CN113960048A - Solderability testing method of solder paste for MWT component - Google Patents
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
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- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/041—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body
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- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
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Abstract
The invention discloses a solderability test method of solder paste for an MWT component, which comprises the following steps: preparing a sample; smearing a sample; preparing for welding; starting welding; simulation testing; primary screening; secondary screening; screening for the third time; and (6) comprehensive evaluation. According to the invention, when a solder paste sample is smeared, the solder paste of different products needs to be uniformly stirred, and then sampling can be carried out, so that the phenomenon that substances are unevenly distributed due to precipitation in the solder paste can be avoided, the performance of the solder paste product can be accurately tested, the hollowed-out holes are smeared by the aid of the base plate and the hollowed-out template, the solder paste is smeared uniformly and in the same size, the welded mechanical tensile force can be conveniently tested in the later period, the accuracy of a test result can be improved, the tensile force test is carried out by setting different environments, the tensile force test data is recorded, the performance of different solder pastes in different extreme environments can be tested, and then the more suitable solder paste product can be conveniently selected by means of three-layer screening.
Description
Technical Field
The invention relates to the technical field of solder paste detection methods, in particular to a solder paste solderability test method for an MWT component.
Background
MWT is a metal perforation winding technology, is applied to a solar cell, realizes a perforation process on a primary silicon wafer by laser or other methods, achieves the purpose of leading a primary electrode to the same surface, and increases the conversion efficiency of the cell by reducing the BUSBAR shading area; the MWT component is an efficient unconventional component, the positive electrode points and the negative electrode points of the solar component are distributed on the back face of the cell piece, the component is connected with the conductive core plate and the cell piece through solder paste, the circuit conduction effect is ensured, the performance of a solder paste product is particularly important in weldability, and the rework amount is increased due to poor weldability.
The prior patent (publication number: CN109551133A) discloses a solderability test method of a solder paste for an MWT component, and relates to the technical field of a solder paste detection method. Coating solder paste on the solder paste using part of each sample, placing the sample in a constant temperature box, observing the curing form and additive residue of the solder paste, and selecting the solder paste meeting the requirements; and coating the battery piece and the copper foil with the solder paste meeting the requirements, and producing a detection sample according to a product production process. The inventor finds that the following problems in the prior art are not solved well in the process of realizing the scheme: 1. according to the method, the solder pastes of different products are not stirred during sampling, and the solder pastes can cause uneven distribution of internal substances after standing for a period of time, so that test data can be influenced, and errors exist in test results; 2. the method does not simulate an extreme test environment during testing, and experimental test data has certain errors in an actual environment; 3. the method has the advantages that the smearing thickness is uncontrollable during smearing test, so that the fixed value in the experiment is uncontrollable, and the reliability of the obtained experiment result is not high.
Disclosure of Invention
An object of the present invention is to provide a solderability test method of a solder paste for MWT components in order to solve the above problems.
The invention achieves the aim through the following technical scheme, and provides a solder paste solderability test method for an MWT component, which comprises the following steps:
first, sample preparation, numbering a plurality of solder paste products, and then taking and numbering the same number of test boards.
And secondly, smearing a sample, combining the substrate and the hollowed-out templates in the plurality of test boards, smearing the solder paste products with corresponding numbers on one side surface of the hollowed-out template far away from the substrate, smearing the hollowed-out holes by using a scraper, and finishing smearing the solder paste in the plurality of test boards.
And thirdly, preparing for welding, separating the combined substrates and the hollow-out templates by using a prying tool, horizontally placing the substrates on a fixing clamp respectively, and finally placing the battery pieces on the welding test blocks downwards on the positions of the current-conducting plates respectively.
And fourthly, starting welding, blowing the solder paste to the surface of the substrate by using a hot air blower with rated temperature, and starting to fix the solder paste products at high temperature to finish welding the conductive plate and the battery piece.
