bonding state (like adhesion) of coating 1 and circuit board substrate 3 (being the through-hole wall face) should meet certain requirement in the through hole.The method of the above-mentioned bonding state of existing test is on pad 2, to utilize web members (coating 1 also can be welded on Xi Si or draw point in the through hole in to hollow through hole) such as spot-welding technology welding tin silk or draw point; Through Xi Si or draw point coating in the through hole 1 is carried out pull-out test again, judge the bonding state of coating 1 and circuit board substrate 3 in the through hole according to the result of pull-out test.
The inventor finds to exist at least in the prior art following problem: existing measuring technology is for small size through hole and inapplicable; For example at the wiring board that is used for the Chip Packaging level; Through-hole diameter is 0.1～0.2mm; Its pad 2 diameters also are merely about 1mm; In spot welding, be easy to cause problems such as pad 2 damages, web member location are forbidden, web member strength of joint deficiency, promptly can't Xi Si or draw point be welded on the pad 2 solid and reliablely, therefore also just can't test the bonding state of interior coating 1 of through hole and circuit board substrate 3 through spot-welding technology.
Summary of the invention
Embodiments of the invention provide a kind of method of testing interior coating of through hole and circuit board substrate bonding state, and it also is suitable for small size through hole.
For achieving the above object, embodiments of the invention adopt following technical scheme:
A kind of method of testing interior coating of through hole and circuit board substrate bonding state comprises:
Through reflow soldering process web member is combined with the pad of coating one end in the through hole;
Through said web member coating in the through hole is applied pulling force to carry out pull-out test.
Wherein, For coating in the equal-sized through holes in two ends such as cylindricality (cylinder or prism) or hollow cylindrical; " pad of coating one end in the through hole " is meant the pad of its any end; And for platform shape (round platform or terrace with edge) or hollow the interior coating of through hole that two ends such as shape vary in size, " pad of coating one end in the through hole " is meant the pad of its bigger end.
Wherein, reflow welding is claimed in Reflow Soldering again, is meant earlier soldering paste to be coated on the matrix, again parts to be welded are arranged on the soldering paste by the precalculated position, thus the technology that soldering paste curing is welded together matrix and parts.
In the method owing to coating in the test through hole of embodiments of the invention and circuit board substrate bonding state; Web member combines with pad through reflow soldering process; Therefore even under the very little situation of through hole and pad size; Web member also can and be connected on the pad by accurate location solid and reliablely, so this method also is suitable for small size through hole.
Embodiments of the invention also provide a kind of web member that is used for according to coating and circuit board substrate bonding state in the said method test through hole, and it can be used for small size through hole is tested.
For achieving the above object, embodiments of the invention adopt following technical scheme:
A kind of web member that is used for according to coating and circuit board substrate bonding state in the said method test through hole,
Said web member has and is used for the contact site that contacts with soldering paste, and is used for the connecting portion that is connected with pull-out test equipment; Or
Said web member is made up of first and second portion, and said first has and is used for the contact site that contacts with soldering paste, and said second portion has and is used for the connecting portion that is connected with pull-out test equipment.
Because being used for having according to the coating and the web member of circuit board substrate bonding state in the said method test through hole of embodiments of the invention is used for the contact site that contacts with soldering paste; So it can link together through reflow soldering process and pad, thereby can be used for small size through hole is tested.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the cross-sectional view of existing line plate through hole;
Fig. 2 is the method flow diagram of interior coating of the test through hole of the embodiment of the invention and circuit board substrate bonding state;
Fig. 3 for the method for coating in the test through hole of the embodiment of the invention one and circuit board substrate bonding state in the cross-sectional view that is welded to connect part rear board through hole;
Fig. 4 for the method for coating in the test through hole of the embodiment of the invention two and circuit board substrate bonding state in the cross-sectional view that is welded to connect part rear board through hole;
Fig. 5 for the method for coating in the test through hole of the embodiment of the invention three and circuit board substrate bonding state in the cross-sectional view that is welded to connect part rear board through hole.
Embodiment
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme of the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is a part of embodiment of the present invention, rather than whole embodiment.Based on the embodiment among the present invention, all other embodiment that those of ordinary skills are obtained under the prerequisite of not making creative work belong to the scope that the present invention protects.
The embodiment of the invention provides a kind of method of testing interior coating of through hole and circuit board substrate bonding state, and as shown in Figure 2, it comprises:
S01, web member is combined with the pad of coating one end in the through hole through reflow soldering process;
S02, coating in the said through hole is applied pulling force to carry out pull-out test through said web member.
