CN114286541A - HDI board processing method, HDI board and electronic equipment - Google Patents
HDI board processing method, HDI board and electronic equipment Download PDFInfo
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- CN114286541A CN114286541A CN202111355809.2A CN202111355809A CN114286541A CN 114286541 A CN114286541 A CN 114286541A CN 202111355809 A CN202111355809 A CN 202111355809A CN 114286541 A CN114286541 A CN 114286541A
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- 238000003672 processing method Methods 0.000 title claims abstract description 14
- 238000012545 processing Methods 0.000 claims abstract description 85
- 238000000034 method Methods 0.000 claims abstract description 43
- 238000003825 pressing Methods 0.000 claims abstract description 23
- 238000004080 punching Methods 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 238000006087 Brown hydroboration reaction Methods 0.000 claims description 12
- 239000011889 copper foil Substances 0.000 claims description 12
- 238000007689 inspection Methods 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 8
- 239000012528 membrane Substances 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 238000003801 milling Methods 0.000 claims description 4
- 238000007796 conventional method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 description 8
- 230000009471 action Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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Abstract
The invention provides a processing method of an HDI board, the HDI board and electronic equipment, wherein the method comprises the following steps: respectively punching and pattern processing the 2 nd layer, the 3 rd layer, the N-1 st layer and the N-2 nd layer core plates of the HDI plate by adopting a first preset processing flow, and carrying out corresponding processing treatment; respectively carrying out graphic processing on the 4 th layer to the N-3 th layer core plates of the HDI plate by adopting a second preset processing flow, and carrying out corresponding processing treatment; sequentially overlapping and pressing N layers of core plates of the HDI plate; and respectively carrying out outer layer treatment on the 1 st layer core plate and the Nth layer core plate of the HDI plate by adopting a third preset processing flow. By the method, the conventional method for processing the HDI board by two times of pressing is changed into one-time pressing, so that the processing flow of the conventional HDI board in the industry is effectively shortened, the processing time is shortened, and the cost is reduced.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a processing method of an HDI board, the HDI board and electronic equipment.
Background
In the printed circuit board industry, on the premise that electronic products tend to have multiple functions and complexity, the contact distance of an integrated circuit element is reduced, the signal transmission speed is relatively increased, the number of connection wires is increased, the length of wiring among the points is locally shortened, and high-density circuit configuration and micro-hole technology are required to be applied to achieve the aim. The wiring and the crossover are difficult to achieve for single or double panels, so that the Circuit Board is multilayered, and as signal lines are increased, more power supply layers and ground layers are necessary for design, which makes the multi-layer Printed Circuit Board (multi Printed Circuit Board) more popular.
As a result, HDI is becoming more and more widely used, especially in consumer products and automotive panels. With the rapid development of high-speed signals, the application to the HDI process is also beginning in the AI video accelerator card. HDI is an abbreviation for High Density interconnect (High Density interconnect) and is a technique for producing printed circuit boards, a relatively High line distribution Density circuit board using micro-blind buried via technology. HDI is a compact product designed specifically for small volume users. The traditional HDI process generally needs multiple times of pressing, is long in flow and high in cost, and also puts higher requirements on the performance of the PCB. In the internet era of rapid development, how to shorten the process and reduce the cost becomes a problem of general concern.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a method for processing an HDI board, and an electronic device, which can effectively reduce the number of times of pressing the HDI board and the processing flow.
In order to achieve the purpose, the invention is realized by the following technical scheme: a processing method of an HDI board, wherein the HDI board comprises N layers of core boards, and the processing method comprises the following steps:
respectively punching and pattern processing the 2 nd layer, the 3 rd layer, the N-1 st layer and the N-2 nd layer core plates of the HDI plate by adopting a first preset processing flow, and carrying out corresponding processing treatment;
respectively carrying out graphic processing on the 4 th layer to the N-3 th layer core plates of the HDI plate by adopting a second preset processing flow, and carrying out corresponding processing treatment;
sequentially overlapping and pressing N layers of core plates of the HDI plate;
and respectively carrying out outer layer treatment on the 1 st layer core plate and the Nth layer core plate of the HDI plate by adopting a third preset processing flow.
Further, the first preset processing flow comprises the following steps:
s21: carrying out brown oxidation treatment on the core plate;
s22: adopting a direct laser method to punch out laser blind holes of the core plate;
s23: filling and leveling the punched laser blind hole in an electroplating mode;
s24: carrying out graphic processing on the core board;
s25: carrying out automatic optical inspection on the core board;
s26: and after passing the inspection, performing brown oxidation treatment on the core plate.
