CN206775815U - Intersect the HDI printed boards of blind hole conduction beneficial to detection - Google Patents
Intersect the HDI printed boards of blind hole conduction beneficial to detection Download PDFInfo
- Publication number
- CN206775815U CN206775815U CN201720169011.1U CN201720169011U CN206775815U CN 206775815 U CN206775815 U CN 206775815U CN 201720169011 U CN201720169011 U CN 201720169011U CN 206775815 U CN206775815 U CN 206775815U
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- blind hole
- circuit plate
- circuit board
- detection
- element circuit
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The utility model discloses the HDI printed boards for intersecting blind hole conduction beneficial to detection, simple in construction, upside outer circuit plate and downside outer circuit plate can help to protect inner layer circuit board not to be destroyed, and ensure that service life of the present utility model；Shifting to install for blind hole can help the regular distribution of blind hole, layout is simple, detection for blind hole conduction is provided convenience, and penetrating element circuit board quantity is arranged on downside outer circuit plate for the blind hole of odd number, penetrating element circuit board quantity is arranged on upside outer circuit plate for the blind hole of even numbers, the blind hole that can preferably distinguish one from the other connects several layers of element circuit plates, is easy to user to operate；Using the plating metal electrodeposited coating in blind hole inwall, and electrodeposition of metals is the copper material through being washed away frequently with circuit board so that the utility model is not in due to detection of the interference automatic optical detection device such as bubble that tradition carries out blind hole consent with resin material and occurs for blind hole.
Description
Technical field
Printed circuit board arrangement field is the utility model is related to, is specially beneficial to the HDI prints that detection intersects blind hole conduction
Making sheet.
Background technology
Under the trend of the continuous micro of internal electron part of electronic installation, the circuit board often storehouse circuit of several layers
Structure, and when the circuit of different interlayers has the conducting demand of interconnection, it will be opened up on the insulation system between two layer conductors
One blind hole, the bottom of the blind hole can manifest the conductive junction point of lower sandwich circuit, then by filling up in conductive materials to the blind hole,
To be electrically connected with the wire of the conductive junction point of the lower sandwich circuit and the upper layer circuit, blind hole is located at top layer and the bottom of printed substrate
Layer surface, there is certain depth, for the connection of surface line and following internal layer circuit, the depth in hole is typically not greater than certain
Ratio (aperture).
Traditional HDI printed boards easily attach dirt in manufacturing process when opening up blind hole to the conductive junction point of bottom
Or the conductive junction point is even damaged, however, when existing automatic optics inspection carries out outward appearance detection to circuit board, often because blind
It is difficult to be irradiated to luminous ray in hole and causes the difficulty in the conductive junction point image acquirement of the blind via bottom, traditional HDI
Blind hole in printed board is unfavorable for being detected the conduction for intersecting blind hole.
Utility model content
The purpose of this utility model is to provide the HDI printed boards for intersecting blind hole conduction beneficial to detection, above-mentioned to solve
The problem of being proposed in background technology.
To achieve the above object, the utility model provides following technical scheme：Intersect the HDI of blind hole conduction beneficial to detection
Printed board, including HDI printed board main bodys, the HDI printed boards main body include inner layer circuit board, on the upside of inner layer circuit board
Upside outer circuit plate, the downside outer circuit plate on the downside of inner layer circuit board, the inner layer circuit board include several phases
The element circuit plate being mutually superimposed, it is provided through in the blind hole of one or more element circuit plates between the element circuit plate.
Pass through above-mentioned technical proposal, upside outer circuit plate and downside outer circuit plate can help to protect inner layer circuit board
It is not destroyed, ensure that service life of the present utility model, reduces risk in transit of the present utility model.
Preferably, one fewer than element circuit plate quantity of the blind hole quantity, the blind hole diameter are 1.5-1.7 millimeters,
Testing weld pad is provided with the blind hole.
Pass through above-mentioned technical proposal, element circuit plate is if N number of, then the quantity of blind hole is that (N-1) is individual, so can be with
By minimum blind hole come the element circuit plate of random layer；The setting of testing weld pad can improve the convenience of detection.
Preferably, the blind hole is dislocatedly distributed in upside outer circuit plate upper surface and downside outer circuit plate following table up and down
Face, the quantity of the blind hole penetrating element circuit board is increased successively by quantity two to element circuit plate total number, and penetrating element
Circuit board quantity is arranged on downside outer circuit plate for the blind hole of odd number, and penetrating element circuit board quantity is set for the blind hole of even numbers
In upside outer circuit plate.
