CN104181103A - Drawing test method and device for evaluating binding strength of PCB bonding pad - Google Patents
Drawing test method and device for evaluating binding strength of PCB bonding pad Download PDFInfo
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- CN104181103A CN104181103A CN201410420814.0A CN201410420814A CN104181103A CN 104181103 A CN104181103 A CN 104181103A CN 201410420814 A CN201410420814 A CN 201410420814A CN 104181103 A CN104181103 A CN 104181103A
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Abstract
The invention discloses a drawing test method for evaluating binding strength of a PCB bonding pad. The method comprises the following steps of firstly preparing a test withdrawing needle with an embedded solder ball and a PCB bonding pad with an embedded solder point, and fixing the withdrawing needle on a drawing device chuck containing a heat source while enabling the withdrawing needle to be perpendicularly aligned to the target bonding pad; then enabling the solder ball of the withdrawing needle to be contacted with the solder point of the bonding pad, starting the heat source, transferring the heat from the heat source to the solder ball through the withdrawing needle, and thus welding the solder ball and the bonding pad by virtue of gravity effect of the molten solder ball; and finally directly starting a drawing device to acquire a cratering failure mode, a maximum release force and a drawing curve of the target bonding pad so as to realize the evaluation for the binding strength of the bonding pad. According to the method, a special drawing device is not needed, and the withdrawing needle which is made of a special material and a special test clamp are not needed, so that the expense is low; the procedure is simple, the operability is high, the universality and practicability are achieved, and the automation of the test process is easy to realize. The invention also discloses a drawing test device for evaluating the binding strength of the PCB bonding pad.
Description
Technical field
The present invention relates to the technology of printed circuit board, specifically a kind of drawing test method and device of evaluating PCB pad cohesive strength.
Background technology
It is the inevitable direction of microelectronics development of manufacturing that printed circuit board (pcb) is used halogen-free substrate and lead-free solder.In the manufacture and use procedure of PCB, multi-reflow welding and Rework Technics, can make the contact bed between PCB pad and substrate fiber bear thermal stress repeatedly.In addition, be adapted to leadless technique, corresponding improvement has also been carried out in PCB design.These changes not only make printed circuit board more crisp, more easily fracture, but also make the contact bed of PCB pad bottom can bear higher thermal stress, easily produce common PCB pad hole thereupon and split phenomenon.As scientific paper [Miao Cai, DongJi Xie, Boyi Wu, Investigation on PCB Pad Strength, IEEE, ICEPT-HDP 2010, pp1226-1229] described in, it is one of main failure mode of electronic product that PCB pad hole is split.Outstanding pin test (Pin-Pull Test) method of pulling out of having introduced for the resistance to spalling test of pad hole of PCB pad testing standard (IPC-9708) of promulgating in Dec, 2010.The method is best suited for testing weld pad hole and splits this failure mode, yet the drawing test method that this standard recommendation is used exists following problem: one, and need special equipment to test, somewhat expensive and device-specific are strong; Its two, the material behavior of pin is required very high, need special pin and the custom-designed testing apparatus fixture of pulling out.Reason based on above-mentioned two aspects, the cost that launches the pull-out test of PCB pad cohesive strength will be very high.For prevention PCB pad hole, split Problem of Failure, strengthen product reliability, a kind of with low cost, drawing test method and equipment of facilitating feasible evaluation PCB pad cohesive strength of active demand.
Summary of the invention
The object of the invention is for the deficiencies in the prior art, and provide a kind of drawing test method and device of the PCB of evaluation pad cohesive strength, the special support equipment that does not need somewhat expensive of this method is tested, what do not need special material pulls out pin and special test fixture simultaneously, the method step is succinct, workable, have good versatility and practicality and be easy to realize the robotization of test process, for prevention PCB pad hole, split Problem of Failure, strengthening product reliability provides effective technological means; This installation cost is cheap, easy and simple to handle, practicality and versatility higher.
