CN108882560A - A kind of processing method and golden finger wiring board of golden finger - Google Patents
A kind of processing method and golden finger wiring board of golden finger Download PDFInfo
- Publication number
- CN108882560A CN108882560A CN201810746462.6A CN201810746462A CN108882560A CN 108882560 A CN108882560 A CN 108882560A CN 201810746462 A CN201810746462 A CN 201810746462A CN 108882560 A CN108882560 A CN 108882560A
- Authority
- CN
- China
- Prior art keywords
- golden finger
- lead wire
- wiring board
- electroplate lead
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to a kind of processing method of golden finger and golden finger wiring boards, include the following steps：Electroplate lead wire is processed on the outer layer of assist side, electroplate lead wire is connected with all golden finger PAD on wiring board；Several plated through-holes are processed on electroplate lead wire, and electroplate lead wire is connect with electroplated lead, the gold-plated formation golden finger on golden finger PAD；It drills, makes between multiple golden fingers in open-circuit condition in the center of plated through-hole；Wiring board is milled out into shape.The present invention is provided through electroplate lead wire and connect with electroplated lead, the gold-plated formation golden finger on golden finger PAD, after preferably milling out shape, golden finger endpoint location does not reveal copper, also it is capable of the normal operating of gold finger galvanizing gold process simultaneously, improve the defect of existing golden finger technology and improves the quality of golden finger production.
Description
Technical field
The present invention relates to printed-board technology field more particularly to the processing methods and golden finger route of a kind of golden finger
Plate.
Background technique
PCB, full name PrintedCircuitBoard, Chinese are printed wiring board or printed circuit board, hereinafter referred to as line
Road plate；Wiring board is the carrier of electronic component.With the development of electronic technology, each electronic product has most printed wiring board
New requirement, pcb board tend to develop to short, small, light, thin direction, and integrated level is very high, demand of the novel product to golden finger
It is higher and higher, " golden finger " for optic module, computer display card, memory bar and it is various containing the correlation of USB interface set
The standby position being in contact with other substrates, in consideration of it, being also increasingly stringenter to " golden finger " surface treatment and appearance requirement.
Due to the particularity of " golden finger ", must have and have good wearability and low contact resistance performance, therefore make
During making " golden finger ", one layer of gold is plated on " golden finger " surface to realize.In existing golden finger manufacturing technology, gold
Finger needs the golden finger PAD connection of outer layer using plating gold finger lead then to utilize plating with conducting before plating
Technique is gold-plated on golden finger PAD by plating gold finger lead, and finally complete golden finger.
The gold finger lead that broken with gong knife gong is needed after completing due to plating golden finger, finger lead can remain in PCB outer layer
Golden finger PAD end or surrounding, and at present the high-tech areas such as seabed fiber module and space flight and aviation PCB make
In it is required that, to guarantee that golden finger adapts to the stability under high-intensitive working environment, being usually required around golden finger does not allow
Reveal copper, and golden finger wants gold-plated and gold plated lead must be added gold-plated.
Summary of the invention
Technical problem to be solved by the invention is to provide a kind of processing methods for the golden finger for not revealing copper around golden finger
And golden finger wiring board.
In order to solve the above technical problems, the technical scheme is that：A kind of processing method of golden finger, including following step
Suddenly：
An electroplate lead wire, the resistance on the electroplate lead wire and the wiring board are processed on the outer layer of the wiring board
Weld golden finger PAD series connection all in windowed regions；
Several plated through-holes are processed on the electroplate lead wire, the plated through-hole is located between two golden finger PAD；
The electroplate lead wire is connect with electroplated lead, by electroplating technology on golden finger PAD gold-plated formation golden finger；
It is drilled by bore process in the center of the plated through-hole, makes to connect by the electroplate lead wire multiple
It is in open-circuit condition between golden finger；
The wiring board is milled out into shape.
As a preferred technical solution, after the electroplate lead wire machine-shaping, one layer of resistance is covered on the electroplate lead wire
Solder paste.
As a preferred technical solution, in the setting of the outside of the plated through-hole convenient for the pad of boring positioning.
As a preferred technical solution, after the golden finger molding, and before drilling at plated through-hole center, described
Gold glue is pasted above golden finger, for protecting the golden finger.
Golden finger wiring board, the outer layer of the wiring board are equipped with golden finger PAD, are equipped with and pass through above the golden finger PAD
Craft of gilding forms golden finger, is additionally provided with the electroplate lead wire connecting with all golden finger PAD on the outer layer of the wiring board, described
Electroplate lead wire is equipped with several and processes hole by the electroless coating that bore process is formed, and electroless coating processing hole makes the plating
It is in open-circuit condition between lead and multiple golden fingers.
