CN102706267B - Blind hole offset detecting method - Google Patents
Blind hole offset detecting method Download PDFInfo
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- CN102706267B CN102706267B CN201210190152.3A CN201210190152A CN102706267B CN 102706267 B CN102706267 B CN 102706267B CN 201210190152 A CN201210190152 A CN 201210190152A CN 102706267 B CN102706267 B CN 102706267B
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- lamellar body
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Abstract
The invention relates to a blind hole offset detecting method, which comprises the following steps of: setting a plurality of mutually independent first-layer sheet bodies and a plurality of interconnected second-layer sheet bodies before laser drilling, wherein a central hole is formed in the center of each second-layer sheet body; correspondingly arranging the first-layer sheet bodies and the second-layer sheet bodies vertically; drilling blind holes on the first-layer sheet bodies by using laser, plating copper in the blind holes, and performing offset detection; connecting a meter pen of a universal meter to a first-layer sheet body corresponding to the upper part of a tested sheet body in the second-layer sheet bodies, and sequentially connecting the other meter pen to the first-layer sheet body corresponding to the upper part of the other sheet body in the second-layer sheet bodies; and judging the offset according to the conduction condition of the meter pens. The range of the magnitude of blind hole offset can be accurately judged by designing and detecting the sheet bodies, and whether a product has risk or not is judged by combining the minimum ring width of the blind holes in a plate; and the method is easy to design and convenient in judgment, and the quality of the product is improved.
Description
Technical field
the present invention relates to a kind of blind hole bias detecting method.
Background technology
at present, also do not have direct the non-rejected can detect the method for blind hole bias size, more cannot judge blind hole side-play amount in plate, thus cannot confirm whether electrical measurement OK plate exists fiduciary level risk.
Summary of the invention
the object of this invention is to provide a kind of blind hole bias detecting method.
for achieving the above object, the technical solution used in the present invention is:
a kind of blind hole bias detecting method, comprises the following steps:
(1) before, carrying out laser boring, following structure is set:
ground floor lamellar body: there are several, separate between the ground floor lamellar body described in several;
second layer lamellar body: identical with described ground floor lamellar body quantity, be interconnected between second layer lamellar body described in several, the center of described second layer lamellar body offers center pit, and the aperture of described center pit reduces successively, there is in described second layer lamellar body at least one test lamellar body;
by upper and lower setting corresponding to described ground floor lamellar body, second layer lamellar body, be positioned at upper and lower described ground floor lamellar body, the center line of second layer lamellar body is located along the same line;
(2), described ground floor lamellar body carry out laser beat blind hole, in blind hole, carry out copper facing, carry out offset detection:
use multimeter, be connected to by a root table pen in described second layer lamellar body and test ground floor lamellar body corresponding to lamellar body top, another root table pen is connected to the ground floor lamellar body that in described second layer lamellar body, other lamellar body top is corresponding successively; If D1 is this ground floor lamellar body correspondence lower second layer lamellar body center pit aperture, D2 is blind hole ring width, and when the non-conducting of test pencil, the single-side shift amount of blind hole is within (D1-D2)/2; When test pencil conducting, the single-side shift amount of blind hole exceeds (D1-D2)/2.
preferably, described second layer lamellar body bottom is provided with the third layer lamellar body that quantity is with it identical, position is corresponding.
preferably, described test lamellar body is provided with two, and center pit is not offered in the test lamellar body center described in two.
preferably, in step (2), test pencil is connected to the ground floor lamellar body on the large second layer lamellar body top of described center pit from the ground floor lamellar body on the little second layer lamellar body top of described center pit.
further preferably, when the single-side shift amount of blind hole exceeds (D1-D2)/2, test pencil is connected to the ground floor lamellar body on the large second layer lamellar body top of an adjacent center pit, when the non-conducting of test pencil, the single-side shift amount of blind hole is between the numerical value of adjacent two (D1-D2)/2, when test pencil conducting, repeat said process.
preferably, multimeter is adjusted to buzzing shelves, and during test pencil conducting, buzzing is sounded.
because technique scheme is used, the present invention compared with prior art has following advantages:
the present invention, by the design of lamellar body (PAD) and detection, can judge the scope residing for blind hole bias size accurately, then the situation of blind hole minimum annular ring in board, thus judge product whether devoid of risk, its simplicity of design, it is convenient to judge, improves the quality of product.
