CN105115415A - Circuit board blind hole depth test structure and test method thereof - Google Patents
Circuit board blind hole depth test structure and test method thereof Download PDFInfo
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- CN105115415A CN105115415A CN201510429804.8A CN201510429804A CN105115415A CN 105115415 A CN105115415 A CN 105115415A CN 201510429804 A CN201510429804 A CN 201510429804A CN 105115415 A CN105115415 A CN 105115415A
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- blind hole
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Abstract
The invention discloses a circuit board blind hole depth test structure comprising a circuit board body formed by press-fitting N layers of circuit boards. Each of the N layers of circuit boards is provided with a circuit area and an edge milling area. The edge milling area of each layer of circuit board is provided with a depth test area. The depth test area of each layer of circuit board is provided with (N-1) groups of test points, wherein the test points arranged in the first layer of circuit board and the test points arranged in the last layer of circuit board are not communicated, and each layer of circuit board from the second layer of circuit board to the (N-1)th layer of circuit board is communicated with the test points corresponding to the layer of circuit board. The invention further discloses a circuit board blind hole depth test method. The traditional test method is changed, the test structure is optimized, and the test structure is simple and highly practical. Blind hole depth test is more accurate, the test speed and efficiency are improved, the time for circuit board blind hole depth test is shortened, and the efficiency of circuit board manufacturing is improved. The manufacturing cost and the consumption of slice materials are reduced, and the cost of production is reduced.
Description
Technical field
The invention belongs to circuit board making field, be specifically related to a kind of wiring board blind hole depth test structure and method of testing thereof.
Background technology
Along with the development of wiring board techniques, circuit board technique also obtains fast lifting, and is widely used in the technical fields such as communication, computing machine.Simultaneously in order to the part realized between wiring board is communicated with, meet special needs, need to make blind hole, to meet its demand.And wiring board makes blind hole, by adopting drilling machine to carry out making blind hole, blind hole to the detection of blind hole depth, detects the demand whether it meets client after making.At present, wiring board manufacturing enterprise is in measurement circuit board blind hole degree of depth process, very high to the accuracy requirement making board, and the quality of producing is difficult to control, the mode of its degree of depth management and control is by playing section, grinding section, the mode adopting high-power microscope to measure again carries out the degree of depth determining blind hole, this blind hole detection method, not only Making programme is complicated, expend time in length, cost is high, and it is limited to get number of sections, monitoring blind area is beaten, test result can not be obtained immediately at the scene, also need to send to physics laboratory to analyze, interval time is long, be unfavorable for execute-in-place, cause production efficiency low, be unfavorable for the long-run development of enterprise.
Summary of the invention
In view of this, the technical problem to be solved in the present invention is that a kind of test is accurate, quick, improves wiring board blind hole depth test structure and the method for testing thereof of testing efficiency.
In order to solve the problems of the technologies described above, the present invention adopts following scheme to realize: a kind of wiring board blind hole depth test structure, comprise by the wiring board body treating drilling blind hole of N sandwich circuit board pressing, described N sandwich circuit board is equipped with land and gong edge regions, the depth test region for testing the wiring board treating drilling blind hole is provided with in the gong edge regions of each sandwich circuit board, the depth test region of each sandwich circuit board described is provided with N-1 group test point, is arranged on ground floor wiring board and is not all communicated with the test point on last sandwich circuit board; The test point that in 2nd sandwich circuit board to N-1 sandwich circuit board, each sandwich circuit board is corresponding with its position is communicated with.
Wherein, the number of plies of the N in described N sandwich circuit board is: N >=3.
Wherein, the quantity of the test point of each described group is 2.
Wherein, described test point is PAD.
The method of testing of the wiring board blind hole depth described in more than one, comprises following concrete steps:
S1. above-described wiring board body is chosen;
S2. wiring board body is placed on drilling machine and holes;
S3. the wiring board body after boring is put into electroplating bath to electroplate test point and blind hole;
S4. the test point after plating is tested.
