TWI719715B - Gold finger structure and manufacturing method thereof - Google Patents

Abstract

The present invention provides a gold finger structure and a manufacturing method thereof. The manufacturing method includes the steps as follows: providing a substrate, a circuit layer formed on the substrate, and an outer insulating layer covering a part of the circuit layer, wherein the circuit layer includes a plurality of metal lines, and each of the metal lines includes a circuit segment, a pad, and a first sacrificing segment, and wherein a first sacrificing area is defined on the substrate, and the first sacrificing carries the first sacrificing segments; performing a blind routing process on the first sacrificing segment of each of the metal lines so as to remove each of the first sacrificing segments, a part of the pad adjacent to the corresponding one of the first sacrificing segments, and the first sacrificing area, further forming a first short edge on a part of the pad of each of the metal lines away from the circuit segment, and forming a first groove at a position of the substrate corresponding to a position to the first short edges.

Description

Gold finger structure and manufacturing method thereof

The invention relates to a gold finger and a manufacturing method thereof, in particular to a gold finger structure and a manufacturing method thereof.

In the existing manufacturing method of the gold finger structure, the semi-finished product of the existing gold finger structure is modified by etching. However, the above-mentioned etching method actually causes many problems. For example, the etching solution required for the etching step will pollute the environment; the etching process will take a lot of time, which in turn causes the problems of low production efficiency and high production costs. Therefore, how to provide a method for manufacturing a gold finger structure that reduces pollution and saves time so as to improve the defects of the existing gold finger structure manufacturing method has become one of the important issues to be solved by this business.

Therefore, the inventor believes that the above-mentioned shortcomings can be improved, and with great concentration of research and the application of scientific principles, we finally propose an invention with reasonable design and effective improvement of the above-mentioned shortcomings.

The embodiment of the present invention is to provide a gold finger structure and a manufacturing method thereof, which can effectively improve the defects that may occur in the existing gold finger structure and the manufacturing method thereof.

The embodiment of the present invention provides a method for manufacturing a gold finger structure, including: a pre-step: providing a board, a circuit layer formed on the board, and covering a part of the circuit An insulating outer layer of the layer; wherein the circuit layer includes a plurality of metal circuits arranged in a lateral direction, and each of the metal circuits includes: a circuit segment partially buried in the insulating outer layer; a pad, It includes an inner circuit connected to the circuit section and a gold-plated film on which the inner circuit is plated; and a first sacrificial section connected to a part of the inner circuit away from the circuit section; wherein, the board The body defines a first sacrificial area, which carries a plurality of the first sacrificial sections; wherein the first sacrificial section of each of the metal lines is exposed outside the corresponding gold-plated film; and a blind fishing Step: Blind fishing is performed on the first sacrificial section of each of the metal lines to remove each of the first sacrificial section, the adjacent pad portion, and all of the board. In the first sacrificial area, the pads of each of the metal circuits are formed with a first short side at a position far away from the circuit section, and the board body is formed on a plurality of the first short sides. The position is formed with a first long groove.

The embodiment of the present invention also discloses a gold finger structure, which includes: a plate body formed with a first long groove; an insulating outer layer formed on the plate body; and a circuit layer formed on the plate body and including an edge A plurality of metal lines arranged in a transverse direction, and each of the metal lines includes: a line section partially buried in the insulating outer layer; and a pad including an inner line connected to the line section and plating A gold-plated film of the inner circuit is provided; wherein, in each of the metal circuits, the pad is formed with a first short side at a position away from the circuit section; the positions of the first long grooves correspond to On a plurality of said first short sides.

In summary, the gold finger structure and the manufacturing method thereof disclosed in the embodiments of the present invention are compared with the existing method of manufacturing the gold finger structure. Through the improvement of the manufacturing method, the use of etching chemicals is greatly reduced or completely eliminated. Accordingly, a gold finger structure and a manufacturing method thereof are provided which have lower environmental pollution, shorter manufacturing time, and can quickly modify the length of multiple gold fingers after gold plating.

In order to further understand the features and technical content of the present invention, please refer to the following detailed descriptions and drawings about the present invention, but these descriptions and drawings are only used to illustrate the present invention, and do not make any claims about the protection scope of the present invention. limit.