And fifthly, performing simulation test, after cooling, putting the plurality of substrates and the bottom fixing clamp into an environment simulation space, performing tension test aiming at different environments, and recording tension test data.
And sixthly, screening for the first time, and screening out qualified solder paste products by comparing the qualified data of the MWT component.
And seventhly, secondary screening, namely, observing a plurality of cured qualified solder paste products under a microscope, and selecting the solder paste products with qualified appearances.
And eighthly, screening for three times, carrying out resistance test on the solder paste product with qualified appearance by using a special resistance test tool, and recording data.
And ninthly, comprehensively evaluating, comparing all data, analyzing to obtain a ranking list of the solder paste products, summarizing the advantages and the disadvantages of the products, and completing the solderability test of the solder pastes of various products.
Preferably, the test board comprises a base plate, a hollow template and a plurality of welding test blocks, and the length and the width of the surface of one side of the base plate are the same as those of the surface of one side of the hollow template.
Preferably, a nameplate is fixedly mounted on the surface of one side of the substrate, a plurality of conductive plates are embedded in the substrate, and four convex blocks are fixedly mounted on the surface of one side of the substrate.
Preferably, the hollowed-out template is provided with a notch, the hollowed-out template is provided with a plurality of hollowed-out holes in a penetrating manner, and the hollowed-out template is provided with four alignment holes.
Preferably, a battery piece is fixedly mounted on the surface of one side of the welding test block, a connecting column is fixedly mounted on the surface of one side of the welding test block, which is far away from the battery piece, and a tension test hole is formed in the connecting column in a penetrating manner.
Preferably, when the battery pieces on the plurality of welding test blocks are respectively placed on the positions of the conducting plates in a downward mode, at least one conducting plate is not provided with the welding test block.
Preferably, in the fifth step, the environment simulation space comprises temperature, pH value and humidity, and the temperature comprises extremely cold and extremely hot environments.
Preferably, the solder paste product with qualified appearance is selected in the seventh step, and the solder paste product is observed to have no gathering phenomenon on the surface, no morphological change and metal luster on the surface.
Preferably, when the solder paste sample is coated in the second step, the sample can be taken after the solder pastes of different products are uniformly stirred.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, when a solder paste sample is smeared, samples can be taken after solder pastes of different products are uniformly stirred, so that the phenomenon that substances are unevenly distributed due to precipitation in the solder paste can be avoided, and the performance of the solder paste product can be accurately tested;
according to the invention, the substrate and the hollowed-out template are arranged, and the scraper is used for smearing the hollowed-out holes, so that the smearing of the solder paste in the plurality of test boards is completed, the smearing of the solder paste is relatively uniform and has the same size, the mechanical tensile force of the welding can be conveniently tested at the later stage, and the accuracy of the test result can be conveniently improved;
according to the invention, the plurality of substrates and the bottom fixing clamp are placed in the environment simulation space, tension tests are carried out aiming at different environments, tension test data are recorded, the performances of different solder pastes under different extreme environments can be tested, and then a more appropriate solder paste product can be conveniently selected through three-layer screening.
Drawings
FIG. 1 is a flow chart of a method of the present invention;
FIG. 2 is a perspective view of a substrate according to the present invention;
FIG. 3 is a perspective view of the stencil of the present invention;
fig. 4 is a perspective view of a welding test block according to the present invention.
In the figure: 1. a substrate; 11. a nameplate; 12. a conductive plate; 13. a raised block; 2. hollowing out the template; 21. a notch; 22. hollowing out holes; 23. aligning holes; 3. welding a test block; 31. connecting columns; 32. a battery piece; 33. and (6) testing the hole by tensile force.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
referring to fig. 1-4, an embodiment of the present invention is shown: a solderability test method of a solder paste for an MWT component, the solderability test method of the solder paste is as follows:
first, sample preparation, numbering a plurality of solder paste products, and then taking and numbering the same number of test boards.
