CN112423480A - Method for improving electroplating hole filling process of circuit board - Google Patents
Method for improving electroplating hole filling process of circuit board Download PDFInfo
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- CN112423480A CN112423480A CN202011364516.6A CN202011364516A CN112423480A CN 112423480 A CN112423480 A CN 112423480A CN 202011364516 A CN202011364516 A CN 202011364516A CN 112423480 A CN112423480 A CN 112423480A
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- circuit board
- hole
- board substrate
- electroplating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
Abstract
The invention relates to the technical field of circuit boards, in particular to a method for improving an electroplating hole filling process of a circuit board, which comprises the following steps: (1) taking a circuit board substrate to be drilled, and simultaneously drilling a first pore channel on the front side of the circuit board substrate and a second pore channel in the back side area of the corresponding circuit board substrate by adopting laser processing; the first pore passage and the second pore passage are communicated to form a through hole; (2) and (4) carrying out electro-coppering hole filling on the circuit board substrate with the drilled through hole. According to the invention, the front side and the back side of the circuit board substrate are drilled by laser simultaneously, and the drilled holes on the front side and the back side of the circuit board substrate are communicated to form the through hole, so that the thin circuit board substrate can be used for processing the through hole and filling the hole. The method has the advantages of simple and easily-controlled operation, high production efficiency and low production cost, and the plating layer on the surface of the substrate is uniform after the holes are filled with the electroplated metal, thereby avoiding the quality problem of the circuit after etching and improving the product yield, the product reliability and the production efficiency of the circuit board.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a method for improving an electroplating hole filling process of a circuit board.
Background
The circuit board is an important electronic component, is a support body of the electronic component, is a carrier for electrical connection of the electronic component, and plays an important role in modern industrial production. With the development trend of light, thin, short and small circuit boards, the substrate of the existing circuit board product is too thin, the resin hole plugging and grinding plate thinning process cannot be carried out, only the through hole drilling and whole plate hole filling process can be carried out, but the through hole drilling by direct mechanical drilling and the through hole drilling by laser are difficult to carry out whole plate hole filling, so that a method capable of processing the through hole and filling the hole is needed to be provided to improve the situation.
Disclosure of Invention
In order to overcome the defects and shortcomings in the prior art, the invention aims to provide a method for improving the electroplating hole filling process of a circuit board. The method is simple and easy to control in operation, high in production efficiency, low in production cost, stable in product quality, beneficial to improving the yield and reliability of products and high in practicability.
The purpose of the invention is realized by the following technical scheme: a method for improving a circuit board electroplating hole filling process comprises the following steps:
(1) taking a circuit board substrate to be drilled, and simultaneously drilling a first pore channel on the front side of the circuit board substrate and a second pore channel in the back side area of the corresponding circuit board substrate by adopting laser processing; the first pore channel and the second pore channel are communicated to form a through hole, and a circuit board substrate with the through hole is obtained;
(2) and (4) carrying out electro-coppering hole filling on the circuit board substrate with the drilled through hole.
The method for improving the electroplating hole filling process of the circuit board comprises the steps of processing a circuit board hole by laser, adopting a method of simultaneously drilling a first hole channel on the front side and a second hole channel on the back side, and communicating the first hole channel on the front side and the second hole channel on the back side to form a through hole; when the invention is used for processing a thin circuit board substrate which cannot be subjected to resin hole plugging and grinding plate thinning treatment, through holes can be processed, and hole filling treatment can be performed after the through holes are processed. The method is simple and easy to control in operation, the electroplating hole filling efficiency is high, the plating layer on the surface of the substrate is uniform after the hole is filled with the electroplating metal, the quality problem of the circuit after etching is avoided, and the product yield, the product reliability and the production efficiency of the circuit board are improved.
Further, in the step (1), the first pore passage and the second pore passage are communicated and are funnel-shaped, and the narrow end of the first pore passage is communicated with the narrow end of the second pore passage. The laser drilling method has the advantages that the laser drilling parameters are adjusted, so that the through holes form a funnel type structure, the parameters of plate hole filling are adjusted, the holes are filled and manufactured, the hole filling effect is good, and the product quality and the product reliability are improved.
