CN105430945B - HDI blind holes of circuit board deviation fool proof test method - Google Patents
HDI blind holes of circuit board deviation fool proof test method Download PDFInfo
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- CN105430945B CN105430945B CN201510828193.4A CN201510828193A CN105430945B CN 105430945 B CN105430945 B CN 105430945B CN 201510828193 A CN201510828193 A CN 201510828193A CN 105430945 B CN105430945 B CN 105430945B
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- blind hole
- deviation
- fool proof
- test
- circuit board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Abstract
The present invention provides a kind of HDI blind holes of circuit board deviation fool proof test method, includes the following steps：The HDI circuit board is provided；Blind hole deviation fool proof test section is made in the technique edges of the HDI circuit board, the blind hole deviation fool proof test section includes test blind hole, multiple conducting blind holes, isolation ring and test point, the test blind hole is located at the center of the isolation ring, multiple conducting blind holes are located on the isolation ring, and central spacer setting is isolated with described in the test point；The detection of blind hole deviation is carried out to the blind hole deviation fool proof test section, tests the conduction of the test blind hole and the test point；According to the blind hole deviation test section test blind hole and the test point conduction determine blind hole whether deviation.Compared with the relevant technologies, the HDI blind holes of circuit board deviation fool proof test method has the advantages that easy to operate, accuracy is high and testing efficiency is high.
Description
Technical field
The present invention relates to art of printed circuit boards more particularly to a kind of HDI blind holes of circuit board deviation fool proof test methods.
Background technique
High density interconnection (High Density Interconnection, HDI) circuit board belongs to high-end printed circuit board
Product, its purpose is to meet the needs of electronic product develops towards micromation, high-frequency high-speed, multifunction direction.HDI
Circuit board advances the high integration and high-intelligentization development of electronic system design and manufacture, has been widely used in space flight skill
In art, Medical Devices and the high-end electronic product such as consumer.Blind hole production is closed the most in HDI rigid-flex combined board manufacture craft
One of the step of key is the main path for realizing interlayer interconnection.Therefore, blind hole manufacturing technology is improved for improving HDI circuit board
Quality it is most important.
Currently, the blind hole density of HDI circuit board is higher, pad spacing is smaller due to requiring, lead to the production of HDI circuit board
Difficulty increases.When HDI circuit board time outer chassis area is smaller, due to the influence of aligning accuracy and cumulative limit, laser
Easily there is the phenomenon that inclined internal layer chassis in blind hole, and when blind hole deviation is larger, connection short circuit occur in blind hole and time outer layer, in conduction
It is can be found that in test process；But when blind hole deviation is smaller, the half of blind hole bottom outlet is located on the outside of chassis, with secondary outer graphics
Not formed short circuit, such abnormal conductive test equipment using routine are unable to measure, and only do correlation after the completion of Client card
Cold cycling test, in the presence of having steam in blind hole, conducting short circuit will occur with underlying graphics in blind hole, lead to customer
There is functional form and scraps in end, and factory faces huge claim.
It solves the above problems therefore, it is necessary to provide the new HDI blind holes of circuit board deviation fool proof test method of one kind.
Summary of the invention
The HDI circuit high and high testing efficiency the technical problem to be solved by the invention is to provide easy to operate, accuracy
Board blind hole deviation fool proof test method.
The present invention provides a kind of HDI blind holes of circuit board deviation fool proof test method.Include the following steps：HDI circuit is provided
Plate；Blind hole deviation fool proof test section is made in the technique edges of the HDI circuit board, the blind hole deviation fool proof test section includes surveying
Blind hole, multiple conducting blind holes, isolation ring and test point are tried, the test blind hole is located at the center of the isolation ring, multiple
The conducting blind hole is located on the isolation ring, and central spacer setting is isolated with described in the test point；It is anti-to the blind hole deviation
Slow-witted test section carries out the detection of blind hole deviation, tests the conduction of the test blind hole and the test point；It is inclined according to the blind hole
The conduction of test blind hole described in the fool proof test section of position and the test point determines blind hole deviation and deviation amount, if the conducting
Property for short circuit, then there is deviation in the blind hole of the HDI circuit board；The non-deviation of blind hole of the on the contrary then described HDI circuit board.
Preferably, described in the technique edges production blind hole deviation fool proof test section step of HDI circuit board, the blind hole is inclined
There are two position fool proof test section is set, respectively spaced first blind hole deviation fool proof test section and the second blind hole deviation fool proof
Test section, the test blind hole and isolation ring of the first blind hole deviation fool proof test section and the bottom of the HDI circuit board are conductive
Spacing between layer is less than the test blind hole and isolation ring of the second blind hole deviation fool proof test section and the HDI circuit board
Spacing between bottom conductive layer.
Preferably, in the technique edges production blind hole deviation fool proof test section step of the HDI circuit board, described first is blind
Spacing between the test blind hole and isolation ring of hole deviation fool proof test section and the bottom conductive layer of the HDI circuit board is
2.5mil；The test blind hole and isolation ring of second blind hole deviation fool proof test section and the bottom of the HDI circuit board are conductive
Spacing between layer is 3.5mil.
Preferably, the conducting of the first blind hole deviation fool proof test section and the second blind hole deviation fool proof test section is blind
Hole is 4.
Compared with the relevant technologies, HDI blind holes of circuit board deviation fool proof test method of the invention passes through in the HDI circuit
The technique edges of plate make the blind hole deviation fool proof test section, test the conduction of the test blind hole and the test point, root
According to it is described test blind hole and the test point conduction determine the HDI blind hole whether deviation and deviation amount.The HDI electricity
Road board blind hole deviation fool proof test method has the advantages that easy to operate, accuracy is high and testing efficiency is high.
Detailed description of the invention
Fig. 1 is the flow diagram of HDI blind holes of circuit board deviation fool proof test method of the present invention；
Fig. 2 is that the structure of blind hole deviation fool proof test section in HDI blind holes of circuit board deviation fool proof test method of the present invention is shown
It is intended to；
Fig. 3 is test philosophy schematic diagram in HDI blind holes of circuit board deviation fool proof test method of the present invention.
Specific embodiment
Below in conjunction with drawings and embodiments, the invention will be further described.
Illustrate please refer to the process that Fig. 1, Fig. 2 and Fig. 3, Fig. 1 are HDI blind holes of circuit board deviation fool proof test method
Figure；Fig. 2 is the structural schematic diagram of blind hole deviation fool proof test section in HDI blind holes of circuit board deviation fool proof test method of the present invention；
Fig. 3 is test philosophy schematic diagram in HDI blind holes of circuit board deviation fool proof test method of the present invention.The HDI blind holes of circuit board is inclined
Position fool proof test method includes the following steps：
Step S1：HDI circuit board is provided；
Step S2：Blind hole deviation fool proof test section is made in the technique edges of the HDI circuit board；
Specifically, the blind hole deviation fool proof test section 1 includes test blind hole 11, multiple conducting blind holes 13, isolation ring 15
And test point 17.The test blind hole 11 is located at the center of the isolation ring 15.Multiple conducting blind holes 13 are located on
The isolation ring 15.The test point 17 is arranged with the central spacer 15 of being isolated.The test blind hole 11 and the isolation ring 15
There are certain spacing, multiple conducting blind holes 13 and the HDI circuit boards with the bottom conductive layer of the HDI circuit board
The conducting of bottom conductive layer, the test point 17 are connected on the HDI circuit board with the conducting blind hole 13, the isolation ring 15
Make to be not turned between the test blind hole 11 and the conducting blind hole 13.
There are two the blind hole deviation fool proof test section 1 is set, respectively spaced first blind hole deviation fool proof test
Area's (not shown) and the second blind hole fool proof deviation test section (not shown).The first blind hole deviation fool proof test section and described
Two blind hole fool proof deviation test sections include test blind hole, multiple conducting blind holes, isolation ring and test point.First blind hole is inclined
Spacing between the test blind hole and isolation ring and the bottom conductive layer of the HDI circuit board of position fool proof test section is less than described the
Spacing between the test blind hole and isolation ring and the bottom conductive layer of the HDI circuit board of two blind hole deviation fool proof test sections.