And secondly, smearing a sample, combining the substrate 1 and the hollow template 2 in the plurality of test boards, smearing the solder paste product corresponding to the number on the surface of one side of the hollow template 2 far away from the substrate 1, smearing the hollow holes 22 by using a scraper, and finishing smearing the solder paste in the plurality of test boards.
And thirdly, preparing for welding, separating the substrate 1 and the hollow template 2 which are combined by a plurality of substrates by using a prying tool, respectively and horizontally placing the substrates 1 on a fixing clamp, and finally, downwards placing the battery pieces 32 on the welding test blocks 3 on the positions of the conductive plates 12 respectively.
And fourthly, starting welding, namely blowing the solder paste onto the surface of the substrate 1 by using a hot air blower with rated temperature, and starting fixing the solder paste products at high temperature to finish welding the conductive plate 12 and the battery piece 32.
And fifthly, performing simulation test, after cooling, putting the plurality of substrates 1 together with the bottom fixing clamp into an environment simulation space, performing tension test aiming at different environments, and recording tension test data.
And sixthly, screening for the first time, and screening out qualified solder paste products by comparing the qualified data of the MWT component.
And seventhly, secondary screening, namely, observing a plurality of cured qualified solder paste products under a microscope, and selecting the solder paste products with qualified appearances.
And eighthly, screening for three times, carrying out resistance test on the solder paste product with qualified appearance by using a special resistance test tool, and recording data.
And ninthly, comprehensively evaluating, comparing all data, analyzing to obtain a ranking list of the solder paste products, summarizing the advantages and the disadvantages of the products, and completing the solderability test of the solder pastes of various products.
Specifically, survey test panel and include base plate 1, fretwork template 2 and a plurality of welding test piece 3, one side surface length and width of base plate 1 and fretwork template 2 are the same, and base plate 1 is the same with the size of fretwork template 2, makes things convenient for current conducting plate 12 and fretwork hole 22 ability one-to-one, makes things convenient for the later stage to paint.
Specifically, a nameplate 11 is fixedly mounted on the surface of one side of the substrate 1, a plurality of conductive plates 12 are embedded in the substrate 1, and four convex blocks 13 are fixedly mounted on the surface of one side of the substrate 1.
Specifically, the hollow template 2 is provided with a notch 21, the hollow template 2 is provided with a plurality of hollow holes 22 in a penetrating manner, and the hollow template 2 is provided with four alignment holes 23.
Specifically, one side fixed surface of welding test piece 3 installs battery piece 32, one side fixed surface that battery piece 32 was kept away from to welding test piece 3 installs spliced pole 31, run through on the spliced pole 31 and seted up pulling force test hole 33, set up protruding piece 13 and counterpoint hole 23 and be convenient for counterpoint, make things convenient for current conducting plate 12 and fretwork hole 22 ability one-to-one.
Specifically, do not place welding test piece 3 with at least empty one current conducting plate 12 when placing battery piece 32 on a plurality of welding test piece 3 respectively down on the position of current conducting plate 12, through setting up idle empty one current conducting plate 12, make things convenient for the later stage to pass through the microscope and observe.
Specifically, in the fifth step, the environment simulation space includes temperature, ph and humidity, and the temperature includes extremely cold and hot environments.
Specifically, the solder paste product with qualified appearance is selected in the seventh step, and the solder paste product is observed to have no gathering phenomenon on the surface, no morphological change and metallic luster on the surface.
Specifically, the tin cream stirring rear of different products can be sampled when the tin cream sample is smeared in the second step, and the phenomenon that the substances are unevenly distributed due to precipitation in the tin cream can be avoided by sampling the tin cream stirring rear of different products, so that the performance of the tin cream product can be tested.
The above is a solderability test method after three screens.
Example two:
referring to fig. 1-4, an embodiment of the present invention is shown: a solderability test method of a solder paste for an MWT component, the solderability test method of the solder paste is as follows:
first, sample preparation, numbering a plurality of solder paste products, and then taking and numbering the same number of test boards.