100: gold finger structure

1: Board body

1a: The first sacrifice zone

1b: The second sacrifice zone

1c: The first long slot

1d: the second longest slot

2: Insulation outer layer

3: Line layer

31: Metal circuit

311: line segment

312: Pad

3121: internal line

3122: gold-plated film

312a: first short side

31’: Sub-metal circuit

312’: Sub-pad

3121’: Inner line

3122’: Sub-gold-plated film

312’a: second short side

313: First Sacrifice Section

314: Second Sacrifice Section

L: longitudinal direction

L1: first length

L2: second length

W: horizontal direction

D: depth direction

D1: first depth

D2: second depth

S110: Preliminary steps

S120: blind fishing steps

FIG. 1 is a schematic diagram of the pre-steps of the manufacturing method of the gold finger structure according to the embodiment of the present invention.

2 is a schematic diagram of the blind fishing step of the method of manufacturing the gold finger structure according to the embodiment of the present invention.

Fig. 3 is an enlarged schematic diagram of area III in Fig. 2.

4 is a schematic cross-sectional view of FIG. 2 along section line IV.

FIG. 5 is an enlarged schematic diagram of area V in FIG. 2.

FIG. 6 is a schematic cross-sectional view of FIG. 2 along the section line VI.

FIG. 7 is a schematic diagram of a gold finger structure according to an embodiment of the invention.

FIG. 8 is a schematic diagram of FIG. 7 omitting multiple gold-plated films and multiple sub-gold-plated films.

Please refer to Figures 1 to 8, which are embodiments of the present invention. It should be noted that the relevant numbers and appearances mentioned in the corresponding drawings in this embodiment are only used to specifically illustrate the embodiments of the present invention. , In order to understand the content of the present invention, but not to limit the protection scope of the present invention.

[Manufacturing method of gold finger structure]

Please refer to FIG. 1 and FIG. 2. This embodiment discloses a method for manufacturing a gold finger structure. Compared with the existing method for fabricating a gold finger structure, the method for fabricating a gold finger structure of this embodiment causes less environmental pollution, takes less time, and can modify the length of the gold finger after gold plating. The manufacturing method of the golden finger structure includes a pre-step S110 and a blind fishing step S120. Hereinafter, each step of the manufacturing method of the gold finger structure of this embodiment will be described. It should be noted that when the present invention implements the method for manufacturing the above-mentioned golden finger structure, the above-mentioned steps are not used. The content and sequence of the steps are limited.

The pre-step S110 is as shown in FIG. 1: providing a board 1, a circuit layer 3 formed on the board 1, and an insulating outer layer 2 covering a part of the circuit layer 3. The circuit layer 3 includes a plurality of metal circuits 31 arranged along a lateral direction W, and each of the metal circuits 31 includes a circuit section 311 partially embedded in the insulating outer layer 2, a pad 312, and A first sacrifice section 313. The pad 312 includes an inner circuit 3121 connected to the circuit section 311 and a gold-plated film 3122 plated with the inner circuit 3121; the first sacrificial section 313 is connected to the inner circuit 3121 away from The position of the line section 311; the board body 1 defines a first sacrificial area 1a, which carries a plurality of the first sacrificial sections 313; and, the first sacrificial section 313 of each of the metal lines 31 It is exposed outside the corresponding gold-plated film 3122.

In this embodiment, the board body 1 is substantially rectangular, the short sides of the rectangle (or the board body 1) are substantially parallel to the lateral direction W, and the lateral direction W is perpendicular to a longitudinal direction. L. It should be noted that the board body 1 is mainly used to carry other components, and this embodiment does not limit the shape, size, material, and other properties of the board body 1 here.

The board 1 may define the first sacrificial area 1a and the second sacrificial area 1b, which respectively carry a plurality of the first sacrificial section 313 and a plurality of the second sacrificial section 314 (in the following description Details). Both the first sacrificial area 1a and the second sacrificial area 1b are substantially elongated and are substantially parallel to the lateral direction W. The shape and size of the first sacrificial area 1a and the first sacrificial area 1a may vary according to requirements or corresponding to the number of the plurality of first sacrificial segments 313 carried by it. Similarly, the number, shape, and size of the second sacrificial regions 1b can be changed according to requirements or corresponding to the number of the plurality of second sacrificial sections 314 carried by them. In this embodiment, the first sacrificial area 1a is located on the lower side of the board 1 in FIG. 1, and a part of the second sacrificial area 1b is roughly defined in four sub-connections in FIG. Between the pads 312' (detailed in the subsequent description).

