CN112770520A

CN112770520A - Gold finger structure and manufacturing method thereof

Info

Publication number: CN112770520A
Application number: CN201911069701.XA
Authority: CN
Inventors: 钟欢欢; 张涛; 杨海; 孙奇; 吕政明
Original assignee: Jianding Wuxi Electronics Co ltd
Current assignee: Jianding Wuxi Electronics Co ltd
Priority date: 2019-11-05
Filing date: 2019-11-05
Publication date: 2021-05-07

Abstract

The invention discloses a golden finger structure and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: providing a board body, a circuit layer formed on the board body, and an insulating outer layer covering a part of the circuit layer, wherein the circuit layer comprises a plurality of metal circuits, each metal circuit comprises a circuit section, a connecting pad, and a first sacrificial section, and the board body defines a first sacrificial area for bearing a plurality of the first sacrificial sections; and carrying out blind fishing on the first sacrificial section of each metal circuit to remove each first sacrificial section, the joint pad part adjacent to the first sacrificial section and the first sacrificial area of the plate body, so that a first short edge is formed on the joint pad of each metal circuit at the part far away from the circuit section, and a first long groove is formed on the plate body at the position corresponding to the first short edges.

Description

Gold finger structure and manufacturing method thereof

Technical Field

The present invention relates to a gold finger and a method for manufacturing the same, and more particularly, to a gold finger structure and a method for manufacturing the same.

Background

In the conventional method for manufacturing the gold finger structure, a semi-finished product of the conventional gold finger structure is modified by etching. However, the above etching method actually causes many problems. For example, the etching solution required for the etching step may pollute the environment; the etching process takes a lot of time, which results in low production efficiency and high production cost. Therefore, it is one of the important issues to be solved by the industry to provide a method for manufacturing a gold finger structure that reduces contamination and saves time to overcome the drawbacks of the conventional method for manufacturing a gold finger structure.

The present inventors have considered that the above-mentioned drawbacks can be improved, and have made intensive studies in cooperation with the application of scientific principles, and finally have proposed an invention that is reasonably designed and effectively improves the above-mentioned drawbacks.

Disclosure of Invention

Embodiments of the present invention provide a gold finger structure and a method for manufacturing the same, which can effectively overcome the defects possibly generated by the existing gold finger structure and the method for manufacturing the same.

The embodiment of the invention provides a manufacturing method of a golden finger structure, which comprises the following steps: a pre-step: providing a board body, a circuit layer formed on the board body, and an insulating outer layer covering a part of the circuit layer; wherein the wiring layer includes a plurality of metal wirings arranged in a transverse direction, and each of the metal wirings includes: a line section partially embedded in the insulating outer layer; the connecting pad comprises an inner circuit connected with the circuit section and a gold-plated film plated with the inner circuit; the first sacrificial section is connected to the part of the internal circuit, which is far away from the circuit section; wherein, the plate body is defined with a first sacrificial area which bears a plurality of the first sacrificial sections; wherein the first sacrificial section of each metal circuit is exposed outside the corresponding gold-plated film; and a blind fishing step: and carrying out blind fishing on the first sacrificial section of each metal circuit to remove each first sacrificial section, the joint pad part adjacent to the first sacrificial section and the first sacrificial area of the plate body, so that a first short edge is formed on the joint pad of each metal circuit at the part far away from the circuit section, and a first long groove is formed on the plate body at the position corresponding to the first short edges.

The embodiment of the invention also discloses a golden finger structure, which comprises: a plate body, which is provided with a first elongated slot; an insulating outer layer formed on the board body; and a circuit layer formed on the board body and including a plurality of metal circuits arranged in a transverse direction, each of the metal circuits including: a line section partially embedded in the insulating outer layer; and a pad comprising an inner circuit connected to the circuit section and a gold-plated film plated with the inner circuit; in each metal circuit, a first short edge is formed on the part, far away from the circuit section, of the contact pad; the first long grooves are respectively corresponding to the first short sides.

In summary, the gold finger structure and the manufacturing method thereof disclosed in the embodiments of the present invention greatly reduce or completely eliminate the use of etching solution by improving the manufacturing method compared to the existing manufacturing method of the gold finger structure, thereby providing a gold finger structure and the manufacturing method thereof that have less environmental pollution, shorter manufacturing time, and can rapidly modify the lengths of a plurality of gold fingers after gold plating.

For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the invention in any way.

