CN102539996A - Detection method and system for layers of multilayer circuit board - Google Patents
Detection method and system for layers of multilayer circuit board Download PDFInfo
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- CN102539996A CN102539996A CN2011104074458A CN201110407445A CN102539996A CN 102539996 A CN102539996 A CN 102539996A CN 2011104074458 A CN2011104074458 A CN 2011104074458A CN 201110407445 A CN201110407445 A CN 201110407445A CN 102539996 A CN102539996 A CN 102539996A
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Abstract
The invention discloses a detection method for layers of a multilayer circuit board; the detection method comprises the following steps of: providing a detection circuit board with inspection holes, wherein the detection circuit board is arranged at a technology side of the multilayer circuit board; detecting whether the inspection holes are electrically conducted; and judging the bias condition. The invention also provides a detection system for the multilayer circuit board; the detection system adopts the detection method and comprises a detection device and the detection circuit board, wherein the detection circuit board comprises an external line layer of the circuit board and multiple internal line layers of the circuit board which are combined in a laminating manner; an external circuit board and an internal circuit board are interconnected through multiple through holes to form a relatively independent network path; multiple independent paths are realized in each multilayer circuit board in an interconnection manner; and the paths need to be mutually insulated and can not be conducted. After the detection is finished by using the detection circuit board, the detection circuit board is removed from the multilayer circuit board, and the multilayer circuit board is not affected. The detection method and the detection system have the advantages of convenience, fastness and high efficiency.
Description
Technical field
The present invention relates to the electric circuit inspection field, particularly a kind of detection method and system that is applicable to multilayer circuit board interlayer skew with a plurality of single layer board.
Background technology
Along with technical development and the people consumption demand to electronic product, the printed circuit board (PCB) of high density, multilayer number becomes the development trend of circuit board gradually.In general, multilayer circuit board is that a plurality of laminas form through the pressing mode, and in order to guarantee that circuit board line is accurate, very high for the aligning accuracy requirement of pressing process.In case big interlayer skew occurs, just short circuit or breaking phenomena possibly occur between the circuit of multilayer circuit board, thereby influence electric property, serious meeting causes circuit board damage.Existing interlayer offset detects adopts microtomy usually, and each layer of circuit board via cut into slices, and analyzes then, judges whether contraposition is accurate between each layer.This mode weak point need to be the expensive time to make section, will certainly damage circuit board, and need carry out manual measurement or judgement to the interlayer skew, wastes time and energy, and detection efficiency is low and error is big.
Summary of the invention
In order to solve the problems referred to above of prior art, be necessary to provide a kind of directly perceived, convenient, fast and efficient is high is used for multilayer circuit board detecting method and the system that the interlayer offset detects.
The technical scheme that technical solution problem of the present invention is adopted is: a kind of multilayer circuit board detecting method comprises: provide to have the testing circuit plate that detects the hole, said testing circuit plate is arranged on the technology limit of multilayer circuit board; Detect between the said detection hole and whether conduct; Judge drift condition, said testing circuit plate removes from multilayer circuit board after accomplishing detection.
Further, said detection hole is divided into many groups and detects the hole group, and each group comprises the first detection hole and the second detection hole.Pitch of holes between the first and second detection holes of each group detection hole group is inequality, and said pitch of holes maximal value is not less than the micropore pitch of holes maximal value of said multilayer circuit board.
Further, detect when whether conducting between the said detection hole, judge whether to conduct detecting between the first detection hole of each group and the second detection hole.
Further, the judgement drift condition is included in and can judges the corresponding aperture back gauge that side-play amount is the said first and second detection holes under the situation that detects conducting.
Another technical scheme provided by the invention is a kind of multilayer circuit board detection system; Comprise pick-up unit and testing circuit plate; Said testing circuit plate comprises the detection hole that many groups have different holes back gauge, and said pick-up unit is through detecting whether conduct the interlayer drift condition of judging said multilayer circuit board between the said detection hole.
Further; Said each group detects the hole group and comprises the first detection hole and the second detection hole; Said pick-up unit comprises first detecting unit and second detecting unit; Corresponding each group of said first detecting unit detects the first detection hole in hole, and corresponding each group of said second detecting unit detects the second detection hole in hole.