The insulating outer layer 2 covers a part of the circuit layer 3 and is formed at an end of the board body 1 adjacent to the upper side in FIG. 1. In this embodiment, the insulating outer layer 2 is substantially rectangular, and the short sides of the aforementioned rectangle (or the insulating outer layer 2) are substantially parallel to the longitudinal direction L. The insulating outer layer 2 may be a resin material, such as polyimide, polyester, polyethylene dicarboxylate, polytetrafluoroethylene, epoxy resin, or aramid. However, the shape, size, material, and other related properties of the insulating outer layer 2 can be changed according to requirements, and this embodiment is not limited herein.

In this embodiment, the circuit layer 3 may be formed of a conductive material, such as copper or silver, and the material of the circuit layer 3 can be changed according to requirements. As mentioned in the pre-step S110, the circuit layer 3 includes a plurality of metal circuits 31, and each metal circuit 31 includes the circuit segment 311, the pad 312, and the first sacrifice Section 313.

In this embodiment, the number of the metal circuits 31 included in the circuit layer 3 is nine, and two of the adjacent metal circuits 31 are each defined as a sub-metal circuit 31' (such as: The third and fourth metal lines 31) are counted from the left side of FIG. 1. In each of the sub-metal lines 31', the pads 312 include two sub-pads 312' arranged at intervals along the longitudinal direction L. In other words, the number of the sub-pads 312' in this embodiment is four.

It is worth mentioning that a plurality of adjacent sub-metal lines 31' can be defined as a sub-metal line group (in this embodiment, the third and fourth lines are counted from the left side of FIG. The sub-metal lines 31' may be collectively defined as the sub-metal line group), and the number of the second sacrificial regions 1b of the board 1 corresponds to the number of the sub-metal line groups. In this embodiment, the number of the sub-metal circuit group is one, but the number of the sub-metal circuit group and the number of the sub-metal circuit 31' included in it can be changed according to requirements. Examples are limited.

For example, in other embodiments not shown in the present invention, the number of sub-metal circuit groups included in the circuit layer 3 is two, and each of the sub-metal circuit groups includes two sub-metal circuit groups. 31'; There are two second sacrificial areas 1b correspondingly defined on the board 1, and each The second sacrificial area 1b carries the four second sacrificial segments 314 of one of the sub-metal circuit groups.

Each of the sub-pads 312' includes a sub-inner circuit 3121' and a sub-gold-plated film 3122' plated on the sub-inner circuit 3121'. Among the two sub-pads 312', the sub-inner circuit 3121' of the sub-pad 312' located opposite to the upper part of FIG. 1 is connected to the line segment 311; The sub-internal circuit 3121 ′ of the sub-pad 312 ′ is connected to the first sacrificial section 313. In addition, the two sub-inner circuits 3121' of the two sub-pads 312' are connected by a second sacrificial section 314, and the second sacrificial section 314 is located between the two sub-pads 312' . In addition, the first sacrificial section 313 and the second sacrificial section 314 are both exposed outside the corresponding gold plating film 3122.

It should be noted that the plurality of metal lines 31 does not limit the number of the sub-metal lines 31' contained therein, and the plurality of metal lines 31 does not limit the number of the sub-metal lines 31' contained therein. Moreover, in each of the sub-metal lines 31', the number of the sub-pads 312' included in the pads 312 is not limited to two. That is, when the number of sub-pads 312' included in the pad 312 is greater than or equal to two, the metal circuit 31 including the pad 312 may be defined as the sub-metal circuit 31' , And any two adjacent sub-pads 312 ′ in the longitudinal direction L are connected by the second sacrificial section 314. In addition, the arrangement sequence of the metal lines 31 and the sub-metal lines 31' along the lateral direction W can also be changed according to requirements, which is not limited in this embodiment.

The blind fishing step S120 is shown in FIG. 2: blind fishing is performed on the first sacrificial section 313 of each of the metal lines 31 to remove each of the first sacrificial sections 313 and adjacent ones. The pads 312 and the first sacrificial area 1a of the board 1, so that the pads 312 of each of the metal lines 31 form a first The short side 312a, and the plate body 1 is formed with a first long groove 1c at a position corresponding to the plurality of first short sides 312a.

The blind fishing step S120 may also perform blind fishing on the second sacrifice section 314 of each of the sub-metal lines 31' to remove the second sacrifice section 314 and the two adjacent ones. Part of the sub-pads 312' and the second sacrificial area 1b of the board 1, so that the two sub-pads 312' are formed with two adjacent second short sides 312'a, In addition, the plate body 1 is formed with a second long groove 1d at positions corresponding to the plurality of second short sides 312'a.