And secondly, smearing a sample, combining the substrate 1 and the hollow template 2 in the plurality of test boards, smearing the solder paste product corresponding to the number on the surface of one side of the hollow template 2 far away from the substrate 1, smearing the hollow holes 22 by using a scraper, and finishing smearing the solder paste in the plurality of test boards.
And thirdly, preparing for welding, separating the substrate 1 and the hollow template 2 which are combined by a plurality of substrates by using a prying tool, respectively and horizontally placing the substrates 1 on a fixing clamp, and finally, downwards placing the battery pieces 32 on the welding test blocks 3 on the positions of the conductive plates 12 respectively.
And fourthly, starting welding, namely blowing the solder paste onto the surface of the substrate 1 by using a hot air blower with rated temperature, and starting fixing the solder paste products at high temperature to finish welding the conductive plate 12 and the battery piece 32.
And fifthly, performing simulation test, after cooling, putting the plurality of substrates 1 together with the bottom fixing clamp into an environment simulation space, performing tension test aiming at different environments, and recording tension test data.
And sixthly, screening for the first time, and screening out qualified solder paste products by comparing the qualified data of the MWT component.
And seventhly, secondary screening, namely, observing a plurality of cured qualified solder paste products under a microscope, and selecting the solder paste products with qualified appearances.
And eighthly, comprehensively evaluating, comparing all data, analyzing to obtain a ranking list of the solder paste products, summarizing the advantages and the disadvantages of the products, and completing the solderability test of the solder pastes of various products.
Specifically, survey test panel and include base plate 1, fretwork template 2 and a plurality of welding test piece 3, one side surface length and width of base plate 1 and fretwork template 2 are the same, and base plate 1 is the same with the size of fretwork template 2, makes things convenient for current conducting plate 12 and fretwork hole 22 ability one-to-one, makes things convenient for the later stage to paint.
Specifically, a nameplate 11 is fixedly mounted on the surface of one side of the substrate 1, a plurality of conductive plates 12 are embedded in the substrate 1, and four convex blocks 13 are fixedly mounted on the surface of one side of the substrate 1.
Specifically, the hollow template 2 is provided with a notch 21, the hollow template 2 is provided with a plurality of hollow holes 22 in a penetrating manner, and the hollow template 2 is provided with four alignment holes 23.
Specifically, one side fixed surface of welding test piece 3 installs battery piece 32, one side fixed surface that battery piece 32 was kept away from to welding test piece 3 installs spliced pole 31, run through on the spliced pole 31 and seted up pulling force test hole 33, set up protruding piece 13 and counterpoint hole 23 and be convenient for counterpoint, make things convenient for current conducting plate 12 and fretwork hole 22 ability one-to-one.
Specifically, do not place welding test piece 3 with at least empty one current conducting plate 12 when placing battery piece 32 on a plurality of welding test piece 3 respectively down on the position of current conducting plate 12, through setting up idle empty one current conducting plate 12, make things convenient for the later stage to pass through the microscope and observe.
Specifically, in the fifth step, the environment simulation space includes temperature, ph and humidity, and the temperature includes extremely cold and hot environments.
Specifically, the solder paste product with qualified appearance is selected in the seventh step, and the solder paste product is observed to have no gathering phenomenon on the surface, no morphological change and metallic luster on the surface.
Specifically, the tin cream stirring rear of different products can be sampled when the tin cream sample is smeared in the second step, and the phenomenon that the substances are unevenly distributed due to precipitation in the tin cream can be avoided by sampling the tin cream stirring rear of different products, so that the performance of the tin cream product can be tested.