Further, said testing circuit plate comprises that 6 groups are detected the hole, and said 6 groups of hole back gauges that detect the hole are respectively 2mil, 3mil, 4mil, 5mil, 6mil, 7mil.
Further, said pick-up unit also comprises Tip element, and said Tip element is detecting luminous prompting when conducting.
Further; Said testing circuit plate comprises outer circuit plate line layer and a plurality of inner layer circuit board line layer that pressing combines; The outer circuit plate of telling and inner layer circuit board be to realize the interconnected relatively independent network path that forms through a plurality of through holes; Realize a plurality of independently paths in each piece multilayer circuit board in this way, but individual channel needs each other the mutual insulating can not conducting.
Compared to prior art; Multilayer circuit board detecting method of the present invention through different holes back gauge is set on the testing circuit plate the detection hole and whether conduct and detect the drift condition of judging said multilayer circuit board detecting the hole; Can not damage multilayer circuit board; Complex process such as also need not cut into slices, efficient quick.Multilayer circuit board detection system of the present invention comprises pick-up unit and testing circuit plate, and pick-up unit comprises first detecting unit and second detecting unit, through to detecting the judgement of the situation that conducts between the group of hole, can obtain corresponding drift condition.In addition, can show testing result intuitively, need not destroy circuit board, also need not make section through display unit, make whole testing process and as a result Display Realization efficient quick, convenient directly perceived.In addition, multilayer circuit board detection system of the present invention also can realize automation mechanized operation through robotization control, thereby can raise the efficiency.
Description of drawings
Fig. 1 is the schematic perspective view of multilayer circuit board checking device of the present invention;
Fig. 2 is the enlarged diagram of the testing circuit plate of multilayer circuit board detection system of the present invention;
Fig. 3 is the schematic flow sheet of multilayer circuit board detecting method of the present invention.
Embodiment
In order to make the object of the invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
The invention discloses a kind of multilayer circuit board detecting method, comprising: provide to have the testing circuit plate that detects the hole, said testing circuit plate is arranged on the technology limit of multilayer circuit board; Detect between the said detection hole and whether conduct; Judge drift condition, said testing circuit plate removes from multilayer circuit board after accomplishing detection.。
The present invention also provides a kind of multilayer circuit board detection system; Comprise pick-up unit and testing circuit plate; The micropore of different holes back gauge is set on the said testing circuit plate; Said testing circuit plate comprises the detection hole that many groups have different holes back gauge, and wherein each group comprises one first detection hole and one second detection hole, and said pick-up unit comprises first detecting unit and second detecting unit; Corresponding each group of said first detecting unit detects the first detection hole in hole, and corresponding each group of said second detecting unit detects the second detection hole in hole.Wherein, Said testing circuit plate comprises outer circuit plate line layer and a plurality of inner layer circuit board line layer that pressing combines; The outer circuit plate of telling and inner layer circuit board be to realize the interconnected relatively independent network path that forms through a plurality of through holes; Realize a plurality of independently paths in each piece multilayer circuit board in this way, but individual channel needs each other the mutual insulating can not conducting.
Below in conjunction with accompanying drawing the present invention is described further.
Please consult Fig. 1 and Fig. 2 simultaneously, multilayer circuit board detection system of the present invention one embodiment comprises pick-up unit and testing circuit plate, pick-up unit comprises first detecting unit 101, second detecting unit 102 and Tip element 103.Wherein, said first detecting unit 101 is connected to power supply one end, and said second detecting unit 102 is connected to the power supply other end.
Said testing circuit plate comprises the detection hole that many groups have different holes back gauge, and wherein each group comprises one first detection hole 201 and one second detection hole 202.As shown in Figure 2, in the present embodiment, said testing circuit plate comprises that 6 groups are detected the hole group, and the pitch of holes of its each group respectively is 2mil, 3mil, 4mil, 5mil, 6mil, 7mil.Said testing circuit plate is arranged on the outer surveyed area of multilayer circuit board, and holes simultaneously and pressing with multilayer circuit board, therefore has the drift condition identical with said multilayer circuit board.It has the inner layer circuit board with the identical number of plies of multilayer circuit board.The inner layer circuit board of said testing circuit plate has and detects the micropore of hole correspondence.When skew takes place the inner layer circuit board of said testing circuit plate, detect the conductive metal layer of the corresponding inner layer circuit board in hole.