In the method owing to coating in the test through hole of embodiments of the invention and circuit board substrate bonding state; Web member combines with pad through reflow soldering process; Therefore even under the very little situation of through hole and pad size; Web member also can and be connected on the pad by accurate location solid and reliablely, so this method also is suitable for small size through hole.
Particularly, the used soldering paste of Reflow Soldering is a paste, so can be coated on desired location exactly and remain on this position; Scolder then will be melted in the spot welding of prior art; But liquid solder is difficult to by accurate point to pad top the pad of small size through hole (especially to); So liquid solder possibly flow to other outer position of pad; The web member location is inaccurate, connection is inhomogeneous, strength of joint is low, pad damages (as being covered by excessive scolder) thereby cause, even maybe damaged line plate (flowing to like soldering paste on other circuit of wiring board).
Secondly, Reflow Soldering can form that the position is accurate at pad and web member, the two linked together after the contacting of pressure stability again; And the spot welding of prior art must be connected pad after applying melting solder immediately with web member, if the position of web member is inaccurate at this moment, then can cause problems such as the web member location is inaccurate, strength of joint deficiency.
And in Reflow Soldering, formation face contacts between pad and web member; And what in the spot welding of prior art, form is a contact; So the connection that Reflow Soldering forms is more reliable, intensity is higher.
In addition, because the spot welding of prior art need make solder paste melts,, in welding process, cause pad, wiring board to cross cause thermal damage easily so heating-up temperature is very high; And Reflow Soldering of the present invention only need make soldering paste solidify, so its heating-up temperature is lower, can avoid the problems referred to above.
In addition, the point of prior art is welded under the atmospheric environment and carries out, thereby possibly sneak into bubble in the scolder, and strength of joint is reduced; And Reflow Soldering of the present invention can be cured under vacuum condition, thereby the bubble in the soldering paste is few, and strength of joint is high, and is difficult for oxidation.
Embodiment one
The embodiment of the invention provides a kind of method of testing interior coating 1 of through hole and circuit board substrate 3 bonding states, and as shown in Figure 3, it comprises:
S11, on the pad 2 above the through hole to be measured of testing sample, be coated with soldering paste 4 with instruments such as cutters, this soldering paste 4 is preferably solder(ing) paste 4; Wherein soldering paste 4 preferably is coated with the upper surface of completely whole pad 2.
S12, first web member 5 (being the first of web member 7) is placed on the soldering paste 4 on the pad 2.Combine for the ease of soldering paste 4; This first web member 5 is made up of metal or alloy (like copper, aluminium, tin, lead or their alloy etc.) in the part that contacts with soldering paste 4 at least; Preferred first web member, 5 integral body are coated with the metal or alloy layer by the metal or alloy made or on the surface; More preferably, first web member 5 is by flexible or copper coating.From seeing in shape; The lower surface of first web member 5 preferably can be pushed down soldering paste 4 upper surfaces; Promptly this lower surface should can well contact (certainly, if the lower surface of first web member 5 also can be realized the present invention less than soldering paste 4 upper surfaces) to guarantee the two more than or equal to the upper surface of soldering paste 4.Therefore, first web member 5 is sheet shapes such as (being copper sheet or the copper facing tablet of length and width at 5～8mm like first web member 5) in the part that contacts with soldering paste 4 preferably.In a preferred embodiment; For strengthening combining of first web member 5 and soldering paste 4; At least the part that is used for contacting with soldering paste 4 at the lower surface of first web member 5 is provided for increasing the alligatoring structure of surfaceness, and this structure can comprise a large amount of micro-pits or microprotrusion or microflute or little rib etc.
S13, testing sample is sent into reflow ovens (for example infrared radiation curing oven etc.); In 4～6 minutes (for example 5 minutes), be warming up to 240～280 ℃ (for example 260 ℃) from room temperature; And keeping 30～40s more than 230 ℃; Soldering paste 4 is solidified, thereby first web member 5 is welded together with pad 2 through soldering paste 4.Wherein, this solidification process can carry out under vacuum environment, can reduce the bubble (for example, utilizing vacuum condition that the bubble in the soldering paste is extracted out) in the soldering paste so on the one hand, increases strength of joint, also can avoid wiring board or soldering paste generation oxidation simultaneously.
