TWI726432B - Multi-cut gold finger structure and manufacturing method thereof - Google Patents

Abstract

The present invention provides a multi-cut gold finger structure and a manufacturing method thereof. The multi-cut gold finger structure includes a substrate, an outer insulating layer formed on the substrate, a circuit layer formed on the substrate and including a plurality of metal lines arranged along a transverse direction, and a plurality of gold-plated films. Each of the metal lines includes a major segment, a front pad, and at least one isolated pad. A part of the major segment is embedded in the outer insulating layer, and the other part of the major segment exposed from the outer insulating layer is defined as a rear pad. The gold-plated films are plated on the outer surfaces of the rear pad, the front pad and the at least one isolated pad.

Description

Multi-section gold finger structure and manufacturing method thereof

The invention relates to a gold finger structure and a manufacturing method thereof, in particular to a multi-section gold finger structure and a manufacturing method thereof.

In recent years, with the continuous development of the science and technology industry, the requirements for the structure of the gold finger are also increasing. However, the development of the existing golden finger structure has not kept up with the pace of technological development and has gradually been unable to meet the needs of the market. Therefore, how to improve the structure and design to overcome the above-mentioned shortcomings and make it meet the design requirements has become one of the important issues that this business wants to solve.

Therefore, the inventor believes that the above-mentioned shortcomings can be improved, and with great concentration of research and the application of scientific principles, we finally propose an invention with reasonable design and effective improvement of the above-mentioned shortcomings.

The embodiment of the present invention provides a multi-section gold finger structure and a manufacturing method thereof, which can effectively improve the defects that may occur in the existing gold finger structure.

The embodiment of the present invention discloses a multi-section gold finger structure, including: a board body; an insulating outer layer formed on the board body; a circuit layer formed on the board body and including a plurality of strips arranged in a transverse direction Metal lines, and each of the metal lines includes: a main body section, one part of which is buried in the insulating outer layer, and another part of the main body section is exposed on the insulating outer layer and is defined as a back pad; A front pad and the rear pad are arranged at intervals along a longitudinal direction, and the longitudinal direction is parallel to the transverse direction; and at least one isolated pad is arranged at intervals along the longitudinal direction Between the rear pad and the front pad; and a plurality of gold-plated films, plated on the outer surface of the rear pad, the outer surface of the front pad, and at least one of each of the metal lines The outer surface of the isolated pad.

The embodiment of the present invention also discloses a method for manufacturing a multi-section gold finger structure, including: a pre-step: providing a board, a circuit layer formed on the board, and an insulating outer layer covering a part of the circuit layer Wherein, the circuit layer includes: a plurality of metal circuits, each including an inner circuit buried in the insulating outer layer and a metal section exposed on the insulating outer layer; and a plurality of sacrificial sections, exposed on the An insulating outer layer, and any two adjacent metal segments are connected by one sacrificial segment; an opening step: a plurality of openings are formed in each metal segment along a longitudinal direction, and any two The plurality of openings on the adjacent metal segments are separated by the sacrificial segments located therebetween, so that each of the metal segments includes a back pad connected to the corresponding inner circuit, A front pad that is spaced apart from the back pad, and at least one isolated pad that is spaced apart between the back pad and the front pad; a dividing step: on each of the sacrificial segments A masking strip is formed; an electroplating step: the outer surface of the back pad, the outer surface of the front pad, and the outer surface of at least one of the isolated pads of the plurality of metal lines are respectively plated A plurality of gold-plated films, and the plurality of the gold-plated films are separated from each other; and a removing step: removing a plurality of the masking strips and a plurality of the sacrificial segments to form a multi-section gold finger structure.

The embodiment of the present invention further discloses a multi-section gold finger structure, which is manufactured by the above-mentioned manufacturing method of the multi-section gold finger structure.

In summary, the multi-section gold finger structure and its manufacturing method disclosed in the embodiments of the present invention are different from the existing gold finger structure and can effectively improve the defects of the existing gold finger structure through special structural design and matching. .

In order to further understand the features and technical content of the present invention, please refer to the following detailed descriptions and drawings about the present invention, but these descriptions and drawings are only used to illustrate the present invention, and do not make any claims about the protection scope of the present invention. limit.

