CN208402212U - A kind of gold finger lead not connect with golden finger - Google Patents
A kind of gold finger lead not connect with golden finger Download PDFInfo
- Publication number
- CN208402212U CN208402212U CN201721908660.5U CN201721908660U CN208402212U CN 208402212 U CN208402212 U CN 208402212U CN 201721908660 U CN201721908660 U CN 201721908660U CN 208402212 U CN208402212 U CN 208402212U
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- CN
- China
- Prior art keywords
- lead
- golden finger
- finger
- golden
- gold
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 239000010931 gold Substances 0.000 title claims abstract description 20
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 238000007747 plating Methods 0.000 claims abstract description 6
- 238000013461 design Methods 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 10
- 230000003247 decreasing effect Effects 0.000 abstract description 2
- 230000008054 signal transmission Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000005553 drilling Methods 0.000 description 8
- 238000007639 printing Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses the gold finger lead that one kind is not connect with golden finger, including circuit board unit, there are several golden fingers on circuit board unit, golden finger is connected with route, and the route other end is connected by via hole with inner lead；Several golden fingers and conducting wire, route form different networks, connecting line is equipped between each network, connecting line and golden finger chip interconnection, lead, which extends to outside circuit board unit, connects metal aperture, metal aperture runs through plank, metal aperture both ends are equipped with pad, and pad connects the main lead of golden finger, main lead connection plating contained side.Golden finger surface connection structure is not changed, design requirement has been completely secured, it ensure that the accuracy of signal transmission, for multi-layer board lead design in internal layer, it is conducting on the main lead of outer layer by metal aperture, the quality problem that golden finger top burr and copper sheet warp is avoided, the process of this complex precise of bevel edge technique is decreased.
Description
Technical field
The utility model relates to arrive a kind of gold-plated structure of pcb board, belong to board production technical field more particularly to one
The gold finger lead that kind is not connect with golden finger.
Background technique
Circuit board such as printed circuit board, flexible circuit board is widely used in electronic field, if two pieces of circuit boards are mutual
Connection, general we can use edge connector (edge connector), be commonly called as " golden finger ".
Since craft of gilding is needed through lead conducting electric current during board production, gold plated lead is generally directly set
Meter on golden finger top, but part wiring board because functional requirement, the cause different in size of the golden finger of design, or design golden finger away from
Farther out from edges of boards, in bevel edge technique, the remaining length of finger lead is also inconsistent is easy to produce burr, another aspect golden finger
Lead residual is too long, also easilys lead to copper sheet in subsequent use and warps, has very big functionality to the current lead-through of golden finger
It influences.In addition golden finger being made without lead, production process is many and diverse, and need multi-fold to handle, in existing economic development, cost
Control is also the growth point of company's growth and profit, and therefore, the prior art is defective, needs to improve.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, one kind is provided and can be avoided and is drawn in bevel edge removal
The gilding structure of edge connector for circuit board that burr and copper sheet warp is generated when line, in addition contour structures are beautiful, and operation is facilitated not increase
Cost.
To solve the above problems, the technical scheme that the utility model is provided is as follows:
A kind of gold finger lead not connecting with golden finger, including circuit board unit have on the circuit board unit several
Golden finger, the golden finger are connected with route, and the route other end is connected by via hole with inner lead；Several gold
Finger and conducting wire, route form different networks, and connecting line, the connecting line and golden finger lead are equipped between each network
Connection, the lead, which extends to outside circuit board unit, connects metal aperture, and the metal aperture runs through plank, the metal aperture both ends
Equipped with pad, the pad connects the main lead of golden finger, the main lead connection plating contained side.
Preferred technical solution, it is 4-8mil that the main wire widths of golden finger, which are lead width described in 1-3mm.,.
Preferred technical solution, the golden finger include long golden finger and short golden finger and special-shaped golden finger.
Preferred technical solution, the outer golden finger part of the circuit board unit are laid with copper sheet and increase prosthetic finger, the vacation
Finger lead is connected on main lead, and object of the prosthetic finger as detection or experiment can test to avoid with plank
It causes to waste.
