JPH07218405A - Measuring edge-lay bonding strength - Google Patents

Measuring edge-lay bonding strength

Info

Publication number
JPH07218405A
JPH07218405A JP3409294A JP3409294A JPH07218405A JP H07218405 A JPH07218405 A JP H07218405A JP 3409294 A JP3409294 A JP 3409294A JP 3409294 A JP3409294 A JP 3409294A JP H07218405 A JPH07218405 A JP H07218405A
Authority
JP
Japan
Prior art keywords
edge
bonding strength
lay
base material
joint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3409294A
Other languages
Japanese (ja)
Inventor
Masaru Soga
勝 曽我
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP3409294A priority Critical patent/JPH07218405A/en
Publication of JPH07218405A publication Critical patent/JPH07218405A/en
Pending legal-status Critical Current

Links

Landscapes

  • Sampling And Sample Adjustment (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

PURPOSE:To enable accuracte evaluation of edge-lay bonding strength by providing a base material with a wide chucking part and constricted bonding part of a contact material and forming a wide chucking part with an auxiliary specimen at the other edge of the contact material. CONSTITUTION:A rectangular plane specimen 6 with a narrow junction is prepared by punching out an edge lay material with a hand press. The specimen 6 is joined to an auxiliary material 7 of the same property as a base material 1 at a junction by holding the other edge of the specimen 6. The specimens 6 is soldered or bonded with adhesive to the auxiliary material 7 at the front and back sides, or either front or back side. The specimens 7 and 6, and the base material 1 are chucked, and subjected to a tensile test to measure the junction strength of the base material 1 and contact material. A tensile force by which the junction is broken is indicated numerically as the bonding strength and evaluated.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、コネクター等の電気接
点用エッジレイ材料の接合強度を正確に数値で表わせる
ようにしたエッジレイ接合強度測定方法に関するもので
ある。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an edge lay bonding strength measuring method capable of accurately expressing the bonding strength of an edge lay material for electrical contacts such as connectors.

【0002】[0002]

【従来の技術】図1に示すように帯状の台材1の一側端
に細い接点材2が接合されたエッジレイ材料3の接合強
度を測定することは、接合された接点材2が微小幅であ
る為、困難で、適切な方法が無かった。この為、従来
は、エッジレイ材料3を適当な長さに切断した後、図5
に示すように角形ブロック4に接点材2を押し当て、も
う1個の角形ブロック4にて挾んで固定し、然る後図6
に示すように台材1を水平になるように折り曲げ、さら
に図7に示すように台材1を垂直になるように折り返す
ことを繰り返して、その折り曲げ、折り返し回数を計測
して、その回数によりエッジレイ接合強度を表示してい
た。
2. Description of the Related Art As shown in FIG. 1, the bonding strength of an edge lay material 3 in which a thin contact material 2 is bonded to one end of a strip-shaped base material 1 is measured by measuring the bonded contact material 2 with a very small width. Therefore, it was difficult and there was no suitable method. For this reason, conventionally, after cutting the edge lay material 3 into an appropriate length,
As shown in Fig. 6, the contact material 2 is pressed against the rectangular block 4 and sandwiched and fixed by the other rectangular block 4, and then, as shown in FIG.
As shown in Fig. 7, the base material 1 is bent horizontally, and as shown in Fig. 7, the base material 1 is folded back vertically so that the number of times of bending and folding is measured. The edge ray joint strength was displayed.

【0003】ところで、上記のエッジレイ接合強度測定
方法は、折り曲げ回数と強度の相関はあるが、その値は
適格ではない。即ち、折り曲げ回数1回でも破断する時
があったが、実用製品化へのプレス加工では何ら問題を
起さないので、適切な評価ではなかった。また、測定作
業時、接合部を角形ブロック4の上縁に当てるのが難し
く、その上接合部が他の部分より硬い為、ここを角形ブ
ロック4の上縁に当てても接合部はなかなか折り曲ら
ず、接合部よりやや上側で折り曲がることになる。従っ
て、正確に接合部で折り曲げできない。
By the way, in the above-mentioned edge lay bonding strength measuring method, there is a correlation between the number of bendings and the strength, but the value is not suitable. That is, even if the sheet was bent even once, it sometimes broke, but it was not an appropriate evaluation because it does not cause any problem in press working for commercialization. Also, during the measurement work, it is difficult to apply the joint to the upper edge of the rectangular block 4, and since the upper joint is harder than other parts, even if it is applied to the upper edge of the rectangular block 4, the joint will not easily fold. It will not bend and will bend slightly above the joint. Therefore, it cannot be bent accurately at the joint.