It should be noted that, in this embodiment, the plurality of first short sides 312a and the plurality of second short sides 312'a are linear and parallel to the lateral direction. In other words, it is difficult to compare the non-straight shape (such as arc or curved shape) of the gold finger structure manufactured by any gold finger structure manufacturing method to the gold finger structure manufacturing method of this embodiment.

In addition, in the blind fishing step S120, each of the pads 312 has a first length L1 in the longitudinal direction L, and each of the sub-pads 312' has a second length L2 in the longitudinal direction L, And the first length L1 of each pad 312 is greater than the second length L2 of any one of the sub pads 312'.

Please refer to FIGS. 3 to 6 in conjunction with FIG. 2. In detail, the first short side 312a and the second short side 312'a formed by the blind fishing step S120 are respectively cut into a part Part of the first long groove 1c and a part of the second long groove 1d. In addition, for the convenience of description, the manufacturing method of the golden finger structure further defines a depth direction D perpendicular to the longitudinal direction L and the transverse direction W. Wherein, the first long groove 1c has a first depth D1, and the first depth D1 is between 25um and 75um; the second long groove 1d has a second depth D2, and the first depth D1 The second depth D2 is between 25um and 75um. The first depth D1 and the second depth D2 are both substantially parallel to the depth direction D.

In the blind fishing step S120 of this embodiment, a milling cutter (not shown) in rotation can be moved to perform blind fishing processing on each corresponding part. The milling cutter is generally elongated and has a long axis direction. In detail, when performing blind fishing, the milling cutter rotates on its axis in the long axis direction and moves in the transverse direction W, so it will be located at a position adjacent to the milling cutter for blind fishing processing. A plurality of the first short sides 312a and a first long groove 1c, or a plurality of the second The short side 312'a and the second long groove 1d.

In this embodiment, since the first long groove 1c and the second long groove 1d are formed by the blind fishing process described above, the contours of the notches of the first long groove 1c and the second long groove 1d They are all similar to a playground shape (the above playground shape is similar to a rectangle with opposite sides replaced by an arc side, which is similar to the shape of a playground, so it is referred to as a playground shape for short). It should be noted that in the blind fishing step S120, the tools required for blind fishing, the method for blind fishing, and the shape and size of the milling cutter can all be changed according to requirements. Examples are limited.

In the blind fishing step S120 of this embodiment, the plurality of first sacrificial sections 313 carried by the first sacrificial area 1a and the plurality of second sacrificial sections 313 carried by the second sacrificial area 1b are not processed. The blind fishing processing sequence of the sacrifice section 314 is restricted. That is to say, according to actual requirements, the plurality of second sacrificial sections 314 carried by the second sacrificial area 1b may be blind-fished, and then the plurality of second sacrificial sections 314 carried by the first sacrificial area 1a may be processed blindly. The first sacrifice section 313 is blind fishing processing. Or, when the board 1 provided in the pre-step S110 includes a plurality of first sacrifice areas 1a and a plurality of second sacrifice areas 1b, in the blind fishing step S120, a plurality of the The plurality of first sacrificial sections 313 carried by the first sacrificial area 1a and the plurality of second sacrificial sections 314 carried by the plurality of second sacrificial areas 1b may be alternately subjected to blind fishing.

It should be noted that the plurality of first sacrifice sections 313 and the plurality of second sacrifice sections 314 are not limited to all being removed through the blind fishing step S120. For example, in a special application, a plurality of the first sacrificial sections 313 may be removed by the blind fishing step S120, and a plurality of the second sacrificial sections 314 may be removed by an etching method; or, more One of the first sacrificial segments 313 can be removed by the etching method, and a plurality of the second sacrificial segments 314 can be removed by the blind fishing step S120. However, except for the blind fishing step S120, this embodiment does not limit the manner of removing the plurality of the first sacrifice sections 313 or the plurality of the second sacrifice sections 314.

It should be noted that the manufacturing method of the golden finger structure is performed in the pre-step Before step S110, it may further include a filming step, an electroplating step, and a removing step in sequence. However, the manufacturing method of the gold finger structure is not limited to include the filming step, the electroplating step, and the removing step.

