CN205648192U - Communication backplate crimping hole back drilling degree of depth test module - Google Patents
Communication backplate crimping hole back drilling degree of depth test module Download PDFInfo
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- CN205648192U CN205648192U CN201620501928.2U CN201620501928U CN205648192U CN 205648192 U CN205648192 U CN 205648192U CN 201620501928 U CN201620501928 U CN 201620501928U CN 205648192 U CN205648192 U CN 205648192U
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Abstract
The utility model provides a communication backplate crimping hole back drilling degree of depth test module, including crimping hole, first to the third test hole, firstly be PTH through -hole, crimping hole for sinking the copper hole to the third test hole, first test hole loops through the first line, crimping hole, the second line and is connected with the second test hole and switches on, the first line, the second line set up in first appointed inlayer, first test hole loops through third circuit, crimping hole, fourth circuit and is connected with the third test hole and switches on, third circuit, fourth circuit set up in the appointed inlayer of second. Utilize the utility model provides a communication backplate crimping hole back drilling degree of depth test module can adjust when unqualified at production site quick check back drilling hole drilling depth immediately, improves production and quality management and control efficiency, guarantee the product quality, and manufacturing process is simple, convenient operation, and it is low to have solved traditional slicing efficiency, length consuming time, and easy scratch face scheduling problem.
Description
Technical field
This utility model relates to wiring board techniques field, particularly relates to a kind of communication backplane crimping hole back drill depth test module.
Background technology
Along with the high speed development of ethernet technology, the port speed present as the flagship product high-end switch of ethernet technology has risen to 40G, 100G from 1G, 10G, and the speed of even 400G has begun to formulation standard.How to solve the high speed to switch backplane bus signals that port speed fast lifting brought to stablize transmission requirement and become for new technology competition point.Therefore it is required that the hardware board of switching can realize installing simply on backboard, easily operation, parts consolidate, vibration resistance is strong, it is hardly damaged, and the backboard only 5mil of thickness of dielectric layers between layers, every sheet has the back drill crimping hole of ten several different depths, therefore boring aperture is carried on the back in the crimping on backboard and depth tolerances requires the strictest, due to pressing and the inhomogeneities of plating when adding actual production, the medium thickness and the copper thickness that cause every PNL plate are the most variant, therefore management and control is spent in back drill control deeply the most difficult, traditional cut sections for microscopic examination mode there is problems in that
(1) cut sections for microscopic examination belong to destructive inspection, and easily scrape card face
(2) with slicing mode, every sheet is checked, produce in batches not-so-practical, it is impossible to understand the quality status of every sheet
(3) every sheet needs to play ten several sections, and workload is too big, easily obscures when quantity is more, it is not easy to statistics
(4) to wait section result could continue to produce when producing, rig stand-by time length, efficiency are low.
Utility model content
For solving the problems referred to above, this utility model provides a kind of communication backplane crimping hole back drill depth test module, and including crimping hole, the first to the 3rd instrument connection, described first to the 3rd instrument connection is PTH through hole, crimping Kong Weichen copper hole；First instrument connection passes sequentially through first line, crimping hole, the second circuit and the second instrument connection and connects conducting, and described first line, the second circuit are arranged at the first appointment internal layer；First instrument connection passes sequentially through tertiary circuit, crimping hole, the 4th circuit and the 3rd instrument connection and connects conducting, and described tertiary circuit, the 4th circuit are arranged at the second appointment internal layer.
Preferably, described crimping bore dia is 0.3 ~ 0.4mm.
Preferably, the distance between described crimping hole, the first to the 3rd instrument connection is 3 ~ 5mm.
Preferably, a diameter of 0.8 ~ 1.2mm of described first to the 3rd instrument connection, the weld-ring of the first to the 3rd instrument connection is than the monolateral big 0.2mm that holes.
Preferably, the live width of described first to fourth circuit is 4-10mil.
Utilize the communication backplane crimping hole back drill depth test module that this utility model provides, the back drill hole drilling degree of depth can be quickly checked in production scene, can adjust immediately time defective, improve and produce and quality management and control efficiency, it is ensured that product quality, and manufacturing process is simple, easy to operate, solve tradition slice efficiency low, the longest, and the easily problem such as scratch plate face.
Accompanying drawing explanation
Fig. 1 is a kind of communication backplane crimping hole back drill depth test module embodiments schematic diagram that this utility model provides.
Fig. 2 is that this utility model is applied to communication backplane imposite embodiment schematic diagram.
Detailed description of the invention
This utility model is explained in further detail below in conjunction with accompanying drawing and embodiment for the ease of it will be appreciated by those skilled in the art that.