Further, in the step (1), the aperture of the opening of the first pore channel located on the front side of the circuit board substrate and the aperture of the opening of the second pore channel located on the back side of the circuit board substrate are both 105 μm and 115 μm. The pore diameter of the communication part of the first pore passage and the second pore passage is 60-100 μm. According to the invention, the hole channel is processed by adopting laser drilling, so that through holes can be processed on a thin circuit board substrate which cannot be subjected to resin hole plugging and grinding plate thinning treatment, and hole plugging treatment can be carried out after the through holes are processed, thus the product yield, the product reliability and the production efficiency of the circuit board are improved, and the production cost is reduced.
Further, in the step (2), the electroplating copper to fill the hole comprises the following steps:
a1, polishing, sand blasting, juvenile grinding and cleaning the circuit board substrate with the through hole;
a2, placing the cleaned circuit board substrate in electroplating solution for electroplating copper filling treatment;
further, in the step a1, cleaning is performed by using plasma.
Further, in the step a2, the electroplating solution includes the following raw materials: 220g/L of copper sulfate 180-. Further, the functional auxiliary agent comprises the following raw materials in parts by weight: 25-35 parts of ethylene diamine tetraacetic acid, 10-15 parts of sodium allylsulfonate, 3-6 parts of polyethylene glycol, 4-8 parts of polyvinyl alcohol and 4-7 parts of fatty alcohol-polyoxyethylene ether.
According to the invention, copper sulfate, sulfuric acid, HCl and functional additives are compounded to prepare the electroplating solution for electroplating hole filling, so that the electroplating solution has an excellent hole filling effect, can prevent defects such as hole filling holes and insufficient hole filling, has a smooth and flat copper surface, improves the uniformity of through hole conductive electroplating, and improves the hole filling rate to more than 95%, and the product yield and the product reliability.
Further, in the step A2, the current density of the electroplating filling hole is 1.6-2.2A/dm2The electroplating temperature is 24-30 ℃. The electroplating time of the electroplating filling hole is 50-70 min.
Further, in the step A2, the thickness of the plating layer on the surface of the substrate for plating and filling the hole is 30-40 μm.
The invention carries out electroplating hole filling by adopting the process steps and controlling the process parameters, has excellent hole filling effect, can prevent the defects of hole filling cavities, insufficient full hole filling and the like, has simple and easily controlled operation, high production efficiency, low production cost and stable product quality, is beneficial to improving the product yield and the product reliability, and has strong practicability.
Further, the circuit board substrate is a ceramic thin film circuit board substrate.
The invention has the beneficial effects that: according to the method for improving the electroplating hole filling process of the circuit board, the front side and the back side of the circuit board substrate are drilled with laser simultaneously, and the drilled holes on the front side and the back side of the circuit board substrate are communicated to form the through hole, so that the thin circuit board substrate can be used for machining the through hole and filling the hole. The method has the advantages of simple and easily-controlled operation, high production efficiency, low production cost, stable product quality, good hole filling effect, uniform plating layer on the surface of the substrate after the hole is filled with the electroplated metal, avoiding the quality problem of the circuit after etching, and improving the product yield, the product reliability and the production efficiency of the circuit board.
Drawings
Fig. 1 is a schematic diagram of a circuit board substrate of the present invention after drilling.
Fig. 2 is an effect diagram of the circuit board substrate of embodiment 1 after drilling.
FIG. 3 is a diagram showing the effects of the circuit board of embodiment 2 after hole filling by electroplating.
The reference numerals include: 11-a circuit board substrate 11; 12-a first porthole 12; 13-second porthole 13.
Detailed Description
For the understanding of those skilled in the art, the present invention will be further described with reference to the following examples and the accompanying fig. 1, and the description of the embodiments is not intended to limit the present invention.
In an exemplary embodiment of the invention, a method for improving a circuit board electroplating via filling process includes the following steps:
(1) taking a circuit board substrate 11 to be drilled, and simultaneously drilling a first hole channel 12 on the front side of the circuit board substrate 11 and a second hole channel 13 in the back side area of the corresponding circuit board substrate 11 by adopting laser processing; the first pore channel 12 is communicated with the second pore channel 13 to form a through hole, and a circuit board substrate 11 drilled with the through hole is obtained;
(2) the circuit board substrate 11 with the through-holes drilled therein is subjected to electro-coppering.
Further, in the step (1), the first pore passage 12 and the second pore passage 13 are communicated to form a funnel shape, and the narrow end of the first pore passage 12 is communicated with the narrow end of the second pore passage 13. The invention adjusts the laser drilling parameters, adjusts the laser drilling parameters to enable the through holes to form a funnel type structure, adjusts the parameters of plate hole filling, and fills and manufactures the holes, thereby having good hole filling effect and improving the product quality and the product reliability.