【0004】[0004]

【発明が解決しようとする課題】そこで本発明は、エッ
ジレイ接合強度を正確に且つ安定して数値化して評価で
きて、信頼性の高い測定方法を提供しようとするもので
ある。
SUMMARY OF THE INVENTION Therefore, the present invention is intended to provide a highly reliable measuring method capable of accurately and stably digitizing and evaluating the edge ray bonding strength.

【0005】[0005]

【課題を解決するための手段】上記課題を解決するため
の本発明のエッジレイ接合強度測定方法は、帯状の台材
の一側端に細い接点材が接合されたエッジレイ材料の接
合強度を測定するに於いて、エッジレイ材料を接合部を
くびらせた試料片を作り、次にこの試料片の接合部とは
反対側の接点材の外端部を挾んで補助試料を接合し、然
る後この補助試料と前記試料片の台材とをチャッキング
して引張り試験を行い、台材と接点材の接合強度を測定
することを特徴とするものである。ここで、上記補助試
料の接合は、半田付けするに限らず、瞬間接着材や樹脂
による接合でも良く、さらに裏表に限らず表また裏の片
面での接合でも良いものである。なお、試料片は接合部
がくびれた平面矩形が好ましい。また、エッジレイ材料
から試料片への加工はプレス加工で行なうが、それに限
るものではない。さらに、補助試料は、矩形に限るもの
ではない。
In order to solve the above-mentioned problems, the edge-ray bonding strength measuring method of the present invention measures the bonding strength of an edge-ray material in which a thin contact material is bonded to one end of a strip-shaped base material. , Make a sample piece with the edge ray material constricted at the joint, then sandwich the outer edge of the contact material on the side opposite to the joint of this sample piece to join the auxiliary sample, and after that This auxiliary sample and the base material of the sample piece are chucked to perform a tensile test, and the bonding strength between the base material and the contact material is measured. Here, the joining of the auxiliary sample is not limited to soldering, but may be joining with an instant adhesive or resin, and is not limited to the front and back sides, but may be the front side or the back side. The sample piece is preferably a flat rectangular shape with a narrowed joint. Further, the processing from the edge lay material to the sample piece is performed by pressing, but is not limited thereto. Furthermore, the auxiliary sample is not limited to a rectangle.

【0006】[0006]

【作用】上記のように本発明のエッジレイ接合強度測定
方法は、台材と接点材の接合部をくびらせて台材を幅広
いチャッキング部とし、接点材の外端部に補助試料を表
裏より半田付けして他方に幅広いチャッキング部を形成
し、この両チャッキング部を確実に引張り試験機にチャ
ッキングできるので、引張り試験を安定して正確にでき
るので、その測定値を台材と接点材の接点強度値として
表現でき、信頼性の高いものとなる。
As described above, according to the method of measuring the edge lay joint strength of the present invention, the base material is made into a wide chucking portion by constricting the joint portion of the base material and the contact material, and the auxiliary sample is provided on the outer end of the contact material. Since a wider chucking part is formed on the other side by soldering and both chucking parts can be securely chucked to the tensile tester, the tensile test can be performed stably and accurately, so the measured value can be used as the base material. It can be expressed as the contact strength value of the contact material and has high reliability.

【0007】[0007]