The technical scheme that realizes the object of the invention is:
A pull-out test device of evaluating PCB pad cohesive strength, comprises pedestal, unlike the prior art, also comprises
Fixture, described fixture is arranged on the top of pedestal, and down, chuck can move up and down the chuck of fixture;
Well heater, described well heater is arranged on fixture;
Specimen holder, described specimen holder is arranged on the bottom surface of pedestal, corresponding with chuck.
Evaluate a drawing test method for PCB pad cohesive strength, comprise above-mentioned proving installation, described method comprises the steps:
1) choose test and pull out pin, in test, pull out the preset soldered ball in one end of pin;
2) selected target PCB sample, preset solder joint on the pad of target P CB sample;
3) target P CB sample is placed in the specimen holder of proving installation, test is pulled out to pin clamping on the chuck of proving installation, one end that the preset soldered ball of pin band is pulled out in test vertically downward, makes test pull out pin and target P CB sample pad vertical centering;
4) chuck is moved down, the preset soldered ball that test is pulled out on pin contacts with the preset solder joint on target P CB sample pad;
5) pin is pulled out in heating test, and the deadweight nutating action during by preset soldered ball melting makes test pull out the preset solder joint fusion on preset soldered ball and target P CB sample pad on pin;
6) cut off thermal source, make the fusion solder joint on target P CB sample pad cooling, realize test and pull out the welding between pin and target P CB sample pad;
7) by chuck vertically upward pull-out test pull out pin, until target P CB sample pad is peeled off target P CB sample completely, now just can object observing PCB sample pad hole split failure mode, and record maximum peeling force and pull-out curve;
8) repeating step 1)-7), failure mode, maximum peeling force and pull-out curve are split in the pad hole that obtains a plurality of target P CB samples, by conversion and statistical study, realize and evaluate PCB pad cohesive strength.
This device advantage is: practicality and versatility with low cost, easy and simple to handle, to have strengthened evaluation PCB pad cohesive strength pull-out test.
The advantage of this method is: do not need special support equipment to test, what do not need special material pulls out pin and special test fixture simultaneously, the method step is succinct, workable, have good versatility and practicality and be easy to realize the robotization of test process, for prevention PCB pad hole, split Problem of Failure, strengthening product reliability provides effective technological means.
Accompanying drawing explanation
Fig. 1 is the structural representation that pin is pulled out in the test that is provided with preset soldered ball in embodiment;
Fig. 2 a-Fig. 2 c schematically shows the process of preset solder joint on PCB sample pad;
Fig. 3 is provided with the structural representation that the proving installation of pin is pulled out in test in embodiment;
Fig. 4 is schematic diagram when test is pulled out the preset solder joint vertical centering of the preset soldered ball of pin and PCB sample pad and contacts in embodiment;
Fig. 5 is that embodiment tests the schematic diagram after the preset solder joint coating scaling powder that pulls out the preset soldered ball of pin and PCB sample pad;
Fig. 6 is that embodiment tests the schematic diagram after the preset solder joint welding of pulling out the preset soldered ball of pin and PCB sample pad;
Fig. 7 be embodiment up pull-out test pull out pin and make PCB sample pad peel off the schematic diagram after PCB sample fails.
In figure, 1. test is pulled out solder joint 12. holes that the preset solder joint of the preset soldered ball 3.PCB of pin 2. sample 4. pad 5. tin cream 6. 7. pedestal 8. chuck 9. well heater 10. scaling powders 11. merge and is split 13. specimen holders.
Embodiment
Below in conjunction with drawings and Examples, content of the present invention is further elaborated, but is not limitation of the invention.
Embodiment:
With reference to Fig. 3, a kind of pull-out test device of evaluating PCB pad cohesive strength, comprises pedestal 7, also comprises
Fixture, described fixture is arranged on the top of pedestal 7, and down, chuck 8 can move up and down the chuck 8 of fixture;
Well heater 9, described well heater 9 is arranged on fixture;
Specimen holder 13, described specimen holder 13 is arranged on the bottom surface of pedestal 7, corresponding with chuck 8.