Further, in the step (1), the aperture of the opening of the first pore passage 12 located on the front surface of the circuit board substrate 11 and the aperture of the opening of the second pore passage 13 located on the back surface of the circuit board substrate 11 are 105-114 μm. In the step (1), the pore diameter of the communication part of the first pore canal 12 and the second pore canal 13 is 60-68 μm.
Further, in the step (2), the electroplating copper to fill the hole comprises the following steps:
a1, polishing, sand blasting, juvenile grinding and cleaning the circuit board substrate 11 drilled with the through hole;
a2, placing the cleaned circuit board substrate 11 in electroplating solution for electroplating and copper filling treatment;
further, in the step a1, cleaning is performed by using plasma.
Further, in the step a2, the electroplating solution includes the following raw materials: 220g/L of copper sulfate 180-. Further, the functional auxiliary agent comprises the following raw materials in parts by weight: 25-35 parts of ethylene diamine tetraacetic acid, 10-15 parts of sodium allylsulfonate, 3-6 parts of polyethylene glycol, 4-8 parts of polyvinyl alcohol and 4-7 parts of fatty alcohol-polyoxyethylene ether.
Further, in the step A2, the current density of the electroplating filling hole is 1.6-2.2A/dm2The electroplating temperature is 24-30 ℃. The electroplating time of the electroplating filling hole is 50-70 min.
Further, the circuit board substrate 11 is a ceramic thin film circuit board substrate 11. The thickness of the circuit board substrate 11 is 105-125 μm.
Example 1
A method for improving a circuit board electroplating hole filling process comprises the following steps:
(1) taking a circuit board substrate 11 to be drilled, and simultaneously drilling a first hole channel 12 on the front side of the circuit board substrate 11 and a second hole channel 13 in the back side area of the corresponding circuit board substrate 11 by adopting laser processing; the first pore channel 12 is communicated with the second pore channel 13 to form a through hole, and a circuit board substrate 11 drilled with the through hole is obtained;
(2) the circuit board substrate 11 with the through-holes drilled therein is subjected to electro-coppering.
As shown in fig. 1, in the step (1), the first hole channel 12 and the second hole channel 13 are communicated in a funnel shape, and the narrow end of the first hole channel 12 is communicated with the narrow end of the second hole channel 13.
Further, in the step (1), the aperture of the opening of the first via 12 on the front side of the circuit board substrate 11 is shown as L1 in fig. 1, L1 is 110.4 μm, the aperture of the opening of the second via 13 on the back side of the circuit board substrate 11 is shown as L2 in fig. 1, and L2 is 107.2 μm. In the step (1), the pore diameter of the communication part of the first pore passage 12 and the second pore passage 13 is shown as L3 in FIG. 1, and L3 is 63.5 μm.
Further, in the step (2), the electroplating copper to fill the hole comprises the following steps:
a1, polishing, sand blasting, juvenile grinding and cleaning the circuit board substrate 11 drilled with the through hole;
a2, placing the cleaned circuit board substrate 11 in electroplating solution for electroplating and copper filling treatment;
further, in the step a1, cleaning is performed by using plasma.
Further, in the step a2, the electroplating solution includes the following raw materials: 200g/L of copper sulfate, 150g/L, HCl 1.5.5 g/L of sulfuric acid and 28g/L of functional additive. Further, the functional auxiliary agent comprises the following raw materials in parts by weight: 30 parts of ethylene diamine tetraacetic acid, 12 parts of sodium allylsulfonate, 4 parts of polyethylene glycol, 5 parts of polyvinyl alcohol and 6 parts of fatty alcohol-polyoxyethylene ether.
Further, in the step A2, the current density of the electroplating filling hole is 1.8A/dm2The plating temperature was 25 ℃. And the electroplating time of the electroplating filled hole is 60 min.
Further, the circuit board substrate 11 is a ceramic thin film circuit board substrate 11. The thickness of the circuit board substrate 11 is shown as L4, and L4 is 117.6 μm.
When the dicing inspection was performed for the hole-filling effect of the through-hole of the present example, the hole-filling rate of the through-hole of the circuit board substrate 11 was 99%, and the surface copper thicknesses of the front surface and the back surface of the circuit board substrate 11 were 32.1 μm and 31.6 μm, respectively.