When detecting, the detection hole of each group is detected, judged between the first detection hole and the second detection hole whether conduct.If because squint, just can conduct through conductive metal layer between the first detection hole and the second detection hole, thus constitute the conducting loop together with first detecting unit 101 and second detecting unit 102.
In addition, the conducting situation of the detection hole group through different holes back gauge can be judged the drift condition of multilayer circuit board.For example, detect the hole back gauge and be between the detection hole group of 4mil and conduct, and the hole back gauge is not have conducting between the detection hole group of 5mil, can judge side-play amount basically at 4mil so.
In other embodiment of the present invention, said Tip element 103 comprises the light emitting diode with said first detecting unit 101,102 series connection of second detecting unit, when detecting when conducting said lumination of light emitting diode.
In further embodiment of the present invention, said pick-up unit also comprises automatic control unit, and said first detecting unit of its may command and the second detecting unit machine detect automatically.
Among other embodiment of the present invention, said detection hole group can as 8 groups, 10 groups etc., not limited to according to the setting of detection needs.Pitch of holes between the said first detection hole and the second detection hole also can be according to the setting of detection needs.
Seeing also Fig. 3, is the schematic flow sheet of an embodiment of multilayer circuit board detecting method of the present invention.Said multilayer circuit board detecting method comprises:
Step S1 provides to have the testing circuit plate that detects the hole, the contiguous said multilayer circuit board setting of said testing circuit plate, and with the pressing together of said multilayer circuit board, have identical interlayer side-play amount.Wherein, said detection hole is divided into many groups and detects the hole group, and each group comprises the first detection hole and the second detection hole.Pitch of holes between the first and second detection holes of each group detection hole group is inequality, and said pitch of holes maximal value is not less than the micropore pitch of holes maximal value of said multilayer circuit board.In the present embodiment, said testing circuit plate can adopt the testing circuit plate in the foregoing description.
Whether step S2 detects between the said detection hole and conducts, and to detecting between the first detection hole of each group and the second detection hole, judges whether to conduct during detection.
Step S3 judges drift condition.Because every group of first and second detection holes of detecting the hole group have hole back gauge inequality, therefore can judge side-play amount under the situation of conducting and probably be the corresponding aperture back gauge in the said first and second detection holes detecting.
Compared to prior art; Multilayer circuit board detecting method of the present invention through different holes back gauge is set on the testing circuit plate the detection hole and whether conduct and detect the drift condition of judging said multilayer circuit board detecting the hole; Can not damage multilayer circuit board; Complex process such as also need not cut into slices, efficient quick.Multilayer circuit board detection system of the present invention comprises pick-up unit and testing circuit plate, and pick-up unit comprises first detecting unit and second detecting unit, through to detecting the judgement of the situation that conducts between the group of hole, can obtain corresponding drift condition.In addition, can show testing result intuitively, need not destroy circuit board, also need not make section through display unit, make whole testing process and as a result Display Realization efficient quick, convenient directly perceived.In addition, multilayer circuit board detection system of the present invention also can realize automation mechanized operation through robotization control, thereby can raise the efficiency.
Above content is to combine concrete preferred implementation to the further explain that the present invention did, and can not assert that practical implementation of the present invention is confined to these explanations.For the those of ordinary skill of technical field under the present invention, under the prerequisite that does not break away from the present invention's design, can also make some simple deduction or replace, all should be regarded as belonging to protection scope of the present invention.
Claims (9)
1. a multilayer circuit board detecting method is characterized in that, comprising: provide to have the testing circuit plate that detects the hole, said testing circuit plate is arranged on the technology limit of multilayer circuit board; Detect between the said detection hole and whether conduct; Judge drift condition, said testing circuit plate removes from multilayer circuit board after accomplishing detection.