S14, will have connecting portion 61 second web member 6 (being the second portion of web member 7) bonding (as using 502 glue) on first web member 5, this connecting portion 61 is used for being connected with the chuck of pull-out test equipment etc.Wherein second web member 6 can be the screw of diameter 5～7mm, long 25～50mm, and its double-screw bolt part promptly constitutes above-mentioned connecting portion 61.Certainly, second web member 6 also can be other shape except that arachnoid, for example is column, and an end of this column second web member 6 is used to connect first web member 5, and the other end is used for chuck with pull-out test equipment etc. and is connected.And second web member 6 also can adopt other any method to carry out with being connected of first web member 5, for example welding, clamping etc.Obviously, though second web member 6 has the cross sectional shape of " ⊥ " in Fig. 3, but; It also can have other cross sectional shape as required, for example, and the cross sectional shape of " 1 " shape; Perhaps gradually slightly or gradually thin cross sectional shape (that is the variable-width of connecting portion 61 in Fig. 3).
Alternatively, this step (S14) can be carried out in advance, for example carries out before at heating steps (S13), or just carries out before in the step (S12) that is put into first web member on the soldering paste 4.
S15, (testing apparatus can be the equipment that meets tensile test requirement among the IPC-TM-650 with test fixture testing sample to be fixed on pull-out test equipment; Like IMADA-DS2-50N type puller system) sample stage on; Clamp connecting portion 61 with the clip of pull-out test equipment, and apply pulling force vertically upward, pulling force is transmitted in the through hole on the coating 1 through first web member, 5 grades; Thereby coating in the through hole 1 is at the uniform velocity extracted from through hole (like 50mm/s), and the value of thrust of record withdrawal process.
S16, the value of thrust that is write down is analyzed; And with 1 section of coating in the through hole of extracting; Analyze its destruction situation (for example fracture position etc.); (for example destroy is not to occur on the interface of coating 1 and circuit board substrate 3 through hole in when the destruction situation is unusual; And occur in the through hole in the coating 1) time, also available ESEM (SEM), energy depressive spectroscopy (EDS) etc. continue to observe and destroy section and produce unusual reason to analyze.The above-mentioned each item result of analysis-by-synthesis, thus the bonding state of coating 1 and circuit board substrate 3 in the through hole obtained.
In above embodiment one, the unit construction of first web member 5 and 6 two separations of second web member constitutes web member 7.But, as required, also can the become one web member 7 (shown in embodiment two) of formula of first web member 5 and second web member 6.
Embodiment two
The embodiment of the invention provides a kind of method of testing coating 1 and circuit board substrate 3 bonding states in the through hole, and is as shown in Figure 4, and the method for testing of itself and embodiment one is similar, and difference is:
The used web member 7 of present embodiment is structure as a whole, and itself promptly has to be used for the connecting portion 71 that is connected with pull-out test equipment, so no longer need use second web member, also need not carry out the S14 step of the foregoing description one again.
Embodiment three
The embodiment of the invention provides a kind of method of testing coating 1 and circuit board substrate 3 bonding states in the through hole, and is as shown in Figure 5, and the method for testing of itself and embodiment one is similar, and difference is:
Soldering paste 4 is not coated on the pad 2; But be coated on the lower surface of first web member 5 (because the lower surface of first web member 5 is bigger; Therefore coating process is comparatively simple); Soldering paste 4 preferably is coated with the whole lower surface (certainly, final actual have only part soldering paste 4 contact with pad 2) of full first web member 5, even to guarantee that soldering paste 4 also can contact with pad 2 well when not really accurate when first web member 5 is located.
Obviously, in the method for above-mentioned each embodiment, when carrying out pull-out test; Can coating in the through hole not extracted yet, but coating in the through hole is applied a predetermined pull, if coating is not pulled out in this predetermined pull lower through-hole; Confirm that promptly its bonding state is qualified; Otherwise confirm that then bonding state is defective, wherein, this predetermined pull can require to set according to product specification.In this way, can carry out Non-Destructive Testing to product.。
The embodiment of the invention provides a kind of web member that is used for according to coating and circuit board substrate bonding state in the said method test through hole,
Said web member has and is used for the contact site that contacts with soldering paste, and is used for the connecting portion that is connected with pull-out test equipment; Or
Said web member is made up of first and second portion, and said first has and is used for the contact site that contacts with soldering paste, and said second portion has and is used for the connecting portion that is connected with pull-out test equipment.