Preferred technical solution, the gold finger lead want Unified Element plate side to arrange.
The utility model compared with prior art, has the following advantages: golden finger surface connection structure is not changed, and is protected completely
Design requirement has been demonstrate,proved, ensure that the accuracy of signal transmission, in the circuit network structure being connect with golden finger, connecting line connection
Network where golden finger, and be connected to outside plate by lead, for multi-layer board lead design in internal layer, it is conducting to by metal aperture
On the main lead of outer layer, realize conducting electric current, after complete golden finger to be plated, connecting line bored by bore process it is disconnected, without doing hand again
Refer to that top bevel edge removes lead technique, avoids the quality problem that golden finger top burr and copper sheet warp, ensure that golden finger
The absolute integrity of structure, while the process of this complex precise of bevel edge technique is decreased, process time is shortened, is saved
Cost.
Detailed description of the invention
Illustrate embodiment or technical solution in the prior art in order to clearer, it below will be to embodiment or the prior art
The required attached drawing used is briefly described in description, it is clear that, the accompanying drawings in the following description is only the one of utility model
A little embodiments for those of ordinary skill in the art without creative efforts, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 is single dual platen golden finger structure schematic diagram of the utility model；
Fig. 2 is the multi-layer board golden finger structure schematic diagram of the utility model；
Fig. 3 is the composing structure schematic diagram of the utility model.
Detailed description of the invention 1- golden finger, 2- route, 3- lead, 4- drilling, 5- via hole, 6- conducting wire, 7- metal aperture, 8-
Contained side, 11- internal layer 11,12- outer layer 12 is electroplated in pad, the main lead of 9-, 10-.
Specific embodiment
For the ease of understanding the utility model, in the following with reference to the drawings and specific embodiments, the utility model is carried out more detailed
Thin explanation.The preferred embodiment of the utility model is given in attached drawing.But the utility model can be with many different
Form is realized, however it is not limited to this specification described embodiment.On the contrary, purpose of providing these embodiments is makes to this
The understanding of the disclosure of utility model is more thorough and comprehensive.
Unless otherwise defined, technical and scientific term all used in this specification and the skill for belonging to the utility model
The normally understood meaning of the technical staff in art field is identical.Art used in the description of the utility model in this specification
Language, which is only for the purpose of describing specific embodiments, is not intended to limitation the utility model.
As shown in Figure 1, one embodiment of the utility model is:
A kind of 1 lead of golden finger not connect with golden finger 1, including circuit board unit, if having on the circuit board unit
Dry golden finger 1, the golden finger 1 are connected with route 2, and 2 other end of route is connected by via hole 5 and inner lead 6；Institute
State several golden fingers 1 and conducting wire 6, route 2 form different networks, between each network be equipped with connecting line, the connecting line and
The connection of 1 lead 3 of golden finger, the lead 3 extend to and connect metal aperture 7 outside circuit board unit, and the metal aperture 7 runs through plate
Son, 7 both ends of metal aperture are equipped with pad 8, and the pad 8 connects the main lead 9 of golden finger 1, the main connection of the lead 9 plating folder
Side.
Preferred technical solution, it is 4-8mil that main 9 width of lead of the golden finger 1, which is 3 width of lead described in 1-3mm.,.
Preferred technical solution, the golden finger 1 include long golden finger 1 and short golden finger 1 and special-shaped golden finger 1.
Preferred technical solution, outer 1 part of golden finger of the circuit board unit are laid with copper sheet and increase prosthetic finger, described
Artificial hand index wire is connected on main lead 9.
Preferred technical solution, 1 lead of golden finger want Unified Element plate side to arrange, and facilitate typesetting and detection lead
Residual degree.