Wherein, the wiring board body described in step S2 is when holing, and the blind hole bore cutter in drilling machine and test point bore cutter synchronizing moving are holed to the blind hole on wiring board body and N-1 group test point.
Wherein, the concrete steps of the plating described in step S3 are electroplated for wiring board body is put into electroplating bath, make the hole wall electroplated metal layer of blind hole on wiring board body and test point, realize each sandwich circuit board in blind hole and each sandwich circuit board conducting in N-1 group test point.
Wherein, during test point is tested described in step S4, adopt energising continuity test.
Compared with prior art, wiring board blind hole depth test structure of the present invention by being provided with N-1 group test point on the gong plate region of N sandwich circuit board, and one group of test point that in the 2nd ~ (N-1) wiring board, every one deck is corresponding is communicated with, change traditional method of testing, optimal inspection structure, have simple for structure, practical, during test blind hole depth, change traditional blind hole test technology, save the input of human resources, blind hole depth is tested more accurate, wiring board body is put into drilling machine hole, the synchronous gong blind hole of bore cutter and test point during boring, make the degree of depth of blind hole identical with the degree of depth of test point, gong convenient test is quick, the degree of depth of blind hole can be tested out accurately, improve testing efficiency, the synchronous gong blind hole of bore cutter and test point during boring, make the degree of depth of blind hole identical with the degree of depth of test point, and layer of metal layer is electroplated in blind hole and test point, make blind hole and test point conducting, by energising conductive device, test point is tested, can the degree of depth testing out test point of quicklook, thus draw the degree of depth of blind hole, make the method for testing of blind hole more succinct, convenient, the convenient monitoring that wiring board blind hole is made, improve test speed and efficiency, shorten the test duration of wiring board blind hole depth, improve the make efficiency of wiring board, decrease the generation of defective products in blind hole manufacturing process, reduce scrappage, save cost of manufacture and section material, save production cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of embodiment 1.
Fig. 2 is the explosive view in embodiment 1.
Fig. 3 is the structural representation of embodiment 3.
Fig. 4 is the explosive view in enforcement 3.
Embodiment
In order to allow those skilled in the art understand technical scheme of the present invention better, below in conjunction with accompanying drawing, the present invention is further elaborated.
Embodiment 1 one kind of two sandwich circuit board blind hole depth test structure
A kind of wiring board blind hole depth test structure, comprises by the wiring board body 1 treating drilling blind hole of three sandwich circuit board 11 pressings.It is overlapping that the same position place of three described sandwich circuit boards is equipped with land and gong edge regions after land 111 and gong edge regions 112, three sandwich circuit board pressing.Described land is the connecting circuit of circuit, and described gong edge regions is the region that circuit needs gong to remove in gong crack approach.The depth test region 1121 for testing the wiring board treating drilling blind hole is equipped with in the gong edge regions 112 of each sandwich circuit board, the depth test region 1121 of each sandwich circuit board described is equipped with two groups of test points 1122, first group of test point represents the connection situation of second layer wiring board, and second group of test point represents the connection situation of last sandwich circuit board.Each described group test point is all made up of two PAD, and the circuit be arranged between two groups of test points 1122 on ground floor wiring board and last sandwich circuit board is not all communicated with; Between two PAD of i.e. first group of test point and be not all communicated with between two PAD of second group of test point.When making internal layer circuit plate, the second group test point corresponding with the sandwich circuit board is communicated with, namely be communicated with by circuit between two PAD being arranged on second group of test point on second layer wiring board, when making follow-up boring, when energising is tested two groups of PAD of second layer wiring board, make the circuit turn-on be energized between conductive device, realize test, thus draw the degree of depth of blind hole.
The method of testing of embodiment 2 one kind of two sandwich circuit board blind hole depth
A method of testing for wiring board blind hole depth, comprises following concrete steps:
S1. choose the three sandwich circuit board bodies 1 made in embodiment 1 to test.