【実施例】本発明によるエッジレイ接合強度測定方法の
一実施例を図によって説明すると、図1に示すように幅
14mm、厚さ0.08mmのCu−Ni20〜22wt%−Sn 4.5〜
5.7wt%よりなる帯状の台材1の一側端に、幅2mm、厚
さ0.08mmのAg−Pd40wt%−Cu20wt%よりなる細い
接点材2が接合されたエッジレイ材料3の接合強度を測
定するに於いて、このエッジレイ材料3を、図2に示す
ようにハンドプレスにて打ち抜いて接合部5を幅3mm、
長さ3mmとなるようにくびらせた平面矩形(縦16mm、横
20mm)の試料片6を作り、次にこの試料片6の接合部5
とは反対側の接点材2の外端部を挾んで図3に示すよう
に矩形(縦25mm、横20mm)の台材1の材質よりなる補助
試料7を表裏両側ならびに表側、裏側の各々片側で、半
田または接着材にて接合し、然る後この補助試料7と前
記試料片6の台材1とをチャッキングして、図4に示す
ように引張り試験を行い、台材1と接点材2の接合強度
を測定した。そして接合部5が破断した引張り力でもっ
て接合強度として数値化し、評価した。その結果を以下
の表に示す。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the method for measuring edge lay joint strength according to the present invention will be described with reference to the drawings.
14mm, 0.08mm thick Cu-Ni 20-22wt% -Sn 4.5-
The bonding strength of the edge lay material 3 in which a thin contact material 2 made of Ag-Pd 40 wt% -Cu 20 wt% having a width of 2 mm and a thickness of 0.08 mm is joined to one side end of the strip-shaped base material 1 made of 5.7 wt% is measured. At this time, the edge lay material 3 is punched by a hand press as shown in FIG.
A flat rectangle that is constricted to a length of 3 mm (length 16 mm, width
20mm) sample piece 6 is made, and then the joint part 5 of this sample piece 6
As shown in FIG. 3, with the outer end portion of the contact material 2 on the opposite side of the contact material 2 sandwiched, an auxiliary sample 7 made of the material of the rectangular base material 25 (length 25 mm, width 20 mm) is used on both front and back sides as well as on both front and back sides. Then, the auxiliary sample 7 and the base material 1 of the sample piece 6 are chucked by soldering or an adhesive material, and a tensile test is performed as shown in FIG. The bonding strength of the material 2 was measured. Then, the tensile strength at which the joint 5 was broken was quantified as a joint strength and evaluated. The results are shown in the table below.

【0008】[0008]

【表1】 [Table 1]

【0009】[0009]

【発明の効果】以上の通り本発明のエッジレイ接合強度
測定方法によれば、エッジレイ接合強度を引張り試験に
より正確に且つ安定して数値化して評価できるので、信
頼性が高く、従来のエッジレイ接合強度測定方法にとっ
て代わることのできる。
As described above, according to the edge-lay bonding strength measuring method of the present invention, since the edge-ray bonding strength can be accurately and stably quantified and evaluated by the tensile test, the reliability is high and the conventional edge-ray bonding strength is high. It can replace the measuring method.

【図面の簡単な説明】[Brief description of drawings]

【図1】エッジレイ材料を示す斜視図である。FIG. 1 is a perspective view showing an edge lay material.

【図2】本発明のエッジレイ接合強度測定方法の一実施
例の工程を示す図である。
FIG. 2 is a diagram showing steps of one embodiment of the method for measuring edge lay joint strength of the present invention.

【図3】本発明のエッジレイ接合強度測定方法の一実施
例の工程を示す図である。
FIG. 3 is a diagram showing a process of an embodiment of the edge ray bonding strength measuring method of the present invention.

【図4】本発明のエッジレイ接合強度測定方法の一実施
例の工程を示す図である。
FIG. 4 is a diagram showing a process of an embodiment of the edge ray bonding strength measuring method of the present invention.

【図5】従来のエッジレイ接合強度測定方法の工程を示
す図である。
FIG. 5 is a diagram showing steps of a conventional edge ray bonding strength measuring method.

【図6】従来のエッジレイ接合強度測定方法の工程を示
す図である。
FIG. 6 is a diagram showing steps of a conventional edge-lay bonding strength measuring method.

【図7】従来のエッジレイ接合強度測定方法の工程を示
す図である。
FIG. 7 is a diagram showing steps of a conventional edge-lay bonding strength measuring method.

【符号の説明】[Explanation of symbols]

1 帯状の台材 2 細い接点材 3 エッジレイ材料 5 接合部 6 試料片 7 補助試料 1 Band-shaped base material 2 Thin contact material 3 Edge lay material 5 Joint part 6 Specimen piece 7 Auxiliary specimen

