CN105934110B - The sandwich structure and method for producing multi-layer board of ultra-thin multi-layer board processing - Google Patents
The sandwich structure and method for producing multi-layer board of ultra-thin multi-layer board processing Download PDFInfo
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- CN105934110B CN105934110B CN201610403486.2A CN201610403486A CN105934110B CN 105934110 B CN105934110 B CN 105934110B CN 201610403486 A CN201610403486 A CN 201610403486A CN 105934110 B CN105934110 B CN 105934110B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1484—Simultaneous treatments, e.g. soldering lead-in-hole components simultaneously with surface mounted components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention provides a kind of method that multi-layer board makes, and is first pressed together on a loading plate upper and lower surface two double face coppers by the second prepreg, third prepreg low temperature, forms the sandwich structure of ultra-thin multi-layer board processing；Then the blind hole in upper and lower double face copper is formed by laser drill in the sandwich structure upper and lower surface of ultra-thin multi-layer board processing；Then the another side circuit in two double face coppers is formed by metallization in the structure of step S5；Then in the sandwich structure upper and lower surface of ultra-thin multi-layer board processing by two outer copper foils by the 4th prepreg, the 5th prepreg high-temperature laminating, form sandwich structure after solidification；Two four-layer circuit board structures are formed on the outside of the release film of loading plate；Finally two four-layer circuit board structures on the outside of the release film of loading plate are peeled.The present invention can reduce technology difficulty, once manufacture two circuit boards, improve efficiency；It solves to make the warpage issues that substrate generates.
Description
Technical field
The present invention relates to a kind of processing technology, the processing technology of ultra-thin wiring board below especially a kind of 80 μ m thick.
Background technology
Thickness is difficult in 80 μm of circuit board through-hole filling perforation manufactures below, is difficult to fill up hole by plating, thus, it can not
It completes multi-layer board and folds hole, it is difficult to the problem of completing plating filling perforation.
The ultra thin plate processing processing on the common horizontal line of substrate below of 80 μ m thicks will appear folded plate and snap-gauge, seriously
There is the plate that gives up in Shi Jiyi.
Thickness can form aperture in copper-clad plate by laser drill and be less than in 80 μm of double face coppers below at present
100 μm of through-hole, and this small through hole needs to carry out electro-coppering filling perforation, it is desirable that and without cavity in hole, and the thickness of core plate is small
In 80 μm of wiring board, multi-layer board is made, it is desirable that carry out the folded hole machined of multistage blind hole.But conventional filling perforation plating, no matter
It is whole plate plating or graphic plating, cannot be satisfied the requirement of filling up of the electroplates in hole, face copper has plated very thick, and through-hole is not yet
It can fill up.Then it has been proposed that a kind of technology of two-sided through-hole.Using the method for laser defocus, laser spot is placed on two-sided cover
It at a certain distance from copper coin surface, allows the copper face of processing not in focus, the blind of inverted trapezoidal is made a call in the side of double face copper
Hole, then double face copper is turned over, the inverted trapezoidal blind hole back of the body of another and front is formed with same method in same position
To the inverted trapezoidal blind hole of the back of the body, by the deep processing of second inverted trapezoidal blind hole to the blind hole unicom with opposite, a waist drum is formed
The through-hole of type, i.e., so-called butterfly hole；As shown in Figure 1；Label 1 ' is the copper foil of double face copper in Fig. 1, and label 2 ' is core plate,
Label 3 ' is butterfly hole；
It after this butterfly hole 3 ' forms the via hole by electroless copper, then is electroplated, due to the hole among through-hole
Diameter is small, forms two, both sides blind hole so being gradually closed with the lengthening of electroplating time, among through-hole, finally fills out the electroplates in hole
It is full；As shown in Figure 2；
It can be seen in fig. 2 that with the extension of time, electro-coppering 4 ' gradually fills up through-hole 3 '.Though this method can be with
Realize the electroplates in hole, still, technology difficulty is larger, and there are probelem in two aspects：
1, due to being that defocus mode or other modes is used to manufacture the hole of inverted trapezoidal, technique controlling difficulty is larger, it is desirable that double
The consistency of thickness of panel is good, and the fluctuating of laser drill machine table top is small, and particle and dust etc. influence processing serious in processing.
2, positive and negative aperture aligning accuracy requires height, if positive and negative misplaces, can be had an impact to plating.As it can be seen that such
Control process difficulty is big, and consistency and repeated and environmental requirement are high.