Further, the second preset processing flow comprises the following steps:
s31: carrying out graphic processing on the core board;
s32: carrying out automatic optical inspection on the core board;
s33: and after passing the inspection, performing brown oxidation treatment on the core plate.
Further, the third preset processing flow includes the following steps:
s41: milling burrs of the core plate;
s42: carrying out brown oxidation treatment on the core plate;
s43: adopting a direct laser method to punch out laser blind holes of the core plate;
s44: and filling and leveling the punched laser blind hole by adopting an electroplating mode.
Further, the step of processing the core plate with the pattern specifically includes:
a pretreatment step, namely cleaning and microetching the core plate;
a film pressing step, namely sticking a dry film on the surface of the core plate;
exposing, and transferring the required circuit pattern to a dry film through a film;
a developing step of removing the dry film not exposed;
etching step, etching the unnecessary copper foil;
and a step of membrane removal, in which membrane stripping liquid reacts with the dry membrane to remove the dry membrane on the plate surface.
Further, the step S22 further includes:
when a laser hole is punched from the 3 rd layer core board to the 2 nd layer core board, the copper foil of the 2 nd layer core board is prevented from being punched through by controlling laser energy parameters;
when a laser hole is punched from the core plate of the (N-2) th layer to the core plate of the (N-1) th layer, the copper foil of the core plate of the (N-1) th layer is prevented from being punched through by controlling laser energy parameters.
Correspondingly, the invention further discloses an HDI plate manufactured by the HDI plate machining method.
Correspondingly, the invention discloses electronic equipment, which adopts the HDI board.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a processing method of an HDI board, the HDI board and electronic equipment, wherein the method comprises the following steps: respectively punching and pattern processing the 2 nd layer, the 3 rd layer, the N-1 st layer and the N-2 nd layer core plates of the HDI plate by adopting a first preset processing flow, and carrying out corresponding processing treatment; respectively carrying out graphic processing on the 4 th layer to the N-3 th layer core plates of the HDI plate by adopting a second preset processing flow, and carrying out corresponding processing treatment; sequentially overlapping and pressing N layers of core plates of the HDI plate; and adopting a third preset processing flow to carry out outer layer treatment on the 1 st layer core plate and the Nth layer core plate of the HDI plate. By the method, the conventional method for processing the HDI board by two times of pressing is changed into one-time pressing, so that the processing flow of the conventional HDI board in the industry is effectively shortened, the processing time is shortened, and the cost is reduced.
Therefore, compared with the prior art, the invention has prominent substantive features and remarkable progress, and the beneficial effects of the implementation are also obvious.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a process flow diagram of an embodiment of the present invention.
FIG. 2 is a schematic illustration of the processing of an embodiment of the present invention.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
as shown in fig. 1, the present embodiment provides a method for processing an HDI board, where the HDI board includes N layers of core boards, and the method for processing the HDI board includes the following steps:
s101: and respectively punching and pattern processing the 2 nd layer, the 3 rd layer, the N-1 st layer and the N-2 nd layer core plates of the HDI plate by adopting a first preset processing flow, and carrying out corresponding processing treatment.
Wherein, the first preset processing flow specifically comprises:
1. and performing brown oxidation treatment on the core plate.
2. And (3) punching the laser blind hole of the core plate by adopting a direct laser method. In this step, when laser holes are punched from the 3 rd layer core board to the 2 nd layer core board, the copper foil of the 2 nd layer core board is prevented from being punched through by controlling laser energy parameters. When a laser hole is punched from the core plate of the (N-2) th layer to the core plate of the (N-1) th layer, the copper foil of the core plate of the (N-1) th layer is prevented from being punched through by controlling laser energy parameters.
3. And filling and leveling the punched laser blind hole by adopting an electroplating mode.
4. And carrying out graphic processing on the core plate.
5. And carrying out automatic optical inspection on the core plate.
6. And after passing the inspection, performing brown oxidation treatment on the core plate.
S102: and respectively carrying out graphic processing on the 4 th layer to the N-3 rd layer core plates of the HDI plate by adopting a second preset processing flow, and carrying out corresponding processing treatment.
Wherein, the second preset processing flow specifically comprises:
1. and carrying out graphic processing on the core plate.