Embodiment
In order to better understand the utility model, illustrate for act dual platen and multi-layer board respectively, as shown in figures 1 and 3,
In two panel construction, golden finger 1 is found out in circuit board unit first, it is a net that those golden fingers 1 are separated in golden finger 1
Network, those golden fingers 1 are the networks for individually having oneself, after the network composition for distinguishing golden finger 1, different 1 nets of golden finger
Network is allocated as different layers and compares the position checked, and then select optimal, addition connecting line and the 4 least structures that drill, together
When to avoid 2 structures of route of tow sides, connecting line is set in public substrate area, while setting 1 lead 3 of golden finger
Position, connecting line and lead 3 connect, and connecting line and 3 width of lead are set as 4-8mil.If 2 width of route is equal in plate
Very little needs that the connecting line and lead 3 with 2 extra fine wire same widths of route in plate is arranged.When route 2 is wider in plate,
Lead 3 and connection wire are designed according to 4-8mil.
In the lead 3 of addition, 3 quantity of lead cannot be excessive, preferably there was only a lead 3 on one side, at most not
It to be more than three leads 3；In two panel construction, lead 3 does not need to connect with metal aperture 7.
In the production process, production typesetting production when, the arrangement of golden finger 1 wants direction consistent, and be golden finger 1 as far as possible
Centralized processing, convenient control and measurement to golden finger 1 gold medal thickness.Also facilitate the addition of main lead 9 simultaneously.
Lead 3 is connected on main lead 9, and the width of main lead 9 is greater than 1mm, and main lead 9 is connected to plating contained side
On.
After redesign is completed, according to the tool that design is completed, normal sawing sheet, drilling 4, heavy copper, plate electricity, etching, printing
Welding resistance.When printing welding resistance, metal part is intended to stencil outside the circuit board unit of all delivery, and then reduces unnecessary
Gold waste.
Before shaping, disconnection wiring is bored by way of drilling 4, lead is cut off at the time of molding.
As shown in Figures 2 and 3, in Multilayer Structure, golden finger is found out in 12 route 2 of circuit board unit outer layer first
1, respectively affiliated network is found out in golden finger 1, checks each 2 situation of sandwich circuit, and check every layer of 4 connection of drilling,
The common substrate region in multilayer line 2 is found simultaneously；In addition in several layers that internal layer 11 facilitates addition connecting line, each
1 network conductors of the corresponding golden finger of layer, 6 distribution situation layering compares, after the network composition for distinguishing golden finger 1, different
1 network of golden finger is allocated as different layers and compares to check, selects the optimal position of each network addition connecting line；Every
In the selection design of layer, several link positions can be designed, and then after the completion of different layers have gone out power, multi-layer analysis is selected more
Optimal point of addition and optimal adding layers.
In addition connecting line and the design of drilling 4, to facilitate addition connecting line and there are enough common substrate areas to be
It is good, while connecting line will lack as far as possible, drilling 4 will also be lacked as far as possible, and then avoid 2 structure of route of all internal layers 11 simultaneously, inside
In 11 structure of layer, while 1 lead of golden finger, 3 position is set, connecting line and lead 3 connect, and connecting line and lead 3 are wide
Degree is set as 4-8mil.In the lead 3 of addition, 3 quantity of lead cannot be excessive, and design is at one layer as far as possible, a side
Reason is searched when something goes wrong.
It is connected to outside delivery cell board in the lead 3 of internal layer 11, on layout technique edges, is provided with downlink connection copper
Disk, lead 3 are connected with copper dish.
In the design of outer layer 12, place setting pad 8 identical with 11 copper dish position of internal layer, pad 8 and main lead 9 connect
It connects, the width of main lead 9 is greater than 1mm, and main lead 9 is connected on plating contained side.
In the production process, production typesetting production when, the arrangement of golden finger 1 wants direction consistent, and be golden finger 1 as far as possible
Centralized processing, convenient control and measurement to golden finger 1 gold medal thickness.Also facilitate the addition of main lead 9 simultaneously.