S2. board wiring board body 1 being placed on drilling machine is holed.During boring, the blind hole bore cutter in drilling machine and test point bore cutter synchronously move down, and the degree of depth moved down is identical, make the degree of depth of the blind hole on bore cutter gong wiring board body identical with the degree of depth of test point.On blind hole in circuit body and wiring board a two group test point is holed by drilling machine.After boring, wiring board body is cleared up, facilitate next step to operate.Described drilling machine can adopt mechanical drilling machine or laser drilling machine to hole.
S3. the wiring board body after boring is put into electroplating bath to electroplate test point and blind hole.After plating, make the hole wall of the test point on wiring board body and blind hole electroplate one deck electroplated metal layer, realize between each sandwich circuit board in the hole on wiring board body and test conducting in the hole between each sandwich circuit board in spot hole.
Owing to being communicated with between two PAD in first group of test point that second layer wiring board is corresponding, so after plating, the equal conducting of hole wall of the hole wall of blind hole and two groups of test points.Energising test is carried out to two groups of test points of wiring board body, the degree of depth that bore cutter is holed can be detected, then judge the degree of depth of blind hole according to the degree of depth of test point.
S4. the test point after plating is tested.
Due in the electroplating technology of step S3, the hole wall of test point and blind hole is made all to electroplate one deck electroplated metal layer by plating, this plated metal is conducting metal, this metal can select the plated metals such as metal gold, silver, copper, nickel to electroplate according to the actual electrical plating of circuit board line, after plating, make the circuit in wiring board identical with plated metal.Test point after plating is tested, during test, multimeter is used to test to wiring board body, the detection pin of multimeter is inserted in the hole of first group of test point, now, due to conducting between two PAD in first group of test point, the circuit between the multimeter of detection forms path, multimeter conducting; The detection pin of multimeter is inserted in the hole of second group of test point, now owing to not being communicated with between two PAD in second group of test point, between the multimeter detected, volume circuit can not form path, so two of multimeter are detected not all right formation path between pin, can judge thus, during boring, the bore cutter gong test point of ground floor wiring board, the degree of depth of boring only arrives the surface of second layer wiring board.Because bore cutter is synchronously holed to blind hole and test point, passable thus, the degree of depth of blind hole is also only to the surface of second layer wiring board.
By current method of testing, intuitively can test out the degree of depth of blind hole fast, realize the monitoring of blind hole depth, and be arranged on gong plate region due to test point, in subsequent processing operations, gong edge regions will be removed by gong from wiring board body, not affect the intrinsic land of wiring board, reduce defective products rate, improve the utilization factor in gong plate region, optimize wiring board test technology, reduce scrappage, save production cost, improve testing efficiency.
Energising conductive device in the present embodiment can also use other to utilize current lead-through principle to carry out the testing equipment tested except multimeter, all can realize, does not enumerate one by one and set forth at this.
