CN103197190B - Hole plate - Google Patents
Hole plate Download PDFInfo
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- CN103197190B CN103197190B CN201310075799.6A CN201310075799A CN103197190B CN 103197190 B CN103197190 B CN 103197190B CN 201310075799 A CN201310075799 A CN 201310075799A CN 103197190 B CN103197190 B CN 103197190B
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- small
- hole
- holes
- substrate
- electroplate
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Abstract
The invention discloses a hole plate comprising a square substrate, wherein a plurality of small through holes for testing are formed in the substrate at intervals, copper layers are respectively electroplated in the plurality of the small through holes, welding disks are respectively electroplated on the circumferences of the plurality of the small through holes, and wires are electroplated between each two adjacent welding disks of the small through holes so that all the small through holes are connected in series. A plurality of large through holes are formed among the small through holes in the substrate, and the plurality of the large through holes are connected with the plurality of the small through holes in a non-circuit mode. The hole plate can simulate the situation of a circuit board in the practical copper plating process, and correctness of test results is guaranteed.
Description
Technical field
The present invention relates to a kind of ten thousand orifice plates, for detecting having no copper in the holes phenomenon in printed circuit board (PCB) flow process.
Background technology
Having no copper in the holes is one of defect common in printed circuit board production run.For avoiding this defect to occur in the product as far as possible, conventional method is a test board of design, and whether normally carry out testing process, this test board is commonly referred to as ten thousand orifice plates, or dog hone lamella.The common having no copper in the holes test board i.e. specification of ten thousand orifice plates is: long 600 millimeters, wide 500 millimeters, substrate thickness 2.0 millimeters, boring aperture 0.2 millimeter to 0.3 millimeter, drilling hole amount 1 ten thousand to 10 ten thousand.Then holes all in wired in series ten thousand orifice plate is used, test result multimeter or hummer inspection, any one hole not conducting, can quick position, finally by cross-section analysis, determine the reason of generation problem.Substitute with test board i.e. ten thousand orifice plates and produce plate, decrease and scrap and unnecessary flow process, reduce cost.But ten thousand common orifice plate designs have ignored plant equipment in actual production and swing and the mobility of solution in hole of generation, and therefore its test result is qualified, not necessarily represents that flow process is no problem.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of ten thousand orifice plates, can the sight of real simulation circuit board in actual copper-plating technique, ensure the correctness of test result.
The present invention in order to the technical scheme solving its technical matters and adopt is: a kind of ten thousand orifice plates, comprise square substrate, this substrate is interval with some test small through hole, layers of copper is electroplate with respectively in this some small through hole, and this some small through hole periphery is electroplate with pad respectively, and be electroplate with wire between the pad of adjacent small through hole and all small through hole is formed be connected in series, some large through-holes are provided with, without connection between this some large through-hole and described some small through hole between some small through hole of described substrate.
As a further improvement on the present invention, the diameter of described large through-hole is at least greater than 3 times of small through hole diameter.
The invention has the beneficial effects as follows: by increasing some large through-holes on ten thousand orifice plates, because the aperture of large through-hole is larger relative to small through hole aperture, therefore more solution can be flow through, thus carry out the production run of real simulation reality more, prevent in small through hole in actual production process less and produce without copper phenomenon owing to adjoining copper electroplating solution that large through-hole makes to flow through in it.
Accompanying drawing explanation
Fig. 1 is these existing ten thousand orifice plate partial structurtes schematic diagram;
Fig. 2 is that Fig. 1 is along A-A cross-sectional view;
Fig. 3 is partial structurtes schematic diagram of the present invention.
By reference to the accompanying drawings, make the following instructions:
1---substrate 2---small through hole
3---pad 4---wire
5---large through-hole
Embodiment
By reference to the accompanying drawings, the present invention is elaborated, but protection scope of the present invention is not
Be limited to following embodiment, the simple equivalence namely in every case done with the present patent application the scope of the claims and description changes and modifies, and all still belongs within patent covering scope of the present invention.
As shown in Figure 3, a kind of ten thousand orifice plates, comprise square substrate 1, this substrate is interval with some test small through hole 2, be electroplate with layers of copper respectively in this some small through hole, and this some small through hole periphery is electroplate with pad 3 respectively, and is electroplate with wire 4 between the pad of adjacent small through hole and all small through hole is formed is connected in series, it is characterized in that: between some small through hole of described substrate, be provided with some large through-holes 5, without connection between this some large through-hole and described some small through hole.Like this, by the setting of large through-hole, can sight in more real analog line plate actual production process, and can when true manufacturing machine generation is waved, more solution can be passed through in large through-hole, prevent the solution that flows through in small through hole few and the having no copper in the holes phenomenon that produces, thus test result is produced close to real more.It is The more the better that this large through-hole is arranged, and aperture is the bigger the better simultaneously.Preferably, the diameter of described large through-hole is at least greater than 3 times of small through hole diameter.
Claims (2)
1. an orifice plate, comprise square substrate (1), this substrate is interval with some test small through hole (2), layers of copper is electroplate with respectively in this some small through hole, and this some small through hole periphery is electroplate with pad (3) respectively, and be electroplate with wire (4) between the pad of adjacent small through hole and all small through hole is formed be connected in series, it is characterized in that: between some small through hole of described substrate, be provided with some large through-holes (5), without connection between this some large through-hole and described some small through hole.
2. ten thousand orifice plates according to claim 1, is characterized in that: the diameter of described large through-hole is at least greater than 3 times of small through hole diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310075799.6A CN103197190B (en) | 2013-03-11 | 2013-03-11 | Hole plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310075799.6A CN103197190B (en) | 2013-03-11 | 2013-03-11 | Hole plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103197190A CN103197190A (en) | 2013-07-10 |
| CN103197190B true CN103197190B (en) | 2015-05-27 |
Family
ID=48719873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310075799.6A Active CN103197190B (en) | 2013-03-11 | 2013-03-11 | Hole plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103197190B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103743991A (en) * | 2013-12-27 | 2014-04-23 | 广州兴森快捷电路科技有限公司 | Method and apparatus for testing conductive-hole electrical property of PCB plate |
| JP5832607B1 (en) * | 2014-08-12 | 2015-12-16 | ファナック株式会社 | Printed wiring board |
| CN112954889A (en) * | 2021-01-20 | 2021-06-11 | 江门崇达电路技术有限公司 | Copper deposition process test board and manufacturing method thereof |
| CN113109696B (en) * | 2021-04-12 | 2023-08-08 | 万安裕维电子有限公司 | PCB conductive hole performance test method |
-
2013
- 2013-03-11 CN CN201310075799.6A patent/CN103197190B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103197190A (en) | 2013-07-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Ni Yunzhi Inventor after: Chen Qin Inventor after: Zhu Yongle Inventor before: Ni Yunzhi Inventor before: Chen Qin Inventor before: Xiao Jinsong |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: NI YUNZHI CHEN ZHEN XIAO JINSONG TO: NI YUNZHI CHEN ZHEN ZHU YONGLE |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |