CN201260269Y

CN201260269Y - Printed circuit board

Info

Publication number: CN201260269Y
Application number: CNU200820201286XU
Authority: CN
Inventors: 兰迪.列德; 熊文忠
Original assignee: HUIZHOU MEIRUI ELECTRONIC TECHNOLOGY Co Ltd
Current assignee: HUIZHOU MEIRUI ELECTRONIC TECHNOLOGY Co Ltd
Priority date: 2008-09-24
Filing date: 2008-09-24
Publication date: 2009-06-17
Anticipated expiration: 2018-09-24

Abstract

The utility model relates to a circuit board, in particular to a printed circuit board (PCB) used for inspecting the process capability of the circuit board. A plurality of test strips are arranged on the circuit board, including a test strip for testing the thickness of copper in a hole and the deepening electroplating capacity, a test strip for testing the thermal stress of the circuit board inner layer connection, a test strip for testing the aligning accuracy of the inner layer, a test strip for testing the conducting capability of the plated copper, a test strip for testing the combining capacity of the plated copper in the hole, a test strip for testing the tin solder adhereing capability of a surface welding pad, a test strip for testing the borehole wall state and the combining capacity of a press plate, and a wire-width and wire-distance test strip. The test strips are separately distributed on the circuit board. By monitoring the entire process and the process capability of the production of the circuit board by the testing circuit board, the problems and improvement in the process can be reflected at any time, no test strips are needed to be additionally added on a finished circuit board by each customer, or a producing circuit board is discarded due to being tested, thus saving the cost of materials and benefiting the statistical analysis of the detected data as well.

Description

A kind of printed substrate

Technical field

The utility model relates to a kind of printed substrate, specifically is meant a kind of printed substrate that is used for wiring board processing procedure efficiency test.

Background technology

Continuous upgrading along with modern electronic product, the number of plies of wiring board is in continuous increase, the high density interconnect plate is also in a large amount of productions, so just require the making ability of wiring board to improve constantly, processing procedure ability to wiring board will be done strong monitoring, and therefore a good processing procedure ability detection line plate just has been necessary.Traditional wiring board processing procedure ability is to adopt destruction production plate or each test all to do the mode that a breadboard goes to detect relevant processing procedure ability when detecting.The shortcoming of doing so at first is to have caused raw-material waste; Secondly the part production board causes quantity not enough because of test, can not deliver goods by customer demand; Be exactly thereby that the data of at every turn doing are not easy to the situation of change that comparison can't be grasped wiring board processing procedure ability in addition.

The utility model content

At the shortcoming of prior art, the purpose of this utility model provides and a kind of printed substrate manufacture craft, equipment, processing procedure ability can comprehensively be represented, is convenient to do check and data analysis, special-purpose wiring board.

For achieving the above object, the technical scheme taked of the utility model is:

A kind of printed substrate is provided, and described wiring board is set to 14 layers, and thickness of slab is 3.0mm, and the minimum-value aperture is 0.25mm; The aperture aspect ratio, promptly the minimum ratio of plank thickness and minimum aperture diameter is 12:1.

Described wiring board be provided with in the hole copper thick and electroplate covering power test pieces, borehole wall situation and pressing plate binding ability test pieces, inner cord connects tin aptitude tests sheet, fusing point test pieces and live width line-spacing test pieces on thermal stress test pieces, internal layer contraposition accuracy test pieces, copper facing ducting capacity test pieces, the surface pads; Described test pieces is separate to be distributed on the wiring board.

On the utility model wiring board set test pieces very easily on the slave plate hand get off, every kind of test pieces is provided with two at least, for ask for something strict process test pieces even be provided with more than ten, is convenient to data statistics and analysis.By this measurement circuit plate whole technology, the processing procedure ability of wiring board production played supervisory function bit, problem in the processing procedure and improvement are reflected at any time, need not on production board, set up measurement circuit each client, also reduced because of test and scrapped the quantity of producing plate, saved material cost.

Description of drawings

Fig. 1 is that the utility model is formed structural representation; Fig. 2 is thick and plating covering power and an inner cord connection thermal stress test pieces enlarged diagram of copper in the described hole; Fig. 3 is described inner cord contraposition accuracy test pieces enlarged diagram; Fig. 4 is described plate copper facing ducting capacity test pieces enlarged diagram; Fig. 5 is described fusing point test pieces enlarged diagram; Fig. 6 is a live width line-spacing test pieces enlarged diagram on the described plate.

Embodiment

The utility model is described in further detail below in conjunction with accompanying drawing.

As Fig. 1, wiring board described in the utility model is set to rectangle, plate is provided with that to be used to detect copper in the hole thick and electroplate the test pieces 1 that covering power, inner cord connect thermal stress, borehole wall situation and pressing plate binding ability, be used to detect the test pieces 2 of internal layer contraposition accuracy, be used to detect the test pieces 3 of copper facing ducting capacity, be used to detect the test pieces 4 of tin ability on the surface pads, be used to detect the test pieces 5 of sheet material fusing point and be used to detect live width line-spacing test pieces 6; Described test pieces is separate to be distributed on the wiring board.