Pass through above-mentioned technical proposal, shifting to install for blind hole can help the regular distribution of blind hole so that this practicality is new
Blind hole layout on the HDI customization plates of type is simple, is provided convenience for the detection of blind hole conduction, and penetrating element circuit board number
The blind hole measured as odd number is arranged on downside outer circuit plate, and penetrating element circuit board quantity is arranged on outside upside for the blind hole of even numbers
Layer circuit board, the blind hole that can preferably distinguish one from the other connect several layers of element circuit plates, are easy to user to operate.
Preferably, the metal level being provided with the blind hole inwall after metallization.
Preferably, the metal level is layers of copper.
Pass through above-mentioned technical proposal, the utility model use the plating metal electrodeposited coating in blind hole inwall, and metal plating
Layer is through the copper material that is washed away frequently with circuit board so that the utility model is not in because tradition is carried out with resin material
Blind hole consent and detection of the interference automatic optical detection device such as bubble for occurring for blind hole.
Compared with prior art, the beneficial effects of the utility model are：The utility model is simple in construction, upside outer circuit
Plate and downside outer circuit plate can help to protect inner layer circuit board not to be destroyed, and ensure that service life of the present utility model,
Reduce risk in transit of the present utility model；Shifting to install for blind hole can help the regular distribution of blind hole so that this reality
It is simple with the blind hole layout on new HDI customization plates, provided convenience for the detection of blind hole conduction, and penetrating element circuit
Plate quantity is arranged on downside outer circuit plate for the blind hole of odd number, and penetrating element circuit board quantity is arranged on for the blind hole of even numbers
Side outer circuit plate, the blind hole that can preferably distinguish one from the other connect several layers of element circuit plates, are easy to user to operate；Using in blind hole
Plating metal electrodeposited coating in inwall, and electrodeposition of metals is the copper material through being washed away frequently with circuit board so that this practicality is new
Type is not in because bubble that tradition carries out blind hole consent with resin material and occurs etc. disturbs automatic optical detection device pair
In the detection of blind hole.
Brief description of the drawings
Fig. 1 is that figure is cutd open in the overall structure side of the utility model embodiment one；
Fig. 2 is the top view of the utility model embodiment two.
In figure：1-HDI printed board main bodys；2- inner layer circuit boards；Outer circuit plate on the upside of 3-；Outer circuit plate on the downside of 4-；
5- element circuit plates；6- blind holes；7- testing weld pads；8- metal levels.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Embodiment one：
The utility model provides a kind of technical scheme：Intersect the HDI printed boards of blind hole conduction, including HDI beneficial to detection
Printed board main body 1, the HDI printed boards main body 1 include inner layer circuit board 2, the upside outer layer electricity positioned at the upside of inner layer circuit board 2
Road plate 3, the downside outer circuit plate 4 positioned at the downside of inner layer circuit board 2, the inner layer circuit board 2 are overlapped mutually including several
Element circuit plate 5, be provided through in the blind hole 6 of one or more element circuit plates, upside between the element circuit plate 5
Outer circuit plate 3 and downside outer circuit plate 4 can help to protect inner layer circuit board 2 not to be destroyed, and ensure that the utility model
Service life, reduce risk in transit of the present utility model.
Further, one fewer than the quantity of element circuit plate 5 of the quantity of blind hole 6,6 a diameter of 1.5-1.7 of blind hole
Millimeter, is provided with testing weld pad 7 in the blind hole 6, and element circuit plate is if N number of, then the quantity of blind hole is that (N-1) is individual, so
One can be by minimum blind hole 6 come the element circuit plate 5 of random layer；The setting of testing weld pad 7 can improve detection just
Victory.
Further, the blind hole is dislocatedly distributed about 6 in the upper surface of upside outer circuit plate 3 and downside outer circuit plate
4 lower surfaces, the quantity of the penetrating element circuit board 5 of blind hole 6 are increased successively by quantity two to the total number of element circuit plate 5, and
The quantity of penetrating element circuit board 5 is arranged on downside outer circuit plate 4 for the blind hole 6 of odd number, and the quantity of penetrating element circuit board 5 is double
Several blind holes 6 is arranged on upside outer circuit plate 3, and shifting to install for blind hole 6 can help 6 regular distribution of blind hole so that
Blind hole 6 in HDI customization plates main body 1 of the present utility model is laid out simply, is provided convenience for the detection of the conduction of blind hole 6, and
The quantity of penetrating element circuit board 5 is arranged on downside outer circuit plate 4 for the blind hole 6 of odd number, and the quantity of penetrating element circuit board 5 is double
Several blind holes 6 is arranged on upside outer circuit plate 3, and the blind hole 6 that can preferably distinguish one from the other connects several layers of element circuit plates 5, is easy to
User operates.