Embodiment 3 one kinds of N sandwich circuit board blind hole depth test structures
A kind of wiring board blind hole depth test structure, comprises by the wiring board body 1 treating drilling blind hole of N sandwich circuit board 11 pressing.It is overlapping that the same position place of described N sandwich circuit board is equipped with land and gong edge regions after land 111 and the pressing of gong edge regions 112, N sandwich circuit board.Described land is the connecting circuit of circuit, and described gong edge regions is the region that circuit needs gong to remove in gong crack approach.The depth test region 1121 for testing the wiring board treating drilling blind hole is equipped with in the gong edge regions 112 of each sandwich circuit board, the depth test region 1121 of each sandwich circuit board described is equipped with N-1 group test point 1122, first group of test point represents the connection situation of second layer wiring board, second group of test point represents the connection situation of third layer wiring board, 3rd group of test point represents the connection situation of the 4th sandwich circuit board, so analogize, N-1 group test point represents the connection situation of n-th layer wiring board.Each described group test point is all made up of two PAD, and the circuit be arranged between two groups of test points 1122 on ground floor wiring board and last sandwich circuit board is not all communicated with; Between two PAD of i.e. first group of test point and be not all communicated with between two PAD of second group of test point.When making internal layer circuit plate, when making the N-1 group test point on second layer wiring board, be communicated with between two PAD of corresponding for the second layer first group of test point, all be not communicated with between two PAD that other test point is corresponding, when making the N-1 group test point on third layer wiring board, be communicated with between two PAD of corresponding for third layer second group of test point, all be not communicated with between two PAD that other test point is corresponding, when making the N-1 group test point on the 4th sandwich circuit board, be communicated with between two PAD of the 4th layer of corresponding the 3rd group of test point, all be not communicated with between two PAD that other test point is corresponding, so analogize, when making the N-2 group test point on N-1 sandwich circuit board, be communicated with between two PAD of the N-2 group test point of N-1 layer correspondence, all be not communicated with between two PAD that other test point is corresponding, N sandwich circuit board is carried out overlapping pressing.After follow-up boring, be energized and two PAD in each group test point are tested, make the circuit turn-on be energized between conductive device, realize test, thus draw the degree of depth of blind hole.
The method of testing of embodiment 4 one kinds of N sandwich circuit board blind hole depths
A method of testing for wiring board blind hole depth, comprises following concrete steps:
S1. choose the N sandwich circuit board body 1 made in embodiment 3 to test.
S2. board wiring board body 1 being placed on drilling machine is holed.During boring, the blind hole bore cutter in drilling machine and test point bore cutter synchronously move down, and the degree of depth moved down is identical, make the degree of depth of the blind hole on bore cutter gong wiring board body identical with the degree of depth of test point.Blind hole in circuit body and the N-1 group test point on wiring board are holed by drilling machine.After boring, wiring board body is cleared up, facilitate next step to operate.Described drilling machine can adopt mechanical drilling machine or laser drilling machine to hole.
S3. the wiring board body after boring is put into electroplating bath to electroplate test point and blind hole.After plating, make the hole wall of the test point on wiring board body and blind hole electroplate one deck electroplated metal layer, realize between each sandwich circuit board in the hole on wiring board body and test conducting in the hole between each sandwich circuit board in spot hole.
In N-1 group test point, owing to being communicated with between two PAD in first group of test point that second layer wiring board is corresponding, be communicated with between two PAD in second group of test point that third layer wiring board is corresponding, so analogize, be communicated with between two PAD in the N-1 group test point that N-2 sandwich circuit board is corresponding, so after plating, according to the degree of depth of boring in step 2, the hole wall making the blind hole after holing corresponding and the equal conducting of hole wall of N-1 group test point.Energising test is carried out to the N-1 group test point on wiring board body, the degree of depth that bore cutter is holed can be detected, then judge the degree of depth of blind hole according to the degree of depth of test point.
S4. the test point after plating is tested.
Due in the electroplating technology of step S3, the hole wall of test point and blind hole is made all to electroplate one deck electroplated metal layer by plating, this plated metal is conducting metal, this metal can select the plated metals such as metal gold, silver, copper, nickel to electroplate according to the actual electrical plating of circuit board line, after plating, make the circuit in wiring board identical with plated metal.Test point after plating is tested, during test, multimeter is used to test to wiring board body, test in the hole of the detection pin of multimeter being inserted successively N-1 group test point from first group of test point, now, due to the corresponding sandwich circuit board of each group test point, when the detection pin of multimeter is inserted into two PAD in M group test point, if the circuit between multimeter forms path, multimeter conducting, represent that the M+1 sandwich circuit board in wiring board body is communicated with, can draw thus, the degree of depth of test point is the degree of depth of M+1 sandwich circuit board; Because bore cutter is synchronously holed to blind hole and test point, passable thus, the degree of depth of blind hole is also only to the surface of M+1 sandwich circuit board.Wherein the pass of M and N is: M≤N.
