CN104582288A - PCB back drilling plate back drilling depth detecting method - Google Patents
PCB back drilling plate back drilling depth detecting method Download PDFInfo
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- CN104582288A CN104582288A CN201510018027.8A CN201510018027A CN104582288A CN 104582288 A CN104582288 A CN 104582288A CN 201510018027 A CN201510018027 A CN 201510018027A CN 104582288 A CN104582288 A CN 104582288A
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Abstract
The invention discloses a PCB back drilling plate back drilling depth detecting method which comprises the steps that a back drilling layer of a back drill and three different testing holes of up-down adjacent layers are connected with shared communication holes of corresponding layers respectively in a line mode, and a line penetrates through the back drilling holes in the same layer horizontally; a drilling mouth is used for carrying out hole drilling on three testing holes of each testing strip and the shared communication holes; a pre-drilling hole is additionally drilled at a back drilling hole position of each testing strip, and the diameter of the pre-drilling hole is smaller than a back drilling hole; and when back drilling is carried out on the pre-drilling hole, whether back drilling depth meets requirements is determined by connecting-disconnecting testing. The method is simple in design and high in testing efficiency, process monitoring is convenient, equipment does not need to be added and changed, only design needs to be changed, and the purpose of quality monitoring can be achieved.
Description
Technical field
The present invention relates to printed wiring board manufacture technology field, particularly relate to a kind of PCB back drill backboard drilling depth detection method.
Background technology
Along with the development of electron trade, in PCB manufacturing process, back drill flow process is a kind of special facture flow process, and it mainly bores the part without the need to conducting falling to cause electric signal noise on original interlayer conduction hole, makes the interlayer be left behind keep being communicated with.
Often because the back drill degree of depth is difficult to management and control in manufacturing process, cause back drill failure.For the underproof back drill plate of the degree of depth, be difficult in process of production judge, generally must measure judgement by section, make to produce this type of plate and there is unnecessary section and scrap, the quality that every PCS plate can monitor back drill preferably can not be reached simultaneously.
There is following problem in traditional detection method:
1, because of interlayer base material thickness less (general more than 0.075mm), be difficult to comprehensive monitoring by section or depth gauge detection and ensure that the back drill degree of depth is qualified;
2, detection of cutting into slices is destructive testing, and the more loaded down with trivial details difficulty of test is comparatively large, needs the more time, affects efficiency, be difficult to the detection accomplishing every PCS plate, there is certain quality risk;
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of PCB back drill backboard drilling depth detection method, be intended to solve that existing detection method is difficult to realize comprehensive monitoring, waste material, difficulty of test is large, efficiency is low, there is the problem of quality risk.
Technical scheme of the present invention is as follows:
A kind of PCB back drill backboard drilling depth detection method, wherein, comprises step:
A, on PCB technology limit, arrange several test-strips, the number of test-strips is determined according to the quantity of PCB back drill layer, and wherein each test-strips contains 3 instrument connections, 1 shared intercommunicating pore, 1 back drill hole;
B, will 3 different instrument connections of the back drill layer of back drill and its neighbouring layer be needed to carry out connection with the shared intercommunicating pore of equivalent layer respectively, and circuit cross the back drill hole of same layer;
C, employing are bored to chew and are holed on 3 instrument connections and shared intercommunicating pore of each test-strips;
D, need the back drill hole site of back drill to add brill prebored hole in each test-strips, and prebored hole diameter is less than back drill bore dia;
E, 3 of each test-strips instrument connections, 1 shared intercommunicating pore and back drill hole carried out the via hole and form electrical communication loop;
F, when carrying out back drill in described prebored hole, determine whether the back drill degree of depth meets the demands by off test.
Described PCB back drill backboard drilling depth detection method, wherein, in described step b, boring the diameter chewed is 0.25 ~ 0.6mm.
Described PCB back drill backboard drilling depth detection method, wherein, in described step c, prebored hole diameter 0.15mm more than less of back drill hole.
Described PCB back drill backboard drilling depth detection method, wherein, on each back drill layer, instrument connection presses yi word pattern arrangement.
Described PCB back drill backboard drilling depth detection method, wherein, in described steps d, circuit crosses the center in back drill hole.