Evaluate a drawing test method for PCB pad cohesive strength, comprise above-mentioned proving installation, described method comprises the steps:
1) choose test and pull out pin 1, in test, pull out the preset soldered ball 2 in one end of pin 1, as shown in Figure 1;
2) selected target PCB sample, preset solder joint 6 on target P CB sample 3 pads 4, as shown in Fig. 2 a-Fig. 2 c;
3) target P CB sample 3 is placed in the specimen holder 13 of proving installation, test is pulled out to pin 1 clamping on the chuck 8 of proving installation, test is pulled out pin 1 with one end of preset soldered ball 2 vertically downward, makes test pull out pin 1 and target P CB sample 3 pad 4 vertical centerings, as shown in Figure 3;
4) chuck 8 is moved down, the preset soldered ball 2 that test is pulled out on pin 1 contacts with the preset solder joint 6 on target P CB sample 3 pads 4, as shown in Figure 4;
5) pin 1 is pulled out in heating test, and the deadweight nutating action during by preset soldered ball 2 melting makes test pull out on preset soldered ball 2 on pin 1 and target P CB sample 3 pads 4 preset solder joint 6 and merges, as shown in Figure 6;
6) cut off thermal source, make the fusion solder joint on target P CB sample 3 pads 4 cooling, realize the welding that 4 of pin 1 and target P CB sample 3 pads are pulled out in test;
7) by chuck 8 vertically upward pull-out test pull out pin 1, until target P CB sample 3 pads 4 are peeled off target P CB sample 3 completely, measure the peeling force of pad 4 simultaneously, as shown in Figure 7, arrow in figure represents the direction of drawing, now just can split 12 failure modes in object observing PCB sample 3 pad holes, and record maximum peeling force and pull-out curve, the measuring method of pull-out curve is existing mechanical technology;
8) repeating step 1)-7), failure mode, maximum peeling force and pull-out curve are split in the pad hole that obtains a plurality of target P CB samples 3, by conversion and statistical study, described conversion and statistical analysis technique are prior art, as mean value, standard error analysis etc., realize and evaluate PCB pad cohesive strength.
Particularly, in step 1), the material that pin 1 is pulled out in test is to have weldability and metal material or alloy material that can thermal conductivity, and the copper pin that this example selects ordinary capacitor part to use pulls out pin 1 as test; The material of preset soldered ball 2 is for having kupper solder or lead-free solder.
Step 2) in, select the array pad of 45 row * 45 row as drawing object, print solder paste 5 on the target pad 4 of PCB sample 3, and realize preset solder joint 6 on pad 4 under Reflow Soldering, as Fig. 2 a-Fig. 2 c has provided the process of preset solder joint 6 on target P CB sample 3 pads 4; The material of preset solder joint 6 is for having kupper solder or lead-free solder.
Before pin 1 is pulled out in step 5) heating test, in test, pull out on the preset soldered ball 2 of pin 1 and the preset solder joint 6 of pad 4 and add liquid soldering flux 10, as shown in Figure 5, to guarantee welding quality.
In step 5), the realization of deadweight nutating action is when welding preset soldered ball 2, by controlling size, the weight of preset soldered ball 2, make in welding process, preset soldered ball 2 gravity down when molten condition is greater than scolding tin with wetting power summation down and test is pulled out to the up wetting power of pin 1.
Claims (2)
1. a pull-out test device of evaluating PCB pad cohesive strength, comprises pedestal, it is characterized in that, also comprises
Fixture, described fixture is arranged on the top of pedestal, and down, chuck can move up and down the chuck of fixture;
Well heater, described well heater is arranged on fixture;
Specimen holder, described specimen holder is arranged on the bottom surface of pedestal, corresponding with chuck.