Obviously, the web member of present embodiment can also have the structure of the web member of using in the method for testing of above-mentioned any embodiment.
Because being used for having according to the coating and the web member of circuit board substrate bonding state in the said method test through hole of embodiments of the invention is used for the contact site that contacts with soldering paste; So it can link together through reflow soldering process and pad, thereby can be used for small size through hole is tested.
Preferably; The part that the lower surface of the web member of using in the web member of above-mentioned each embodiment or the method for testing of above-mentioned each embodiment is used for contacting with soldering paste also can have recess, when web member contacts under certain pressure with soldering paste, can the soldering paste restriction be contained in the recess; To prevent that soldering paste from arbitrarily flowing; And increase the contact area of soldering paste and web member, and soldering paste is fully contacted with the web member lower surface in recess, thus assurance web member accurate positioning and combine closely with soldering paste.
The above; Be merely embodiment of the present invention, but protection scope of the present invention is not limited thereto, any technician who is familiar with the present technique field is in the technical scope that the present invention discloses; The variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain of said claim.
Claims (12)
1. a method of testing interior coating of through hole and circuit board substrate bonding state is characterized in that, comprising:
Through reflow soldering process web member is combined with the pad of coating one end in the through hole;
Through said web member coating in the through hole is applied pulling force to carry out pull-out test.
2. the method for coating and circuit board substrate bonding state in the test through hole according to claim 1 is characterized in that said web member being combined with the pad of coating one end in the through hole through reflow soldering process comprises:
In said through hole, be coated with soldering paste on the pad of a said end of coating, and on said soldering paste, web member be set, said web member is contacted with said soldering paste, said soldering paste is preferably solder(ing) paste; Or, on web member, be coated with soldering paste, and said web member is arranged on the pad of a said end of coating in the said through hole, said pad is contacted with said soldering paste, said soldering paste is preferably solder(ing) paste;
Heat said soldering paste and make its curing, thereby said pad and said web member are welded together.
3. the method for coating and circuit board substrate bonding state is characterized in that said web member is made up of metal or alloy in the part that is used for contacting with said soldering paste at least in the test through hole according to claim 1 and 2; Preferably, said web member is made up of copper in the part that is used for contacting with said soldering paste at least.
4. according to the method for coating and circuit board substrate bonding state in each described test through hole in the aforementioned claim, it is characterized in that said web member is provided for increasing the alligatoring structure of surfaceness at least in the part that is used for contacting with said soldering paste.
5. according to the method for coating and circuit board substrate bonding state in each described test through hole in the aforementioned claim, it is characterized in that,
Said web member has connecting portion, and said connecting portion is used for linking to each other with pull-out test equipment; Or
Said web member is made up of first and second portion, and said first is used for contacting with said soldering paste, and said second portion has and is used for the connecting portion that links to each other with pull-out test equipment.
6. according to the method for coating and circuit board substrate bonding state in each described test through hole in the aforementioned claim, it is characterized in that said web member is a sheet in the part that is used for contacting with said soldering paste at least.
7. according to the method for coating and circuit board substrate bonding state in each described test through hole in the aforementioned claim, it is characterized in that, saidly on said soldering paste, web member be set and comprise:
The lower surface of said web member is pressed on the upper surface of said soldering paste, and the lower surface of said web member is more than or equal to the upper surface of said soldering paste.
8. according to the method for coating and circuit board substrate bonding state in each described test through hole in the aforementioned claim, it is characterized in that said web member is being used for having the recess that is used to hold said soldering paste with the contacted part of said soldering paste.
9. according to the method for coating and circuit board substrate bonding state in each described test through hole in the aforementioned claim, it is characterized in that the said soldering paste of said heating comprises its curing:
In 4 minutes to 6 minutes, said soldering paste is heated to 240 degrees centigrade to 280 degrees centigrade from room temperature, and was keeping 30 seconds to 40 seconds more than 230 degrees centigrade.
10. according to the method for coating and circuit board substrate bonding state in each described test through hole in the aforementioned claim, it is characterized in that the said soldering paste of said heating comprises its curing:
The said soldering paste of heating makes its curing under vacuum environment.
11. the method according to coating and circuit board substrate bonding state in each described test through hole in the aforementioned claim is characterized in that, saidly through said web member coating in the through hole is applied pulling force and comprises to carry out pull-out test:
Through said web member coating in the through hole is applied predetermined pull; Confirm that coating is qualified with the bonding state of circuit board substrate in the said through hole if fail coating in the said through hole pulled out then, if it is defective coating in the said through hole to be pulled out in then definite said through hole the bonding state of coating and circuit board substrate.
