CN113015338A - Circuit board with crossed blind holes and processing method thereof - Google Patents
Circuit board with crossed blind holes and processing method thereof Download PDFInfo
- Publication number
- CN113015338A CN113015338A CN202110218398.6A CN202110218398A CN113015338A CN 113015338 A CN113015338 A CN 113015338A CN 202110218398 A CN202110218398 A CN 202110218398A CN 113015338 A CN113015338 A CN 113015338A
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- core
- hole
- copper
- board
- pressing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to the technical field of circuit board processing, and discloses a circuit board with crossed blind holes and a processing method thereof, wherein the processing method comprises the following steps; drilling a first through hole on the second core plate, depositing copper, electroplating, and plugging with resin; laminating one surface of the second core plate and the first semi-solidified sheet together and pressing; after pressing, one surface of the first semi-cured sheet, which is far away from the second core board, is plated with a copper foil; after pressing, drilling a second through hole and depositing copper for electroplating; laminating the first core board, the second prepreg and the other surface of the second core board after copper deposition and electroplating together and pressing; and drilling a third through hole on the first core plate and the second solidified sheet after pressing, and depositing copper for electroplating, wherein the third through hole corresponds to the first through hole. The invention adopts a mode of drilling the through hole first and then controlling the depth, the depth of the generated blind hole is shallow, the subsequent copper deposition and electroplating can not be influenced, and the yield of the circuit board is further ensured.
Description
Technical Field
The invention belongs to the technical field of circuit board processing, and particularly relates to a circuit board with crossed blind holes and a processing method thereof.
Background
The crossed blind holes refer to two different blind holes in the same layer of the circuit board. The arrangement of the crossed blind holes can improve the welding density, and the crossed blind holes are mainly used for reducing the transmission of signal lines, reducing the cost and simultaneously reducing the physical space and the weight.
The current processing method of the circuit board cross blind hole comprises the steps of carrying out press fitting on a multilayer core board and a prepreg and then drilling holes at one time through laser drilling to form the circuit board cross blind hole, wherein in the copper deposition process of the formed deep blind hole, liquid medicine cannot be fully exchanged to cause incomplete copper deposition, and further to cause generation of sand holes. In addition, in the deep blind hole copper electroplating process, the thickness of a plating layer can not reach the standard due to insufficient exchange of liquid medicine, and the circuit board is scrapped.
Disclosure of Invention
Therefore, an object of the present invention is to provide a method for processing a circuit board having crossed blind holes, so as to solve the problem that the circuit board is easily scrapped due to incomplete chemical solution exchange in the copper deposition and copper plating process of the current deep blind holes formed by drilling at one time. By adopting the processing method of the circuit board with the crossed blind holes, the mode of firstly drilling the through holes and then drilling the through holes is adopted, the depth of the generated blind holes is shallow, subsequent copper deposition and electroplating cannot be influenced, and the yield of the circuit board is further ensured.
The specific contents are as follows:
the processing method of the circuit board with the crossed blind holes is characterized in that the circuit board is formed by integrally processing a first core board and a second core board in a pressing mode, and comprises the following steps:
s1 first core plate
The first core board is a double-sided copper-clad board;
s2 second core board
The second core plate is a double-sided copper-clad plate, and the second core plate is drilled with a first through hole, plated with copper, plated with resin and plugged with holes;
s3 second core board pressing
Laminating one surface of the second core plate and the first semi-solidified sheet in the step S2 and pressing; after pressing, one surface of the first semi-cured sheet, which is far away from the second core board, is plated with a copper foil; after pressing, drilling a second through hole and depositing copper for electroplating;
s4 pressing the first core board and the second core board
Laminating the first core board in the step S1, the second prepreg and the other surface layer of the second core board plated with the copper in the step S3 together and pressing; and drilling a third through hole on the first core plate and the second solidified sheet after pressing, and depositing copper for electroplating, wherein the third through hole corresponds to the first through hole.
The beneficial effects of the invention are as follows:
the invention converts circuit board pressing into batch pressing, converts cross blind holes into through holes for processing, and specifically, a first through hole is manufactured on a second core board firstly, then the second through hole is manufactured by pressing with a first prepreg, and then the pressed second core board is pressed with the first core board and a second prepreg again; and after lamination, the first core plate and the second curing sheet are provided with a third through hole, and the third through hole is communicated with the first through hole, so that the first through hole is converted into a blind hole. And, the copper plating is carried out in advance at the first through hole, so that the feasibility of deep drilling during the manufacturing of the third through hole can be ensured, and the processing technology of the crossed blind hole is further realized. The mode of drilling through holes first and then controlling the depth is adopted, the depth of the produced blind holes is shallow, subsequent copper deposition and electroplating cannot be influenced, and the yield of the circuit board is further ensured.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board with cross blind holes in an embodiment.