Drawings

FIG. 1 is a schematic diagram illustrating a front-end step of a method for fabricating a gold finger structure according to an embodiment of the present invention;

fig. 2 is a schematic diagram illustrating a blind fishing step of the method for manufacturing a gold finger structure according to the embodiment of the present invention;

FIG. 3 is an enlarged schematic view of region III of FIG. 2;

FIG. 4 is a schematic cross-sectional view of FIG. 2 along section line IV;

FIG. 5 is an enlarged schematic view of region V of FIG. 2;

FIG. 6 is a schematic cross-sectional view of FIG. 2 along section line VI;

FIG. 7 is a diagram illustrating a gold finger structure according to an embodiment of the present invention;

FIG. 8 is a schematic view of FIG. 7 without the plurality of gold plating films and the plurality of sub-gold plating films.

Description of the symbols

100: golden finger structure

1: plate body

1 a: first sacrificial region

1 b: second sacrificial region

1 c: first long groove

1 d: second long groove

2: insulating outer layer

3: line layer

31: metal circuit

311: line section

312: connecting pad

3121: inner line

3122: gold-plated film

312 a: first short side

31': sub-metal circuit

312': sub-pad

3121': interior wiring

3122': gilding film

312' a: second short side

313: first sacrificial segment

314: second sacrificial segment

L: longitudinal direction

L1: first length

L2: second length

W: in the transverse direction

D: direction of depth

D1: first depth

D2: second depth

S110: preliminary step

S120: blind fishing step

Detailed Description

Please refer to fig. 1 to 8, which are exemplary embodiments of the present invention, and it should be noted that, in the exemplary embodiments, related numbers and shapes mentioned in the accompanying drawings are only used for describing the embodiments of the present invention in detail, so as to facilitate the understanding of the contents of the present invention, and not for limiting the scope of the present invention.

[ method for producing gold finger Structure ]

Referring to fig. 1 and 2, the present embodiment discloses a method for manufacturing a gold finger structure. Compared with the existing method for manufacturing the structure of the gold finger structure, the method for manufacturing the gold finger structure of the embodiment has the advantages of low environmental pollution, less time consumption and capability of modifying the length of the gold finger after gold plating. The method for manufacturing the gold finger structure comprises a pre-step S110 and a blind-fishing step S120. The steps of the method for fabricating a gold finger structure of this embodiment will be described. In addition, when the method for manufacturing the gold finger structure is implemented, the content and the sequence of the steps are not limited in the present invention.

The pre-step S110 is as shown in fig. 1: a board body 1, a circuit layer 3 formed on the board body 1, and an insulating outer layer 2 covering a part of the circuit layer 3 are provided. The circuit layer 3 includes a plurality of metal circuits 31 arranged along a transverse direction W, and each metal circuit 31 includes a circuit section 311 partially embedded in the insulating outer layer 2, a pad 312, and a first sacrificial section 313. Wherein the pad 312 includes an inner circuit 3121 connected to the circuit segment 311 and a gold-plated film 3122 plated on the inner circuit 3121; the first sacrificial segment 313 is connected to the inner circuit 3121 away from the circuit segment 311; the board body 1 defines a first sacrificial region 1a, which carries a plurality of the first sacrificial segments 313; moreover, the first sacrificial segment 313 of each metal line 31 is exposed outside the corresponding gold-plating film 3122.

In the present embodiment, the plate body 1 is substantially rectangular, the short sides of the rectangle (or the plate body 1) are substantially parallel to the transverse direction W, and the transverse direction W is perpendicular to a longitudinal direction L. It should be noted that the plate body 1 is mainly used for carrying other components, and the embodiment does not limit the shape, size, material, and other properties of the plate body 1.

The plate body 1 may define the first sacrificial region 1a and the second sacrificial region 1b, which respectively carry a plurality of the first sacrificial segments 313 and a plurality of the second sacrificial segments 314 (detailed in the following description). The first sacrificial region 1a and the second sacrificial region 1b are both substantially elongated and are both substantially parallel to the lateral direction W. The shape and size of the first sacrificial region 1a and the first sacrificial segments 313 may vary according to the requirement or the number of the first sacrificial segments 313 carried by the first sacrificial region. Similarly, the number, shape and size of the second sacrificial regions 1b may vary according to the requirement or the number of the second sacrificial segments 314 carried thereby. In the present embodiment, the first sacrificial region 1a is located at a lower portion of the board body 1 in fig. 1, and a portion of the second sacrificial region 1b is substantially defined between four sub-pads 312' (described in detail later) in fig. 1.