12. a web member that is used for according to coating and circuit board substrate bonding state in each described method test through hole of aforementioned claim is characterized in that,
Said web member has the connecting portion that is used for the contact site that contacts with soldering paste and is used for being connected with pull-out test equipment; Or
Said web member is made up of first and second portion, and said first has and is used for the contact site that contacts with soldering paste, and said second portion has and is used for the connecting portion that is connected with pull-out test equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010503474XA CN102445412A (en) | 2010-09-30 | 2010-09-30 | Method for testing combination condition of internal coating of through hole with circuit board, and connecting element used for the same |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010503474XA CN102445412A (en) | 2010-09-30 | 2010-09-30 | Method for testing combination condition of internal coating of through hole with circuit board, and connecting element used for the same |
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| CN102445412A true CN102445412A (en) | 2012-05-09 |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103091247A (en) * | 2013-01-15 | 2013-05-08 | 广东生益科技股份有限公司 | Method and equipment for testing binding force of pad and base material |
| CN104181103A (en) * | 2014-08-25 | 2014-12-03 | 桂林电子科技大学 | Drawing test method and device for evaluating binding strength of PCB bonding pad |
| CN104596925A (en) * | 2015-01-22 | 2015-05-06 | 深圳崇达多层线路板有限公司 | Method for detecting binding force of metallized blind hole bottom and inner-layer base copper of HDI (High Density Interconnect) plate |
| CN104819931A (en) * | 2015-04-24 | 2015-08-05 | 深圳崇达多层线路板有限公司 | Method for detecting reliability of blind via holes of circuit boards |
| CN105158154A (en) * | 2015-07-30 | 2015-12-16 | 桂林电子科技大学 | Method for testing PCB pad bonding strength |
| CN105898993A (en) * | 2016-05-09 | 2016-08-24 | 广州美维电子有限公司 | Monitoring method for blind hole filling cavities |
| CN107036891A (en) * | 2017-05-25 | 2017-08-11 | 深圳崇达多层线路板有限公司 | A kind of method that whether micro-via interconnects failure in detection wiring board |
| CN108112190A (en) * | 2018-01-17 | 2018-06-01 | 郑州云海信息技术有限公司 | A kind of method for the multiple rows of connector through hole welding of high-layer super thick wiring board |
| CN109551133A (en) * | 2018-12-27 | 2019-04-02 | 江苏日托光伏科技股份有限公司 | A kind of solderability test method of MWT component tin cream |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103091247A (en) * | 2013-01-15 | 2013-05-08 | 广东生益科技股份有限公司 | Method and equipment for testing binding force of pad and base material |
| CN103091247B (en) * | 2013-01-15 | 2015-09-16 | 广东生益科技股份有限公司 | The method of testing of a kind of pad and base material adhesion and equipment |
| CN104181103A (en) * | 2014-08-25 | 2014-12-03 | 桂林电子科技大学 | Drawing test method and device for evaluating binding strength of PCB bonding pad |
| CN104596925A (en) * | 2015-01-22 | 2015-05-06 | 深圳崇达多层线路板有限公司 | Method for detecting binding force of metallized blind hole bottom and inner-layer base copper of HDI (High Density Interconnect) plate |
| CN104819931A (en) * | 2015-04-24 | 2015-08-05 | 深圳崇达多层线路板有限公司 | Method for detecting reliability of blind via holes of circuit boards |
| CN105158154A (en) * | 2015-07-30 | 2015-12-16 | 桂林电子科技大学 | Method for testing PCB pad bonding strength |
| CN105898993A (en) * | 2016-05-09 | 2016-08-24 | 广州美维电子有限公司 | Monitoring method for blind hole filling cavities |
| CN107036891A (en) * | 2017-05-25 | 2017-08-11 | 深圳崇达多层线路板有限公司 | A kind of method that whether micro-via interconnects failure in detection wiring board |
| CN108112190A (en) * | 2018-01-17 | 2018-06-01 | 郑州云海信息技术有限公司 | A kind of method for the multiple rows of connector through hole welding of high-layer super thick wiring board |
| CN109551133A (en) * | 2018-12-27 | 2019-04-02 | 江苏日托光伏科技股份有限公司 | A kind of solderability test method of MWT component tin cream |
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Application publication date: 20120509 |