Further, the metal level 8 being provided with the inwall of blind hole 6 after metallization, the metal level 8 is layers of copper, this
Utility model uses the electroplated metal layer 8 in the inwall of blind hole 5, and electrodeposition of metals is the copper material through being washed away frequently with circuit board
Matter so that the utility model is not in because the interference such as the bubble that tradition carries out blind hole consent with resin material and occurs are automatic
Detection of the optical detection apparatus for blind hole.
As shown in figure 1, the number of the element circuit plate 5 used in the present embodiment is four, it is as shown in the above, then blind
The number that hole 6 is set is three.
Embodiment 2：The structure, principle and implementation steps of the present embodiment are similar with embodiment one, and different places are：
In the present embodiment, as shown in Fig. 2 the element circuit plate 5 used in the present embodiment is five, the number that blind hole 6 is set
Measure as four.
The utility model is when coming into operation：Blind hole 6 according to the upper and lower surface of HDI customization plates main body 1 is arranged in is entered
Row judges, can effectively and substantially distinguish the element circuit plate 5 of the connection of blind hole 6, can be docked by testing weld pad 7 with blind hole,
Carry out the test conduction of blind hole 6.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from principle of the present utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (3)
1. intersect the HDI printed boards of blind hole conduction beneficial to detection, including HDI printed boards main body (1), it is characterised in that：It is described
HDI printed boards main body (1) includes inner layer circuit board (2), the upside outer circuit plate (3) on the upside of inner layer circuit board (2), position
Downside outer circuit plate (4) on the downside of inner layer circuit board (2), the inner layer circuit board (2) include what several were overlapped mutually
Element circuit plate (5), the blind hole (6) in one or more element circuit plates is provided through between the element circuit plate (5),
Blind hole (6) quantity is described blinder than few one of element circuit plate (5) quantity, a diameter of 1.5-1.7 millimeters of blind hole (6)
Testing weld pad (7) is provided with hole (6), the blind hole (6) is dislocatedly distributed in upside outer circuit plate (3) upper surface with up and down
Side outer circuit plate (4) lower surface, the quantity of blind hole (6) the penetrating element circuit board (5) is by quantity two to element circuit plate
(5) total number increases successively, and penetrating element circuit board (5) quantity is arranged on downside outer circuit plate for the blind hole (6) of odd number
(4), penetrating element circuit board (5) quantity is arranged on upside outer circuit plate (3) for the blind hole (6) of even numbers.
2. the HDI printed boards according to claim 1 for being beneficial to detection and intersecting blind hole conduction, it is characterised in that：It is described blind
The metal level (8) being provided with hole (6) inwall after metallization.
3. the HDI printed boards according to claim 2 for being beneficial to detection and intersecting blind hole conduction, it is characterised in that：The gold
It is layers of copper to belong to layer (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720169011.1U CN206775815U (en) | 2017-02-24 | 2017-02-24 | Intersect the HDI printed boards of blind hole conduction beneficial to detection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720169011.1U CN206775815U (en) | 2017-02-24 | 2017-02-24 | Intersect the HDI printed boards of blind hole conduction beneficial to detection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206775815U true CN206775815U (en) | 2017-12-19 |
Family
ID=60647209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720169011.1U Active CN206775815U (en) | 2017-02-24 | 2017-02-24 | Intersect the HDI printed boards of blind hole conduction beneficial to detection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206775815U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110611989A (en) * | 2019-10-29 | 2019-12-24 | 业成科技（成都）有限公司 | Circuit board and electronic device |
| CN113015338A (en) * | 2021-02-26 | 2021-06-22 | 成都明天高新产业有限责任公司 | Circuit board with crossed blind holes and processing method thereof |
-
2017
- 2017-02-24 CN CN201720169011.1U patent/CN206775815U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110611989A (en) * | 2019-10-29 | 2019-12-24 | 业成科技（成都）有限公司 | Circuit board and electronic device |
| CN113015338A (en) * | 2021-02-26 | 2021-06-22 | 成都明天高新产业有限责任公司 | Circuit board with crossed blind holes and processing method thereof |
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