The insulating outer layer 2 covers a part of the wiring layer 3 and is formed at one end of the board body 1 adjacent to the upper side in fig. 1. The insulating outer layer 2 in this embodiment is substantially rectangular, and the short sides of the rectangle (or the insulating outer layer 2) are substantially parallel to the longitudinal direction L. The insulating outer layer 2 may be a resin material such as polyimide, dacron, polyethylene terephthalate, polytetrafluoroethylene, epoxy resin, or aramid, for example. However, the shape, size, material, and other relevant properties of the insulating outer layer 2 can be changed according to the requirement, and the embodiment is not limited herein.

In this embodiment, the circuit layer 3 may be formed of a conductive material, such as copper or silver, and the material of the circuit layer 3 may vary according to requirements. As mentioned in the pre-step S110, the circuit layer 3 includes a plurality of metal circuits 31, and each metal circuit 31 includes the circuit segment 311, the pad 312, and the first sacrificial segment 313.

The circuit layer 3 in this embodiment includes nine metal lines 31, and two adjacent metal lines 31 are each defined as a sub-metal line 31' (e.g., the third and fourth metal lines 31 counted from the left side of fig. 1). In each of the sub-metal lines 31 ', the pads 312 include two sub-pads 312' disposed at intervals along the longitudinal direction L. That is, the number of the sub-pads 312' in the present embodiment is four.

It should be noted that a plurality of adjacent sub-metal lines 31 'may be defined as a sub-metal line group (in the present embodiment, the sub-metal lines 31' of the third and fourth from the left side of fig. 1 may be collectively defined as the sub-metal line group), and the number of the second sacrificial regions 1b of the board body 1 corresponds to the number of the sub-metal line group. In the present embodiment, the number of the sub-metal circuit groups is one, but the number of the sub-metal circuit groups and the number of the sub-metal circuits 31' included in the sub-metal circuit groups can be changed according to the requirement, and is not limited to this embodiment.

For example, in other embodiments not shown in the present disclosure, the number of sub-metal line groups included in the line layer 3 is two, and each sub-metal line group includes two sub-metal lines 31'; two second sacrificial regions 1b are correspondingly defined on the board body 1, and each of the second sacrificial regions 1b carries four second sacrificial segments 314 of one of the sub-metal circuit groups.

Each sub-pad 312 'includes an inter-sub-trace 3121' and a sub-gold-plated film 3122 'plated on the inter-sub-trace 3121'. In the two sub-pads 312 ', the sub-inner circuit 3121 ' of the sub-pad 312 ' located at the upper side in fig. 1 is connected to the circuit segment 311; the sub-inner traces 3121 'of the sub-pad 312' located relatively below in fig. 1 are connected to the first sacrificial segment 313. In addition, the sub-inner traces 3121 ' of the two sub-pads 312 ' are connected by a second sacrificial segment 314, and the second sacrificial segment 314 is located between the two sub-pads 312 '. In addition, the first sacrificial section 313 and the second sacrificial section 314 are exposed outside the corresponding gold-plating film 3122.

It should be noted that the metal lines 31 do not limit the number of the sub-metal lines 31 'included in the metal lines 31, and the metal lines 31 do not limit the sub-metal lines 31' included in the metal lines 31. In addition, the number of the sub-pads 312 'included in the pads 312 in each of the sub-metal lines 31' is not limited to two. That is, when the number of sub-pads 312 ' included in the pad 312 is greater than or equal to two, the metal line 31 including the pad 312 can be defined as the sub-metal line 31 ', and any two sub-pads 312 ' adjacent to each other in the longitudinal direction L are connected by the second sacrificial segment 314. In addition, the arrangement order of the metal lines 31 and the sub-metal lines 31' along the transverse direction W may also vary according to the requirement, and the embodiment is not limited herein.

The blind fishing step S120 is as shown in fig. 2: the first sacrificial segments 313 of the metal lines 31 are subjected to a blind-tapping process to remove the first sacrificial segments 313, the portions of the pads 312 adjacent to the first sacrificial segments 313, and the first sacrificial regions 1a of the board body 1, so that a first short edge 312a is formed at a portion of the pads 312 of the metal lines 31, which is far away from the line segment 311, and a first long slot 1c is formed at a position of the board body 1, which corresponds to the first short edges 312 a.