Invention content
It is an object of the present invention to overcome the shortcomings of the prior art and provide the three of a kind of ultra-thin multi-layer board processing
Mingzhi's structure and method for producing multi-layer board solve the technical barrier of the electroplates in hole of the ultra-thin wiring board of 80 μ m thicks or less, will
Through-hole process change is processed at through core plate blind hole, is become the common blind hole plating of circuit-board industry, is simplified technique, reduce technique
Difficulty；By the interim bonding structure of loading plate, ultra-thin double face copper process change is processed as slab, avoid snap-gauge and
Folded plate；It can avoid being manufactured the warpage issues of substrate generation with the interim bonding structure of loading plate；The technical solution adopted by the present invention
It is：
A kind of method that multi-layer board makes, includes the following steps：
Step S1 provides two double face coppers；First prepreg is placed among two double face coppers, low temperature pressing
Three layers of interim bonding structure are formed, wherein the first prepreg is uncured；
Step S2 makes circuit in the upper outer lower face surface of three layers of interim bonding structure；
Step S3 opens two double face coppers from the first prepreg, forms two electricity with single side circuit
Road plate；
Step S4 is low by the second prepreg, third prepreg by two double face coppers with single side circuit
Temperature is pressed together on a loading plate upper and lower surface, the formation interim bonding structure of loading plate, and the three of as ultra-thin multi-layer board processing
Mingzhi's structure；The established single side circuit of double face copper is inwardly towards loading plate when pressing；Second prepreg, third
Prepreg is uncured；
The loading plate includes intermediate core plate, is pressed together on the loading plate copper foil on intermediate core plate two sides；Intermediate core plate two sides
It is covered with release film above loading plate copper foil；Release film outer side covering has copper foil support plate；
Step S5, it is two-sided above and below the sandwich structure upper and lower surface of ultra-thin multi-layer board processing is formed by laser drill
Blind hole in copper-clad plate；
Step S6 forms the another side circuit in two double face coppers in the structure of step S5 by metallization；
Then two outer copper foils are passed through by step S7 in the sandwich structure upper and lower surface of ultra-thin multi-layer board processing
Four prepregs, the 5th prepreg high-temperature laminating form sandwich structure after solidification；
Two four-layer circuit board structures are formed on the outside of the release film of loading plate；
Step S9 peels two four-layer circuit board structures on the outside of the release film of loading plate.
Further, in step S1, the temperature of low temperature pressing is at 80 DEG C~140 DEG C.
Further, in step S4, the temperature of low temperature pressing is at 80 DEG C~140 DEG C.
Further, in step S5, removing glue Slag treatment is carried out in blind hole.
Further, step S6 is specifically included：
Step S6.1 removes face copper on the sandwich structure for the ultra-thin multi-layer board processing for making blind hole；
Step S6.2, the then sandwich structure Electroless copper of the ultra-thin multi-layer board processing after removing face copper,
Form chemical plating copper layer；
Step S6.3 is lithographically formed graphic plating on the sandwich structure of the ultra-thin multi-layer board processing after copper coating
Mask；
Step S6.4 carries out graphic plating, forms the sandwich knot of ultra-thin multi-layer board processing using graphic plating mask
The another side circuit of two double face coppers on structure；
Step S6.5, stripping：Remove the graphic plating mask formed in step S6.3；
Step S6.6, with the chemical plating copper layer under the method removal graphic plating mask for dodging erosion.
A kind of sandwich structure of the ultra-thin multi-layer board processing formed in above-mentioned manufacture craft, including：
Loading plate, the loading plate include intermediate core plate, are pressed together on the loading plate copper foil on intermediate core plate two sides；Intermediate core plate
It is covered with release film above the loading plate copper foil on two sides；Release film outer side covering has copper foil support plate；
Two double face coppers with single side circuit are pressed together on institute by the second prepreg, third prepreg low temperature
It states on loading plate upper and lower surface, forms the interim bonding structure of loading plate；
When low temperature presses, the second prepreg, third prepreg are uncured, double face copper established list when pressing
On the inside of upper thread road direction.
The advantage of the invention is that：
1）The present invention processes through-hole process change at through core plate blind hole, and the copper at the back side retains, directly by the electroplates in hole,
Become the common blind hole plating of circuit-board industry.Simplify technique, reduces technology difficulty.
2）By the interim bonding structure of loading plate, ultra-thin double face copper process change is processed as slab, is avoided
Snap-gauge and folded plate.