Please refer to FIG. 1 to FIG. 10, which are embodiments of the present invention. It should be noted that the relevant quantities and appearances mentioned in the corresponding drawings of this embodiment are only used to specifically illustrate the implementation of the present invention. The method is to facilitate understanding of the content of the present invention, rather than to limit the protection scope of the present invention.

This embodiment discloses a multi-section gold finger structure 100, which is a multi-section gold finger product with a small pitch. The multi-section gold finger structure 100 includes a board body 1, an insulating outer layer formed on the board body 1, a circuit layer 4 formed on the board body 1, and a part of the circuit layer 4 The multiple gold-plated films5.

Please refer to FIG. 1 and FIG. 2. In this embodiment, the board body 1 is, for example, a rectangle, and the board body 1 includes an inner conductive layer 11 embedded therein. Wherein, the edge of the board 1 includes two first short sides A1 facing each other and two first long sides B1 facing each other. For the convenience of description, the multi-section gold finger structure 100 is defined with a transverse direction W parallel to the two first short sides A1 and a longitudinal direction L parallel to the two first long sides B1. In practical applications, the main function of the board body 1 is to support the insulating outer layer 2, the circuit layer 4, and other components. Therefore, the shape, size, material, and other related properties of the board body 1 can be used. It changes according to requirements and is not limited in this embodiment.

In addition, the end of the plate body 1 near the bottom of FIG. 1 is defined as a free end 1a. In practical applications, the free end 1a of the board body 1 can be used to insert a mating component, a slot, or other related components. It should be noted that the multi-section gold finger structure 100 disclosed in this embodiment can also be matched with related components, and related personnel can also adjust the related components of the multi-section gold finger structure 100 accordingly. That is to say, the multi-cut gold finger structure 100 of this embodiment does not limit the matching with related components or the corresponding adjustment in structure.

As shown in FIGS. 1 and 2, the insulating outer layer 2 is formed on the board body 1. In this embodiment, the insulating outer layer 2 is, for example, a rectangle, and the insulating outer layer 2 includes two second short sides A2 facing each other and two second long sides B2 facing each other. In addition, the two second short sides A2 of the insulating outer layer 2 are parallel to the longitudinal direction L and the two second long sides B2 of the insulating outer layer 2 are parallel to the lateral direction W. In detail, in this embodiment, the insulating outer layer 2 is formed on the board 1 and adjacent to the upper side of FIG. 1.

However, the shape, size, quantity, material, position of the insulating outer layer 2 formed on the board 1 and other related properties can be changed according to requirements. For example, the insulating outer layer 2 may be a resin material, such as polyimide, polyester, polyethylene dicarboxylate, polytetrafluoroethylene, epoxy resin, or aramid.

The circuit layer 4 is formed on the board 1. In this embodiment, the circuit layer 4 may be formed of a conductive material, such as copper or silver. However, the material of the circuit layer 4 can be changed according to requirements, and is not limited to this embodiment. The circuit layer 4 includes a plurality of the metal circuits 41 arranged along the transverse direction W. In detail, the plurality of metal lines 41 are substantially parallel to the longitudinal direction L, and the distance between any two adjacent metal lines 41 can be changed according to requirements.

In this embodiment, the circuit layer 4 may also include a transverse circuit 42. In the drawing of this embodiment, the horizontal line 42 is substantially parallel to the horizontal direction W and is embedded in the insulating outer layer 2. However, the horizontal line 42 is not limited to be parallel to the horizontal direction W and the direction of the horizontal line 42 can be changed according to requirements, and is not limited to this embodiment. In addition, the lateral lines 42 connect a plurality of the metal lines 41 arranged along the lateral direction W at intervals.

Please refer to FIG. 1 and FIG. 2, each metal circuit 41 includes a main body section 412, a front pad 413, and at least one isolated pad 414. One part of the main body section 412 is buried in the insulating outer layer 2 and connected to the lateral circuit 42, and another part of the main body section 412 is exposed on the insulating outer layer 2 and is defined as a back pad 4121. The rear pad 4121 and the front pad 413 are spaced apart from each other along the longitudinal direction L. At least one isolated pad 414 is arranged between the rear pad 4121 and the front pad 413 along the longitudinal direction L at intervals.