In the blind-tapping step S120, the second sacrificial section 314 of each sub-metal line 31 ' may be blind-tapped to remove the second sacrificial section 314, the adjacent two sub-pads 312 ' thereof, and the second sacrificial region 1b of the board body 1, so that two adjacent second short sides 312 ' a are formed on the two sub-pads 312 ', and a second long slot 1d is formed on the board body 1 at a position corresponding to the second short sides 312 ' a.

It should be noted that, in the present embodiment, the first short sides 312a and the second short sides 312' a are all linear and parallel to the transverse direction. That is, the non-linear (e.g., arc or curved) shape of the gold finger structure manufactured by any method is difficult to be compared with the method for manufacturing the gold finger structure of the present embodiment.

In addition, in the blind-tapping step S120, each of the pads 312 has a first length L1 in the longitudinal direction L, each of the sub-pads 312 'has a second length L2 in the longitudinal direction L, and the first length L1 of each of the pads 312 is greater than the second length L2 of any of the sub-pads 312'.

Referring to fig. 3 to 6 in conjunction with fig. 2, in detail, the first short side 312a and the second short side 312' a formed in the blind-scooping step S120 are aligned with a portion of the first long groove 1c and a portion of the second long groove 1d, respectively. For convenience of description, the method for manufacturing the gold finger structure further defines a depth direction D perpendicular to the longitudinal direction L and the transverse direction W. Wherein the first elongated slot 1c has a first depth D1, and the first depth D1 is between 25um (μm) and 125 um; the second elongated slot 1D has a second depth D2, and the second depth D2 is between 25um and 125 um. The first depth D1 and the second depth D2 are both substantially parallel to the depth direction D.

In the blind fishing step S120 of this embodiment, each corresponding portion may be blind-fished by moving a milling cutter (not shown) during rotation. The milling cutter is substantially long and has a long axis direction. Specifically, since the milling cutter rotates about the longitudinal direction as an axis and moves in the lateral direction W during blind milling, a plurality of the first short sides 312a and first long grooves 1c, or a plurality of the second short sides 312' a and second long grooves 1d are formed in a portion adjacent to the milling cutter where blind milling is performed.

In this embodiment, since the first long slot 1c and the second long slot 1d are formed by the blind-fishing process, the shapes of the notches of the first long slot 1c and the second long slot 1d are similar to a playground shape (the playground shape is similar to a rectangle with two opposite sides replaced by a circular arc side, and is similar to the shape of a playground, so that the playground shape is simply referred to as the playground shape). In the blind fishing step S120, the tool required for the blind fishing, the method for the blind fishing, the shape and the size of the milling cutter, and the like may be changed according to the requirements, and are not limited to this embodiment.

In the blind fishing step S120 of the present embodiment, the blind fishing sequence of the first sacrificial segments 313 carried by the first sacrificial region 1a and the second sacrificial segments 314 carried by the second sacrificial region 1b is not limited. That is, according to actual requirements, the blind fishing process may be performed on the plurality of second sacrificial segments 314 carried by the second sacrificial region 1b, and then the blind fishing process may be performed on the plurality of first sacrificial segments 313 carried by the first sacrificial region 1 a. Alternatively, when the board body 1 provided in the pre-step S110 includes a plurality of first sacrificial regions 1a and a plurality of second sacrificial regions 1b, in the blind fishing step S120, the plurality of first sacrificial segments 313 carried by the plurality of first sacrificial regions 1a and the plurality of second sacrificial segments 314 carried by the plurality of second sacrificial regions 1b may be alternately blind-fished.

It should be noted that the plurality of first sacrificial segments 313 and the plurality of second sacrificial segments 314 are not limited to be removed by the blind fishing step S120. For example, in a special application, the first sacrificial segments 313 can be removed by the blind-fishing step S120, and the second sacrificial segments 314 can be removed by an etching method; alternatively, a plurality of the first sacrificial segments 313 may be removed by the etching, and a plurality of the second sacrificial segments 314 may be removed by the blind-scooping step S120. However, the present embodiment does not impose limitations on the manner of removing the first sacrificial segments 313 or the second sacrificial segments 314 except for the blind-fishing step S120.

It should be noted that, the method for manufacturing the gold finger structure may further include a step of coating a film, a step of electroplating, and a step of removing, in order, before the pre-step S110. The method for manufacturing the gold finger structure is not limited to include the step of coating the film, the step of electroplating, and the step of removing.