3）By loading plate transition, two circuit boards are once manufactured, efficiency is improved.
4）The four-layer circuit board of formation has the good symmetry in structure, effectively avoids with the interim bonding structure of loading plate
Manufacture the warpage issues that substrate generates.
Description of the drawings
Fig. 1 is that the prior art makes through-hole schematic diagram in ultrathin double-face copper-clad plate.
Fig. 2 is that filling perforation schematic diagram is electroplated in ultrathin double-face copper-clad plate in the prior art.
Fig. 3 is that the low temperature of the present invention presses the interim bonding structural schematic diagram of two three layers of double face coppers formation.
Fig. 4 is the present invention in three layers of interim bonding body structure surfaces making conspectus.
Fig. 5 is that two double face coppers of the present invention are opened to form two with single side circuit from the first prepreg
Circuit board schematic diagram.
Fig. 6 is that the sandwich structure of the ultra-thin multi-layer board processing of the present invention forms schematic diagram.
Fig. 7 is the sandwich structure drilling blind hole schematic diagram in ultra-thin multi-layer board processing of the present invention.
Fig. 8 is that the sandwich structure of the ultra-thin multi-layer board processing of the present invention removes face copper schematic diagram.
Fig. 9 is that the sandwich structure surface of the ultra-thin multi-layer board processing of the present invention forms chemical plating copper layer schematic diagram.
Figure 10 is that graphic plating mask schematic diagram is made on the sandwich structure of the ultra-thin multi-layer board processing of the present invention.
Figure 11 is that the graphic plating of the present invention forms two double-sided copper-clads on the sandwich structure of ultra-thin multi-layer board processing
The another side conspectus of plate.
Figure 12 removes graphic plating mask schematic diagram on the sandwich structure for the ultra-thin multi-layer board processing of the present invention.
Figure 13 is the chemical plating copper layer schematic diagram under the removal graphic plating mask of the present invention.
Figure 14 is the sandwich structure and prepreg and outer copper foil high-temperature high-pressure of the ultra-thin multi-layer board processing of the present invention
Close sandwich structure schematic diagram after forming solidification.
Figure 15 is the four-layer circuit board schematic diagram after separation.
Specific implementation mode
With reference to specific drawings and examples, the invention will be further described.
The present embodiment introduces the sandwich structure of ultra-thin multi-layer board processing, and is used using this ultra-thin multi-layer board processing
Sandwich structure carry out multi-layer board making method；
The method that multi-layer board makes, includes the following steps：
Step S1 provides two ultrathin double-face copper-clad plates 1,2；First prepreg 3 is placed in two double face coppers 1,2
Between, low temperature presses to form three layers of interim bonding structure, wherein the first prepreg 3 is uncured；The temperature of low temperature pressing is at 80 DEG C
~140 DEG C；As shown in Figure 3；
Ultrathin double-face copper-clad plate this example refers to 80 μm of double face coppers below；
The prepreg used in the present invention can be the prepreg of FR4, BT prepregs, and RCC removes the half of copper foil
Solidified resin piece；
By taking double face copper 1 as an example, the structure of double face copper includes the layers of copper 102,103 on core plate 101 and core plate two sides；
Step S2 makes circuit in the upper outer lower face surface of three layers of interim bonding structure, forms structure as shown in Figure 4；Fig. 4
Middle label 4 and 5 is the circuit that formation is made on three layers of interim bonding structure；
Step S3 opens two double face coppers 1,2 from the first prepreg 3, and forming two has single side circuit
Circuit board；As shown in Figure 5；
Step S4, as shown in fig. 6, by two double face coppers 1,2 with single side circuit by the second prepreg 6,
7 low temperature of third prepreg is pressed together on 8 upper and lower surface of loading plate, forms the interim bonding structure of loading plate, as ultra-thin
The sandwich structure of multi-layer board processing；As shown in Figure 6；Double face copper 1,2 established single side circuits are inwardly when pressing
I.e. towards loading plate 8；
The temperature of low temperature pressing is at 80 DEG C~140 DEG C；Second prepreg 6, third prepreg 7 are uncured；
The loading plate 8 is a double face copper for carrying extra thin copper foil, can include by acquisition purchased in market, loading plate 8
Intermediate core plate 801, the loading plate copper foil 802,803 for being pressed together on 801 two sides of intermediate core plate；The loading plate on 801 two sides of intermediate core plate
Copper foil 802,803 is covered with release film 804,805 above；Release film 804,805 outer side coverings have copper foil support plate 806,807；
The loading plate 8 is the double face copper with extra thin copper foil, wherein the loading plate copper foil on 801 two sides of intermediate core plate
802,803 be extra thin copper foil, and the copper foil support plate thickness outside release film is thicker, plays the role of protection and carrying.