In actual production, as long as process this test board of some at regular intervals by the wiring board production technology of standard, this test board is delivered to domestic and external relevant speciality mechanism detect, to guarantee the accuracy and the authority of testing result.

As Fig. 2 is test pieces 1 enlarged diagram, and this test pieces can be carried out following several test: test that copper is thick and the plating covering power is tested, inner cord connects thermal stress in the hole and borehole wall situation and the test of pressing plate binding ability.

When producing plate, copper is thick and electroplate the diverse location effect difference of covering power at plate in the hole in, so is provided with this test pieces respectively at four edges and the center of plate.Be provided with the little pad of a lot of circles around this test pieces, this kind setting is for the ease of copper facing in the hole.

When doing hole copper covering power detection,, then test pieces is done the cross-sectional slices in hole, be can be observed the electro-coppering thickness data that reaches the surface in the hole at the microscopically that amplifies 200 times as long as by hand this test pieces is separated from whole plate.Described hole copper covering power is by calculating, and promptly uses with the minimum aperture copper thickness in a kind of hole divided by copper coating thickness, can calculate the hole copper covering power in different apertures like this.Borehole wall situation and pressing plate binding ability can detect by observing equally.

The test that inner cord connects thermal stress is the test pieces that separates to be put into 288 ℃ the plumbous stove of tin, take out cooling after 3 seconds, and then put into stove, so repeatedly after 6 times, do the cross-sectional slices in hole again, whether with internal layer copper have separate, the test pieces that qualified explained hereafter goes out should not separated at microscopically if can observe electro-coppering.

Inner cord contraposition accuracy test pieces, i.e. test pieces 2 enlarged diagrams as described in as Fig. 3 being.

This test pieces is arranged on 12 diverse locations of wiring board.Totally 14 layers of whole plates, the same position on each layer of this test pieces is provided with the big orifice ring of 5mil.Whether the hole that the test pieces through making can be observed each internal layer by magnifying glass at same position, thereby can determine the ability of internal layer and pressing contraposition technology.

Plate copper facing ducting capacity test pieces, i.e. test pieces 3 enlarged diagrams as described in as Fig. 4 being.

This test pieces is divided into three kinds by the difference in its test aperture, for fully measuring the hole plating copper ducting capacity, this intercommunicating pore is set on every kind of test pieces as much as possible, and the hole of generally getting 708 same apertures links to each other successively, and three kinds of apertures are respectively 10mil, 12mil, 46.5mil.

Get the logical suitable electric current of this test pieces, do thermocycling experiment then, be about to it and put into the cold cycling machine, with cold cycling machine temperature from circular heating cooling between the room temperature to 150 ℃, detect this test pieces and can bear this circulation of how many times, thereby judge the ability that conducting and copper facing interconnect in the hole.

Test pieces 4 is a tin aptitude tests sheet on the bond pad surface, and test pieces is provided with the pad of different shape, for example circle, square, rectangle etc.Take off this test pieces, scaling powder is coated on the surface, carries out the stove check, and the plumbous furnace temperature of tin is 288 ℃, and spending the stove time is 10 seconds, crosses the last tin situation of observing each pad behind the stove, and tin ability on the pad is made a decision.

Fig. 5 is the fusing point test pieces, i.e. test pieces 5 enlarged diagrams.

Take off the melting point test that test pieces is as shown in the figure made the internal layer film, draw the comparison of internal layer melting point numerical value and theoretical numerical value, judge whether product meets the requirements.

Fig. 6 is live width line-spacing test pieces on the described plate, i.e. test pieces 6 enlarged diagrams.

This test pieces is provided with six in the circuit board, is respectively applied for the live width line-spacing etch capabilities of detection line plate different directions.Every built-in testing sheet is provided with the line of different in width and the line-spacing of different size, and the minimum effective line width of its setting is 3mil, and minimum active line is apart from being 3mil also, and the minimum feature line-spacing that can reach during with actual production is suitable, has marked the width of every line among the figure.Like this can the measurement circuit plate etch capabilities of outer live width line-spacing.

Claims

1, a kind of printed substrate is characterized in that: described wiring board be provided with in the hole copper thick and electroplate covering power test pieces, borehole wall situation and pressing plate binding ability test pieces, inner cord connects tin aptitude tests sheet, fusing point test pieces and live width line-spacing test pieces on thermal stress test pieces, internal layer contraposition accuracy test pieces, copper facing ducting capacity test pieces, the surface pads; Described test pieces is separate to be distributed on the wiring board.

2, printed substrate according to claim 1 is characterized in that: described wiring board is 14 laminates, and thickness of slab is 3.0mm, and the minimum-value aperture is 0.25mm; The aperture aspect ratio, promptly the minimum ratio of plank thickness and minimum aperture diameter is 12:1.