Example 2
A method for improving a circuit board electroplating hole filling process comprises the following steps:
(1) taking a circuit board substrate 11 to be drilled, and simultaneously drilling a first hole channel 12 on the front side of the circuit board substrate 11 and a second hole channel 13 in the back side area of the corresponding circuit board substrate 11 by adopting laser processing; the first pore channel 12 is communicated with the second pore channel 13 to form a through hole, and a circuit board substrate 11 drilled with the through hole is obtained;
(2) the circuit board substrate 11 with the through-holes drilled therein is subjected to electro-coppering.
Further, in the step (1), the first pore passage 12 and the second pore passage 13 are communicated to form a funnel shape, and the narrow end of the first pore passage 12 is communicated with the narrow end of the second pore passage 13. The invention adjusts the laser drilling parameters, adjusts the laser drilling parameters to enable the through holes to form a funnel type structure, adjusts the parameters of plate hole filling, and fills and manufactures the holes, thereby having good hole filling effect and improving the product quality and the product reliability.
Further, in the step (1), the aperture of the opening of the first hole 12 located on the front side of the circuit board substrate 11 is 118.5 μm, and the aperture of the opening of the second hole 13 located on the back side of the circuit board substrate 11 is 115.6 μm. In the step (1), the pore diameter of the communication part of the first pore passage 12 and the second pore passage 13 is 95.0 μm.
Further, in the step (2), the electroplating copper to fill the hole comprises the following steps:
a1, polishing, sand blasting, juvenile grinding and cleaning the circuit board substrate 11 drilled with the through hole;
a2, placing the cleaned circuit board substrate 11 in electroplating solution for electroplating and copper filling treatment;
further, in the step a1, cleaning is performed by using plasma.
Further, in the step a2, the electroplating solution includes the following raw materials: 180g/L of copper sulfate, 12g/L, HCl 1g/L of sulfuric acid and 22g/L of functional assistant. Further, the functional auxiliary agent comprises the following raw materials in parts by weight: 25 parts of ethylene diamine tetraacetic acid, 10 parts of sodium allylsulfonate, 3 parts of polyethylene glycol, 4 parts of polyvinyl alcohol and 4 parts of fatty alcohol-polyoxyethylene ether.
Further, in the step A2, the current density of the electroplating filling hole is 1.6A/dm2The plating temperature was 24 ℃. And the electroplating time of the electroplating filled hole is 70 min.
Further, the thickness of the circuit board substrate 11 was 107.2 μm.
When the slicing inspection is performed on the filling effect of the through holes of the example, the filling rate of the through holes of the circuit board substrate 11 is 98%, and the surface copper thicknesses of the front surface and the back surface of the circuit board substrate 11 are 38.4 μm and 37.7 μm, respectively.
The rest of this embodiment is similar to embodiment 1, and is not described herein again.
Example 3
A method for improving a circuit board electroplating hole filling process comprises the following steps:
(1) taking a circuit board substrate 11 to be drilled, and simultaneously drilling a first hole channel 12 on the front side of the circuit board substrate 11 and a second hole channel 13 in the back side area of the corresponding circuit board substrate 11 by adopting laser processing; the first pore channel 12 is communicated with the second pore channel 13 to form a through hole, and a circuit board substrate 11 drilled with the through hole is obtained;
(2) the circuit board substrate 11 with the through-holes drilled therein is subjected to electro-coppering.
Further, in the step (1), the first pore passage 12 and the second pore passage 13 are communicated to form a funnel shape, and the narrow end of the first pore passage 12 is communicated with the narrow end of the second pore passage 13. The invention adjusts the laser drilling parameters, adjusts the laser drilling parameters to enable the through holes to form a funnel type structure, adjusts the parameters of plate hole filling, and fills and manufactures the holes, thereby having good hole filling effect and improving the product quality and the product reliability.
Further, in the step (1), the aperture of the opening of the first pore passage 12 located on the front surface of the circuit board substrate 11 and the aperture of the opening of the second pore passage 13 located on the back surface of the circuit board substrate 11 are both 106.5 μm. In the step (1), the pore diameter of the communicating part of the first pore passage 12 and the second pore passage 13 is 68.6 μm.
Further, in the step (2), the electroplating copper to fill the hole comprises the following steps:
a1, polishing, sand blasting, juvenile grinding and cleaning the circuit board substrate 11 drilled with the through hole;
a2, placing the cleaned circuit board substrate 11 in electroplating solution for electroplating and copper filling treatment;
further, in the step a1, cleaning is performed by using plasma.