Step S5, it is two-sided above and below the sandwich structure upper and lower surface of ultra-thin multi-layer board processing is formed by laser drill
Blind hole 9 in copper-clad plate 1,2；As shown in Figure 7；
Preferably, removing glue Slag treatment is carried out in blind hole 9；Specifically de-smear is removed using alkaline permanganate solution；
Step S6 forms the another side circuit in two double face coppers 1,2 in the structure of step S5 by metallization；
The method of metallization can be a subtractive to method, improvement semi-additive process, can also be semi-additive process.Flow is the system of semi-additive process below
Make flow：
Step S6.1, as shown in figure 8, removing face on the sandwich structure for the ultra-thin multi-layer board processing for making blind hole
Copper；I.e. by the outer surface layers of copper removal in double face copper 1,2；The method that etching can be used in this step；
Step S6.2, as shown in figure 9, the then sandwich structure surface of the ultra-thin multi-layer board processing after removing face copper
Electroless copper forms chemical plating copper layer 10；
Step S6.3, as shown in Figure 10, photoetching on the sandwich structure of the ultra-thin multi-layer board processing after copper coating
Form graphic plating mask 11；
Step S6.4 using graphic plating mask 11, carries out graphic plating, forms ultra-thin multi-layer board and add as shown in figure 11
The another side circuit 12 of two double face coppers 1,2 on the sandwich structure of work；Blind hole 9 be electroplated and has been filled out in this step
Hole；
Step S6.5, stripping：Remove the graphic plating mask 11 formed in step S6.3；As shown in figure 12；Alkali can be used
The method of the molten film of liquid removes；
Step S6.6, with the chemical plating copper layer 10 under the method removal graphic plating mask for dodging erosion；As shown in figure 13；
Then, it carries out：
Step S7, then in the sandwich structure upper and lower surface of ultra-thin multi-layer board processing by two outer copper foils 15,16
By the 4th prepreg 13,14 high-temperature laminating of the 5th prepreg, sandwich structure after solidification is formed；As shown in figure 14；
This step high temperature presses so that the second prepreg 6 in the sandwich structure of ultra-thin multi-layer board processing, the
Three prepregs 7；And the 4th prepreg 13, the 5th prepreg 14 in this step can cure；
Temperature to the prepreg of FR4, BT prepregs, hot setting can be respectively 200 DEG C, 260 DEG C；
Two four-layer circuit board structures are formed on the outside of the release film of loading plate 8；
Step S8, in previous step, after prepreg solidification, the copper foil support plate 806,807 of 8 both sides of loading plate has been distinguished
It is combined with the second prepreg 6, third prepreg 7；To form two four-layer circuit boards on the outside of the release film of loading plate 8
Structure；
In this step, two four-layer circuit board structures on the outside of the release film of loading plate 8 are peeled；
Due to there is the presence of release film 804,805, can be easy to directly peel the four-layer circuit board of both sides,
It forms two four-layer circuit boards and a two sides only has the double face copper of extra thin copper foil；
The four-layer circuit board peeled is as shown in figure 15.
Subsequent step, the outer-layer circuit that can also carry out four-layer circuit board make, and in the upper following table of four-layer circuit board
Face makes the techniques such as solder mask and solderability protective layer, and introduction is omitted.
In above-mentioned steps,
Ultrathin double-face copper-clad plate is pressed by low temperature and prepreg forms three layers of interim bonding structure, three layers of interim bonding
Structure has larger thickness, convenient to be processed on plate line, easy to operate, reduces snap-gauge problem, and this structure manufacture is ultra-thin
The single side circuit of plate, effectively simplifying technique reduces manufacture difficulty, reduces process costs.