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 帯状の台材の一側端に細い接点材が接合
されたエッジレイ材料の接合強度を測定するに於いて、
エッジレイ材料を接合部をくびらせた試料片を作り、次
にこの試料片の接合部とは反対側の接点材の外端部を挾
んで補助試料を接合し、然る後この補助試料と前記試料
片の台材とをチャッキングして引張り試験を行い、台材
と接点材の接合強度を測定することを特徴とするエッジ
レイ接合強度測定方法。
1. In measuring the bonding strength of an edge lay material in which a thin contact material is bonded to one end of a strip-shaped base material,
Make a sample piece with the edge lay material constricted at the joint, then sandwich the outer edge of the contact material on the side opposite to the joint of this sample piece to join the auxiliary sample, and then with this auxiliary sample An edge lay bonding strength measuring method, comprising: chucking the base material of the sample piece to perform a tensile test to measure the bonding strength between the base material and the contact material.
【請求項2】 請求項1において、エッジレイ材料をプ
レス抜きして試料片を作ることを特徴とするエッジレイ
接合強度測定方法。
2. The method for measuring edge-ray bonding strength according to claim 1, wherein the edge-ray material is pressed out to prepare a sample piece.
【請求項3】 請求項1又は2において、試験片を接合
部がくびらせた平面矩形としたことを特徴とするエッジ
レイ接合強度測定方法。
3. The method for measuring edge-ray bond strength according to claim 1, wherein the test piece is a flat rectangular shape having a narrowed joint.
【請求項4】 請求項1、2又は3において、補助試料
を矩形としたことを特徴とするエッジレイ接合強度測定
方法。
4. The edge-ray bonding strength measuring method according to claim 1, 2 or 3, wherein the auxiliary sample has a rectangular shape.
【請求項5】 請求項1、2、3又は4において、補助
試料を半田または接着材ないしは樹脂にて接合したこと
を特徴とするエッジレイ接合強度方法。
5. The edge lay bonding strength method according to claim 1, 2, 3 or 4, wherein the auxiliary sample is bonded with solder or an adhesive or resin.
JP3409294A 1994-02-07 1994-02-07 Measuring edge-lay bonding strength Pending JPH07218405A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3409294A JPH07218405A (en) 1994-02-07 1994-02-07 Measuring edge-lay bonding strength

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3409294A JPH07218405A (en) 1994-02-07 1994-02-07 Measuring edge-lay bonding strength

Publications (1)

Publication Number Publication Date
JPH07218405A true JPH07218405A (en) 1995-08-18

Family

ID=12404640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3409294A Pending JPH07218405A (en) 1994-02-07 1994-02-07 Measuring edge-lay bonding strength

Country Status (1)

Country Link
JP (1) JPH07218405A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011123445A2 (en) * 2010-03-31 2011-10-06 Flextronics Ap, Llc Pin soldering for printed circuit board failure testing
CN102445412A (en) * 2010-09-30 2012-05-09 北大方正集团有限公司 Method for testing combination condition of internal coating of through hole with circuit board, and connecting element used for the same
CN103808651A (en) * 2014-01-24 2014-05-21 西安交通大学 Testing method for adhesive strength of historic preservation material
CN104360258A (en) * 2013-03-05 2015-02-18 弗莱克斯电子有限责任公司 In-circuit testing fixture device automatic opening and eject system
CN105547999A (en) * 2015-12-31 2016-05-04 银邦金属复合材料股份有限公司 Method for measuring bonding strength of metal composite material, sample and sample manufacture method
US9964563B1 (en) 2014-07-18 2018-05-08 Flextronics Ap, Llc Method and apparatus for ICT fixture probe cleaning

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011123445A2 (en) * 2010-03-31 2011-10-06 Flextronics Ap, Llc Pin soldering for printed circuit board failure testing
WO2011123445A3 (en) * 2010-03-31 2012-02-23 Flextronics Ap, Llc Pin soldering for printed circuit board failure testing
US8534136B2 (en) 2010-03-31 2013-09-17 Flextronics Ap, Llc. Pin soldering for printed circuit board failure testing
CN102445412A (en) * 2010-09-30 2012-05-09 北大方正集团有限公司 Method for testing combination condition of internal coating of through hole with circuit board, and connecting element used for the same
CN104360258A (en) * 2013-03-05 2015-02-18 弗莱克斯电子有限责任公司 In-circuit testing fixture device automatic opening and eject system
CN103808651A (en) * 2014-01-24 2014-05-21 西安交通大学 Testing method for adhesive strength of historic preservation material
US9964563B1 (en) 2014-07-18 2018-05-08 Flextronics Ap, Llc Method and apparatus for ICT fixture probe cleaning
CN105547999A (en) * 2015-12-31 2016-05-04 银邦金属复合材料股份有限公司 Method for measuring bonding strength of metal composite material, sample and sample manufacture method

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