In this embodiment, the outer shapes of the rear pad 4121, the front pad 413, and the at least one isolated pad 414 are generally rectangular, and the outer shape can be changed according to requirements. For example, in other embodiments not shown in the present invention, the appearance of the rear pad 4121, the front pad 413, and at least one of the isolated pads 414 may be square or trapezoidal. In more detail, in each metal circuit 41, the distance between the rear pad 4121, the front pad 413, and at least one isolated pad 414 is not limited to be equal. For example, the distance between the rear pad 4121 and the at least one isolated pad 414 may not be equal to the distance between the at least one isolated pad 414 and the front pad 413.

In this embodiment, the number of at least one isolated pad 414 included in the plurality of metal lines 41 is two, and part of the at least one isolated pad 414 included in the plurality of metal lines 41 The number is one (for example, the first and third metal lines 41 from left to right in FIG. 2) and the number of at least one isolated pad 414 included in the plurality of metal lines 41 in the other part There are two (for example: the second and fourth metal lines 41 from left to right in Figure 2).

However, the number of at least one isolated pad 414 included in the plurality of metal lines 41 is not limited to one and two, and can be changed according to requirements. For example, in other embodiments not shown in the present invention, the number of at least one isolated pad 414 included in any one of the metal lines 41 may be one, two, or three. In other words, the number of at least one isolated pad 414 included in the plurality of metal lines 41 is three.

Furthermore, the plurality of metal lines 41 may define a first metal line 41a including one isolated pad 414 and a second metal line 41b including two isolated pads 414. The lengths of the back pad 4121 and the front pad 413 of each of the first metal lines 41a are greater than the lengths of the back pad 4121 and the front pad 413 of each of the second metal lines 41b, respectively length.

In this embodiment, the first metal lines 41a and the second metal lines 41b are staggered along the lateral direction W. It should be noted that the arrangement of the first metal circuit 41a and the second metal circuit 41b can be changed according to requirements. That is, the number of the second metal lines 41b located between any two adjacent first metal lines 41a is not limited to one, and is located between any two adjacent second metal lines 41b The number of the first metal circuit 41a is also not limited to one.

Referring to FIGS. 3 to 5, in this embodiment, each metal circuit 41 defines at least one connecting portion 415 and the at least one connecting portion 415 is located on the rear pad 4121 or the front pad 413. For example, one metal line 41 may have one connecting portion 415, which is located on the rear pad 4121 or the front pad 413. Alternatively, one metal line 41 may have four connecting portions 415 (for example, the third metal line 41 counted from left to right in FIG. 2). Two of the four connecting portions 415 are located on the rear pad 4121, and the other two of the four connecting portions 415 are located on the front pad 413. However, the number and positions of the connecting portions 415 can be changed according to requirements, and are not limited here.

Furthermore, in this embodiment, each metal circuit 41 includes a conductive pillar 416 embedded in the board 1 and connected to the connecting portion 415. In other words, each metal circuit 41 is provided with at least one conductive pillar 416, and the conductive pillar 416 is connected to the rear pad 4121 or the front pad 413 through the connecting portion 415. In other words, the circuit layer 4 including a plurality of the metal circuits 41 includes a plurality of the conductive pillars 416, but the present invention is not limited to this.

The conductive pillars 416 are electrically coupled to the inner conductive layer 11 buried in the board 1, so that at least part of the plurality of rear pads 4121 in the circuit layer 4 and the plurality of At least part of the front pad 413 can be electrically coupled to the inner conductive layer 11 through the corresponding conductive pillar 416. That is, through the conductive pillars 416 connected to the connecting portion 415, each of the metal lines 41 is electrically coupled to the inner conductive layer 11 in the board body 1. It should be noted that the isolated pad 414 of each metal circuit 41 is not electrically coupled to the inner conductive layer 11 in this embodiment, and the conductive pillar 416 in this embodiment The quantity can be adjusted according to demand, and the present invention is not limited here.

