CN102958288B - Printed circuit board drilling method - Google Patents
Printed circuit board drilling method Download PDFInfo
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- CN102958288B CN102958288B CN201110241257.2A CN201110241257A CN102958288B CN 102958288 B CN102958288 B CN 102958288B CN 201110241257 A CN201110241257 A CN 201110241257A CN 102958288 B CN102958288 B CN 102958288B
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Abstract
The invention discloses a printed circuit board drilling method. A printed circuit board comprises a top plate, a bottom plate and a core plate. The printed circuit board drilling method includes mechanically drilling through holes at different positions of the core plate, subjecting the through holes to copper depositing and electroplating; subjecting the through holes subjected to copper depositing and electroplating to resin hole plugging treatment; plating copper on resin; binding the top plate and the bottom plate on the upper surface and the lower surface of the core plate, arranging external copper layers on the outer surfaces of the top plate and the bottom plate; and drilling blind holes at positions, corresponding to the through holes, on the external copper layers of the top plate and the bottom plate, subjecting the blind holes to copper depositing and electroplating so that the external copper layers are conductive with the copper layers of the through holes, wherein the bottoms of the blind holes extend to the copper layers on the through holes. Thus, the through holes at different positions on the circuit board are communicated, multilayer circuit connection is formed, and drilling blind holes with high thickness and diameter ratio is omitted.
Description
Technical field
The present invention relates to printed circuit board (PCB) (PCB, Printed Circuit Board) processing method technical field, more particularly, relate to a kind of printed circuit board drilling method.
Background technology
The integrated level of printed circuit board (PCB) embodies an important indicator of properties of product, in order to improve the integrated level of printed circuit board (PCB), occurred multilayer board.Please refer to Fig. 1, more space is provided in order to give the cabling of multilayer circuit board, make it have best electric property, the top layer L1 of printed circuit board (PCB) and the surface of bottom L4 are provided with blind hole A, B usually, or run through the through hole C of whole circuit board (namely running through L1, L2, L3 and L4 layer successively).This blind hole C or through hole A, B can be used for the connection of top layer wiring and internal layer circuit.
After the boring method of conventional print-circuit board normally first presses printed circuit board, the mode of laser drill or machine drilling is used to hole on a printed circuit, then, in this hole, carry out electroless copper and electro-coppering, finally carry out showing methods again.This processing method, general be applicable to the smaller blind hole of processing thickness and aperture or through hole, and for the larger blind hole of thickness and aperture or through hole, then there are problems: such as, adopt conventional borehole method when processing high thickness to diameter ratio hole, there is the unmanageable problem of drilling depth, drilling depth is defective easily causes product rejection.In addition, the too dark operations such as follow-up change gold, change tin of also giving of boring bring difficulty.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of printed circuit board drilling method, and it can overcome the various defects that prior art bores high thickness to diameter ratio hole.
For solving the problems of the technologies described above, one of technical scheme of the present invention is: provide a kind of printed circuit board drilling method, and described printed circuit board (PCB) comprises top plate, bottom plate and at least one deck central layer, comprises the following steps:
1), on central layer diverse location, adopt the mode holes drilled through of machine drilling, and heavy copper, electroplating processes are done to described through hole;
2), to described through sinking copper, electroplating processes through hole carry out filling holes with resin process;
3), copper facing on resin;
4), more described top plate, bottom plate are bonded in respectively the upper and lower surface of described central layer, the outer surface of described top plate and bottom plate is provided with external copper;
5), in the position of the corresponding described through hole of the external copper of described top plate and backplane level adopt the mode of laser drill to be drilled with blind hole, the bottom of described blind hole extends to the layers of copper on described through hole;
6), to described blind hole do heavy copper, electroplating processes, make the layers of copper conducting on described external copper and described through hole.
More specifically, in step 1) after, then electroplating processes is done to described through hole, increase the thickness of layers of copper further.
More specifically, in step 2) after, the part described resin being exceeded to layers of copper in described through hole polishes process.
More specifically, polishing process described in adopts machinery to complete except glue or ceramic brush board mode.
More specifically, in step 3) in, on described resin, the thickness of layers of copper is greater than 10 microns.