2. And carrying out automatic optical inspection on the core plate.
3. And after passing the inspection, performing brown oxidation treatment on the core plate.
S103: and (4) sequentially laminating and pressing the N layers of core plates of the HDI plate.
S104: and respectively carrying out outer layer treatment on the 1 st layer core plate and the Nth layer core plate of the HDI plate by adopting a third preset processing flow.
Wherein the third preset processing flow specifically comprises:
1. and milling burrs of the core plate.
2. And performing brown oxidation treatment on the core plate.
3. And (3) punching the laser blind hole of the core plate by adopting a direct laser method.
4. And filling and leveling the punched laser blind hole by adopting an electroplating mode.
In addition, in the first preset processing flow and the second preset processing flow of the method, the process of processing the pattern of the core plate is included, and the method specifically comprises the following steps:
a pretreatment step: and cleaning and micro-etching the core plate.
Film pressing: and sticking and pressing the dry film on the surface of the core plate.
An exposure step: and transferring the desired wiring pattern to the dry film through the film.
A developing step: and removing the unexposed dry film.
Etching step: the unwanted copper foil is etched away.
A step of removing the film: and (5) reacting the stripping liquid with the dry film, and removing the dry film on the board surface.
The embodiment provides a method for processing an HDI board, which can change the conventional method for processing the HDI board by two times of pressing into one time of pressing, effectively shortens the processing flow of the conventional HDI board in the industry, shortens the processing time and reduces the cost.
Example two:
the invention also discloses a processing method of the HDI board, as shown in FIG. 2, taking an 8-layer printed circuit board as an example, the method specifically comprises the following steps:
1. and processing the pattern of the inner layer.
The processing of the inner layer, namely the processing of the patterns of the L2-L7 layers, mainly comprises the following two steps:
in the first step, the following procedures are adopted when processing the L2 layer, the L3 layer, the L6 layer and the L7 layer:
1.1.1, performing brownification treatment on the core plate. The purpose of this step is in order to increase copper face roughness, the direct radium-shine of convenient next step.
1.1.2, adopting a direct laser method to punch secondary laser blind holes. Wherein, the L3-2 laser holes are punched from the L3 layer, the laser energy parameters need to be controlled, and the copper foil of the L2 layer cannot be punched; similarly, the laser holes of L6-7 are punched from the L6 layer, and the copper foil of the L7 layer cannot be punched.
1.1.3, electroplating and filling the laser blind holes punched in the previous step.
1.1.4, drawing a graph. The method sequentially comprises the following steps:
a pretreatment step: and cleaning and micro-etching the core plate.
Film pressing: and sticking and pressing the dry film on the surface of the core plate.
An exposure step: and transferring the desired wiring pattern to the dry film through the film.
A developing step: and removing the unexposed dry film.
Etching step: the unwanted copper foil is etched away.
A step of removing the film: and (5) reacting the stripping liquid with the dry film, and removing the dry film on the board surface.
1.1.5, AOI test.
1.1.6, browning treatment.
Secondly, when other inner core boards (L4 layers and L5 layers) are processed, the following processing flows are adopted:
1.2.1, the L4 and L5 layers were patterned using the method of 1.1.4.
1.2.2, AOI test.
And 1.2.3, browning treatment.
2. After the L2-L7 layers are processed respectively according to the method, the L1-L8 layers are overlapped and pressed in sequence.
3. The L1 and L8 layers of the HDI panel were overcoated. The method specifically comprises the following steps:
and 3.1.1, milling burrs.
And 3.1.2, browning treatment.
3.1.3, adopting a direct laser method to punch out laser blind holes of the outer layer (L1-2 & L8-7).
And 3.1.4, electroplating and filling the punched laser blind holes.
The embodiment provides a method for processing an HDI board, which can change the conventional method for processing the HDI board by two times of pressing into one time of pressing, effectively shortens the processing flow of the conventional HDI board in the industry, shortens the processing time and reduces the cost.
The embodiment of the invention also provides the HDI board manufactured by the method for machining any HDI board.
The HDI board manufactured by the HDI board processing method can change the conventional method for processing the HDI board by two times of pressing into one time of pressing, effectively shortens the processing flow of the conventional HDI board in the industry, shortens the processing time and reduces the cost.
The embodiment of the invention also provides electronic equipment which comprises the HDI board.