After redesign is completed, according to the tool that design is completed, normal every layer of film out, and be pressed together, it is pressing
During conjunction, it should be noted that the selection of PP piece avoids the excessive formation route 2 of gummosis amount from warping or squeeze and is broken, after pressing,
Normal sawing sheet, drilling 4, heavy copper, plate electricity, etching, printing welding resistance.The metal outside the circuit board unit of all delivery when printing welding resistance
Part is intended to stencil, and then reduces unnecessary gold waste.
Before shaping, disconnection wiring is bored by way of drilling 4, lead is cut off at the time of molding.
It should be noted that above-mentioned each technical characteristic continues to be combined with each other, the various embodiments not being enumerated above are formed,
It is accordingly to be regarded as the range of the utility model specification record；Also, it for those of ordinary skills, can be according to above stating
It is bright to be improved or converted, and all these modifications and variations all should belong to the protection model of the appended claims for the utility model
It encloses.
Claims (5)
1. the gold finger lead that does not connect with golden finger of one kind, including circuit board unit, there are several gold on the circuit board unit
Finger, the golden finger are connected with route, and the route other end is connected by via hole with inner lead；It is characterized in that,
Several golden fingers and conducting wire, route form different networks, and connecting line, the connecting line and gold are equipped between each network
Finger chip interconnection, the lead, which extends to outside circuit board unit, connects metal aperture, and the metal aperture runs through plank, described
Metal aperture both ends are equipped with pad, and the pad connects the main lead of golden finger, the main lead connection plating contained side.
2. the gold finger lead that one kind according to claim 1 is not connect with golden finger, which is characterized in that the golden finger
Main wire widths are that lead width described in 1-3mm. is 4-8mil.
3. the gold finger lead that one kind according to claim 1 is not connect with golden finger, which is characterized in that the circuit board
The outer golden finger part of unit, is laid with copper sheet and increases prosthetic finger, the artificial hand index wire is connected on main lead.
4. the gold finger lead that one kind according to claim 1 is not connect with golden finger, which is characterized in that the golden finger
Including long golden finger and short golden finger and special-shaped golden finger.
5. the gold finger lead that one kind described in any one of -4 is not connect with golden finger, feature exist according to claim 1
In the gold finger lead wants Unified Element plate side to arrange.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721908660.5U CN208402212U (en) | 2017-12-30 | 2017-12-30 | A kind of gold finger lead not connect with golden finger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721908660.5U CN208402212U (en) | 2017-12-30 | 2017-12-30 | A kind of gold finger lead not connect with golden finger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208402212U true CN208402212U (en) | 2019-01-18 |
Family
ID=65065841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721908660.5U Expired - Fee Related CN208402212U (en) | 2017-12-30 | 2017-12-30 | A kind of gold finger lead not connect with golden finger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208402212U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113471164A (en) * | 2021-06-28 | 2021-10-01 | 江西晶浩光学有限公司 | Chip packaging structure, camera module and electronic equipment |
| CN113507791A (en) * | 2021-06-02 | 2021-10-15 | 深圳市强达电路股份有限公司 | Manufacturing method of gold finger with stepped structure |
-
2017
- 2017-12-30 CN CN201721908660.5U patent/CN208402212U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113507791A (en) * | 2021-06-02 | 2021-10-15 | 深圳市强达电路股份有限公司 | Manufacturing method of gold finger with stepped structure |
| CN113471164A (en) * | 2021-06-28 | 2021-10-01 | 江西晶浩光学有限公司 | Chip packaging structure, camera module and electronic equipment |
| CN113471164B (en) * | 2021-06-28 | 2023-09-08 | 江西晶浩光学有限公司 | Chip packaging structure, camera module and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190724 Address after: 518100 District B, Building 12, Second Floor, Tangwei Xinyuan Industrial Zone, Fuyong Street, Baoan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Ruibang Multilayer Circuit Board Technology Co., Ltd. Address before: Longgang District of Shenzhen City, Guangdong province 518000 Pinghu Street Ping West Road No. 7 Building thaw Lake century garden A block 504 Patentee before: He Ding |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190118 Termination date: 20201230 |