In the filming step, a shield (not shown) is covered on the insulating outer layer 2. The shield may have anti-plating properties (that is, gold is not easy to be plated on the shield), so as to avoid gold plating on the outer surface of the shield and cause a waste of gold plating solution. It should be noted that the shape, quantity, material, and other properties of the shielding objects can be changed according to requirements, and this embodiment is not limited herein.

In the electroplating step, the plurality of first sacrificial sections 313 are connected to an electroplating device (not shown), according to the outer surfaces of the plurality of inner circuits 3121 and the plurality of sub inner circuits 3121' A plurality of the gold-plated films 3122 and a plurality of the sub-gold-plated films 3122' are respectively plated, and after the electroplating is completed, the plurality of the first sacrificial sections 313 are not connected by the electroplating equipment. Since the plurality of first sacrificial sections 313 contact the electroplating equipment during the electroplating, the plurality of first sacrificial sections 313 are not plated with the gold plating film 3122 or the sub-gold plating film 3122'.

In the removing step, the shield is removed, thereby forming the board 1, the insulating outer layer 2 and the circuit layer 3 as provided in the pre-step S110.

In different embodiments, in the method of manufacturing the golden finger structure, the sequence of the above steps can be adjusted as follows: the filming step, the electroplating step, the pre-step S110, the blind fishing step S120, and the removing step. That is to say, the removing step can be adjusted to after the blind fishing step S120, and in the pre-step S110, the sub-metal circuit contains the shield that has not been removed.

〔Gold Finger Structure〕

Please refer to FIGS. 7 and 8. This embodiment also discloses a gold finger structure 100, which includes a plate body 1, an insulating outer layer 2 formed on the plate body 1, and an insulating outer layer 2 formed on the plate body 1. line Layer 3. It should be noted that the gold finger structure 100 of this embodiment can be manufactured by the above-mentioned manufacturing method of the gold finger structure, but this embodiment does not limit the manufacturing method of the gold finger structure 100. The structure of each element of the golden finger structure 100 will be introduced below, and the connection relationship between the elements of the golden finger structure 100 will be described in a timely manner.

In this embodiment, the board 1 is substantially rectangular, the short sides of the rectangle (or the board) are substantially parallel to a transverse direction W, and the transverse direction W is perpendicular to a longitudinal direction L. The board body 1 is mainly used to carry other components, and this embodiment does not limit the shape, size, material, and other properties of the board body.

The plate body 1 is formed with a first long groove 1c at an end adjacent to the lower part in FIG. 7, and the first long groove 1c does not penetrate the plate body 1. The first long groove 1c has a first depth D1, and the first depth D1 is between 25um and 75um. It should be noted that the number, shape, size, and formation position of the first long grooves 1c can be changed according to requirements, and are not limited to this embodiment.

In this embodiment, the plate body 1 is further formed with a second long groove 1d, and the second long groove 1d does not penetrate the plate body 1. The second long groove 1d has a second depth D2, and the second depth D2 is between 25um and 75um. In other embodiments not shown in the present invention, the plate body 1 may be formed with two second long grooves 1d, and the two second long grooves 1d are both substantially parallel to the transverse direction W. That is, the number of the second long groove 1d formed by the plate body 1 is at least one. It should be noted that the number, shape, size, and formation position of the second long grooves 1d can be changed according to requirements, and are not limited to this embodiment.

The insulating outer layer 2 covers a part of the circuit layer 3 and is formed at an end of the board body 1 adjacent to the upper side in FIG. 7. In this embodiment, the insulating outer layer 2 is substantially rectangular, and the short sides of the rectangle (or the insulating outer layer) are substantially parallel to the longitudinal direction. The insulating outer layer 2 may be a resin material, such as polyimide, polyester, polyethylene dicarboxylate, polytetrafluoroethylene, epoxy resin, or aramid. However, the outer shape, size and material of the insulating outer layer 2 And other related properties can be changed according to requirements, and this embodiment is not limited here.

In this embodiment, the circuit layer 3 may be formed of a conductive material, such as copper or silver, and the material of the circuit layer 3 can be changed according to requirements. The circuit layer 3 includes a plurality of metal circuits 31 arranged along a lateral direction W, and each of the metal circuits 31 includes a circuit segment 311 and a pad 312. The line section 311 is partially buried in the insulating outer layer 2.