In the present embodiment, the test blind hole of setting the first blind hole deviation fool proof test section and isolation ring and the HDI circuit
The spacing of the bottom conductive layer of plate is 2.5mil；The test blind hole and isolation ring of second blind hole deviation fool proof test section are set
Spacing between the bottom conductive layer of the HDI circuit board is 3.5mil, to make the HDI blind holes of circuit board deviation fool proof
Test method can adapt to the test request during HDI circuit board fabrication.Meanwhile the first blind hole deviation fool proof test section
And in the manufacturing process of the second blind hole deviation fool proof test section, the first blind hole deviation fool proof test section and described second
The diameter setting of the outer test pad of the test blind hole of blind hole deviation fool proof test section is 0.3mm, the diameter of copper face windowing
Setting is 0.5mm, and the test of the first blind hole deviation fool proof test section and the second blind hole deviation fool proof test section is blind
Hole and conducting diameter of blind hole setting are 0.1mm, and the first blind hole deviation fool proof test section and second blind hole is arranged
The test blind hole of deviation fool proof test section and the interval of test point are 3mm.In order to guarantee the accuracy of test and reduce test
Operation difficulty, the conducting blind hole of the first blind hole deviation fool proof test section and the second blind hole deviation fool proof test section is equal
It is arranged for 4 and respectively around the isolation ring positioned at the same area, to reduce the HDI blind holes of circuit board deviation fool proof test
Method testing complexity improves testing efficiency.
Step S3：The detection of blind hole deviation is carried out to the blind hole deviation fool proof test section, tests the test blind hole and institute
State the conduction of test point；
Specifically, the test blind hole 11 is connected with the conducting blind hole 13 when deviation occurs for the test blind hole 11,
Since the conducting blind hole 13 is connected on the HDI circuit board with the test point 17, then the test blind hole 11 with it is described
Test point 17 is also switched on.The test blind hole 11 and the test point 17 are tested using the conductive test needle, if the survey
There are poor short circuits between examination blind hole 11 and the test point 17, then illustrate the HDI blind holes of circuit board deviation.Wherein, it utilizes
Conductive test needle is tested respectively in the first blind hole fool proof deviation test section and the second blind hole deviation fool proof test section
Test blind hole and the conduction between the test point of the same area.
Step S4：The conduction of test blind hole and the test point according to blind hole deviation test section determines blind
Hole whether deviation, if the conduction is short circuit, there is deviation in the blind hole of the HDI circuit board；The on the contrary then described HDI circuit
The non-deviation of the blind hole of plate.
Specifically, according between the test blind hole 11 and the test point 17 in the blind hole deviation fool proof test section
Conduction, can HDI circuit board described in accurate judgement blind hole deviation and deviation amount.Wherein, when the first blind hole deviation is anti-
Slow-witted test section and test blind hole in the second blind hole deviation fool proof test section and between the test point of the same area not
There is short circuit, then deviation is not present in the blind hole of the HDI circuit board；Test in the first blind hole deviation fool proof test section
Occur short circuit between blind hole and test point, and between the test blind hole and test point in the second blind hole deviation fool proof test section
Do not occur short circuit, then the blind hole of the HDI circuit board is there are deviation and deviation amount is more than or equal to 2.5mil and is less than 3.5mil；Work as institute
It states the test blind hole in the first blind hole deviation fool proof test section and the second blind hole deviation fool proof test section and is located at same area
Occurs short circuit between the test point in domain, then the blind hole of the HDI circuit board is there are deviation and deviation amount is more than or equal to 3.5mil.
Therefore, the blind hole of the HDI circuit board can not only be tested by the blind hole deviation fool proof test section 1 with the presence or absence of deviation, also
It can determine that blind hole deviation amount.
Compared with the relevant technologies, HDI blind holes of circuit board deviation fool proof test method of the invention passes through in the HDI circuit
The technique edges of plate make the blind hole deviation fool proof test section 1, test the conducting of the test blind hole 11 and the test point 17
Property, determine whether blind hole deviates and offset according to the conduction that is connected with the test point of test blind hole.The HDI electricity
Road board blind hole deviation fool proof test method has the advantages that easy to operate, accuracy is high and testing efficiency is high.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (3)
1. a kind of HDI blind holes of circuit board deviation fool proof test method, which is characterized in that include the following steps：
HDI circuit board is provided；
Blind hole deviation fool proof test section is made in the technique edges of the HDI circuit board, the blind hole deviation fool proof test section includes
Blind hole, multiple conducting blind holes, isolation ring and test point are tested, the test blind hole is located at the center of the isolation ring, more
A conducting blind hole is located on the isolation ring, and central spacer setting is isolated with described in the test point, wherein the blind hole is inclined
There are two position fool proof test section is set, respectively spaced first blind hole deviation fool proof test section and the second blind hole deviation fool proof
Test section, the test blind hole and isolation ring of the first blind hole deviation fool proof test section and the bottom of the HDI circuit board are conductive
Spacing between layer is less than the test blind hole and isolation ring of the second blind hole deviation fool proof test section and the HDI circuit board
Spacing between bottom conductive layer；
The detection of blind hole deviation is carried out to the blind hole deviation fool proof test section, the test test blind hole is led with the test point
The general character；
Whether the conduction of test blind hole and the test point according to the blind hole deviation fool proof test section determines blind hole
Deviation, if the conduction is short circuit, there is deviation in the blind hole of the HDI circuit board；The on the contrary then described HDI circuit board it is blind
The non-deviation in hole.