The HDI board manufactured by any one of the HDI board processing methods is applied to electronic equipment such as a server, so that pollution and damage to the environment can be reduced, and the manufacturing and using cost of the electronic equipment such as the server can be reduced to a certain extent.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The HDI board, and the electronic device provided by the present invention are described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (8)
1. The HDI board processing method is characterized by comprising the following steps:
respectively punching and pattern processing the 2 nd layer, the 3 rd layer, the N-1 st layer and the N-2 nd layer core plates of the HDI plate by adopting a first preset processing flow, and carrying out corresponding processing treatment;
respectively carrying out graphic processing on the 4 th layer to the N-3 th layer core plates of the HDI plate by adopting a second preset processing flow, and carrying out corresponding processing treatment;
sequentially overlapping and pressing N layers of core plates of the HDI plate;
and respectively carrying out outer layer treatment on the 1 st layer core plate and the Nth layer core plate of the HDI plate by adopting a third preset processing flow.
2. The HDI plate processing method according to claim 1, wherein the first preset processing flow includes the steps of:
s21: carrying out brown oxidation treatment on the core plate;
s22: adopting a direct laser method to punch out laser blind holes of the core plate;
s23: filling and leveling the punched laser blind hole in an electroplating mode;
s24: carrying out graphic processing on the core board;
s25: carrying out automatic optical inspection on the core board;
s26: and after passing the inspection, performing brown oxidation treatment on the core plate.
3. The HDI board processing method according to claim 1, wherein the second preset processing flow comprises the following steps:
s31: carrying out graphic processing on the core board;
s32: carrying out automatic optical inspection on the core board;
s33: and after passing the inspection, performing brown oxidation treatment on the core plate.
4. The method of processing an HDI plate according to claim 1, wherein the third predetermined processing flow comprises the steps of:
s41: milling burrs of the core plate;
s42: carrying out brown oxidation treatment on the core plate;
s43: adopting a direct laser method to punch out laser blind holes of the core plate;
s44: and filling and leveling the punched laser blind hole by adopting an electroplating mode.
5. The method for processing an HDI plate according to claim 2 or 3, wherein the step of performing the graphic processing on the core plate specifically comprises:
a pretreatment step, namely cleaning and microetching the core plate;
a film pressing step, namely sticking a dry film on the surface of the core plate;
exposing, and transferring the required circuit pattern to a dry film through a film;
a developing step of removing the dry film not exposed;
etching step, etching the unnecessary copper foil;
and a step of membrane removal, in which membrane stripping liquid reacts with the dry membrane to remove the dry membrane on the plate surface.
6. The method of processing an HDI plate according to claim 2, wherein the step S22 further includes:
when a laser hole is punched from the 3 rd layer core board to the 2 nd layer core board, the copper foil of the 2 nd layer core board is prevented from being punched through by controlling laser energy parameters;
when a laser hole is punched from the core plate of the (N-2) th layer to the core plate of the (N-1) th layer, the copper foil of the core plate of the (N-1) th layer is prevented from being punched through by controlling laser energy parameters.
7. An HDI board characterized in that the HDI board is manufactured by the HDI board processing method according to any one of claims 1 to 6.
8. An electronic device, characterized in that: the electronic device employs the HDI board according to claim 7.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111355809.2A CN114286541B (en) | 2021-11-16 | 2021-11-16 | Processing method of HDI board, HDI board and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111355809.2A CN114286541B (en) | 2021-11-16 | 2021-11-16 | Processing method of HDI board, HDI board and electronic equipment |
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| Publication Number | Publication Date |
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| CN114286541A true CN114286541A (en) | 2022-04-05 |
| CN114286541B CN114286541B (en) | 2023-08-11 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996560A (en) * | 2019-11-29 | 2020-04-10 | 苏州市迪飞特电子有限公司 | Method for processing multilayer printed circuit board |
| CN113015338A (en) * | 2021-02-26 | 2021-06-22 | 成都明天高新产业有限责任公司 | Circuit board with crossed blind holes and processing method thereof |
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2021
- 2021-11-16 CN CN202111355809.2A patent/CN114286541B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996560A (en) * | 2019-11-29 | 2020-04-10 | 苏州市迪飞特电子有限公司 | Method for processing multilayer printed circuit board |
| CN113015338A (en) * | 2021-02-26 | 2021-06-22 | 成都明天高新产业有限责任公司 | Circuit board with crossed blind holes and processing method thereof |
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| Publication number | Publication date |
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| CN114286541B (en) | 2023-08-11 |
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