Accompanying drawing explanation
accompanying drawing 1 is the schematic diagram of ground floor lamellar body in the present invention;
accompanying drawing 2 is the schematic diagram of second layer lamellar body in the present invention;
accompanying drawing 3 is the schematic diagram of third layer lamellar body in the present invention;
accompanying drawing 4 is that in the present invention, three-layer tablet body superposes and schematic top plan view after offering blind hole;
accompanying drawing 5 is that in the present invention, three-layer tablet body superposes and cross-sectional schematic after offering blind hole.
wherein: 1, ground floor lamellar body; 2, second layer lamellar body; 20, center pit; 21, lamellar body is tested; 3, third layer lamellar body; 4, blind hole.
Embodiment
below in conjunction with drawings and Examples, the invention will be further described:
a kind of blind hole bias detecting method, comprises the following steps:
(1) following structure lamellar body (PAD) is set before, carrying out laser boring:
as shown in Figure 1: ground floor lamellar body 1: there are 13,13 ground floor lamellar bodies 1 between separate, for multimeter provides contact point;
as shown in Figure 2: second layer lamellar body 2: also have 13, be interconnected between 13 second layer lamellar bodies 2, the center of second layer lamellar body 2 offers center pit 20, and the aperture of center pit 20 increases (1-11) from right to left successively; There are in second layer lamellar body 22 test lamellar body 21(the 12nd, 13), center pit is not offered in test lamellar body 31 center;
as shown in Figure 3: third layer lamellar body 3, also there are 13, shield, prevent blind hole from getting to other other layer.
upper, middle and lower corresponding to ground floor lamellar body 1, second layer lamellar body 2 and third layer lamellar body 3 are arranged, the center line being positioned at the ground floor lamellar body 1 of upper, middle and lower, second layer lamellar body 2 and third layer lamellar body 3 is located along the same line, and is connected by second layer lamellar body 2 corresponding with being positioned at its underpart for ground floor lamellar body 1 by plating.
(2), as shown in Figure 4,5: on ground floor lamellar body 1, carry out laser beat blind hole 4, when blind hole 4 does not have skew, can pass from the center pit of second layer lamellar body 2, if when having skew, then can beat on second layer lamellar body 2, in blind hole 4, carry out copper facing, if blind hole 4 is displaced to a certain degree, electro-coppering will make ground floor lamellar body 1, second layer lamellar body 2 links together
when carrying out offset detection:
use multimeter, multimeter is adjusted to buzzing shelves, one root table pen is connected in second layer lamellar body 2 and tests lamellar body 21(the 12nd, 13) ground floor lamellar body 1 corresponding to top, another root table pen is connected to ground floor lamellar body 1 corresponding to other lamellar body in second layer lamellar body 2 (being connected to the 11st from the 1st) top successively; If D1 is the aperture of this ground floor lamellar body 1 corresponding lower second layer lamellar body 2 center pit 20, D2 is the ring width of blind hole 4, if the size of A is respectively from the 1st to 11 in accompanying drawing 4: 1,1.25,1.5,1.75,2,2.25,2.5,2.75,3.25,3.75,4.25mil, when connecting the 1st, when test pencil does not sound, then represent side-play amount in 1mil, as the 1st non-sound, 2nd sounds, then represents side-play amount between 1-1.25mil, by that analogy.
to suppose in plate blind hole 4 ring width minimum be 2.5mil, that the 7th is not rung and then represents OK; If loudness is more than or equal to 7 sound, needs blind hole in section confirmation plate whether to have and exceed carrying, if having, need to scrap process, if without, can afterflow.