More specifically, described central layer is provided with the internal layer location hole of at least two described lead to the hole site of instruction.
More specifically, the quantity of described internal layer location hole is four, and the position of corresponding described central layer corner is arranged respectively.
For solving the problems of the technologies described above, two of technical scheme of the present invention is: provide a kind of printed circuit board drilling method, and described printed circuit board (PCB) comprises top plate, bottom plate and at least one deck central layer, comprises the following steps:
1), on central layer diverse location, adopt the mode holes drilled through of machine drilling, and heavy copper, electroplating processes are done to described through hole;
2), to described through sinking copper, electroplating processes through hole carry out the process of electric conducting material consent;
3), more described top plate, bottom plate are bonded in respectively the upper and lower surface of described central layer, the outer surface of described top plate and bottom plate is provided with external copper;
4), in the position of the corresponding described through hole of the external copper of described top plate and backplane level adopt the mode of laser drill to be drilled with blind hole, the bottom of described blind hole extends to the layers of copper on described through hole;
5), to described blind hole do heavy copper, electroplating processes, make described external copper and described through hole conducting.
Like this, due to first holes drilled through on central layer diverse location, be drilled with blind hole in the position of the corresponding described through hole of external copper of described top plate and backplane level again, the bottom of described blind hole extends to the layers of copper on described through hole.Thus the through hole being positioned at circuit board diverse location can be made to be communicated with, and then form multilayer line connection, and the high thickness to diameter ratio blind hole being difficult to reach technological requirement need not be drilled with.Not only reduce technology difficulty, also improve the quality of product.
Accompanying drawing explanation
With the structural representation of the printed circuit board (PCB) of high thickness to diameter ratio boring in Fig. 1 prior art;
Fig. 2 is the embodiment of the present invention one step 3) central layer cross-sectional schematic on resin after copper facing;
Fig. 3 is the embodiment of the present invention two step 5) and step 6) drilling blind hole cross-sectional schematic after heavy copper, electroplating processes are done to described blind hole on top plate and bottom plate.
Embodiment
In order to make technical problem to be solved by this invention, technical scheme and beneficial effect clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Please refer to Fig. 2 and Fig. 3, in embodiments of the invention one, described printed circuit board (PCB) comprises top plate 1, bottom plate 3 and central layer 2.The course of processing roughly comprises following five steps:
The first step, first holes drilled through H1, H2 on central layer 2 diverse location, described through hole H1, H2 adopt the mode of machine drilling to be formed.Then heavy copper, electroplating processes are done to described through hole H1, H2, make hole lead to the upper chemical copper of deposition in H1, H2.In order to increase the thickness of layers of copper further, after heavy Copper treatment, then electroplating processes is done to described through hole H1, H2.Finally, central layer 2 etches layers of copper 21.
Second step, sinks the through hole of copper and electroplating processes to described process and carries out filling holes with resin process, make to fill up resin 4 in through hole H1, H2; Subsequently process is polished to the part that described resin 4 exceeds layers of copper in described through hole.In the present embodiment, described in polish process and adopt machinery to complete except glue or ceramic brush board mode.
3rd step, please refer to Fig. 2, above-mentioned by copper facing on the resin that polishes; On described resin 4, the thickness of layers of copper is greater than 10 microns.
4th step, described top plate 1, bottom plate 3 are bonded in respectively the upper and lower surface of described central layer 2, the outer surface of described top plate 1 and bottom plate 3 is provided with external copper 11,31;
5th step, please refer to Fig. 3, and be drilled with blind hole M1 in the position of the corresponding described through hole H1 of the external copper 11 of described top plate 1, the bottom of described blind hole M1 extends to the upper layers of copper of described through hole H1.Meanwhile, be drilled with blind hole M2 in the position of the corresponding described through hole of the external copper 31 of described backplane level 3, the bottom of described blind hole M2 extends to the layers of copper on described through hole H2.Described blind hole M1, M2 all adopt the mode of laser drill to be formed.Then, heavy Copper treatment is done to described blind hole M1, M2, make the layers of copper conducting on described external copper and described through hole H1, H2.Certainly, follow-uply resin or electric conducting material can also be clogged to this blind hole M1, M2.