By current method of testing, intuitively can test out the degree of depth of blind hole fast, realize the monitoring of blind hole depth, and be arranged on gong plate region due to test point, in subsequent processing operations, gong edge regions will be removed by gong from wiring board body, not affect the intrinsic land of wiring board, reduce defective products rate, improve the utilization factor in gong plate region, optimize wiring board test technology, reduce scrappage, save production cost, improve testing efficiency.
Energising conductive device in the present embodiment can also use other to utilize current lead-through principle to carry out the testing equipment tested except multimeter, all can realize, does not enumerate one by one and set forth at this.
Above-described embodiment is only wherein specific implementation of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these apparent replacement forms all belong to protection scope of the present invention.
Claims (8)
1. a wiring board blind hole depth test structure, it is characterized in that, comprise by the wiring board body (1) treating drilling blind hole of N sandwich circuit board (11) pressing, described N sandwich circuit board is equipped with land (111) and gong edge regions (112), the depth test region (1121) for testing the wiring board treating drilling blind hole is provided with in the gong edge regions (112) of each sandwich circuit board, the depth test region (1121) of each sandwich circuit board described is provided with N-1 group test point (1122), be arranged on ground floor wiring board not all to be communicated with the test point (1122) on last sandwich circuit board, the test point that in 2nd sandwich circuit board to N-1 sandwich circuit board, each sandwich circuit board is corresponding with its position is communicated with.
2. wiring board blind hole depth test structure according to claim 1, is characterized in that, the number of plies of the N in described N sandwich circuit board is: N >=3.
3. wiring board blind hole depth test structure according to claim 2, is characterized in that, the quantity of the test point (1122) of each described group is 2.
4. wiring board blind hole depth test structure according to claim 3, is characterized in that, described test point (1122) is PAD.
5. a method of testing for the wiring board blind hole depth described in any one of Claims 1 to 4, is characterized in that, comprises following concrete steps:
S1. the wiring board body (1) described in any one of Claims 1 to 4 is chosen;
S2. wiring board body (1) is placed on drilling machine and holes;
S3. the wiring board body after boring is put into electroplating bath to electroplate test point and blind hole;
S4. the test point after plating is tested.
6. the method for testing of wiring board blind hole depth according to claim 5, it is characterized in that, wiring board body described in step S2 is when holing, and the blind hole bore cutter in drilling machine and test point bore cutter synchronizing moving are holed to the blind hole on wiring board body and N-1 group test point.
7. the method for testing of wiring board blind hole depth according to claim 5, it is characterized in that, the concrete steps of the plating described in step S3 are electroplated for wiring board body is put into electroplating bath, make the hole wall electroplated metal layer of blind hole on wiring board body and test point, realize each sandwich circuit board in blind hole and each sandwich circuit board conducting in N-1 group test point.