The one end the golden finger PAD is connected with golden finger outer connection, the electroplate lead wire as a preferred technical solution,
It is conductively connected by the golden finger outer connection and the golden finger PAD.
The wiring board is multilayer circuit board or double-sided wiring board as a preferred technical solution,.
The golden finger is isolated bit golden finger or grading connecting finger as a preferred technical solution,.
By adopting the above-described technical solution, the beneficial effects of the invention are as follows：The present invention is provided with to be arranged in the circuit board
Electroplate lead wire, is connect by electroplate lead wire with electroplated lead, the gold-plated formation golden finger on golden finger PAD, is preferably milled out outer
After shape, golden finger endpoint location does not reveal copper, while can also make golden finger in the normal production of electroplating gold process, improves existing
The defect of golden finger technology and the quality for improving golden finger production.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other drawings based on these drawings.
Fig. 1 is the process flow chart of the processing method of golden finger of the embodiment of the present invention；
Fig. 2 is the structural schematic diagram of golden finger wiring board of the embodiment of the present invention；
Fig. 3 is the cross-sectional view in Fig. 2 at A-A；
In figure：1- wiring board；11- welding resistance windowed regions；2- electroplate lead wire；3- plated through-hole；4- electroless coating processes hole；5-
Golden finger；51- golden finger outer connection；6- pad；7- electroplated lead.
Specific embodiment
As Fig. 1 to Fig. 3 jointly shown in, a kind of processing method of golden finger includes the following steps：
An electroplate lead wire 2 is processed on the outer layer of assist side 1, the welding resistance windowing area on electroplate lead wire 2 and wiring board 1
All golden finger PAD series connection in domain 11；
Several plated through-holes 3 (see circular dashed line part in Fig. 2) are processed on electroplate lead wire 2, plated through-hole 3 is located at two
Between a golden finger PAD；
Electroplate lead wire 2 is connect 7 with electroplated lead, by electroplating technology on golden finger PAD gold-plated formation golden finger 5；
By bore process the drilling of the center of plated through-hole 3 (processing hole 4 see the electroless coating in Fig. 2 and Fig. 3), make
It is in open-circuit condition between the multiple golden fingers 5 connected by electroplate lead wire 2；
Wiring board 1 is milled out into shape.
Preferably, after 2 machine-shaping of electroplate lead wire, one layer of welding resistance oil is covered on electroplate lead wire 2.
Preferably, in the setting of the outside of plated through-hole 3, convenient for the pad 6 of boring positioning, (pad 6, which is located in Fig. 2, to metallize
Between hole 3 and electroless coating processing hole 4).
Preferably, after golden finger 5 forms, and before drilling at 3 center of plated through-hole, gold is pasted above golden finger 5
Glue, for protecting golden finger 5.
As shown in Figures 2 and 3, golden finger wiring board, the outer layer of wiring board 1 are equipped with golden finger PAD, the top golden finger PAD
Equipped with golden finger 5 is formed by craft of gilding, it is additionally provided on the outer layer of wiring board 1 and draws with all golden finger PAD plating connecting
Line 2, electroplate lead wire 2 are equipped with several and process hole 4 by the electroless coating that bore process is formed, and electroless coating processing hole 4 makes to be electroplated
It is in open-circuit condition between lead 2 and multiple golden fingers 5.
Preferably, the one end golden finger PAD is connected with golden finger outer connection 51, and electroplate lead wire 2 is drawn by golden finger outer layer
Line 51 and golden finger PAD are conductively connected.
Wiring board 1 is suitable for multilayer circuit board or double-sided wiring board in the present invention, and golden finger 5 is isolated bit golden finger or divides
Grade golden finger.
The above shows and describes the basic principle, main features and advantages of the invention.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (8)
1. a kind of processing method of golden finger, which is characterized in that include the following steps：
An electroplate lead wire is processed on the outer layer of the wiring board, the electroplate lead wire is opened with the welding resistance on the wiring board
All golden finger PAD series connection in window region；
Several plated through-holes are processed on the electroplate lead wire, the plated through-hole is located between two golden finger PAD；
The electroplate lead wire is connect with electroplated lead, by electroplating technology on golden finger PAD gold-plated formation golden finger；
It is drilled by bore process in the center of the plated through-hole, makes the multiple golden hands connected by the electroplate lead wire
It is in open-circuit condition between finger；
The wiring board is milled out into shape.