2. a drawing test method of evaluating PCB pad cohesive strength, is characterized in that, comprises proving installation, and described method comprises the steps:
1) choose test and pull out pin, in test, pull out the preset soldered ball in one end of pin;
2) selected target PCB sample, preset solder joint on the pad of target P CB sample;
3) target P CB sample is placed in the specimen holder of proving installation, test is pulled out to pin clamping on the chuck of proving installation, one end that the preset soldered ball of pin band is pulled out in test vertically downward, makes test pull out pin and target P CB sample pad vertical centering;
4) chuck is moved down, the preset soldered ball that test is pulled out on pin contacts with the preset solder joint on target P CB sample pad;
5) pin is pulled out in heating test, and the deadweight nutating action during by preset soldered ball melting makes test pull out the preset solder joint fusion on preset soldered ball and target P CB sample pad on pin;
6) cut off thermal source, make the fusion solder joint on target P CB sample pad cooling, realize test and pull out the welding between pin and target P CB sample pad;
7) by chuck vertically upward pull-out test pull out pin, until target P CB sample pad is peeled off target P CB sample completely, now just can object observing PCB sample pad hole split failure mode, and record maximum peeling force and pull-out curve;
8) repeating step 1)-7), failure mode, maximum peeling force and pull-out curve are split in the pad hole that obtains a plurality of target P CB samples, by conversion and statistical study, realize and evaluate PCB pad cohesive strength.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410420814.0A CN104181103A (en) | 2014-08-25 | 2014-08-25 | Drawing test method and device for evaluating binding strength of PCB bonding pad |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410420814.0A CN104181103A (en) | 2014-08-25 | 2014-08-25 | Drawing test method and device for evaluating binding strength of PCB bonding pad |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105033387A (en) * | 2015-08-26 | 2015-11-11 | 桂林电子科技大学 | Manufacturing method of welding pull pins |
| CN105158154A (en) * | 2015-07-30 | 2015-12-16 | 桂林电子科技大学 | Method for testing PCB pad bonding strength |
| CN108982357A (en) * | 2018-07-26 | 2018-12-11 | 张家港康得新光电材料有限公司 | A kind of ply adhesion test device |
| CN110842385A (en) * | 2019-11-14 | 2020-02-28 | 桂林电子科技大学 | Test apparatus and control method of test apparatus |
| CN112338305A (en) * | 2020-10-12 | 2021-02-09 | 深圳市首骋新材料科技有限公司 | Welding process for surface vertical tension test |
| CN112687570A (en) * | 2020-12-28 | 2021-04-20 | 中国电子科技集团公司第十三研究所 | Test method for testing welding performance of welding pad of ceramic shell |
| CN113319454A (en) * | 2021-04-29 | 2021-08-31 | 中国电子科技集团公司第二十九研究所 | Solder presetting method for welding end of surface-mounted self-contained solid solder connector |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5969262A (en) * | 1996-11-19 | 1999-10-19 | Denso Corporation | Method and apparatus for testing junction strength of electrode |
| JP2003188201A (en) * | 2001-12-20 | 2003-07-04 | Hitachi Chem Co Ltd | Method of measuring ball-pull strength |
| JP2004235412A (en) * | 2003-01-30 | 2004-08-19 | Hitachi Chem Co Ltd | Test method of conductor adhesion strength for printed wiring board material and printed wiring board |
| JP2005026594A (en) * | 2003-06-30 | 2005-01-27 | Resuka:Kk | Peeling test method of solid sample attached to or embedded in substrate |