Further, in the step a2, the electroplating solution includes the following raw materials: 220g/L of copper sulfate, 150g/L, HCl 2g/L of sulfuric acid and 32g/L of functional assistant. The functional auxiliary agent comprises the following raw materials in parts by weight: 35 parts of ethylene diamine tetraacetic acid, 15 parts of sodium allylsulfonate, 6 parts of polyethylene glycol, 8 parts of polyvinyl alcohol and 7 parts of fatty alcohol-polyoxyethylene ether.
Further, in the step A2, the current density of the electroplating filling hole is 2.2A/dm2The plating temperature was 30 ℃. And the electroplating time of the electroplating filled hole is 50 min.
Further, the thickness of the circuit board substrate 11 is 105-125 μm.
When the dicing inspection was performed for the hole-filling effect of the through-hole of the present example, the hole-filling rate of the through-hole of the circuit board substrate 11 was 99%, and the surface copper thicknesses of the front surface and the back surface of the circuit board substrate 11 were 33.5 μm and 32.7 μm, respectively.
The rest of this embodiment is similar to embodiment 1, and is not described herein again.
Example 4
A method for improving a circuit board electroplating hole filling process comprises the following steps:
(1) taking a circuit board substrate 11 to be drilled, and simultaneously drilling a first hole channel 12 on the front side of the circuit board substrate 11 and a second hole channel 13 in the back side area of the corresponding circuit board substrate 11 by adopting laser processing; the first pore channel 12 is communicated with the second pore channel 13 to form a through hole, and a circuit board substrate 11 drilled with the through hole is obtained;
(2) the circuit board substrate 11 with the through-holes drilled therein is subjected to electro-coppering.
Further, in the step (1), the first pore passage 12 and the second pore passage 13 are communicated to form a funnel shape, and the narrow end of the first pore passage 12 is communicated with the narrow end of the second pore passage 13.
Further, in the step (1), the aperture of the opening of the first pore passage 12 located on the front surface of the circuit board substrate 11 and the aperture of the opening of the second pore passage 13 located on the back surface of the circuit board substrate 11 are both 110.6 μm. In the step (1), the pore diameter of the communicating part of the first pore passage 12 and the second pore passage 13 is 72.4 μm.
Further, in the step (2), the electroplating copper to fill the hole comprises the following steps:
a1, polishing, sand blasting, juvenile grinding and cleaning the circuit board substrate 11 drilled with the through hole;
a2, placing the cleaned circuit board substrate 11 in electroplating solution for electroplating and copper filling treatment;
further, in the step a1, cleaning is performed by using plasma.
Further, in the step a2, the electroplating solution includes the following raw materials: 190g/L of copper sulfate, 140g/L, HCl 1.8.8 g/L of sulfuric acid and 25/L of functional assistant. The functional auxiliary agent comprises the following raw materials in parts by weight: 28 parts of ethylene diamine tetraacetic acid, 13 parts of sodium allylsulfonate, 5 parts of polyethylene glycol, 6 parts of polyvinyl alcohol and 5 parts of fatty alcohol-polyoxyethylene ether.
Further, in the step A2, the current density of the electroplating filling hole is 2A/dm2The plating temperature was 28 ℃. The electroplating time of the electroplating filling hole is 65 min.
Further, the circuit board substrate 11 is a ceramic thin film circuit board substrate 11. The thickness of the circuit board substrate 11 is 109.8 μm.
When the dicing inspection was performed for the hole-filling effect of the through-hole of the present example, the hole-filling rate of the through-hole of the circuit board substrate 11 was 99%, and the surface copper thicknesses of the front surface and the back surface of the circuit board substrate 11 were 31.4 μm and 30.8 μm, respectively.
The rest of this embodiment is similar to embodiment 1, and is not described herein again.
Comparative example 1
This comparative example differs from example 1 above in that:
in the step A2, the functional auxiliary agent is replaced by the same amount of sodium polydithio-diethyl alkane sulfonate.
Further, in the step A2, the current density of the electroplating filling hole is 1.8A/dm2The plating temperature was 25 ℃. And the electroplating time of the electroplating filled hole is 60 min. The thickness of the circuit board substrate 11 is 116.2 μm.