2. a kind of processing method of golden finger as described in claim 1, it is characterised in that：The electroplate lead wire machine-shaping
Afterwards, one layer of welding resistance oil is covered on the electroplate lead wire.
3. a kind of processing method of golden finger as described in claim 1, it is characterised in that：It is set on the outside of the plated through-hole
Set the pad convenient for boring positioning.
4. a kind of processing method of golden finger as described in claim 1, it is characterised in that：After the golden finger molding, and
Before drilling at plated through-hole center, gold glue is pasted above the golden finger, for protecting the golden finger.
5. using a kind of described in any item golden finger wiring boards of the processing method preparation of golden finger of such as Claims 1-4,
It is characterized in that：The outer layer of the wiring board is equipped with golden finger PAD, is equipped with above the golden finger PAD and is formed by craft of gilding
Golden finger is additionally provided with the electroplate lead wire connecting with all golden finger PAD on the outer layer of the wiring board, sets on the electroplate lead wire
There are several to process hole by the electroless coating that bore process is formed, electroless coating processing hole makes the electroplate lead wire and multiple gold
It is in open-circuit condition between finger.
6. golden finger wiring board as claimed in claim 4, it is characterised in that：The one end the golden finger PAD is connected with golden finger
Outer connection, the electroplate lead wire are conductively connected by the golden finger outer connection and the golden finger PAD.
7. golden finger wiring board as claimed in claim 4, it is characterised in that：The wiring board is multilayer circuit board or two-sided line
Road plate.
8. golden finger wiring board as claimed in claim 4, it is characterised in that：The golden finger is isolated bit golden finger or classification
Golden finger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810746462.6A CN108882560A (en) | 2018-07-09 | 2018-07-09 | A kind of processing method and golden finger wiring board of golden finger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810746462.6A CN108882560A (en) | 2018-07-09 | 2018-07-09 | A kind of processing method and golden finger wiring board of golden finger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108882560A true CN108882560A (en) | 2018-11-23 |
Family
ID=64300365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810746462.6A Pending CN108882560A (en) | 2018-07-09 | 2018-07-09 | A kind of processing method and golden finger wiring board of golden finger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108882560A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110519926A (en) * | 2019-08-01 | 2019-11-29 | 苏州浪潮智能科技有限公司 | A kind of PCB containing golden finger and its wiring method of adjustment and equipment |
| CN112672528A (en) * | 2019-10-16 | 2021-04-16 | 健鼎（无锡）电子有限公司 | Gold finger structure and manufacturing method thereof |
| CN112770520A (en) * | 2019-11-05 | 2021-05-07 | 健鼎（无锡）电子有限公司 | Gold finger structure and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6192580B1 (en) * | 1996-12-05 | 2001-02-27 | Oki Electric Industry Co., Ltd. | Method of making laminate printed circuit board with leads for plating |
| CN1812692A (en) * | 2005-01-25 | 2006-08-02 | 日本电气株式会社 | Print substrate with tab terminal, electronic equipment and method of manufacture the same |
| CN108260291A (en) * | 2017-11-30 | 2018-07-06 | 深圳崇达多层线路板有限公司 | It is a kind of based on filling holes with resin and back drill technique without the remaining electro-plating method of lead |
-
2018
- 2018-07-09 CN CN201810746462.6A patent/CN108882560A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6192580B1 (en) * | 1996-12-05 | 2001-02-27 | Oki Electric Industry Co., Ltd. | Method of making laminate printed circuit board with leads for plating |
| CN1812692A (en) * | 2005-01-25 | 2006-08-02 | 日本电气株式会社 | Print substrate with tab terminal, electronic equipment and method of manufacture the same |
| CN108260291A (en) * | 2017-11-30 | 2018-07-06 | 深圳崇达多层线路板有限公司 | It is a kind of based on filling holes with resin and back drill technique without the remaining electro-plating method of lead |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110519926A (en) * | 2019-08-01 | 2019-11-29 | 苏州浪潮智能科技有限公司 | A kind of PCB containing golden finger and its wiring method of adjustment and equipment |
| CN112672528A (en) * | 2019-10-16 | 2021-04-16 | 健鼎（无锡）电子有限公司 | Gold finger structure and manufacturing method thereof |
| CN112770520A (en) * | 2019-11-05 | 2021-05-07 | 健鼎（无锡）电子有限公司 | Gold finger structure and manufacturing method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181123 |