It should be additionally noted that the multi-section gold finger structure 100 in this embodiment may further include a protective layer 3 formed on the plate body 1, and the protective layer 3 is adjacent to the free surface of the plate body 1. The end 1a covers the part of the metal circuit 41 connected to each front pad 413, so as to prevent the multi-section gold finger structure 100 from damaging the metal circuit 41 during use. Furthermore, the shape, material, and other related properties of the protective layer 3 are not limited to the same as the insulating outer layer 2 and can be changed according to requirements, and will not be repeated here.

A plurality of gold-plated films 5 are respectively plated on the outer surface of the back pad 4121, the outer surface of the front pad 413, and the outer surface of the isolated pad 414 of the plurality of metal lines 41. In this embodiment, a plurality of the gold-plated films 5 are separated from each other, and the surface size of any one of the gold-plated films 5 may be equal to the outer surface of the back pad 4121 on which it is plated, and the front contact The outer surface of the pad 413 or the outer surface of the isolated pad 414. Furthermore, the number of the plurality of gold-plated films 5 is equal to the sum of the numbers of the back pads 4121, the front pads 413, and the isolated pads 414. However, the size and number of the multiple gold-plated films 5 can be changed according to requirements, and are not limited to this embodiment.

Please refer to FIG. 6 to FIG. 10. This embodiment also discloses a manufacturing method of a multi-section gold finger structure. The manufacturing method of the multi-section gold finger structure includes a pre-step S110, an opening step S120, a dividing step S130, an electroplating step S140, and a removing step S150. However, the multi-section gold finger structure 100 of this embodiment may be manufactured by the above-mentioned manufacturing method, but the present invention is not limited thereto. Furthermore, the present invention is not limited to the content and sequence of the above-mentioned steps when implementing the above-mentioned manufacturing method of the multi-section gold finger structure.

The steps of the manufacturing method of the multi-section gold finger structure of this embodiment will be described below. For the structure or other related features of each part of the multi-section gold finger structure, please refer to the related introduction of the first embodiment. , I won’t repeat it below.

The pre-step S110 is shown in FIG. 6: providing a board 1, a circuit layer 4 formed on the board 1, and an insulating outer layer 2 covering a part of the circuit layer 4. The circuit layer 4 includes a plurality of metal circuits 41 and a plurality of sacrificial segments 43. Each of the plurality of metal circuits 41 includes an inner circuit 411 buried in the insulating outer layer 2 and a metal segment 410 exposed on the insulating outer layer 2. The plurality of sacrificial sections 43 are exposed on the insulating outer layer 2, and any two adjacent metal sections 410 are connected by one sacrificial section 43.

In this embodiment, each of the sacrificial sections 43 is rectangular and can be changed according to requirements. In addition, each of the sacrificial segments 43 has a first length distance L1 parallel to the longitudinal direction L, and each of the metal segments 410 has a second length distance L2 parallel to the longitudinal direction L. The second length distance L2 of each of the metal segments 410 is not less than the first length distance L1 of each of the sacrifice segments 43. In practical applications, the first length distance L1, the second length distance L2, the shape, quantity, and other related properties of the sacrifice section 43 and the metal section 410 can be changed according to actual needs. Examples are limited. For example, in other embodiments not shown in the present invention, the second length distance L2 of each metal segment 410 is equal to the first length distance L1 of each sacrifice segment 43, and the metal segment The number of 410 is five and the number of the sacrifice section 43 is four.

The opening step S120 is shown in FIG. 7: a plurality of openings 44 are formed in each of the metal segments 410 along a longitudinal direction L, and a plurality of openings 44 are formed on any two adjacent metal segments 410. The opening 44 is separated by the sacrificial section 3 therebetween, so that each of the metal sections 410 includes a back pad 4121 connected to the corresponding inner circuit 411 and the back pad 4121 a front pad 413 arranged at intervals, and at least one isolated pad 414 located between the rear pad 4121 and the front pad 413 at intervals.