In the filming step, a mask (not shown) is covered on the insulating outer layer 2. The shielding object can have plating-proof property (i.e. gold is not easy to be plated on the shielding object), so as to avoid the waste of gold plating liquid medicine caused by the fact that the gold is plated on the outer surface of the shielding object. It should be noted that the shape, number, material and other properties of the shielding object can be changed according to the requirement, and the embodiment is not limited herein.

In the electroplating step, the plurality of first sacrificial segments 313 are connected to an electroplating apparatus (not shown), so that the plurality of gold plating films 3122 and the plurality of sub-gold plating films 3122 'are respectively plated on the outer surfaces of the plurality of inner wires 3121 and the plurality of sub-inner wires 3121', and the plurality of first sacrificial segments 313 are not connected to the electroplating apparatus after the electroplating is completed. Since the plurality of first sacrificial segments 313 contact the plating apparatus during the plating, the plurality of first sacrificial segments 313 are not plated with the gold plating film 3122 or the gilt plating film 3122'.

In the removing step, the shielding object is removed, so as to form the board body 1, the insulating outer layer 2, and the circuit layer 3 as provided in the pre-step S110.

In various embodiments, in the method for manufacturing the gold finger structure, the sequence of the above steps may be adjusted as follows: the step of coating a film, the step of electroplating, the step of pre-positioning S110, the step of blind fishing S120 and the step of removing. That is, the removing step can be adjusted to be after the blind fishing step S120, and in the pre-fetching step S110, the sub-metal circuit includes the shielding objects that have not been removed yet.

[ gold finger structure ]

Referring to fig. 7 and 8, the present embodiment further discloses a gold finger structure 100, which includes a board body 1, an insulating outer layer 2 formed on the board body 1, and a circuit layer 3 formed on the board body 1. It should be noted that the gold finger structure 100 of the present embodiment may be manufactured by the above-mentioned gold finger structure manufacturing method, but the present embodiment does not limit the manufacturing method of the gold finger structure 100. The following describes the structure of each element of the golden finger structure 100, and the connection relationship between the elements of the golden finger structure 100 is described in due course.

In the present embodiment, the plate body 1 is substantially rectangular, the short sides of the rectangle (or the plate body) are substantially parallel to a transverse direction W, and the transverse direction W is perpendicular to a longitudinal direction L. The plate body 1 is mainly used for carrying other components, and the embodiment does not limit the shape, size, material and other properties of the plate body.

A first long groove 1c is formed at one end of the plate body 1 adjacent to the lower side in fig. 7, and the first long groove 1c does not penetrate through the plate body 1. The first elongated slot 1c has a first depth D1, and the first depth D1 is between 25um and 125 um. It should be noted that the number, shape, size and forming position of the first long grooves 1c may be changed according to the requirement, and are not limited to this embodiment.

In this embodiment, the plate body 1 is further formed with a second elongated slot 1d, and the second elongated slot 1d does not penetrate through the plate body 1. The second elongated slot 1D has a second depth D2, and the second depth D2 is between 25um and 125 um. In other embodiments not shown in the present disclosure, the plate body 1 may be formed with two second long grooves 1d, and both of the two second long grooves 1d are substantially parallel to the transverse direction W. That is, the plate body 1 forms at least one second long groove 1 d. It should be noted that the number, the shape, the size, and the forming position of the second long groove 1d may be changed according to the requirement, and are not limited to this embodiment.

The insulating outer layer 2 covers a part of the wiring layer 3 and is formed at one end of the board body 1 adjacent to the upper side in fig. 7. The insulating outer layer 2 in this embodiment is substantially rectangular, and the short sides of the rectangle (or the insulating outer layer) are substantially parallel to the longitudinal direction. The insulating outer layer 2 may be a resin material such as polyimide, dacron, polyethylene terephthalate, polytetrafluoroethylene, epoxy resin, or aramid, for example. However, the shape, size, material, and other relevant properties of the insulating outer layer 2 can be changed according to the requirement, and the embodiment is not limited herein.

In this embodiment, the circuit layer 3 may be formed of a conductive material, such as copper or silver, and the material of the circuit layer 3 may vary according to requirements. The circuit layer 3 includes a plurality of metal circuits 31 arranged along a transverse direction W, and each metal circuit 31 includes a circuit segment 311 and a pad 312. The line section 311 is partially embedded in the insulating outer layer 2.