Two ultra thin plates are pressed together on one by the circuit board of the existing circuit of one side by low temperature pressing prepreg to carry
The double face copper of extra thin copper foil（That is loading plate 8）On, the sandwich structure of ultra-thin multi-layer board processing is formed, by ultra thin plate
No circuit surface carries out blind hole processing, and the circuit for remanufacturing no circuit surface forms the two sides interconnection of ultra thin plate core plate, i.e., significantly increases
The big thickness of processing substrate, reduces difficulty of processing, simplifies technique, meanwhile, it is blind by the through-hole process change of original ultra thin plate
Hole machined is greatly lowered difficulty of processing instead of machining process for through hole using ripe blind hole processing technology, avoids butterfly hole
Processing and manufacturing, effectively reduces processing cost, and disclosure satisfy that via metal plating is filled a vacancy, and no cavity requires.And with super
The double face copper of thin copper foil is as the loading plate in processing, after use, still can be used as processing of the core plate for other substrates
Manufacture.
In above-mentioned technique, first two ultrathin double-face copper-clad plates are pressed with low temperature（Step S4), then processed in ultra-thin multi-layer board
Sandwich structure two sides high-temperature laminating prepreg and outer copper foil, the prepreg of front low temperature pressing in bonding processes
Cure simultaneously so that two prepregs in the four-layer circuit board structure finally peeled are solid under same high temperature curing conditions
Change, the four-layer circuit board of formation has the good symmetry in structure, effectively avoids manufacturing base with the interim bonding structure of loading plate
The warpage issues that plate generates.
The present invention is this to manufacture ultra thin substrate using two kinds of interim bonding structures（The substrate of the present embodiment is exactly after detaching
Four-layer circuit board）Method, compared with traditional ultra thin substrate manufacturing method have following technical advantage：
It is processed 1. ultra thin plate process change is conventional slab, it is special to process required directing plate etc. without conventional ultra thin plate
Jig reduces technology difficulty, without complex processing requirements, therefore reduces process costs, simplifies technique.
2. converting ultra thin substrate the electroplates in hole to blind hole plating, effectively realize that the technology of plating metal filling through-hole is wanted
It asks.The technical problem for solving ultra thin plate the electroplates in hole difficulty avoids being processed into the multiple sharp of butterfly hole using highly difficult through-hole
Drill finish hole and alignment issues, simplifying technique reduces technology difficulty.
3. the substrate warp for solving to be generated using the manufacturing method of the two-sided interim bonding manufacture multilayered coreless plate of loading plate is asked
Topic.
4. the technical solution adopted by the present invention and conventional ultra thin substrate processing are higher by high efficiency than having the advantages that, primary to add
The interim bonding structure of work forms two substrates.
5. above-mentioned 4 points lead to an inexpensive advantage.
Claims (5)
1. a kind of method that multi-layer board makes, which is characterized in that include the following steps：
Step S1 provides two double face coppers (1,2)；First prepreg (3) is placed in two double face coppers (1,2)
Between, low temperature presses to form three layers of interim bonding structure, wherein the first prepreg (3) is uncured；
Step S2 makes circuit in the upper outer lower face surface of three layers of interim bonding structure；
Step S3 opens two double face coppers (1,2) from the first prepreg (3), and forming two has single side circuit
Circuit board；
Two double face coppers (1,2) with single side circuit are passed through the second prepreg (6), third semi-solid preparation by step S4
Piece (7) low temperature is pressed together on loading plate (8) upper and lower surface, forms the interim bonding structure of loading plate, as ultra-thin multi-layer board
The sandwich structure of processing；Double face copper (1,2) established single side circuit is inwardly towards loading plate when pressing
(8)；Second prepreg (6), third prepreg (7) are uncured；
The loading plate (8) includes intermediate core plate (801), be pressed together on the loading plate copper foil on intermediate core plate (801) two sides (802,
803)；The loading plate copper foil (802,803) on intermediate core plate (801) two sides is covered with release film (804,805) above；Release film
(804,805) outer side covering has copper foil support plate (806,807)；
Step S5 forms double-sided copper-clad up and down in the sandwich structure upper and lower surface of ultra-thin multi-layer board processing by laser drill
Blind hole (9) on plate (1,2)；
Step S6 forms the another side circuit on two double face coppers (1,2) in the structure of step S5 by metallization；
Step S7 is then logical by two outer copper foils (15,16) in the sandwich structure upper and lower surface of ultra-thin multi-layer board processing
The 4th prepreg (13), the 5th prepreg (14) high-temperature laminating are crossed, sandwich structure after solidification is formed；
Two four-layer circuit board structures are formed on the outside of the release film of loading plate (8)；
Step S9 peels two four-layer circuit board structures on the outside of the release film of loading plate (8).