Described through hole H1, H2 adopt machine drilling mode, and described blind hole M1, M2 adopt laser drill mode most important to guarantee drilling quality.This is because:
If, then there is aligning accuracy and require high defect in the inside and outside two-layer mode all using laser drill.Because general laser blind hole diameter is for being designed to 3-8mil (mil), and wherein diameter is that 4mil, 5mil blind hole is more common.Aperture is all smaller, again because blind hole is positioned at different layers, will realize the contraposition of laser blind hole between the different layers, and aligning accuracy requires high.If adopt internal layer laser drill, and outer employing machine drilling, then there will be the problem that hole is up big and down small, the bad control of contraposition, also can face the problem that the dark difficulty of control is large, if control is deeply improper, drill bit can directly get in central layer, has the risk destroying inner line figure.If the inside and outside two-layer mode all using machine drilling, namely uses the mode of machine drilling to get out the hole of each core layer respectively, then the mode of lamination, then there will be when structure is asymmetric between layers, the defect of circuit board warpage.
In order to ensure that the position of blind hole M1, M2 can be accurately corresponding with through hole H1, H2, described central layer 2 is provided with the internal layer location hole (not shown) of at least two described lead to the hole site of instruction.In this enforcement, the quantity of described internal layer location hole is four, and the position of corresponding described central layer corner is arranged respectively.Like this, before the 4th step, record through hole H1, H2 coordinate relative to described internal layer location hole, as needs drilling blind hole M1, M2, according to above-mentioned coordinate information, the position of through hole H1, H2 can be determined.
Like this, due to the present embodiment first holes drilled through H1, H2 on central layer 2 diverse location, be drilled with blind hole M1, M2 in the position of the corresponding described through hole of external copper of described top plate 1 and backplane level 3 again, the bottom of described blind hole extends to the layers of copper on described through hole.Thus the through hole being positioned at circuit board diverse location can be made to be communicated with, and then form multilayer line connection, and the high thickness to diameter ratio blind hole being difficult to reach technological requirement need not be drilled with.Not only reduce technology difficulty, also improve the quality of product.
In addition, in embodiments of the invention two, replace resin material consent with electric conducting material, described electric conducting material can be conductive copper paste, conductive silver paste etc.Like this, copper facing is not just needed as embodiment one on resin.The embodiment of embodiment two is as follows:
The first step, central layer diverse location adopts the mode holes drilled through of machine drilling, and does heavy copper, electroplating processes to described through hole;
Second step, to described through sinking copper, electroplating processes through hole carry out the process of electric conducting material consent;
3rd step, the more upper and lower surface described top plate, bottom plate being bonded in respectively described central layer, the outer surface of described top plate and bottom plate is provided with external copper;
4th step, adopt the mode of laser drill to be drilled with blind hole in the position of the corresponding described through hole of the external copper of described top plate and backplane level, the bottom of described blind hole extends to the layers of copper on described through hole;
5th step, does heavy copper, electroplating processes to described blind hole, makes described external copper and described through hole conducting.
Embodiment two can reach equally and reduce technology difficulty, improves the effect of product quality.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. a printed circuit board drilling method, described printed circuit board (PCB) comprises top plate, bottom plate and at least one deck central layer, comprises the following steps:
1), on central layer diverse location, adopt the mode of machine drilling to bore two through holes, and heavy copper, electroplating processes are done to two described through holes;
2), to two described through sinking copper, electroplating processes through hole carry out filling holes with resin process;
3), copper facing on the resin of two through holes, form the layers of copper on two through holes;
4), more described top plate, bottom plate are bonded in respectively the upper and lower surface of described central layer, the outer surface of described top plate and bottom plate is provided with external copper;
5), in the position of corresponding two the described through holes of the external copper of described top plate and backplane level adopt the mode of laser drill to be drilled with two blind holes, the bottom of two described blind holes extends to the layers of copper on two described through holes respectively;
6), to two described blind holes do heavy copper, electroplating processes, make two described external copper respectively with the layers of copper conducting on two described through holes.