Beneficial effect: simplicity of design of the present invention, seldom takies jigsaw position, conserve space; Every PCS design test passage, can complete in electrical testing operation, need not separately take time, and saves manpower; In production run, available multimeter or the test of break-make road BB machine, facilitate process monitoring; And without the need to increasing and change equipment, only need improve design, the object of character surveillance can be reached.
Accompanying drawing explanation
Fig. 1 is line layer conducting connection diagram of the present invention.
Fig. 2 is that line film of the present invention makes schematic diagram.
Embodiment
The invention provides a kind of PCB back drill backboard drilling depth detection method, for making object of the present invention, technical scheme and effect clearly, clearly, the present invention is described in more detail below.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
A kind of PCB back drill backboard drilling depth detection method provided by the present invention preferred embodiment, it comprises step:
S1, on PCB technology limit, arrange several test-strips, the number of test-strips is determined according to the quantity of PCB back drill layer, and wherein each test-strips contains 3 instrument connections, 1 shared intercommunicating pore, 1 back drill hole;
S2, will 3 different instrument connections of the back drill layer of back drill and its neighbouring layer be needed to carry out connection with the shared intercommunicating pore of equivalent layer respectively, and circuit cross the back drill hole of same layer;
S3, employing are bored to chew and are holed on 3 instrument connections and shared intercommunicating pore of each test-strips;
S4, need the back drill hole site of back drill to add brill prebored hole in each test-strips, and prebored hole diameter is less than back drill bore dia;
S5,3 of each test-strips instrument connections, 1 shared intercommunicating pore and back drill hole carried out the via hole and form electrical communication loop;
S6, when carrying out back drill in described prebored hole, determine whether the back drill degree of depth meets the demands by off test.
Specifically, in step sl, at every PCS technique edges, increase several test-strips, specifically determine test-strips quantity according to the number of plies of PCB back drill layer, specifically can determine according to PCB layout unit number, test-strips Position Design is as far as possible near back drill hole site; Wherein each test-strips contains 3 instrument connections, 1 shared intercommunicating pore, 1 back drill hole.
In step s 2, according to the difference of back drill layer, such as, in embodiment as shown in Figure 1, back drill layer is Ln layer, 3 the different instrument connections then comprising back drill layer and its neighbouring layer are respectively: the n instrument connection of Ln layer, (n-1) instrument connection of Ln-1 layer, (n+1) instrument connection of Ln+1, respectively the n instrument connection of Ln layer and shared intercommunicating pore (0 hole) the Position Design copper packing with layer are carried out connection, equally, (n-1) instrument connection of Ln-1 layer and shared intercommunicating pore (0 hole) the Position Design copper packing with layer are carried out connection, (n+1) instrument connection of Ln+1 and shared intercommunicating pore (0 hole) the Position Design copper packing with layer are carried out connection, and circuit must cross the center in a back drill hole, can conducting after can guaranteeing a brill and electro-coppering like this.
Such as, in embodiment as shown in Figure 1, as same unit back drill layer only has brill one deck (the 5th layer), so test-strips just only has a kind, as same unit has different layers to need back drill, need increase test number according to different layers quantity.
Wherein, in described step S3, boring the diameter chewed is 0.25 ~ 0.6mm.The diameter of answering selection and comparison little chewed by this brill, such as, select 0.3mm.
In described step S4, prebored hole diameter 0.15mm more than less of back drill hole, such as little 0.2mm, its large I designs according to specific needs, need ensure that copper plate can be bored completely needing the place of back drill in back drill hole.
As shown in Figure 1, on each back drill layer, instrument connection presses yi word pattern arrangement, and it can conveniently design, and can design in the gong plate interval of unit and unit, seldom take jigsaw position, conserve space.
Because back drill boring ratio prebored hole diameter is large, that sandwich circuit that the line layer be drilled through during back drill will destroy design connects, and causes instrument connection open circuit; The conducting situation of every layer can be determined like this by off test, break-make is tested with ' n ', ' o ' with ' n+1 ' respectively by ' o ' and ' n-1 ', ' o ', as open circuit then shows the back drill success of this layer, contrary short circuit then shows that the back drill degree of depth does not reach back drill effect not; In actual application, available multimeter or the test of break-make road BB machine, facilitate process monitoring.Every PCS design test passage, can complete in electrical testing operation, need not separately take time, and saves manpower.