The pad 312 includes an inner circuit 3121 connected to the circuit segment 311 and a gold-plated film 3122 plated on the inner circuit 3121, and the pad 312 has a first length L1 in the longitudinal direction L. The circuit layer 3 in this embodiment includes nine metal lines 31, and two adjacent metal lines 31 are each defined as a sub-metal line 31' (e.g., the third and fourth metal lines 31 counted from the left side of fig. 7). In each of the sub-metal lines 31 ', the pads 312 include two sub-pads 312' disposed at intervals along the longitudinal direction L. That is, the number of the sub-pads 312' in the present embodiment is four. Each of the sub-pads 312 'has a second length L2 in the longitudinal direction L, and the first length L1 of each of the pads 312 is greater than the second length L2 of any of the sub-pads 312'.

In each metal line 31, the pad 312 has a first short side 312a at a position far away from the line segment 311. That is to say, the nine metal lines 31 in the present embodiment include nine first short sides 312a, and any one of the first short sides 312a is formed at one end of the metal line 31 adjacent to the lower side in fig. 7. In addition, the positions of the first short sides 312a correspond to the positions of the first long grooves 1c, and the first short sides 312a are all aligned with a part of the first long grooves 1 c.

In each sub-metal line 31 ', each sub-pad 312 ' includes an inter-sub-circuit 3121 ' and a sub-gold plating film 3122 ' plated on the inter-sub-circuit 3121 '. In detail, the sub-inner circuit 3121 ' of the sub-pad 312 ' located at the upper side of fig. 7 is connected to the circuit segment 311 in two sub-pads 312 '. In the two sub-metal lines 31 ' of the present embodiment, four adjacent second short edges 312 ' a are formed on four sub-pads 312 ', the positions of the four second short edges 312 ' a correspond to the positions of the second long grooves 1d, and the four second short edges 312 ' a are aligned with a part of the second long grooves 1 d.

It should be noted that, in the present embodiment, the first short sides 312a and the second short sides 312' a are all linear and parallel to the transverse direction. That is, it is difficult to compare the golden finger structure of the present embodiment to any non-linear golden finger structure (e.g., curved or bent).

In addition, the metal lines 31 do not limit the number of the sub-metal lines 31 'included therein, and the metal lines 31 do not limit the sub-metal lines 31' included therein. In addition, in each of the sub-metal lines 31 ', the number of the sub-pads 312' included in the pads 312 is not limited to two. That is, when the number of the sub-pads 312 'included in the pad 312 is greater than or equal to two, the metal line 31 including the pad 312 may be defined as the sub-metal line 31', and any two sub-pads 312 'adjacent to each other in the longitudinal direction L are formed with two adjacent second short sides 312' a. In addition, the arrangement order of the metal lines 31 and the sub-metal lines 31' may also be changed according to the requirement, and the embodiment is not limited herein.

[ technical effects of embodiments of the present invention ]

In summary, the gold finger structure and the method for manufacturing the same disclosed in the embodiments of the present invention greatly reduce or completely eliminate the use of etching solution by improving the manufacturing method compared to the existing gold finger structure and the method for manufacturing the same. In detail, most of the conventional methods for manufacturing gold finger structures remove the first sacrificial segment and the second sacrificial segment by etching. The above etching method actually causes many problems. For example, the etching solution required by the etching method causes no small pollution to the environment; the manufacturing process in the etching manner takes a long time, thereby causing the problems of low production efficiency and high production cost; in addition, the existing manufacturing method of the gold finger structure is difficult to modify the length of the gold finger after the gold plating is finished.

The blind fishing step of the method for manufacturing a gold finger structure in this embodiment may be to process the first sacrificial section or the second sacrificial section in a blind fishing manner. Therefore, compared with the existing method for manufacturing the gold finger structure, the method for manufacturing the gold finger structure saves etching liquid medicine which can pollute the environment, saves time spent by an etching mode (the etching mode takes more time than a blind-fishing processing mode), and can modify the length of the connecting pad after electroplating. In addition, the blind-fishing step of the method for manufacturing a gold finger structure of the present embodiment can provide regional fast blind-fishing processing, so that the method for manufacturing a gold finger structure of the present embodiment can be applied to fast and mass production.

Moreover, the gold finger structure and the manufacturing method thereof disclosed by the embodiment of the invention also have higher precision. For example: the first elongated slot has a first depth between 25um and 125um, and the second elongated slot has a second depth between 25um and 125 um.