Communication backplane crimping hole back drill depth test module as shown in Figure 1, including crimping hole the 4, first instrument connection the 1, second instrument connection the 2, the 3rd instrument connection 3；Distance between the 4, first to the 3rd instrument connection of crimping hole is 4mm.Crimping hole 4 is the heavy copper hole of diameter 0.35mm；First to the 3rd instrument connection is the PTH through hole of diameter 1mm, and the first to the 3rd instrument connection first appointment internal layer 6 and second in communication backplane specifies the weld-ring 5 on internal layer 7 than boring monolateral big 0.2 mm, the i.e. a diameter of 1.4mm of weld-ring 5.It is arranged in communication backplane first and specifies first line 61, second circuit 62 of internal layer 6, by specifying weld-ring 5 corresponding on internal layer 6 and crimping hole 4 to specify weld-ring 8 corresponding on internal layer 6 to connect first first first instrument connection the 1, second instrument connection 2, crimping hole the 4, first instrument connection the 1, second instrument connection 2 is made to connect conducting；It is arranged in communication backplane second and specifies tertiary circuit the 71, the 4th circuit 72 of internal layer 7, by specifying weld-ring 5 corresponding on internal layer 7 and crimping hole 4 to specify weld-ring 8 corresponding on internal layer 7 to connect second second first instrument connection the 1, the 3rd instrument connection 3, the first instrument connection 1, crimping hole the 4, the 3rd instrument connection 3 is made to connect conducting.The live width of first to fourth circuit is 5mil.
After crimping hole is carried out back drill, back drill hole owing to being formed in crimping hole site destroys original place in part layers of copper and the crimping hole part weld-ring in communication backplane of crimping hole inwall, therefore, when needs check whether the back drill degree of depth specifies between internal layer 6 and the second appointment internal layer 7 first, only need to measure and whether turn between the first instrument connection 1 and second instrument connection the 2, first instrument connection 1 and the 3rd instrument connection 3, if all turning on, illustrate that the degree of depth is inadequate, if being all not turned on, illustrating deep, if an only line conduction, illustrating that the degree of depth was just.
For checking the back drill degree of depth of monoblock communication backplane, it is possible to communication backplane is crimped the distribution of hole back drill depth test module 9 and is arranged at gap digit in the edges of boards of communication backplane and typesetting, as shown in Figure 2.
Being more than specific implementation of the present utility model, it describes more concrete and detailed, but therefore can not be interpreted as the restriction to this utility model the scope of the claims.It should be pointed out that, for the person of ordinary skill of the art, without departing from the concept of the premise utility, it is also possible to make some deformation and improvement, these obvious alternative forms belong to protection domain of the present utility model.
Claims (5)
1. a communication backplane crimping hole back drill depth test module, it is characterised in that: including crimping hole, the first to the 3rd instrument connection, described first to the 3rd instrument connection is PTH through hole, crimping Kong Weichen copper hole；First instrument connection passes sequentially through first line, crimping hole, the second circuit and the second instrument connection and connects conducting, and described first line, the second circuit are arranged at the first appointment internal layer；First instrument connection passes sequentially through tertiary circuit, crimping hole, the 4th circuit and the 3rd instrument connection and connects conducting, and described tertiary circuit, the 4th circuit are arranged at the second appointment internal layer.
2. according to a kind of communication backplane crimping hole back drill depth test module described in claim 1, it is characterised in that: described crimping bore dia is 0.3 ~ 0.4mm.
3. according to a kind of communication backplane crimping hole back drill depth test module described in claim 1, it is characterised in that: the distance between described crimping hole, the first to the 3rd instrument connection is 3 ~ 5mm.
4. according to a kind of communication backplane crimping hole back drill depth test module described in claim 1, it is characterised in that: a diameter of 0.8 ~ 1.2mm of described first to the 3rd instrument connection, the weld-ring of the first to the 3rd instrument connection is than the monolateral big 0.2mm that holes.
5. according to a kind of communication backplane crimping hole back drill depth test module described in claim 1, it is characterised in that: the live width of described first to fourth circuit is 4-10mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620501928.2U CN205648192U (en) | 2016-05-27 | 2016-05-27 | Communication backplate crimping hole back drilling degree of depth test module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620501928.2U CN205648192U (en) | 2016-05-27 | 2016-05-27 | Communication backplate crimping hole back drilling degree of depth test module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205648192U true CN205648192U (en) | 2016-10-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620501928.2U Active CN205648192U (en) | 2016-05-27 | 2016-05-27 | Communication backplate crimping hole back drilling degree of depth test module |
Country Status (1)
| Country | Link |
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| CN (1) | CN205648192U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111256578A (en) * | 2020-01-21 | 2020-06-09 | 惠州中京电子科技有限公司 | Method for detecting depth of back drilling plate |
| CN111356290A (en) * | 2018-12-24 | 2020-06-30 | 胜宏科技（惠州）股份有限公司 | PCB capable of detecting back drilling depth and detection method |
-
2016
- 2016-05-27 CN CN201620501928.2U patent/CN205648192U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111356290A (en) * | 2018-12-24 | 2020-06-30 | 胜宏科技（惠州）股份有限公司 | PCB capable of detecting back drilling depth and detection method |
| CN111356290B (en) * | 2018-12-24 | 2023-09-12 | 胜宏科技（惠州）股份有限公司 | Detection method capable of detecting back drilling depth |
| CN111256578A (en) * | 2020-01-21 | 2020-06-09 | 惠州中京电子科技有限公司 | Method for detecting depth of back drilling plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210224 Address after: 226100 Guangzhou Road 999 Haimen Economic and Technological Development Zone, Nantong City, Jiangsu Province Patentee after: Nantong Shenghong Technology Co.,Ltd. Address before: Xinqiao village Xingcheng science and Technology Park, Danshui Town, Huiyang District, Huizhou City, Guangdong Province Patentee before: VICTORY GIANT TECHNOLOGY (HUIZHOU) Co.,Ltd. |
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| TR01 | Transfer of patent right |