In sum, simplicity of design of the present invention, seldom takies jigsaw position, conserve space; Every PCS design test passage, can complete in electrical testing operation, need not separately take time, and saves manpower; In production run, available multimeter or the test of break-make road BB machine, facilitate process monitoring; And without the need to increasing and change equipment, only need improve design, the object of character surveillance can be reached.
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection domain that all should belong to claims of the present invention.
Claims (5)
1. a PCB back drill backboard drilling depth detection method, is characterized in that, comprise step:
A, on PCB technology limit, arrange several test-strips, the number of test-strips is determined according to the quantity of PCB back drill layer, and wherein each test-strips contains 3 instrument connections, 1 shared intercommunicating pore, 1 back drill hole;
B, will 3 different instrument connections of the back drill layer of back drill and its neighbouring layer be needed to carry out connection with the shared intercommunicating pore of equivalent layer respectively, and circuit cross the back drill hole of same layer;
C, employing are bored to chew and are holed on 3 instrument connections and shared intercommunicating pore of each test-strips;
D, need the back drill hole site of back drill to add brill prebored hole in each test-strips, and prebored hole diameter is less than back drill bore dia;
E, 3 of each test-strips instrument connections, 1 shared intercommunicating pore and back drill hole carried out the via hole and form electrical communication loop;
F, when carrying out back drill in described prebored hole, determine whether the back drill degree of depth meets the demands by off test.
2. PCB back drill backboard drilling depth detection method according to claim 1, is characterized in that, in described step b, boring the diameter chewed is 0.25 ~ 0.6mm.
3. PCB back drill backboard drilling depth detection method according to claim 1, is characterized in that, in described step c, and prebored hole diameter 0.15mm more than less of back drill hole.
4. PCB back drill backboard drilling depth detection method according to claim 1, is characterized in that, on each back drill layer, instrument connection presses yi word pattern arrangement.
5. PCB back drill backboard drilling depth detection method according to claim 1, it is characterized in that, in described steps d, circuit crosses the center in back drill hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510018027.8A CN104582288A (en) | 2015-01-14 | 2015-01-14 | PCB back drilling plate back drilling depth detecting method |
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| CN201510018027.8A CN104582288A (en) | 2015-01-14 | 2015-01-14 | PCB back drilling plate back drilling depth detecting method |
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| CN104582288A true CN104582288A (en) | 2015-04-29 |
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| CN201510018027.8A Pending CN104582288A (en) | 2015-01-14 | 2015-01-14 | PCB back drilling plate back drilling depth detecting method |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105307380A (en) * | 2014-06-13 | 2016-02-03 | 甲骨文国际公司 | Step Drill Test Structure of Layer Depth Sensing on Printed Circuit Board |
| CN110646726A (en) * | 2019-09-20 | 2020-01-03 | 胜宏科技（惠州）股份有限公司 | PCB back drilling nondestructive testing method |
| CN111121586A (en) * | 2019-12-31 | 2020-05-08 | 珠海杰赛科技有限公司 | Method for testing residual thickness of PCB (printed circuit board) back drill |
| CN111867256A (en) * | 2020-07-31 | 2020-10-30 | 金禄电子科技股份有限公司 | Circuit board and manufacturing method |
| CN112714541A (en) * | 2020-12-14 | 2021-04-27 | 竞华电子(深圳)有限公司 | Multi-layer PCB structure and test method |
| CN113218294A (en) * | 2021-04-07 | 2021-08-06 | 奥士康科技股份有限公司 | Depth and alignment precision detection coupon for back drilling |