| JP4483671B2 (en) * | 2005-04-15 | 2010-06-16 | 積水ハウス株式会社 | Tensile test method and tensile tester |
| CN201926615U (en) * | 2010-12-09 | 2011-08-10 | 北大方正集团有限公司 | Drawing test fixture |
| US20110239775A1 (en) * | 2010-03-31 | 2011-10-06 | Flextronics Ap, Llc | Pin soldering for printed circuit board failure testing |
| CN102445412A (en) * | 2010-09-30 | 2012-05-09 | 北大方正集团有限公司 | Method for testing combination condition of internal coating of through hole with circuit board, and connecting element used for the same |
| CN204128944U (en) * | 2014-08-25 | 2015-01-28 | 桂林电子科技大学 | A kind of pull-out test device evaluating PCB pad cohesive strength |
-
2014
- 2014-08-25 CN CN201410420814.0A patent/CN104181103A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5969262A (en) * | 1996-11-19 | 1999-10-19 | Denso Corporation | Method and apparatus for testing junction strength of electrode |
| JP2003188201A (en) * | 2001-12-20 | 2003-07-04 | Hitachi Chem Co Ltd | Method of measuring ball-pull strength |
| JP2004235412A (en) * | 2003-01-30 | 2004-08-19 | Hitachi Chem Co Ltd | Test method of conductor adhesion strength for printed wiring board material and printed wiring board |
| JP2005026594A (en) * | 2003-06-30 | 2005-01-27 | Resuka:Kk | Peeling test method of solid sample attached to or embedded in substrate |
| JP4483671B2 (en) * | 2005-04-15 | 2010-06-16 | 積水ハウス株式会社 | Tensile test method and tensile tester |
| US20110239775A1 (en) * | 2010-03-31 | 2011-10-06 | Flextronics Ap, Llc | Pin soldering for printed circuit board failure testing |
| CN102823341A (en) * | 2010-03-31 | 2012-12-12 | 弗莱克斯电子有限责任公司 | Pin soldering for printed circuit board failure testing |
| CN102445412A (en) * | 2010-09-30 | 2012-05-09 | 北大方正集团有限公司 | Method for testing combination condition of internal coating of through hole with circuit board, and connecting element used for the same |
| CN201926615U (en) * | 2010-12-09 | 2011-08-10 | 北大方正集团有限公司 | Drawing test fixture |
| CN204128944U (en) * | 2014-08-25 | 2015-01-28 | 桂林电子科技大学 | A kind of pull-out test device evaluating PCB pad cohesive strength |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105158154A (en) * | 2015-07-30 | 2015-12-16 | 桂林电子科技大学 | Method for testing PCB pad bonding strength |
| CN105033387A (en) * | 2015-08-26 | 2015-11-11 | 桂林电子科技大学 | Manufacturing method of welding pull pins |
| CN105033387B (en) * | 2015-08-26 | 2017-06-23 | 桂林电子科技大学 | It is a kind of to weld the preparation method for pulling out pin |
| CN108982357A (en) * | 2018-07-26 | 2018-12-11 | 张家港康得新光电材料有限公司 | A kind of ply adhesion test device |
| CN110842385A (en) * | 2019-11-14 | 2020-02-28 | 桂林电子科技大学 | Test apparatus and control method of test apparatus |
| CN112338305A (en) * | 2020-10-12 | 2021-02-09 | 深圳市首骋新材料科技有限公司 | Welding process for surface vertical tension test |
| CN112687570A (en) * | 2020-12-28 | 2021-04-20 | 中国电子科技集团公司第十三研究所 | Test method for testing welding performance of welding pad of ceramic shell |
| CN112687570B (en) * | 2020-12-28 | 2023-02-28 | 中国电子科技集团公司第十三研究所 | Test method for testing welding performance of welding pad of ceramic shell |
| CN113319454A (en) * | 2021-04-29 | 2021-08-31 | 中国电子科技集团公司第二十九研究所 | Solder presetting method for welding end of surface-mounted self-contained solid solder connector |
| CN113319454B (en) * | 2021-04-29 | 2022-08-23 | 中国电子科技集团公司第二十九研究所 | Solder presetting method for welding end of surface-mounted self-contained solid solder connector |
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