2. multilayer circuit board detecting method according to claim 1 is characterized in that, said detection hole is divided into many groups and detects the hole group, and each group comprises the first detection hole and the second detection hole.Pitch of holes between the first and second detection holes of each group detection hole group is inequality, and said pitch of holes maximal value is not less than the micropore pitch of holes maximal value of said multilayer circuit board.
3. whether multilayer circuit board detecting method according to claim 2 is characterized in that, detect when conducting between the said detection hole detecting between the first detection hole of each group and the second detection hole, judges whether to conduct.
4. multilayer circuit board detecting method according to claim 3 is characterized in that, the judgement drift condition is included in can judge the corresponding aperture back gauge that side-play amount is the said first and second detection holes under the situation that detects conducting.
5. multilayer circuit board detection system; It is characterized in that; Comprise pick-up unit and testing circuit plate; Said testing circuit plate comprises the detection hole that many groups have different holes back gauge, and said pick-up unit is through detecting whether conduct the interlayer drift condition of judging said multilayer circuit board between the said detection hole.
6. multilayer circuit board detection system according to claim 5; It is characterized in that; Said each group detects the hole group and comprises the first detection hole and the second detection hole; Said pick-up unit comprises first detecting unit and second detecting unit, and corresponding each group of said first detecting unit detects the first detection hole in hole, and corresponding each group of said second detecting unit detects the second detection hole in hole.
7. multilayer circuit board detection system according to claim 6 is characterized in that, said testing circuit plate comprises that 6 groups are detected the hole, and said 6 groups of hole back gauges that detect the hole are respectively 2mil, 3mil, 4mil, 5mil, 6mil, 7mil.
8. multilayer circuit board detection system according to claim 7 is characterized in that said pick-up unit also comprises Tip element, and said Tip element is detecting luminous prompting when conducting.
9. multilayer circuit board detection system according to claim 7; It is characterized in that; Said testing circuit plate comprises outer circuit plate line layer and a plurality of inner layer circuit board line layer that pressing combines; Said outer circuit plate and inner layer circuit board are to realize the interconnected relatively independent network path that forms through a plurality of through holes, realize a plurality of independently paths in each piece multilayer circuit board in this way, but individual channel needs the mutual insulating can not conducting each other.
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| CN2011104074458A CN102539996A (en) | 2011-12-08 | 2011-12-08 | Detection method and system for layers of multilayer circuit board |
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| CN2011104074458A CN102539996A (en) | 2011-12-08 | 2011-12-08 | Detection method and system for layers of multilayer circuit board |
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Cited By (8)
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| CN104507276A (en) * | 2014-12-18 | 2015-04-08 | 深圳市五株科技股份有限公司 | Method for monitoring wrong stacking sequence of multilayer circuit board |
| CN105716512A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | Interlayer alignment prompt module and method |
| CN106197250A (en) * | 2016-07-01 | 2016-12-07 | 广州兴森快捷电路科技有限公司 | The method of testing of pcb board internal layer off normal |
| CN106932709A (en) * | 2017-02-17 | 2017-07-07 | 李培培 | A kind of multilayer circuit board energization observation debugging apparatus |
| CN109640522A (en) * | 2018-12-14 | 2019-04-16 | 业成科技（成都）有限公司 | Electronic device and electronic equipment |
| CN111157879A (en) * | 2020-01-03 | 2020-05-15 | 深圳市景旺电子股份有限公司 | Layer deviation detection method and layer deviation detection structure of printed circuit board |
| CN113109696A (en) * | 2021-04-12 | 2021-07-13 | 万安裕维电子有限公司 | Method for testing performance of PCB conductive hole |
| CN114485366A (en) * | 2022-01-28 | 2022-05-13 | 宁波华远电子科技有限公司 | Deviation detection method for drilling hole of circuit board |
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| CN113109696A (en) * | 2021-04-12 | 2021-07-13 | 万安裕维电子有限公司 | Method for testing performance of PCB conductive hole |
| CN113109696B (en) * | 2021-04-12 | 2023-08-08 | 万安裕维电子有限公司 | PCB conductive hole performance test method |
| CN114485366A (en) * | 2022-01-28 | 2022-05-13 | 宁波华远电子科技有限公司 | Deviation detection method for drilling hole of circuit board |
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Application publication date: 20120704 |