2. HDI blind holes of circuit board deviation fool proof test method according to claim 1, which is characterized in that in the HDI electricity
In the technique edges production blind hole deviation fool proof test section step of road plate, the test blind hole of the first blind hole deviation fool proof test section
And the spacing between isolation ring and the bottom conductive layer of the HDI circuit board is 2.5mil；The second blind hole deviation fool proof is surveyed
Trying the spacing between the test blind hole and isolation ring and the bottom conductive layer of the HDI circuit board in area is 3.5mil.
3. HDI blind holes of circuit board deviation fool proof test method according to claim 2, which is characterized in that described first is blind
The conducting blind hole of hole deviation fool proof test section and the second blind hole deviation fool proof test section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510828193.4A CN105430945B (en) | 2015-11-24 | 2015-11-24 | HDI blind holes of circuit board deviation fool proof test method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510828193.4A CN105430945B (en) | 2015-11-24 | 2015-11-24 | HDI blind holes of circuit board deviation fool proof test method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105430945A CN105430945A (en) | 2016-03-23 |
| CN105430945B true CN105430945B (en) | 2018-11-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510828193.4A Active CN105430945B (en) | 2015-11-24 | 2015-11-24 | HDI blind holes of circuit board deviation fool proof test method |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106771824A (en) * | 2017-02-15 | 2017-05-31 | 江苏博敏电子有限公司 | A kind of pcb board and its method for being applied to radium-shine hole skew test point |
| CN108572307A (en) * | 2017-03-07 | 2018-09-25 | 惠州中京电子科技有限公司 | A kind of multi-layer H DI printed circuits board blind hole inspection method |
| CN112616266A (en) * | 2020-12-25 | 2021-04-06 | 悦虎晶芯电路(苏州)股份有限公司 | Surface step type circuit board alignment inspection method and circuit board |
| CN113375540B (en) * | 2021-05-17 | 2023-03-03 | 深圳市景旺电子股份有限公司 | Circuit board, circuit board blind hole testing module and testing method thereof |
| CN114364167B (en) * | 2021-12-23 | 2023-11-07 | 江苏普诺威电子股份有限公司 | Double-layer packaging substrate alignment method suitable for laser through holes |
| CN114599171A (en) * | 2022-03-16 | 2022-06-07 | 湖南金康电路板有限公司 | Laser blind hole deviation testing method for high-order HDI |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203015289U (en) * | 2012-12-28 | 2013-06-19 | 广州兴森快捷电路科技有限公司 | Printed circuit board possessing blind hole inner layer deviation detection structure |
| CN203015276U (en) * | 2012-12-25 | 2013-06-19 | 深圳市兴森快捷电路科技股份有限公司 | HDI printed circuit board having blind-hole deviation detecting structure |
| CN203523140U (en) * | 2013-10-11 | 2014-04-02 | 深圳诚和电子实业有限公司 | HDI plate capable of realizing quick detection on conduction of crossed blind and buried holes |
-
2015
- 2015-11-24 CN CN201510828193.4A patent/CN105430945B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203015276U (en) * | 2012-12-25 | 2013-06-19 | 深圳市兴森快捷电路科技股份有限公司 | HDI printed circuit board having blind-hole deviation detecting structure |
| CN203015289U (en) * | 2012-12-28 | 2013-06-19 | 广州兴森快捷电路科技有限公司 | Printed circuit board possessing blind hole inner layer deviation detection structure |
| CN203523140U (en) * | 2013-10-11 | 2014-04-02 | 深圳诚和电子实业有限公司 | HDI plate capable of realizing quick detection on conduction of crossed blind and buried holes |
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| CN105430945A (en) | 2016-03-23 |
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