CN112338305A - Welding process for surface vertical tension test - Google Patents

Welding process for surface vertical tension test Download PDF

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Publication number
CN112338305A
CN112338305A CN202011082823.5A CN202011082823A CN112338305A CN 112338305 A CN112338305 A CN 112338305A CN 202011082823 A CN202011082823 A CN 202011082823A CN 112338305 A CN112338305 A CN 112338305A
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China
Prior art keywords
test
welding
gasket
vertical
tension
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CN202011082823.5A
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Chinese (zh)
Inventor
朱浩宁
齐亚军
许静文
张�杰
孙丰振
刘小丽
李德林
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Soltrium Technology Ltd
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Soltrium Technology Ltd
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Priority to CN202011082823.5A priority Critical patent/CN112338305A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

The application provides a welding process for testing surface vertical tension, which comprises the following steps: arranging a positioning hole on the gasket, and attaching the gasket to the surface of the test base material; uniformly coating a specified amount of solder paste on the welding end of the tension test wire; vertically arranging the tension test line on the surface of the test substrate, wherein the welding end of the tension test line is positioned at the center of the positioning hole; extending a welding gun to the contact position of the welding end and the test base material in an inclined state until the solder paste on the welding end is melted and reflows into the positioning hole, and finally removing the welding gun; the welding process for testing the vertical tensile force of the surface of the gasket is characterized in that the positioning holes in the gasket can control the shape and size of welding spots, solder paste with specified amount is uniformly coated at the welding end of a tensile force testing line, and the use amount of the solder paste is strictly controlled, so that the welding quality and the testing precision are improved.