The pad 312 includes an inner circuit 3121 connected to the circuit section 311 and a gold-plated film 3122 plated on the inner circuit 3121, and the pad 312 has a first in the longitudinal direction L A length L1. In this embodiment, the number of the metal circuits 31 included in the circuit layer 3 is nine, and two of the adjacent metal circuits 31 are each defined as a sub-metal circuit 31' (such as: The third and fourth metal lines 31) are counted from the left side of FIG. 7. In each of the sub-metal lines 31', the pads 312 include two sub-pads 312' arranged at intervals along the longitudinal direction L. In other words, the number of the sub-pads 312' in this embodiment is four. Each of the sub pads 312' has a second length L2 in the longitudinal direction L, and the first length L1 of each of the pads 312 is greater than the second length of any one of the sub pads 312' Length L2.

In each of the metal lines 31, the pad 312 has a first short side 312 a formed at a location away from the line segment 311. That is, in this embodiment, the nine metal lines 31 include a total of nine first short sides 312a, and any one of the first short sides 312a is formed on the metal line 31 adjacent to FIG. 7 The lower end of the middle. In addition, the positions of the plurality of first short sides 312a all correspond to the positions of the first long groove 1c, and the plurality of first short sides 312a are all cut to a portion of the first long groove. 1c.

In each of the sub metal lines 31', each of the sub pads 312' includes a sub inner circuit 3121' and a sub gold plating film 3122' plated on the sub inner circuit 3121'. In detail, of the two sub-pads 312', the sub-inner circuit 3121' of the sub-pad 312' located at the upper side of FIG. 7 is connected to the circuit segment 311. In the two sub-metal lines 31' of this embodiment, four of the The sub pads 312' are formed with four adjacent second short sides 312'a, and the positions of the four second short sides 312'a correspond to the positions of the second long grooves 1d, and the four The second short side 312'a is aligned with a part of the second long groove 1d.

It should be noted that, in this embodiment, the plurality of first short sides 312a and the plurality of second short sides 312'a are linear and parallel to the lateral direction. In other words, it is difficult to compare the gold finger structure of this embodiment with any non-linear (such as arc or curved) gold finger structure.

In addition, the plurality of metal lines 31 does not limit the number of the sub-metal lines 31' included, and the plurality of metal lines 31 does not limit the number of the sub-metal lines 31' included. In addition, in each of the sub metal lines 31', the number of the sub pads 312' included in the pad 312 is not limited to two. That is, when the number of the sub-pads 312' included in the pad 312 is greater than or equal to two, the metal circuit 31 including the pad 312 may be defined as the sub-metal circuit 31', and any two adjacent sub-pads 312' in the longitudinal direction L are formed with two adjacent second short sides 312'a. In addition, the arrangement sequence of the metal circuit 31 and the sub-metal circuit 31' can also be changed according to requirements, which is not limited in this embodiment.

[Technical effects of the embodiments of the present invention]

In summary, the gold finger structure and its manufacturing method disclosed in the embodiments of the present invention, compared with the existing gold finger structure and its manufacturing method, through the improvement of the manufacturing method, greatly reducing or completely eliminating the etching solution use. In detail, most of the existing manufacturing methods of the gold finger structure are to remove the first sacrificial section and the second sacrificial section by etching. The above-mentioned etching method actually causes many problems. For example, the etching solution required by the etching method will cause considerable pollution to the environment; the etching method will take a long time, which will cause the problems of low production efficiency and high production cost; and, the existing gold finger structure It is difficult to modify the length of the gold finger after the gold plating is completed.

The blind fishing step of the method of manufacturing the gold finger structure of this embodiment may be to process the first sacrifice section or the second sacrifice section by blind fishing. Therefore, compared with the existing manufacturing method of the gold finger structure, the manufacturing method of the gold finger structure saves the etching solution that pollutes the environment and saves the time spent in the etching method (the etching method is more expensive than the blind fishing method). It takes more time), and the length of the pad can be modified after electroplating. In addition, the blind fishing step of the method of manufacturing the gold finger structure of this embodiment can provide regional rapid blind fishing processing, so that the method of manufacturing the gold finger structure of this embodiment can be applied For fast and mass production.

Furthermore, the gold finger structure and the manufacturing method thereof disclosed in the embodiments of the present invention also have higher accuracy. For example: the first long groove has a first depth, and the first depth is between 25um and 75um, and the second long groove has a second depth, and the second depth is between 25um Between 75um.

The content disclosed above is only the preferred and feasible embodiments of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention. Inside.