More specifically, the number of the plurality of openings 44 formed on the plurality of metal segments 410 is at least two. In this embodiment, the number of the plurality of openings 44 formed on any one of the metal segments 410 is two or three. That is, when the number of the plurality of openings 44 formed on the metal segment 410 is two, the metal segment 410 includes one rear pad 4121 and one front pad 413 , And one isolated pad 414; when the number of the plurality of openings 44 formed on the metal segment 410 is three, the metal segment 410 includes one rear pad 4121 The front pad 413 and the two isolated pads 414.

In this embodiment, the opening 44 is rectangular as an example, so that the appearance of the rear pad 4121, the front pad 413, and at least one isolated pad 414 are substantially rectangular. However, the shape of the opening 44 can be changed according to requirements, and is not limited to this embodiment. In addition, the shape of any one of the openings 44 is not limited to be the same as the shape of any other opening 44.

It should be noted that the number and type of the plurality of openings 44 can be changed according to requirements. In other words, the number of the plurality of openings 44 formed on each metal segment 410 can be adjusted according to design requirements, thereby changing the number of isolated pads 414 included in each metal segment 410. In addition, the size of the opening 44 of each metal segment 410 in the longitudinal direction L can also be adjusted according to design requirements, thereby changing the rear pad 4121, the front pad 413, and the isolated pad 414 size and the separation distance between each other.

The dividing step S130 is as shown in FIG. 8: a shielding strip 6 is formed on each of the sacrificial segments 43. In this embodiment, the shape of the shielding strip 6 is roughly rectangular, and the shape of the shielding strip 6 can be changed according to requirements. In other words, the shape of the shielding strip 6 is not limited to a rectangle, and the shape of each shielding strip 6 is not limited to be equal.

The electroplating step S140 is shown in FIG. 9: on the outer surface of the back pad 4121, the outer surface of the front pad 413, and at least one of the isolated pads 414 of the plurality of metal lines 41 A plurality of gold-plated films 5 are respectively plated on the outer surface, and the plurality of gold-plated films 5 are separated from each other.

The removing step S150 is shown in FIG. 10: removing a plurality of the masking strips 6 and a plurality of the sacrificial segments 43, thereby forming the multi-section gold finger structure 100.

It should be noted that, in the removing step S150 in this embodiment, a plurality of the masking bars 6 are first removed, and then a plurality of the sacrificial segments 43 are removed by etching. In addition, in this embodiment, the shape and number of the shielding strips 6 correspond to the shape and number of the sacrificial segments 43 removed by etching. In other words, relevant personnel can change the shape and number of the shielding strips 6 according to requirements, so as to change the shape and number of the sacrificial segments 43 that are removed by etching.

[Technical effects of the embodiment of the present invention]

In summary, the multi-section gold finger structure and manufacturing method disclosed in the embodiments of the present invention provide an innovative gold finger structure and manufacturing method through special structure design and matching, and can overcome the existing gold finger structure. Structural defects.

The content disclosed above is only the preferred and feasible embodiments of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention. Inside.

100: Multi-cut gold finger structure 1: Board body 11: Inner conductive layer 1a: free end 2: Insulation outer layer 3: Protective layer 4: Line layer 41: Metal circuit 41a: The first metal circuit 41b: The second metal line 410: Metal segment 411: internal line 412: Main section 4121: After the pad 413: Front pad 414: Isolated pad 415: Connection part 416: Conductive column 42: horizontal line 43: Sacrifice segment 44: Opening 5: Gold-plated film 6: Masking strip L: longitudinal direction L1: the first length distance L2: second length distance W: horizontal direction A1: The first short side A2: The second short side B1: the first long side B2: The second long side S110: Preliminary steps S120: Opening steps S130: Division step S140: Electroplating step S150: Removal steps

FIG. 1 is a schematic top view of a multi-section gold finger structure according to an embodiment of the present invention.

FIG. 2 is a schematic diagram of FIG. 1 omitting the metal film.

Fig. 3 is a schematic cross-sectional view taken along the line III-III of Fig. 1.

Fig. 4 is a schematic cross-sectional view of Fig. 1 along the line IV-IV.

Fig. 5 is a schematic cross-sectional view of Fig. 1 along the section line V-V.