2. the method that multi-layer board as described in claim 1 makes, it is characterised in that：
In step S1, the temperature of low temperature pressing is at 80 DEG C~140 DEG C.
3. the method that multi-layer board as described in claim 1 makes, it is characterised in that：
In step S4, the temperature of low temperature pressing is at 80 DEG C~140 DEG C.
4. the method that multi-layer board as described in claim 1 makes, it is characterised in that：
In step S5, removing glue Slag treatment is carried out in blind hole (9).
5. the method that multi-layer board as described in claim 1 makes, it is characterised in that：
Step S6 is specifically included：
Step S6.1 removes face copper on the sandwich structure for the ultra-thin multi-layer board processing for making blind hole；
Step S6.2, then the sandwich structure Electroless copper of the ultra-thin multi-layer board processing after removing face copper, forms
Chemical plating copper layer (10)；
Step S6.3 is lithographically formed graphic plating mask on the sandwich structure of the ultra-thin multi-layer board processing after copper coating
(11)；
Step S6.4 carries out graphic plating, forms the sandwich knot of ultra-thin multi-layer board processing using graphic plating mask (11)
The another side circuit of two double face coppers (1,2) on structure；
Step S6.5, stripping：Remove the graphic plating mask (11) formed in step S6.3；
Step S6.6, with the chemical plating copper layer (10) under the method removal graphic plating mask for dodging erosion.
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| CN201610403486.2A CN105934110B (en) | 2016-06-08 | 2016-06-08 | The sandwich structure and method for producing multi-layer board of ultra-thin multi-layer board processing |
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| CN201610403486.2A CN105934110B (en) | 2016-06-08 | 2016-06-08 | The sandwich structure and method for producing multi-layer board of ultra-thin multi-layer board processing |
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| CN113950192A (en) * | 2021-08-27 | 2022-01-18 | 江苏博敏电子有限公司 | HDI plate direct laser hole forming method |
| CN114641138A (en) * | 2022-03-18 | 2022-06-17 | 广东世运电路科技股份有限公司 | Circuit board preparation method and circuit board thereof |
| CN115038260A (en) * | 2022-07-06 | 2022-09-09 | 诚亿电子（嘉兴）有限公司 | Method for manufacturing high-frequency PCB with asymmetric stacking design |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103681586A (en) * | 2012-08-30 | 2014-03-26 | 欣兴电子股份有限公司 | Coreless package substrate and manufacturing method thereof |
| CN104168706A (en) * | 2013-05-17 | 2014-11-26 | 欣兴电子股份有限公司 | Bearing substrate and manufacturing method thereof |
| CN104538314A (en) * | 2014-12-29 | 2015-04-22 | 华进半导体封装先导技术研发中心有限公司 | Manufacturing method of three-layer packaging substrate and packaging chip and three-layer packaging substrate |
| CN104701189A (en) * | 2014-12-29 | 2015-06-10 | 华进半导体封装先导技术研发中心有限公司 | Manufacturing method of three-layered packaging substrates and three-layered packaging substrates |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040075595A (en) * | 2003-02-22 | 2004-08-30 | 주식회사 에스아이 플렉스 | Method for manufacturing double side a flexible printed circuit board |
-
2016
- 2016-06-08 CN CN201610403486.2A patent/CN105934110B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103681586A (en) * | 2012-08-30 | 2014-03-26 | 欣兴电子股份有限公司 | Coreless package substrate and manufacturing method thereof |
| CN104168706A (en) * | 2013-05-17 | 2014-11-26 | 欣兴电子股份有限公司 | Bearing substrate and manufacturing method thereof |
| CN104538314A (en) * | 2014-12-29 | 2015-04-22 | 华进半导体封装先导技术研发中心有限公司 | Manufacturing method of three-layer packaging substrate and packaging chip and three-layer packaging substrate |
| CN104701189A (en) * | 2014-12-29 | 2015-06-10 | 华进半导体封装先导技术研发中心有限公司 | Manufacturing method of three-layered packaging substrates and three-layered packaging substrates |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110769606A (en) * | 2019-11-13 | 2020-02-07 | 珠海景旺柔性电路有限公司 | Double-sided processing method suitable for single-sided copper-plated panel |
| CN110769606B (en) * | 2019-11-13 | 2021-02-19 | 珠海景旺柔性电路有限公司 | Double-sided processing method suitable for single-sided copper-plated panel |
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|---|---|
| CN105934110A (en) | 2016-09-07 |
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