100: gold finger structure

1: Board body

1c: The first long slot

1d: the second longest slot

2: Insulation outer layer

3: Line layer

31: Metal circuit

311: line segment

312: Pad

3121: internal line

3122: gold-plated film

31’: Sub-metal circuit

312’: Sub-pad

3121’: Inner line

3122’: Sub-gold-plated film

L: longitudinal direction

L1: first length

L2: second length

W: horizontal direction

D: depth direction

Claims (10)

A method for manufacturing a gold finger structure includes: A pre-step: providing a board, a circuit layer formed on the board, and an insulating outer layer covering a part of the circuit layer; wherein the circuit layer includes A plurality of metal lines arranged in a transverse direction, and each of the metal lines contain: A line section partially buried in the insulating outer layer; A pad including an inner circuit connected to the circuit section and a gold-plated film on which the inner circuit is plated; and A first sacrifice section, connected to a part of the inner line far away from the line section; Wherein, the board body defines a first sacrificial area, which carries a plurality of the first sacrificial sections; Wherein, the first sacrificial section of each of the metal lines is exposed outside the corresponding gold-plated film; and A blind fishing step: blind fishing is performed on the first sacrificial section of each of the metal lines to remove each of the first sacrificial sections, the adjacent pad parts, and the board In the first sacrificial area of the body, the pads of each of the metal circuits are formed with a first short side at a position away from the circuit section, and the board body is arranged to correspond to a plurality of the first A first long groove is formed at the position of the short side. The method for manufacturing a gold finger structure according to claim 1, wherein, in the pre-step, at least two adjacent metal lines are each defined as a sub-metal line, and each of the sub-metal lines The pad includes two sub-pads spaced apart along a longitudinal direction perpendicular to the transverse direction, the inner circuit parts in the two sub-pads are connected by a second sacrificial section, and The second sacrificial section is located between the two sub-pads; wherein, in the pre-step, the board defines a second sacrificial area, which carries a plurality of the second sacrificial sections; wherein In the blind fishing step, blind fishing is performed on the second sacrificial section of each of the sub-metal lines to remove the second sacrificial section and the two adjacent sub-connections. The pad portion and the second sacrificial area of the board body, so that the two sub-pads are formed with two adjacent second short sides, and the board body is corresponding to a plurality of the second A second long groove is formed at the position of the short side. The method for manufacturing a gold finger structure according to claim 2, wherein, in the blind fishing step, each of the pads has a first length in the longitudinal direction, and any one of the sub pads is in the The longitudinal direction has a second length smaller than the first length. The method for manufacturing a gold finger structure according to claim 1, wherein, in the blind fishing step, the first short side of each of the metal lines is aligned with a part of the first long groove; The first long groove has a first depth, and the first depth is between 25um and 75um. The method for manufacturing a golden finger structure according to claim 2, wherein, in the blind fishing step, the second short sides of the two sub-pads are cut in line with a part of the second long groove; The second long groove has a second depth, and the second depth is between 25um and 75um. A gold finger structure, including: A plate body with a first long groove; An insulating outer layer formed on the board; and A circuit layer is formed on the board and includes a plurality of metal circuits arranged in a lateral direction, and each of the metal circuits includes: A line section partially buried in the insulating outer layer; and A pad including an inner circuit connected to the circuit section and a gold-plated film on which the inner circuit is plated; Wherein, in each of the metal circuits, the pads are formed with a first short side at a location away from the circuit section; the positions of the first long grooves respectively correspond to a plurality of the first short sides. The gold finger structure according to claim 6, wherein each of the at least two adjacent metal lines is defined as a sub-metal line, and the pad of each of the sub-metal lines includes a vertical line Two sub-pads are arranged at intervals in a longitudinal direction of the transverse direction. The golden finger structure according to claim 7, wherein each of the pads has a first length in the longitudinal direction, and any one of the sub pads has a smaller length than the first length in the longitudinal direction. The second length. The golden finger structure according to claim 6, wherein, in each of the metal lines, the first short side is cut in line with a part of the first long groove, and the first long groove has a first long groove. A depth, and the first depth is between 25um and 75um. The golden finger structure according to claim 7, wherein the board body is formed with a second long groove, the four sub-pads are formed with four adjacent second short sides, and the second long groove is The position corresponds to the four adjacent second short sides, and the four second short sides are in line with a part of the second long groove; wherein, the second long groove has a second depth, And the second depth is between 25um and 75um.

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