6 is a schematic diagram of the pre-steps of the method for manufacturing a multi-section gold finger according to an embodiment of the present invention.

FIG. 7 is a schematic diagram of the opening steps of the method for manufacturing a multi-section gold finger according to an embodiment of the present invention.

FIG. 8 is a schematic diagram of the division steps of a method for manufacturing a multi-section gold finger according to an embodiment of the present invention.

FIG. 9 is a schematic diagram of electroplating steps in a method for manufacturing a multi-section gold finger according to an embodiment of the present invention.

FIG. 10 is a schematic diagram of removing steps of the method for manufacturing a multi-section gold finger according to an embodiment of the present invention.

100: Multi-cut gold finger structure 1: Board body 1a: free end 2: Insulation outer layer 3: Protective layer 41: Metal circuit 41a: The first metal circuit 41b: The second metal line 42: horizontal line 5: Gold-plated film L: longitudinal direction W: horizontal direction A1: The first short side A2: The second short side B1: the first long side B2: The second long side

Claims (7)

A multi-section gold finger structure includes: a board body; an insulating outer layer formed on the board body; a circuit layer formed on the board body and including a plurality of metal circuits arranged in a transverse direction, and each The metal circuit includes: a main body section, one part of which is buried in the insulating outer layer, and another part of the main body section is exposed on the insulating outer layer and is defined as a back pad; a front pad, And the rear pads are spaced apart from each other along a longitudinal direction, and the longitudinal direction is parallel to the transverse direction; and at least one isolated pad is spaced apart from the rear pads along the longitudinal direction Between the front pads; and a plurality of gold-plated films, plated on the outer surface of the back pad, the outer surface of the front pad, and at least one of the isolated pads of each of the metal lines The outer surface; wherein the plurality of metal lines are divided into a plurality of first metal lines and a plurality of second metal lines staggered along the lateral direction, each of the first metal line includes at least one The number of the isolated pad is one, and the number of at least one of the isolated pads included in each second metal circuit is two. The multi-section gold finger structure according to claim 1, wherein the multi-section gold finger structure further includes an inner conductive layer embedded in the board, and a plurality of the circuit layers are At least part of the rear pad and at least part of the plurality of front pads are electrically coupled to the inner conductive layer. The multi-cut gold finger structure according to claim 2, wherein at least one of the isolated pads of each metal circuit is not electrically coupled to the inner conductive layer. The multi-cut gold finger structure according to claim 1, wherein the lengths of the back pad and the front pad of each of the first metal lines are respectively greater than the length of each of the second metal lines. The length of the back pad and the front pad. A method for manufacturing a multi-section gold finger structure includes: a pre-step: providing a board, a circuit layer formed on the board, and an insulating outer layer covering a part of the circuit layer; wherein the circuit The layer includes: a plurality of metal circuits, each including an inner circuit buried in the insulating outer layer and a metal section exposed on the insulating outer layer; and a plurality of sacrificial sections, exposed on the insulating outer layer, and any two Adjacent metal segments are connected by one sacrificial segment; an opening step: a plurality of openings are formed in each metal segment along a longitudinal direction, and any two adjacent metal segments The plurality of openings on the segment are separated by the sacrificial segment located therebetween, so that each of the metal segments includes a back pad connected to the corresponding inner circuit, and the back pad A front pad and at least one isolated pad spaced apart between the rear pad and the front pad; a dividing step: forming a shielding strip on each of the sacrificial segments; Electroplating step: plating a plurality of gold-plated films on the outer surface of the back pad, the outer surface of the front pad, and the outer surface of at least one of the isolated pads of the plurality of metal lines, and A plurality of the gold-plated films are separated from each other; and a removing step: removing a plurality of the masking strips and a plurality of the sacrificial segments, thereby forming a multi-section gold finger structure. The method for manufacturing a multi-section gold finger structure according to claim 5, wherein, in the removing step, a plurality of the masking strips are first removed, and then an etching method is used Remove a plurality of the sacrificial segments. The method for manufacturing a multi-section gold finger structure according to claim 5, wherein, in the opening step, the number of the plurality of openings formed on the plurality of metal segments is at least two.

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