Further, in the step (1), the aperture of the opening of the first hole 12 located on the front side of the circuit board substrate 11 is 109.5 μm, and the aperture of the opening of the second hole 13 located on the back side of the circuit board substrate 11 are all 106.2 μm. In the step (1), the pore diameter of the communication part of the first pore passage 12 and the second pore passage 13 is 65.7 μm.
When the dicing inspection was performed on the filling effect of the through-hole of the present example, the filling ratio of the through-hole of the circuit board substrate 11 was 91%, and the surface copper thicknesses of the front surface and the back surface of the circuit board substrate 11 were 37.1 μm and 34.8 μm, respectively. The remainder of this comparative example is similar to example 1 and will not be described again here.
The method for improving the electroplating hole filling process of the circuit board can process through holes and can perform hole filling after processing the through holes when processing the thinner circuit board substrate 11 which cannot perform resin hole filling and grinding plate thinning processing. The method is simple and easy to operate and control, the electroplating hole filling efficiency is high, the excellent hole filling effect is achieved, the defects of hole filling cavities, insufficient and full hole filling and the like can be overcome, the plating layer on the surface of the circuit board substrate 11 is uniform after the holes are filled with the electroplating metal, the quality problem of the circuit after etching is avoided, and the product yield, the product reliability and the production efficiency of the circuit board are improved.
The above-described embodiments are preferred implementations of the present invention, and the present invention may be implemented in other ways without departing from the spirit of the present invention.
Claims (9)
1. A method for improving the electroplating hole filling process of a circuit board is characterized in that: the method comprises the following steps:
(1) taking a circuit board substrate to be drilled, and simultaneously drilling a first pore channel on the front side of the circuit board substrate and a second pore channel in the back side area of the corresponding circuit board substrate by adopting laser processing; the first pore channel and the second pore channel are communicated to form a through hole, and a circuit board substrate with the through hole is obtained;
(2) and (4) carrying out electro-coppering hole filling on the circuit board substrate with the drilled through hole.
2. The method of claim 1, wherein the step of improving the hole filling process comprises the steps of: in the step (1), the first pore passage and the second pore passage are communicated and are funnel-shaped, and the narrow end of the first pore passage is communicated with the narrow end of the second pore passage.
3. The method of claim 2, wherein the step of improving the hole filling process comprises the steps of: in the step (1), the aperture of the opening of the first pore channel located on the front side of the circuit board substrate and the aperture of the opening of the second pore channel located on the back side of the circuit board substrate are 105-115 μm.
4. The method of claim 2, wherein the step of improving the hole filling process comprises the steps of: in the step (1), the pore diameter of the communication part of the first pore channel and the second pore channel is 60-100 μm.
5. The method of claim 1, wherein the step of improving the hole filling process comprises the steps of: in the step (2), the step of filling the hole by electroplating copper comprises the following steps:
a1, polishing, sand blasting, juvenile grinding and cleaning the circuit board substrate with the through hole;
and A2, placing the cleaned circuit board substrate in a plating solution for electroplating and copper filling treatment.
6. The method of claim 5, wherein the step of improving the hole filling process comprises the steps of: in the step a1, plasma is used for cleaning.
7. The method of claim 5, wherein the step of improving the hole filling process comprises the steps of: in the step A2, the electroplating solution comprises the following raw materials: 220g/L of copper sulfate 180-.
8. The method of claim 5, wherein the step of improving the hole filling process comprises the steps of: in the step A2, the electroplating fills the holesThe flow density is 1.6-2.2A/dm2The electroplating temperature is 24-30 ℃.
9. The method of claim 5, wherein the step of improving the hole filling process comprises the steps of: in the step A2, the electroplating time of the electroplating filling hole is 50-70 min.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113015343A (en) * | 2021-04-27 | 2021-06-22 | 四会富仕电子科技股份有限公司 | Manufacturing method of interlayer cross line connecting structure and circuit board |
| CN114173492A (en) * | 2021-10-19 | 2022-03-11 | 安捷利美维电子(厦门)有限责任公司 | Through blind hole design method for detecting hole filling capacity of circuit board |
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| CN114173492A (en) * | 2021-10-19 | 2022-03-11 | 安捷利美维电子(厦门)有限责任公司 | Through blind hole design method for detecting hole filling capacity of circuit board |
| CN114173492B (en) * | 2021-10-19 | 2024-03-08 | 安捷利美维电子(厦门)有限责任公司 | Through blind hole design method for detecting hole filling capability of circuit board |
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