The above is a solderability test method after the secondary screening.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (9)
1. A solderability test method of solder paste for an MWT component is characterized by comprising the following steps: the solder paste solderability test method comprises the following steps:
firstly, preparing a sample, numbering a plurality of solder paste products, and then taking and numbering test boards with the same number;
secondly, smearing samples, combining the substrate (1) and the hollowed-out templates (2) in the plurality of test boards, smearing the correspondingly numbered solder paste products on the surface of one side, far away from the substrate (1), of the hollowed-out templates (2), smearing the hollowed-out holes (22) by using a scraper, and finishing smearing the solder paste in the plurality of test boards;
thirdly, preparing for welding, separating a plurality of combined substrates (1) and a hollow template (2) by using a prying tool, respectively horizontally placing the substrates (1) on a fixing clamp, and finally respectively placing the battery pieces (32) on a plurality of welding test blocks (3) on the positions of the current-conducting plates (12) downwards;
fourthly, starting welding, namely blowing the solder paste to the surface of the substrate (1) by using a hot air blower with rated temperature, and starting fixing the solder paste products at high temperature to complete the welding of the conductive plate (12) and the battery piece (32);
fifthly, performing simulation test, after cooling, putting the plurality of substrates (1) and the bottom fixing clamp into an environment simulation space, performing tension test aiming at different environments, and recording tension test data;
sixthly, screening for the first time, and screening out qualified solder paste products by comparing the qualified data of the MWT component;
seventhly, secondary screening, namely observing a plurality of cured qualified solder paste products under a microscope, and selecting solder paste products with qualified appearances;
eighthly, screening for three times, performing resistance test on the solder paste product with qualified appearance by using a special resistance test tool, and recording data;
and ninthly, comprehensively evaluating, comparing all data, analyzing to obtain a ranking list of the solder paste products, summarizing the advantages and the disadvantages of the products, and completing the solderability test of the solder pastes of various products.
2. The solderability test method of a solder paste for MWT components according to claim 1, wherein: the test board comprises a substrate (1), a hollowed-out template (2) and a plurality of welding test blocks (3), wherein the length and the width of the surface of one side of the substrate (1) and the surface of one side of the hollowed-out template (2) are the same.
3. The solderability test method of the solder paste for MWT components according to claim 2, characterized in that: one side fixed surface of base plate (1) installs data plate (11), a plurality of current conducting plates (12) are installed in the embedding on base plate (1), one side fixed surface of base plate (1) installs four protruding pieces (13).
4. The solderability test method of the solder paste for MWT components according to claim 2, characterized in that: the hollow template (2) is provided with a notch (21), the hollow template (2) is provided with a plurality of hollow holes (22) in a penetrating manner, and the hollow template (2) is provided with four alignment holes (23).
5. The solderability test method of the solder paste for MWT components according to claim 2, characterized in that: the welding test block is characterized in that a battery piece (32) is fixedly mounted on the surface of one side of the welding test block (3), a connecting column (31) is fixedly mounted on the surface of one side, away from the battery piece (32), of the welding test block (3), and a tension test hole (33) is formed in the connecting column (31) in a penetrating mode.
6. The solderability test method of a solder paste for MWT components according to claim 1, wherein: when the battery plates (32) on the plurality of welding test blocks (3) are respectively placed on the positions of the conductive plates (12) downwards, at least one conductive plate (12) is not provided with the welding test block (3).
7. The solderability test method of a solder paste for MWT components according to claim 1, wherein: and in the fifth step, the environment simulation space comprises temperature, pH value and humidity, and the temperature comprises extremely cold and extremely hot environments.
8. The solderability test method of a solder paste for MWT components according to claim 1, wherein: and seventhly, selecting a solder paste product with qualified appearance, and observing that the surface of the solder paste has no gathering phenomenon, no morphological change and metallic luster on the surface, thereby obtaining the qualified product.
9. The solderability test method of a solder paste for MWT components according to claim 1, wherein: when the solder paste sample is smeared in the second step, the solder paste of different products needs to be uniformly stirred and then can be sampled.
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