above-described embodiment, only for technical conceive of the present invention and feature are described, its object is to person skilled in the art can be understood content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences done according to Spirit Essence of the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (6)
1. a blind hole bias detecting method, is characterized in that: comprise the following steps:
(1) before, carrying out laser boring, following structure is set:
Ground floor lamellar body: there are several, separate between the ground floor lamellar body described in several;
Second layer lamellar body: identical with described ground floor lamellar body quantity, be interconnected between second layer lamellar body described in several, the center of described second layer lamellar body offers center pit, and the aperture of described center pit reduces successively, there is in described second layer lamellar body at least one test lamellar body;
By upper and lower setting corresponding to described ground floor lamellar body, second layer lamellar body, be positioned at upper and lower described ground floor lamellar body, the center line of second layer lamellar body is located along the same line;
(2), described ground floor lamellar body carry out laser beat blind hole, in blind hole, carry out copper facing, carry out offset detection:
Use multimeter, be connected to by a root table pen in described second layer lamellar body and test ground floor lamellar body corresponding to lamellar body top, another root table pen is connected to the ground floor lamellar body that in described second layer lamellar body, other lamellar body top is corresponding successively; If D1 is this ground floor lamellar body correspondence lower second layer lamellar body center pit aperture, D2 is blind hole ring width, and when the non-conducting of test pencil, the single-side shift amount of blind hole is within (D1-D2)/2; When test pencil conducting, the single-side shift amount of blind hole exceeds (D1-D2)/2.
2. blind hole bias detecting method according to claim 1, is characterized in that: described second layer lamellar body bottom is provided with the third layer lamellar body that quantity is with it identical, position is corresponding.
3. blind hole bias detecting method according to claim 1, is characterized in that: described test lamellar body is provided with two, and center pit is not offered in the test lamellar body center described in two.
4. blind hole bias detecting method according to claim 1, it is characterized in that: in step (2), test pencil is connected to the ground floor lamellar body on the large second layer lamellar body top of described center pit from the ground floor lamellar body on the little second layer lamellar body top of described center pit.
5. blind hole bias detecting method according to claim 4, it is characterized in that: when the single-side shift amount of blind hole exceeds (D1-D2)/2, test pencil is connected to the ground floor lamellar body on the large second layer lamellar body top of an adjacent center pit, when the non-conducting of test pencil, the single-side shift amount of blind hole is between the numerical value of adjacent two (D1-D2)/2, when test pencil conducting, repeat said process.
6. blind hole bias detecting method according to claim 1, it is characterized in that: multimeter is adjusted to buzzing shelves, during test pencil conducting, buzzing is sounded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210190152.3A CN102706267B (en) | 2012-06-11 | 2012-06-11 | Blind hole offset detecting method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210190152.3A CN102706267B (en) | 2012-06-11 | 2012-06-11 | Blind hole offset detecting method |
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| CN102706267A CN102706267A (en) | 2012-10-03 |
| CN102706267B true CN102706267B (en) | 2014-12-17 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103415165B (en) * | 2013-05-07 | 2016-05-11 | 胜宏科技（惠州）股份有限公司 | A kind of method of testing HDI wiring board blind hole quality |
| CN104180747A (en) * | 2013-05-21 | 2014-12-03 | 北大方正集团有限公司 | Method of detecting alignment degree of blind holes and work-in-process PCB |
| CN105115415A (en) * | 2015-07-21 | 2015-12-02 | 胜宏科技（惠州）股份有限公司 | Circuit board blind hole depth test structure and test method thereof |
| CN109526156B (en) * | 2018-11-05 | 2021-04-06 | 深圳崇达多层线路板有限公司 | Detection module and detection method for detecting deviation degree of drilling hole |
| CN109443194B (en) * | 2018-12-06 | 2023-05-12 | 奥士康科技股份有限公司 | Device and method for quantitatively detecting blind hole bottom alignment degree |
| CN113163591B (en) * | 2021-04-25 | 2023-08-22 | 东莞市五株电子科技有限公司 | HDI blind hole board test structure and HDI blind hole board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101709948A (en) * | 2009-12-23 | 2010-05-19 | 深南电路有限公司 | Alignment detecting method of multilayer printed wiring board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05226846A (en) * | 1992-02-14 | 1993-09-03 | Fujitsu Ltd | Checking method for deviation of inner layer of multilayer printed wiring board |
| JPH09205281A (en) * | 1996-01-26 | 1997-08-05 | Matsushita Electric Works Ltd | Method for inspecting inner-layer circuit pattern deviation of multilayer printed wiring board |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101709948A (en) * | 2009-12-23 | 2010-05-19 | 深南电路有限公司 | Alignment detecting method of multilayer printed wiring board |
Non-Patent Citations (1)
| Title |
|---|
| 李艳国等;高层板对位精度计算模型研究;《印制电路信息》;20110430(第4期);第47-49页 * |
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