Description

Welding process for surface vertical tension test
Technical Field
The application belongs to the technical field of tension testing, and particularly relates to a welding process for surface vertical tension testing.
Background
The dielectric filter is designed and manufactured by utilizing the characteristics of low loss, high dielectric constant, small frequency temperature coefficient and thermal expansion coefficient, high power bearing and the like of a dielectric ceramic material, and is composed of a plurality of ladder-shaped circuits formed by longitudinally connecting a plurality of long resonators in series or in parallel in a multistage manner. Since the ceramic dielectric filter is not conductive by itself, it is generally performed by coating and sintering a conductive silver layer on the ceramic dielectric filter so that the ceramic dielectric filter can be electrically connected to the PCB board. In order to ensure that the ceramic dielectric filter can be stably and electrically connected with the PCB, the surface of the ceramic dielectric filter needs to be subjected to a vertical tensile test.
In the prior art, before a vertical tension test, a tension test wire is directly welded on the surface of a ceramic dielectric filter by adopting a reflow soldering technology, but the shape, size, height and flatness of a welding spot obtained by the technology cannot be controlled, so that the area of the welding spot cannot be accurately calculated; meanwhile, the use amount of the solder paste cannot be controlled, so that the production cost and the welding difficulty are increased, and the welding quality and the testing precision are reduced.
Disclosure of Invention
An object of the embodiment of the application is to provide a welding process for testing surface vertical tension, so as to solve the technical problems that welding spots and solder paste cannot be controlled and welding quality and testing precision are poor in the vertical tension testing process in the prior art.
In order to achieve the purpose, the technical scheme adopted by the application is as follows: the welding process for testing the vertical tensile force of the surface comprises the following steps:
arranging a positioning hole on the gasket, and attaching the gasket to the surface of the test base material;
uniformly coating a specified amount of solder paste on the welding end of the tension test wire;
vertically arranging the tension test line on the surface of the test substrate, wherein the welding end of the tension test line is positioned at the center of the positioning hole;
and extending the welding gun to the contact position of the welding end and the test base material in an inclined state until the solder paste on the welding end is melted and flows back into the positioning hole, and finally withdrawing the welding gun.
Preferably, the gasket is the aluminium foil sticky tape, the aluminium foil sticky tape include the aluminium foil material layer and coat in the adhesive material layer of aluminium foil material layer one side, the aluminium foil sticky tape passes through the adhesive material layer paste in the surface of test substrate.
Preferably, the method for forming the positioning hole on the gasket comprises the following steps: and placing the gasket on a fiber laser machine, and forming a positioning hole with a specified shape through the fiber laser machine.
Preferably, before the solder paste of the specified amount is uniformly applied to the soldering terminal of the tensile test line, the method further comprises the following steps: and preparing a certain amount of solder paste by a dispenser or a needle tube.
Preferably, the tensile test line is a copper wire, and a pull ring is arranged at one end, far away from the welding end, of the copper wire.
Preferably, before the tensile test line is vertically disposed on the surface of the test substrate, the method further includes: and starting the heating table, after the heating table is heated to the specified temperature, placing the test base material pasted with the gasket on the heating table, and heating the test base material to the specified temperature through the heating table.
Preferably, the welding gun adopts a flat welding head.
Preferably, when the welding gun extends to the contact position of the welding end and the test base material, the included angle between the welding gun and the surface of the test base material is 30-60 degrees.
Preferably, the gasket is provided with a plurality of positioning holes, the shape and the size of each positioning hole on the gasket are different, and each gasket is respectively attached to the surface of the test base material and is also used for welding a tension test line so as to test the bonding force of the average unit contact area of the surface of the test base material and the tension test line when positioning holes with different shapes and sizes are adopted.
Preferably, the test substrate is a ceramic dielectric filter, the surface of the ceramic dielectric filter is coated with a conductive silver layer, and the gasket is attached to the conductive silver layer of the ceramic dielectric filter.
The application provides a perpendicular tensile test welding process in surface's beneficial effect lies in: compared with the prior art, through on the gasket the shape and the size of solder joint can be controlled to the locating hole, will appoint the volume tin cream to coat in the solder terminal of tensile test line uniformly, the strict control the use amount of tin cream, the cooperation the welder heating the solder terminal with the contact position of test substrate makes can directly follow during the tin cream melting the outer wall of solder terminal flows back extremely in the locating hole to can control solder joint height and roughness, and then effectively reduce manufacturing cost and the welding degree of difficulty, improve welding quality and measuring accuracy.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic perspective view of a surface vertical tension test welding process at step 4 according to an embodiment of the present disclosure;
fig. 2 is a schematic block diagram of a surface vertical tension test welding process provided in an embodiment of the present application.
Wherein, in the figures, the respective reference numerals:
10-a gasket; 11-a positioning hole; 20-a test substrate; 30-solder paste; 40-tensile test line; 41-welding ends; 50-a welding gun; 42-pull ring.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1 to 2 together, a surface vertical pull test welding process provided in an embodiment of the present application will now be described. The welding process for testing the surface vertical tension comprises the following steps:
step 1, arranging a positioning hole 11 on a gasket 10, and attaching the gasket 10 to the surface of a test base material 20;
step 2, uniformly coating the solder paste 30 with a specified amount on the welding end 41 of the tension test line 40;
step 3, vertically arranging the tensile test line 40 on the surface of the test base material 20, wherein the welding end 41 of the tensile test line 40 is positioned at the center of the positioning hole 11;
and 4, extending the welding gun 50 to the contact position of the welding end 41 and the test base material 20 in an inclined state until the solder paste 30 on the welding end 41 is melted and reflows to the positioning hole 11, and finally removing the welding gun 50.
It can be understood that the shape and size of the positioning hole 11 on the gasket 10 can be customized according to actual requirements, and the shape and size of the welding point can be precisely controlled through the positioning hole 11, which is also convenient for calculating the area of the welding point. A specified amount of solder paste 30 is uniformly coated on the welding end 41 of the tensile test wire 40, and the use amount of the solder paste 30 is strictly controlled. Because the solder paste 30 coats in the solder terminal 41 of tensile test line 40 evenly, through welder 50 heats solder terminal 41 with the contact position of test substrate 20 makes directly along during the solder paste 30 melting the outer wall of solder terminal 41 flows back extremely solder terminal 41 with the contact position of test substrate 20, can form full and mellow welding point after the solder paste 30 solidifies once more to can control solder joint height and roughness.
It should be added that, when performing the tensile test, the tensile test line 40 is pulled reversely along the length of the tensile test line 40 by a device such as a tension meter, the tensile force is slowly increased until the tensile test line 40 is completely separated from the surface of the test substrate 20, and the maximum tensile force at this time is recorded; and finally, calculating the bonding force per unit area according to the maximum tensile force and the area of the positioning hole 11, and realizing the test of the surface vertical tensile force.
The utility model provides a perpendicular pull test welding process in surface compares with prior art, through on the gasket 10 the shape and the size of solder joint can be controlled to locating hole 11, will appoint volume tin cream 30 and coat in tensile test line 40's welding end 41 evenly, strictly controlled tin cream 30's use amount, cooperation welder 50 heats welding end 41 with test substrate 20's contact position makes can directly follow when tin cream 30 melts the outer wall of welding end 41 flows back extremely in the locating hole 11 to can control solder joint height and roughness, and then effectively reduce manufacturing cost and welding degree of difficulty, improve welding quality and measuring accuracy.
In another embodiment of the present application, in step 1, the gasket 10 is an aluminum foil tape, the aluminum foil tape includes an aluminum foil material layer and is coated on an adhesive material layer on one side of the aluminum foil material layer, and the aluminum foil tape is adhered to the surface of the test substrate 20 through the adhesive material layer. It can be understood that the aluminum foil tape is easy to process the positioning hole 11, is resistant to high temperature without deformation, can be directly adhered to the surface of the test substrate 20, is accurately positioned, and is prevented from being displaced.
In another embodiment of the present application, in step 1, a method for forming positioning holes 11 in the gasket 10 includes: and placing the gasket 10 on a fiber laser machine, and forming a positioning hole 11 with a specified shape by the fiber laser machine. It can be understood that the positioning hole 11 is one of a circle, a regular polygon, a trapezoid and a parallelogram to facilitate calculating the area of a welding spot, and the fiber laser machine is adopted to cut the positioning hole 11, so that the cutting is accurate and efficient.
In another embodiment of the present application, before step 2, the method further includes: a certain amount of solder paste 30 is prepared by a dispenser or a needle tube. It can be understood that the amount of the solder paste 30 can be precisely controlled by the dispenser or the needle tube, and the dispenser or the needle tube has low cost and convenient use.
In another embodiment of the present application, in step 2, the tensile testing wire 40 is a copper wire, and a pull ring 42 is disposed at an end of the copper wire away from the welding end 41. It can be understood that the copper wire has the advantages of high strength and stability, better welding performance and high tensile force bearing capability compared with other metal materials, and the pull ring 42 is better stressed in the surface vertical tensile force test.
In another embodiment of the present application, before step 3, the method further includes: and starting the heating table, after the heating table is heated to the specified temperature, placing the test base material 20 pasted with the gasket 10 on the heating table, and heating the test base material 20 to the specified temperature through the heating table. It can be understood that the test substrate 20 may be preheated by the heating stage, so that the bonding force of the surface of the test substrate 20 during the soldering process improves the soldering quality.
In another embodiment of the present application, the soldering tip 50 is a flat soldering tip. It can be understood that the flat soldering iron tip can be used for precise spot heating, and meanwhile, in the soldering process, the shape and height of the solder paste 30 can be manually and flexibly adjusted through the flat soldering iron tip, so that the soldering quality is further improved.
In another embodiment of the present application, when the welding torch 50 extends to the contact position of the welding tip 41 and the test substrate 20, the angle between the welding torch 50 and the surface of the test substrate 20 is between 30 ° and 60 °. Illustratively, the torch 50 may be angled at 30 °, 35 °, 40 °, 45 °, 50 °, 55 °, or 60 ° to the surface of the test substrate 20, as desired. It will be appreciated that the included angle between the welding torch 50 and the surface of the test substrate 20 is 30 ° to 60 °, which not only increases the contact area and enhances the heat conduction, but also maintains the air flow during welding and facilitates the operator to observe the welding condition.
In another embodiment of the present application, the plurality of spacers 10 are provided, the shape and size of the positioning hole 11 on each spacer 10 are different, and each spacer 10 is respectively attached to the surface of the test substrate 20 and is also used for welding the tensile test line 40, so as to test the bonding force of the average unit contact area between the surface of the test substrate 20 and the tensile test line 40 when the positioning holes 11 with different shapes and sizes are adopted. It can be understood that, since the bonding force of the bonding surfaces with different shapes and sizes to the unit contact area is different, the error can be further reduced by testing the bonding force of the surface of the test substrate 20 and the average unit contact area of the tensile test line 40 when the positioning holes 11 with different shapes and sizes are adopted.
In another embodiment of the present application, the test substrate 20 is a ceramic dielectric filter, a surface of the ceramic dielectric filter is coated with a conductive silver layer, and the gasket 10 is attached to the conductive silver layer of the ceramic dielectric filter. It will be appreciated that since the ceramic dielectric filter is not inherently conductive, the ceramic dielectric filter can be electrically connected to a PCB board, typically by coating and sintering a conductive silver layer on the ceramic dielectric filter. Therefore, when testing the surface tension of the ceramic dielectric filter, the gasket 10 needs to be attached to the conductive silver layer of the ceramic dielectric filter.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A surface vertical tension test welding process is characterized by comprising the following steps:
arranging a positioning hole on the gasket, and attaching the gasket to the surface of the test base material;
uniformly coating a specified amount of solder paste on the welding end of the tension test wire;
vertically arranging the tension test line on the surface of the test substrate, wherein the welding end of the tension test line is positioned at the center of the positioning hole;
and extending the welding gun to the contact position of the welding end and the test base material in an inclined state until the solder paste on the welding end is melted and flows back into the positioning hole, and finally withdrawing the welding gun.
2. The welding process for testing vertical surface tension according to claim 1, wherein the gasket is an aluminum foil tape, the aluminum foil tape comprises an aluminum foil material layer and an adhesive material layer coated on one side of the aluminum foil material layer, and the aluminum foil tape is adhered to the surface of the test substrate through the adhesive material layer.
3. The surface vertical pull test welding process of claim 2, wherein the method of forming the locating hole in the gasket comprises: and placing the gasket on a fiber laser machine, and forming a positioning hole with a specified shape through the fiber laser machine.
4. The vertical surface tension test soldering process as claimed in claim 1, further comprising, before applying a specified amount of solder paste uniformly to the soldering end of the tension test wire: and preparing a certain amount of solder paste by a dispenser or a needle tube.
5. The welding process for testing the vertical tensile force of the surface as claimed in claim 1, wherein the tensile force testing wire is a copper wire, and a pull ring is arranged at one end of the copper wire, which is far away from the welding end.
6. The vertical surface tension test soldering process according to claim 1, further comprising, before the vertical placement of the tension test wire on the surface of the test substrate: and starting the heating table, after the heating table is heated to the specified temperature, placing the test base material pasted with the gasket on the heating table, and heating the test base material to the specified temperature through the heating table.
7. The vertical surface pull test soldering process according to claim 1, wherein the soldering tip is a flat soldering tip.
8. The surface vertical pull test welding process of claim 7, wherein the included angle between the welding torch and the surface of the test substrate is between 30 ° and 60 ° when the welding torch extends to the contact position of the welding end and the test substrate.
9. The surface vertical tension test welding process of claim 1, wherein a plurality of gaskets are provided, the shape and size of the positioning holes on each gasket are different, and each gasket is respectively attached to the surface of the test substrate and is also used for welding a tension test line, so as to test the bonding force of the surface of the test substrate and the average unit contact area of the tension test line when positioning holes with different shapes and sizes are adopted.
10. The surface vertical tension test welding process of any one of claims 1 to 9, wherein the test substrate is a ceramic dielectric filter, the surface of the ceramic dielectric filter is coated with a conductive silver layer, and the gasket is attached to the conductive silver layer of the ceramic dielectric filter.
CN202011082823.5A 2020-10-12 2020-10-12 Welding process for surface vertical tension test Pending CN112338305A (en)

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CN113178762A (en) * 2021-05-14 2021-07-27 深圳市京泉华科技股份有限公司 Welding method and product
CN113960048A (en) * 2021-10-19 2022-01-21 广东斯特纳新材料有限公司 Solderability testing method of solder paste for MWT component

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Publication number Priority date Publication date Assignee Title
CN113178762A (en) * 2021-05-14 2021-07-27 深圳市京泉华科技股份有限公司 Welding method and product
CN113960048A (en) * 2021-10-19 2022-01-21 广东斯特纳新材料有限公司 Solderability testing method of solder paste for MWT component

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