Reference numerals:
100-a first core board, 200-a second core board, 300-a first prepreg, 400-a second prepreg, 510-a first through hole, 520-a second through hole, 530-a third through hole, 540-a fourth through hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
Examples
The embodiment provides a processing method of a circuit board with crossed blind holes, the processed circuit board is formed by integrally pressing a first core board 100 and a second core board 200, and the specific processing method is as follows:
s1 first core plate
The first core board 100 is a double-sided copper-clad board, that is, a copper foil layer is coated on both sides of the first core board 100. Before the first core plate 100 is processed, the thickness of the copper foil layer is electroplated to the processing thickness. In the first core plate 100, the copper foil layer has a thickness of 25 μm.
The first core board 100 is subjected to laser coding, film pattern exposure, inner layer etching, optical inspection, and browning treatment.
S2 second core board
The second core board 200 is a double-sided copper-clad board, that is, the copper foil layers are covered on both sides of the second core board 200. In the second core board 200, the thickness of the copper foil layer is 18 μm.
Before the second core board 200 is processed, the copper reduction processing is performed to reduce the copper to 10 μm. This is because the two sides of the second core board 200 are mostly made by chemical etching, and in the etching process, since the chemical etching has no directionality, there is also lateral etching in the longitudinal etching process, so that the line precision is not controlled, and therefore, copper reduction processing is required. Copper reduction adopts a chemical reaction mode to reduce the thickness of the copper foil, but the thickness of the copper foil is not easy to be too thin, because if the thickness is too thin, the situation of scratching and breaking lines in the subsequent processing process is easy to occur.
After the copper reduction treatment, drilling a first through hole 510 on the second core board 200, and carrying out copper deposition, backlight detection, pre-plating of hole copper to 25 mu m, hole plugging, curing and polishing, film pattern exposure, electroplating, inner layer etching, inspection and browning treatment.
S3 second core board pressing
Laminating one surface of the browned second core board 200 and the first semi-cured sheet 300 together and pressing the laminated second core board 200 in the step S2, wherein one surface of the first semi-cured sheet 300 away from the second core board 200 is plated with a copper foil; after the pressing, the copper reduction process is performed to reduce the copper to 18 μm, because the copper thickness on the surface of the second core board 200 after the copper deposition and electroplating process of the second core board 200 in S2 may exceed 35 μm, which is not favorable for the manufacture of high-precision copper lines, and therefore the copper reduction process is required. The copper is reduced to 18 mu m, and the aim is that the thickness of the copper foil with 18 mu m is commonly used for printing plates, and if the thickness is thinner, the copper foil is easy to scratch and discard in the subsequent manufacturing process.
After the copper reduction treatment, drilling a second through hole 520 for the second core plate 200 and the second prepreg 400 after pressing, and performing copper deposition, pre-plating hole copper to 25 μm, film pattern exposure, electroplating, inner layer etching, optical inspection and browning treatment after drilling.
S4 pressing the first core board and the second core board
Overlapping and pressing the first core board 100, the second prepreg 400 in the step S1 and the other surface of the second core board 200 subjected to the browning treatment in the step S3; and drilling a third through hole 530 on the laminated first core plate 100 and the second solidified sheet, and depositing copper and electroplating, wherein the third through hole 530 corresponds to the first through hole 510, so that the first through hole 510 is communicated with the third through hole 530.
The copper plate surface of the first core plate 100 far from the second prepreg 400 is subjected to copper reduction treatment after lamination and before drilling the third through hole 530, and the copper is reduced to 25 micrometers, so that the copper reduction treatment aims to manufacture a high-fineness circuit, and a thicker cladding copper layer needs to be formed at the hole opening due to the existence of a blind hole layer for resin hole plugging, and the copper reduction treatment needs to be carried out to 25 micrometers (the thickness of copper in the hole is required to reach 25 micrometers) for subsequent welding, which can resist the high-temperature impact of a column.
After the third through hole 530 is drilled, the fourth through hole 540 is drilled on the first core board 100, the second half-board curing sheet, the second core board 200 and the first half-curing sheet 300, and outer layer process processing is performed, wherein the outer layer process includes pattern transfer, development, electroplating, etching, semi-finished product detection, solder resist ink printing, exposure development, character printing, baking, hot air leveling, molding, detection and other printed circuit board outer layer processing technologies.
In this embodiment, the first through hole 510 to the third through hole 530 are all formed by laser depth control drilling.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. The processing method of the circuit board with the crossed blind holes is characterized in that the circuit board is formed by integrally processing a first core board and a second core board in a pressing mode, and comprises the following steps:
s1 first core plate
The first core board is a double-sided copper-clad board;
s2 second core board
The second core plate is a double-sided copper-clad plate, and the second core plate is drilled with a first through hole, plated with copper, plated with resin and plugged with holes;
s3 second core board pressing
Laminating one surface of the second core plate and the first semi-solidified sheet in the step S2 and pressing; after pressing, one surface of the first semi-cured sheet, which is far away from the second core board, is plated with a copper foil; after pressing, drilling a second through hole and depositing copper for electroplating;
s4 pressing the first core board and the second core board
Laminating the first core board in the step S1, the second prepreg and the other surface layer of the second core board plated with the copper in the step S3 together and pressing; and drilling a third through hole on the first core plate and the second solidified sheet after pressing, and depositing copper for electroplating, wherein the third through hole corresponds to the first through hole.