The disclosure is only a preferred embodiment of the invention and is not intended to limit the scope of the invention, so that all equivalent technical changes made by using the contents of the specification and the drawings are included in the scope of the invention.

Claims

1. A method for manufacturing a gold finger structure comprises the following steps:

the method comprises the following steps: providing a board body, a circuit layer formed on the board body and an insulating outer layer covering a part of the circuit layer; wherein the wiring layer comprises:

a plurality of metal lines arranged in a transverse direction, and each of the metal lines

Comprises the following steps:

a line section partially embedded in the insulating outer layer;

the connecting pad comprises an inner circuit connected to the circuit section and a gold-plated film plated with the inner circuit; and

the first sacrificial section is connected to the part of the internal circuit, which is far away from the circuit section;

wherein, the plate body is defined with a first sacrificial area which bears a plurality of the first sacrificial sections;

wherein the first sacrificial section of each metal circuit is exposed outside the corresponding gold-plated film; and

blind fishing step: and carrying out blind fishing on the first sacrificial sections of the metal circuits to remove the first sacrificial sections, the joint pad parts adjacent to the first sacrificial sections and the first sacrificial areas of the plate body, so that first short edges are formed on the joint pads of the metal circuits at the parts far away from the circuit section, and first long grooves are formed on the plate body at the positions corresponding to the first short edges.

2. The method for manufacturing a gold finger structure as claimed in claim 1, wherein in the pre-step, at least two adjacent metal lines are each defined as sub-metal lines, the pad of each sub-metal line includes two sub-pads spaced apart along a longitudinal direction perpendicular to the transverse direction, the inner line portions in the two sub-pads are connected by a second sacrificial segment, and the second sacrificial segment is located between the two sub-pads; in the pre-step, a second sacrificial region is defined on the plate body and bears a plurality of second sacrificial sections; in the blind-scooping step, the second sacrificial section of each sub-metal circuit is blindly scooped to remove the second sacrificial section, the two adjacent sub-pad positions thereof, and the second sacrificial region of the board body, so that two adjacent second short sides are formed on the two sub-pad, and a second long groove is formed on the board body at a position corresponding to the plurality of second short sides.

3. The method for fabricating a gold finger structure as claimed in claim 2, wherein in the blind-scooping step, each of the pads has a first length in the longitudinal direction, and any one of the sub-pads has a second length in the longitudinal direction smaller than the first length.

4. The method for manufacturing a gold finger structure according to claim 1, wherein in the step of blind-fishing, the first short side of each metal wire is cut to be flush with a part of the first long groove; the first elongated slot has a first depth, and the first depth is between 25um to 125 um.

5. The method for fabricating a gold finger structure of claim 2, wherein in the step of blind-scooping, the second short sides of the two sub-pads are cut to be flush with a portion of the second long groove; the second elongated slot has a second depth, and the second depth is between 25um to 125 um.

6. A gold finger structure, comprising:

a plate body formed with a first elongated slot;

an insulating outer layer formed on the plate body; and

the circuit layer is formed on the plate body and comprises a plurality of metal circuits which are arranged along a transverse direction, and each metal circuit comprises:

a line section partially embedded in the insulating outer layer; and

the connecting pad comprises an inner circuit connected to the circuit section and a gold-plated film plated with the inner circuit;

in each metal circuit, a first short edge is formed on the part, far away from the circuit section, of the contact pad; the first long grooves are respectively corresponding to the first short sides.

7. The gold finger structure of claim 6, wherein at least two adjacent metal lines are each defined as a sub-metal line, and the pad of each sub-metal line comprises two sub-pads spaced apart along a longitudinal direction perpendicular to the transverse direction.

8. The gold finger structure of claim 7 wherein each of the pads has a first length in the longitudinal direction, and any one of the sub-pads has a second length in the longitudinal direction that is less than the first length.

9. The gold finger structure of claim 6 wherein, in each of the metal traces, the first short edge is cut flush with a portion of the first elongated slot, the first elongated slot has a first depth, and the first depth is between 25um and 125 um.

10. The gold finger structure of claim 7, wherein said board body is formed with a second elongated slot, four of said sub-pads are formed with four adjacent second short sides, said second elongated slot is located corresponding to four adjacent second short sides, and four of said second short sides are cut flush with a portion of said second elongated slot; wherein the second elongated slot has a second depth, and the second depth is between 25um to 125 um.