8. the method for testing of wiring board blind hole depth according to claim 5, is characterized in that, during testing test point described in step S4, adopts energising continuity test.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510429804.8A CN105115415A (en) | 2015-07-21 | 2015-07-21 | Circuit board blind hole depth test structure and test method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510429804.8A CN105115415A (en) | 2015-07-21 | 2015-07-21 | Circuit board blind hole depth test structure and test method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109029225A (en) * | 2018-10-09 | 2018-12-18 | 信丰迅捷兴电路科技有限公司 | A kind of Microvia laser pore-forming quality periodic sensing approach |
| CN109709468A (en) * | 2018-12-03 | 2019-05-03 | 上海展华电子有限公司 | Printed wiring board buried conductor functionality test method |
| CN112797887A (en) * | 2020-11-17 | 2021-05-14 | 天津普林电路股份有限公司 | Depth test structure and method for back drilling hole layer of high-rise multilayer board |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201479465U (en) * | 2009-08-21 | 2010-05-19 | 番禺得意精密电子工业有限公司 | Electronic component and circuit board thereof |
| CN201828238U (en) * | 2010-10-11 | 2011-05-11 | 深圳中富电路有限公司 | Back drill depth test device for back drill board |
| CN102159040A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for drilling hole on four-layered circuit board |
| CN102706267A (en) * | 2012-06-11 | 2012-10-03 | 昆山鼎鑫电子有限公司 | Blind hole offset detecting method |
| CN102759701A (en) * | 2011-04-28 | 2012-10-31 | 旺矽科技股份有限公司 | Integrated high-speed test module |
| CN102869208A (en) * | 2012-09-26 | 2013-01-09 | 沪士电子股份有限公司 | Method for controlling depth of two-sided inserting blind hole of printed circuit board |
| CN203015276U (en) * | 2012-12-25 | 2013-06-19 | 深圳市兴森快捷电路科技股份有限公司 | HDI printed circuit board having blind-hole deviation detecting structure |
| CN103456653A (en) * | 2012-05-30 | 2013-12-18 | 南亚科技股份有限公司 | Detection method of semiconductor blind holes |
| CN103517556A (en) * | 2012-06-15 | 2014-01-15 | 深南电路有限公司 | Circuit board depth control type drilling depth determining method and circuit board |
| CN103743991A (en) * | 2013-12-27 | 2014-04-23 | 广州兴森快捷电路科技有限公司 | Method and apparatus for testing conductive-hole electrical property of PCB plate |
-
2015
- 2015-07-21 CN CN201510429804.8A patent/CN105115415A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201479465U (en) * | 2009-08-21 | 2010-05-19 | 番禺得意精密电子工业有限公司 | Electronic component and circuit board thereof |
| CN201828238U (en) * | 2010-10-11 | 2011-05-11 | 深圳中富电路有限公司 | Back drill depth test device for back drill board |
| CN102159040A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for drilling hole on four-layered circuit board |
| CN102759701A (en) * | 2011-04-28 | 2012-10-31 | 旺矽科技股份有限公司 | Integrated high-speed test module |
| CN103456653A (en) * | 2012-05-30 | 2013-12-18 | 南亚科技股份有限公司 | Detection method of semiconductor blind holes |
| CN102706267A (en) * | 2012-06-11 | 2012-10-03 | 昆山鼎鑫电子有限公司 | Blind hole offset detecting method |
| CN103517556A (en) * | 2012-06-15 | 2014-01-15 | 深南电路有限公司 | Circuit board depth control type drilling depth determining method and circuit board |
| CN102869208A (en) * | 2012-09-26 | 2013-01-09 | 沪士电子股份有限公司 | Method for controlling depth of two-sided inserting blind hole of printed circuit board |
| CN203015276U (en) * | 2012-12-25 | 2013-06-19 | 深圳市兴森快捷电路科技股份有限公司 | HDI printed circuit board having blind-hole deviation detecting structure |
| CN103743991A (en) * | 2013-12-27 | 2014-04-23 | 广州兴森快捷电路科技有限公司 | Method and apparatus for testing conductive-hole electrical property of PCB plate |
| WO2015096666A1 (en) * | 2013-12-27 | 2015-07-02 | 广州兴森快捷电路科技有限公司 | Method and device for testing electrical properties of electrically-conductive via of pcb |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109029225A (en) * | 2018-10-09 | 2018-12-18 | 信丰迅捷兴电路科技有限公司 | A kind of Microvia laser pore-forming quality periodic sensing approach |
| CN109709468A (en) * | 2018-12-03 | 2019-05-03 | 上海展华电子有限公司 | Printed wiring board buried conductor functionality test method |
| CN109709468B (en) * | 2018-12-03 | 2021-10-29 | 上海展华电子有限公司 | Method for testing functionality of embedded conductor of printed circuit board |
| CN112797887A (en) * | 2020-11-17 | 2021-05-14 | 天津普林电路股份有限公司 | Depth test structure and method for back drilling hole layer of high-rise multilayer board |
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Application publication date: 20151202 |
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