CN114286541B - Processing method of HDI board, HDI board and electronic equipment - Google Patents
Processing method of HDI board, HDI board and electronic equipment Download PDFInfo
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- CN114286541B CN114286541B CN202111355809.2A CN202111355809A CN114286541B CN 114286541 B CN114286541 B CN 114286541B CN 202111355809 A CN202111355809 A CN 202111355809A CN 114286541 B CN114286541 B CN 114286541B
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- 238000003672 processing method Methods 0.000 title claims abstract description 20
- 238000012545 processing Methods 0.000 claims abstract description 75
- 238000000034 method Methods 0.000 claims abstract description 36
- 238000003825 pressing Methods 0.000 claims abstract description 23
- 238000004080 punching Methods 0.000 claims abstract description 10
- 238000010030 laminating Methods 0.000 claims abstract description 5
- 238000007689 inspection Methods 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 239000011889 copper foil Substances 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 238000003801 milling Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims description 2
- 230000008859 change Effects 0.000 abstract description 4
- 230000008569 process Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a processing method of an HDI board, the HDI board and electronic equipment, wherein the method comprises the following steps: respectively punching and pattern processing the 2 nd layer, the 3 rd layer, the N-1 st layer and the N-2 nd layer core plates of the HDI board by adopting a first preset processing flow, and carrying out corresponding processing treatment; respectively carrying out graphic processing on the 4 th layer to the N-3 rd layer core plates of the HDI plate by adopting a second preset processing flow, and carrying out corresponding processing treatment; laminating and pressing N layers of core plates of the HDI plate in sequence; and adopting a third preset processing flow to respectively carry out outer layer treatment on the 1 st layer core plate and the N th layer core plate of the HDI plate. The method can change the existing two-time pressing method for processing the HDI board into one-time pressing, effectively shortens the processing flow of the current HDI board in the industry, shortens the processing time and reduces the cost.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a processing method of an HDI board, the HDI board and electronic equipment.
Background
In the printed wiring board industry, on the premise that electronic products tend to be multifunctional and complicated, the contact distance of an integrated circuit element is reduced, the signal transmission speed is relatively increased, the number of wires is increased, the length of the inter-point wiring is locally shortened, and the aims are achieved by applying high-density circuit configuration and micropore technology. Wiring and bridging have been a substantial difficulty with single and dual panel boards, and thus circuit boards have been multi-layered, and as signal lines continue to increase, more power and ground planes are necessary means of design, which has led to the popularity of multi-layered printed circuit boards (Multilayer Printed Circuit Board).
Thus, HDI is increasingly used, especially in consumer products and automotive panels. With the rapid development of high-speed signals, in AI video accelerator cards, application to HDI processes is also beginning. HDI is an abbreviation for high density interconnect (High Density Interconnector), a technology for producing printed circuit boards, a circuit board with a relatively high line distribution density using micro-blind via technology. HDI is a compact product designed specifically for small-volume users. The traditional HDI technology generally needs multiple pressing, has long flow and high cost, and also has higher requirements on the performance of the PCB. In the rapidly developing internet age, how to shorten the flow and reduce the cost is a general concern.
Disclosure of Invention
In view of the above problems, the present invention aims to provide a processing method of an HDI board, and an electronic device, which can effectively reduce the number of pressing times and processing flow of the HDI board.
The invention aims to achieve the aim, and the aim is achieved by the following technical scheme: a method of processing an HDI board comprising an N-layer core board, the method comprising:
respectively punching and pattern processing the 2 nd layer, the 3 rd layer, the N-1 st layer and the N-2 nd layer core plates of the HDI board by adopting a first preset processing flow, and carrying out corresponding processing treatment;
respectively carrying out graphic processing on the 4 th layer to the N-3 rd layer core plates of the HDI plate by adopting a second preset processing flow, and carrying out corresponding processing treatment;
laminating and pressing N layers of core plates of the HDI plate in sequence;
and adopting a third preset processing flow to respectively carry out outer layer treatment on the 1 st layer core plate and the N th layer core plate of the HDI plate.
Further, the first preset processing flow includes the following steps:
s21: carrying out browning treatment on the core plate;
s22: a laser blind hole of the core plate is punched by adopting a direct laser method;
s23: filling and leveling the laser blind holes by adopting an electroplating mode;
s24: carrying out graphic processing on the core plate;
s25: performing automatic optical inspection on the core plate;
s26: and after the inspection is passed, the core plate is subjected to browning treatment.
Further, the second preset processing flow includes the following steps:
s31: carrying out graphic processing on the core plate;
s32: performing automatic optical inspection on the core plate;
s33: and after the inspection is passed, the core plate is subjected to browning treatment.
Further, the third preset processing flow includes the following steps:
s41: milling burrs of the core plate;
s42: carrying out browning treatment on the core plate;
s43: a laser blind hole of the core plate is punched by adopting a direct laser method;
s44: filling and leveling the laser blind holes by adopting an electroplating mode.
Further, the graphic processing of the core plate specifically includes:
a pretreatment step, namely cleaning and microetching the core plate;
film pressing, namely sticking a dry film on the surface of the core plate;
an exposure step, namely transferring a required circuit pattern to a dry film through a film;
a developing step of removing the dry film which is not exposed to light;
etching step, etching unnecessary copper foil;
and removing the film, namely reacting the film stripping liquid with the dry film, and removing the dry film on the surface of the board.
Further, the step S22 further includes:
when laser holes are drilled from the 3 rd core plate to the 2 nd core plate, the copper foil of the 2 nd core plate is prevented from being drilled through by controlling laser energy parameters;
when laser holes are drilled from the N-2 layer core plate to the N-1 layer core plate, the copper foil of the N-1 layer core plate is prevented from being perforated by controlling laser energy parameters.
Correspondingly, the invention also discloses an HDI board which is manufactured according to the processing method of the HDI board.
Correspondingly, the invention discloses electronic equipment, and the electronic equipment adopts the HDI board.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a processing method of an HDI board, the HDI board and electronic equipment, wherein the method comprises the following steps: respectively punching and pattern processing the 2 nd layer, the 3 rd layer, the N-1 st layer and the N-2 nd layer core plates of the HDI board by adopting a first preset processing flow, and carrying out corresponding processing treatment; respectively carrying out graphic processing on the 4 th layer to the N-3 rd layer core plates of the HDI plate by adopting a second preset processing flow, and carrying out corresponding processing treatment; laminating and pressing N layers of core plates of the HDI plate in sequence; and performing outer layer treatment on the 1 st layer core plate and the N th layer core plate of the HDI plate by adopting a third preset processing flow. The method can change the existing two-time pressing method for processing the HDI board into one-time pressing, effectively shortens the processing flow of the current HDI board in the industry, shortens the processing time and reduces the cost.
It can be seen that the present invention has outstanding substantial features and significant advances over the prior art, as well as the benefits of its implementation.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method of an embodiment of the present invention.
Fig. 2 is a schematic process diagram of an embodiment of the present invention.
Detailed Description
In order to better understand the aspects of the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Embodiment one:
as shown in fig. 1, the present embodiment provides a processing method of an HDI board, where the HDI board includes N layers of core boards, and the processing method of the HDI board includes the following steps:
s101: and (3) respectively punching and pattern processing the 2 nd layer, the 3 rd layer, the N-1 st layer and the N-2 nd layer core plates of the HDI board by adopting a first preset processing flow, and carrying out corresponding processing treatment.
The first preset processing flow specifically comprises the following steps:
1. and (5) carrying out browning treatment on the core plate.
2. And (5) punching a laser blind hole of the core plate by adopting a direct laser method. In this step, when laser holes are punched from the 3 rd core board to the 2 nd core board, the punching of the copper foil of the 2 nd core board is avoided by controlling the laser energy parameters. When laser holes are drilled from the N-2 layer core plate to the N-1 layer core plate, the copper foil of the N-1 layer core plate is prevented from being perforated by controlling laser energy parameters.
3. Filling and leveling the laser blind holes by adopting an electroplating mode.
4. And carrying out graphic processing on the core plate.
5. And (5) performing automatic optical inspection on the core plate.
6. And after the inspection is passed, the core plate is subjected to browning treatment.
S102: and respectively carrying out graphic processing on the 4 th layer to the N-3 rd layer core plates of the HDI plate by adopting a second preset processing flow, and carrying out corresponding processing treatment.
The second preset processing flow specifically comprises the following steps:
1. and carrying out graphic processing on the core plate.
2. And (5) performing automatic optical inspection on the core plate.
3. And after the inspection is passed, the core plate is subjected to browning treatment.
S103: and laminating and pressing the N layers of core plates of the HDI plate in sequence.
S104: and adopting a third preset processing flow to respectively carry out outer layer treatment on the 1 st layer core plate and the N th layer core plate of the HDI plate.
The third preset processing flow specifically comprises the following steps:
1. milling burrs of the core plate.
2. And (5) carrying out browning treatment on the core plate.
3. And (5) punching a laser blind hole of the core plate by adopting a direct laser method.
4. Filling and leveling the laser blind holes by adopting an electroplating mode.
In addition, in the first preset processing flow and the second preset processing flow of the method, the method comprises a process of carrying out graphic processing on the core plate, and specifically comprises the following steps:
pretreatment: and cleaning and microetching the core plate.
And (3) film pressing: and pasting and pressing a dry film on the surface of the core plate.
An exposure step: and transferring the required circuit pattern to the dry film through a film.
And (3) developing: the unexposed dry film is removed.
Etching: the unwanted copper foil is etched away.
Removing the film: and (3) reacting the stripping liquid with the dry film, and removing the dry film on the board surface.
The embodiment provides a processing method of an HDI board, and the method can change the existing two-time pressing processing method of the HDI board into one-time pressing, thereby effectively shortening the processing flow of the current HDI board in the industry, shortening the processing time and reducing the cost.
Embodiment two:
the invention also discloses a processing method of the HDI board, as shown in fig. 2, taking an 8-layer printed circuit board as an example, the method comprises the following steps:
1. and processing the patterns of the inner layer.
Processing the graph of the inner layer, namely processing the graph of the L2-L7 layer, mainly comprises the following two steps:
in the first step, when processing the L2 layer, the L3 layer, the L6 layer and the L7 layer, the following flow is adopted:
1.1.1, core plate browning treatment. The purpose of this step is to increase the roughness of the copper surface, facilitating the direct laser of the next step.
1.1.2, punching secondary laser blind holes by adopting a direct laser method. Wherein, laser holes of L3-2 are punched from the L3 layer, laser energy parameters are required to be controlled, and copper foil of the L2 layer cannot be punched; similarly, laser holes of L6 to 7 are punched from the L6 layer, and the copper foil of the L7 layer cannot be punched.
1.1.3, electroplating and filling the laser blind holes formed in the upper step.
1.1.4, making a graph. The method sequentially comprises the following steps of:
pretreatment: and cleaning and microetching the core plate.
And (3) film pressing: and pasting and pressing a dry film on the surface of the core plate.
An exposure step: and transferring the required circuit pattern to the dry film through a film.
And (3) developing: the unexposed dry film is removed.
Etching: the unwanted copper foil is etched away.
Removing the film: and (3) reacting the stripping liquid with the dry film, and removing the dry film on the board surface.
1.1.5, AOI inspection.
1.1.6, browning treatment.
Secondly, when other inner core plates (L4 layer and L5 layer) are processed, the following processing flow is adopted:
1.2.1 patterning of the L4 and L5 layers was done using the method of 1.1.4.
1.2.2, AOI inspection.
1.2.3, browning treatment.
2. After the L2-L7 layers are processed according to the method, the L1-L8 layers are overlapped and pressed in sequence.
3. The L1 layer and the L8 layer of the HDI plate are subjected to outer layer treatment. The method specifically comprises the following steps:
3.1.1, milling burrs.
3.1.2, browning treatment.
And 3.1.3, punching laser blind holes on the outer layers (L1-2 and L8-7) by adopting a direct laser method.
And 3.1.4, electroplating and filling the laser blind holes.
The embodiment provides a processing method of an HDI board, and the method can change the existing two-time pressing processing method of the HDI board into one-time pressing, so that the processing flow of the current HDI board in the industry is effectively shortened, the processing time is shortened, and the cost is reduced.
The embodiment of the invention also provides an HDI board which is manufactured by using the processing method of any one of the HDI boards.
The HDI board manufactured by the processing method of any HDI board can be changed into a one-time pressing method by the existing two-time pressing method, so that the processing flow of the existing HDI board in the industry is effectively shortened, the processing time is shortened, and the cost is reduced.
The embodiment of the invention also provides electronic equipment, which comprises the HDI board.
The HDI board manufactured by the processing method of any HDI board is applied to electronic equipment such as a server, so that the pollution and damage to the environment can be reduced, and the manufacturing and using cost of the electronic equipment such as the server can be reduced to a certain extent.
Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The processing method of the HDI board, the HDI board and the electronic equipment provided by the invention are described in detail. The principles and embodiments of the present invention have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present invention and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the invention can be made without departing from the principles of the invention and these modifications and adaptations are intended to be within the scope of the invention as defined in the following claims.
Claims (5)
1. The processing method of the HDI board is characterized in that the HDI board comprises N layers of core boards, wherein the N layers of core boards comprise two outer core boards, four first inner core boards and at least one second inner core board; the processing method comprises the following steps:
respectively punching and pattern processing the 2 nd layer, the 3 rd layer, the N-1 st layer and the N-2 nd layer core plates of the HDI board by adopting a first preset processing flow, and carrying out corresponding processing treatment; wherein the 2 nd, 3 rd, N-1 st and N-2 nd core plates of the HDI board are first inner core plates;
respectively carrying out graphic processing on the 4 th layer to the N-3 rd layer core plates of the HDI plate by adopting a second preset processing flow, and carrying out corresponding processing treatment; wherein the 4 th to N-3 th core plates of the HDI board are second inner core plates;
laminating and pressing N layers of core plates of the HDI plate in sequence;
respectively carrying out outer layer treatment on the 1 st layer core plate and the N th layer core plate of the HDI plate by adopting a third preset processing flow; wherein the 1 st layer and the N th layer core plates of the HDI plate are outer layer core plates;
the first preset processing flow comprises the following steps:
s21: carrying out browning treatment on the core plate;
s22: a laser blind hole of the core plate is punched by adopting a direct laser method;
s23: filling and leveling the laser blind holes by adopting an electroplating mode;
s24: carrying out graphic processing on the core plate;
s25: performing automatic optical inspection on the core plate;
s26: after the inspection is passed, the core plate is subjected to browning treatment;
the second preset processing flow comprises the following steps:
s31: carrying out graphic processing on the core plate;
s32: performing automatic optical inspection on the core plate;
s33: after the inspection is passed, the core plate is subjected to browning treatment;
the third preset processing flow comprises the following steps:
s41: milling burrs of the core plate;
s42: carrying out browning treatment on the core plate;
s43: a laser blind hole of the core plate is punched by adopting a direct laser method;
s44: filling and leveling the laser blind holes by adopting an electroplating mode.
2. The method of processing an HDI board according to claim 1, wherein the patterning the core plate specifically includes:
a pretreatment step, namely cleaning and microetching the core plate;
film pressing, namely sticking a dry film on the surface of the core plate;
an exposure step, namely transferring a required circuit pattern to a dry film through a film;
a developing step of removing the dry film which is not exposed to light;
etching step, etching unnecessary copper foil;
and removing the film, namely reacting the film stripping liquid with the dry film, and removing the dry film on the surface of the board.
3. The method for processing an HDI board according to claim 1, wherein said step S22 further comprises:
when laser holes are drilled from the 3 rd core plate to the 2 nd core plate, the copper foil of the 2 nd core plate is prevented from being drilled through by controlling laser energy parameters;
when laser holes are drilled from the N-2 layer core plate to the N-1 layer core plate, the copper foil of the N-1 layer core plate is prevented from being perforated by controlling laser energy parameters.
4. An HDI board manufactured according to the method of manufacturing an HDI board according to any one of claims 1 to 3.
5. An electronic device, characterized in that: the electronic device employs the HDI board of claim 4.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111355809.2A CN114286541B (en) | 2021-11-16 | 2021-11-16 | Processing method of HDI board, HDI board and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111355809.2A CN114286541B (en) | 2021-11-16 | 2021-11-16 | Processing method of HDI board, HDI board and electronic equipment |
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| Publication Number | Publication Date |
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| CN114286541A CN114286541A (en) | 2022-04-05 |
| CN114286541B true CN114286541B (en) | 2023-08-11 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996560A (en) * | 2019-11-29 | 2020-04-10 | 苏州市迪飞特电子有限公司 | Method for processing multilayer printed circuit board |
| CN113015338A (en) * | 2021-02-26 | 2021-06-22 | 成都明天高新产业有限责任公司 | Circuit board with crossed blind holes and processing method thereof |
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2021
- 2021-11-16 CN CN202111355809.2A patent/CN114286541B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996560A (en) * | 2019-11-29 | 2020-04-10 | 苏州市迪飞特电子有限公司 | Method for processing multilayer printed circuit board |
| CN113015338A (en) * | 2021-02-26 | 2021-06-22 | 成都明天高新产业有限责任公司 | Circuit board with crossed blind holes and processing method thereof |
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| Publication number | Publication date |
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| CN114286541A (en) | 2022-04-05 |
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