| CN113286429A (en) * | 2020-07-31 | 2021-08-20 | 生益电子股份有限公司 | Back drill manufacturing method |
| CN113899304A (en) * | 2021-10-14 | 2022-01-07 | 浪潮商用机器有限公司 | Back drilling depth measuring substrate and back drilling depth measuring method |
| CN114364122A (en) * | 2022-03-17 | 2022-04-15 | 四川英创力电子科技股份有限公司 | Printed circuit board, manufacturing method thereof and back drilling hole depth detection method |
| CN114501804A (en) * | 2021-11-29 | 2022-05-13 | 上海嘉捷通信息科技有限公司 | Depth control method for back drilling of 5G precision circuit board |
| CN114858081A (en) * | 2022-03-22 | 2022-08-05 | 胜宏科技（惠州）股份有限公司 | Visual detection device and method for controlling depth of deep hole |
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| CN201828238U (en) * | 2010-10-11 | 2011-05-11 | 深圳中富电路有限公司 | Back drill depth test device for back drill board |
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| JP2014187153A (en) * | 2013-03-22 | 2014-10-02 | Via Mechanics Ltd | Back drilling method for multilayer printed wiring board, drill therefor and board drilling device |
| CN104567611A (en) * | 2013-10-25 | 2015-04-29 | 北大方正集团有限公司 | Method for detecting backdrilling depth |
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2015
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Patent Citations (5)
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| CN101876687A (en) * | 2010-06-04 | 2010-11-03 | 深南电路有限公司 | Test method for back drilling depth of PCB plate |
| CN201828238U (en) * | 2010-10-11 | 2011-05-11 | 深圳中富电路有限公司 | Back drill depth test device for back drill board |
| CN103096643A (en) * | 2011-11-03 | 2013-05-08 | 北大方正集团有限公司 | Method for detecting back drill holes of printed circuit board (PCB) and PCB being manufactured |
| JP2014187153A (en) * | 2013-03-22 | 2014-10-02 | Via Mechanics Ltd | Back drilling method for multilayer printed wiring board, drill therefor and board drilling device |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105307380B (en) * | 2014-06-13 | 2020-02-11 | 甲骨文国际公司 | Stepping drilling test structure for layer depth sensing of printed circuit board |
| CN105307380A (en) * | 2014-06-13 | 2016-02-03 | 甲骨文国际公司 | Step Drill Test Structure of Layer Depth Sensing on Printed Circuit Board |
| CN110646726A (en) * | 2019-09-20 | 2020-01-03 | 胜宏科技（惠州）股份有限公司 | PCB back drilling nondestructive testing method |
| WO2021051647A1 (en) * | 2019-09-20 | 2021-03-25 | 胜宏科技（惠州）股份有限公司 | Back-drilling nondestructive testing method for pcb |
| CN111121586A (en) * | 2019-12-31 | 2020-05-08 | 珠海杰赛科技有限公司 | Method for testing residual thickness of PCB (printed circuit board) back drill |
| CN113286429A (en) * | 2020-07-31 | 2021-08-20 | 生益电子股份有限公司 | Back drill manufacturing method |
| CN111867256A (en) * | 2020-07-31 | 2020-10-30 | 金禄电子科技股份有限公司 | Circuit board and manufacturing method |
| CN112714541A (en) * | 2020-12-14 | 2021-04-27 | 竞华电子(深圳)有限公司 | Multi-layer PCB structure and test method |
| CN112714541B (en) * | 2020-12-14 | 2022-05-31 | 竞华电子(深圳)有限公司 | Multi-layer PCB structure and test method |
| CN113218294A (en) * | 2021-04-07 | 2021-08-06 | 奥士康科技股份有限公司 | Depth and alignment precision detection coupon for back drilling |
| CN113899304A (en) * | 2021-10-14 | 2022-01-07 | 浪潮商用机器有限公司 | Back drilling depth measuring substrate and back drilling depth measuring method |
| CN114501804A (en) * | 2021-11-29 | 2022-05-13 | 上海嘉捷通信息科技有限公司 | Depth control method for back drilling of 5G precision circuit board |
| CN114501804B (en) * | 2021-11-29 | 2024-03-29 | 上海嘉捷通信息科技有限公司 | Back drilling depth control method for 5G precise circuit board |
| CN114364122A (en) * | 2022-03-17 | 2022-04-15 | 四川英创力电子科技股份有限公司 | Printed circuit board, manufacturing method thereof and back drilling hole depth detection method |
| CN114858081A (en) * | 2022-03-22 | 2022-08-05 | 胜宏科技（惠州）股份有限公司 | Visual detection device and method for controlling depth of deep hole |
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Application publication date: 20150429 |
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