2. The method of claim 1, wherein in step S1, the first core is processed by laser coding, pattern exposure, inner layer etching, inspection, and browning.
3. The method for processing a circuit board having crossed blind vias as claimed in claim 1, wherein in S2, before the second core board is laminated, the thickness of the copper foil layers on both surfaces of the second core board is reduced by microetching.
4. The method for processing a circuit board having intersecting blind vias as defined in claim 3, wherein in S2, the copper reduction treatment is performed by a chemical reaction.
5. The method for processing a circuit board having intersecting blind vias as defined in claim 1 or 3, wherein in S2, the second core board is subjected to a back light detection after copper deposition.
6. The method for processing a circuit board having intersecting blind vias as claimed in claim 1 or 3, wherein in S2, the second core board is subjected to resin plugging treatment, curing polishing, film pattern exposure, electroplating, inner layer etching, optical inspection, and browning treatment.
7. The method for processing a circuit board with crossed blind holes according to claim 1, wherein in S4, the copper reduction treatment is performed on the surface of the first core board away from the copper plate of the second prepreg after the pressing and before the drilling of the third through hole.
8. The method of claim 1, wherein in step S4, after drilling the third through hole, the first core board, the second half-board cured sheet, the second core board and the first half-cured sheet are drilled with the fourth through hole, and then outer layer processing is performed.
9. A circuit board having intersecting blind holes, produced by the method of any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110218398.6A CN113015338B (en) | 2021-02-26 | 2021-02-26 | Circuit board with crossed blind holes and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110218398.6A CN113015338B (en) | 2021-02-26 | 2021-02-26 | Circuit board with crossed blind holes and processing method thereof |
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| Publication Number | Publication Date |
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| CN113015338A true CN113015338A (en) | 2021-06-22 |
| CN113015338B CN113015338B (en) | 2023-01-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110218398.6A Active CN113015338B (en) | 2021-02-26 | 2021-02-26 | Circuit board with crossed blind holes and processing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113630984A (en) * | 2021-07-13 | 2021-11-09 | 广东世运电路科技股份有限公司 | Method for filling copper plating hole with high thickness-diameter ratio and core plate |
| CN114286541A (en) * | 2021-11-16 | 2022-04-05 | 苏州浪潮智能科技有限公司 | HDI board processing method, HDI board and electronic equipment |
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| CN1937886A (en) * | 2005-09-20 | 2007-03-28 | 陈文祺 | High-layer circuit board and its manufacturing method |
| KR20090099712A (en) * | 2008-03-18 | 2009-09-23 | (주)유현전자 | Manufacture method of both side printed circuit board, using single side copper clad laminate |
| CN102523704A (en) * | 2011-12-15 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Production method of multi-stage HDI plate |
| CN206775815U (en) * | 2017-02-24 | 2017-12-19 | 昆山苏杭电路板有限公司 | Intersect the HDI printed boards of blind hole conduction beneficial to detection |
| CN108235601A (en) * | 2017-12-04 | 2018-06-29 | 深南电路股份有限公司 | PCB intersects method for processing blind hole and with the PCB for intersecting blind hole |
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2021
- 2021-02-26 CN CN202110218398.6A patent/CN113015338B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1937886A (en) * | 2005-09-20 | 2007-03-28 | 陈文祺 | High-layer circuit board and its manufacturing method |
| KR20090099712A (en) * | 2008-03-18 | 2009-09-23 | (주)유현전자 | Manufacture method of both side printed circuit board, using single side copper clad laminate |
| CN102523704A (en) * | 2011-12-15 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Production method of multi-stage HDI plate |
| CN206775815U (en) * | 2017-02-24 | 2017-12-19 | 昆山苏杭电路板有限公司 | Intersect the HDI printed boards of blind hole conduction beneficial to detection |
| CN108235601A (en) * | 2017-12-04 | 2018-06-29 | 深南电路股份有限公司 | PCB intersects method for processing blind hole and with the PCB for intersecting blind hole |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113630984A (en) * | 2021-07-13 | 2021-11-09 | 广东世运电路科技股份有限公司 | Method for filling copper plating hole with high thickness-diameter ratio and core plate |
| CN114286541A (en) * | 2021-11-16 | 2022-04-05 | 苏州浪潮智能科技有限公司 | HDI board processing method, HDI board and electronic equipment |
| CN114286541B (en) * | 2021-11-16 | 2023-08-11 | 苏州浪潮智能科技有限公司 | Processing method of HDI board, HDI board and electronic equipment |
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| CN113015338B (en) | 2023-01-10 |
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