2. printed circuit board drilling method as claimed in claim 1, is characterized in that: in step 1) after, then electroplating processes is done to described through hole, increase the thickness of layers of copper further.
3. printed circuit board drilling method as claimed in claim 1, is characterized in that: in step 2) after, the part described resin being exceeded to layers of copper in described through hole polishes process.
4. printed circuit board drilling method as claimed in claim 3, is characterized in that: described in polish process and adopt machinery to complete except glue or ceramic brush board mode.
5. printed circuit board drilling method as claimed in claim 1, is characterized in that: in step 3) in, on described resin, the thickness of layers of copper is greater than 10 microns.
6. printed circuit board drilling method as claimed in claim 1, is characterized in that: described central layer is provided with the internal layer location hole of at least two described lead to the hole site of instruction.
7. printed circuit board drilling method as claimed in claim 6, is characterized in that: the quantity of described internal layer location hole is four, and the position of corresponding described central layer corner is arranged respectively.
8. a printed circuit board drilling method, described printed circuit board (PCB) comprises top plate, bottom plate and at least one deck central layer, comprises the following steps:
1), on central layer diverse location, adopt the mode of machine drilling to bore two through holes, and heavy copper, electroplating processes are done to two described through holes;
2), to two described through sinking copper, electroplating processes through hole carry out the process of electric conducting material consent;
3), more described top plate, bottom plate are bonded in respectively the upper and lower surface of described central layer, the outer surface of described top plate and bottom plate is provided with external copper;
4), in the position of corresponding two the described through holes of the external copper of described top plate and backplane level adopt the mode of laser drill to be drilled with two blind holes, the bottom of two described blind holes extends to the layers of copper on two described through holes respectively;
5), to two described blind holes do heavy copper, electroplating processes, make the described through hole conducting with two respectively of two described external copper.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110241257.2A CN102958288B (en) | 2011-08-21 | 2011-08-21 | Printed circuit board drilling method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110241257.2A CN102958288B (en) | 2011-08-21 | 2011-08-21 | Printed circuit board drilling method |
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| CN102958288A CN102958288A (en) | 2013-03-06 |
| CN102958288B true CN102958288B (en) | 2015-04-29 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104602452B (en) * | 2013-10-31 | 2017-11-10 | 北大方正集团有限公司 | A kind of preparation method of circuit board |
| CN104185385A (en) * | 2014-08-21 | 2014-12-03 | 江苏迪飞达电子有限公司 | Method for machining micro buried hole board |
| CN105451429B (en) * | 2014-08-29 | 2018-06-26 | 深南电路有限公司 | The processing method and circuit board of a kind of circuit board |
| CN107820361B (en) * | 2017-10-11 | 2020-07-24 | 龙南骏亚电子科技有限公司 | Preparation method of ceramic-based circuit board |
| CN113873786B (en) * | 2020-06-30 | 2023-12-29 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| CN112739016B (en) * | 2020-12-10 | 2023-03-14 | 惠州市特创电子科技股份有限公司 | Stacked hole circuit board and preparation method thereof |
| CN113141709A (en) * | 2021-02-26 | 2021-07-20 | 江苏博敏电子有限公司 | Equipment self-checking method for blind hole position offset of circuit board |
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| CN1348330A (en) * | 2001-10-19 | 2002-05-08 | 全懋精密科技股份有限公司 | Manufacture of thin core board for multiple-layer circuit board |
| CN101296583A (en) * | 2008-04-24 | 2008-10-29 | 苏州市惠利华电子有限公司 | Method for processing printed circuit board |
| CN101977486A (en) * | 2010-10-29 | 2011-02-16 | 东莞红板多层线路板有限公司 | Method for manufacturing via stubs of circuit board |
| CN102159040A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for drilling hole on four-layered circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100598274B1 (en) * | 2004-09-01 | 2006-07-07 | 삼성전기주식회사 | Embedded resistor printed circuit board and method for fabricating the same |
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- 2011-08-21 CN CN201110241257.2A patent/CN102958288B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1348330A (en) * | 2001-10-19 | 2002-05-08 | 全懋精密科技股份有限公司 | Manufacture of thin core board for multiple-layer circuit board |
| CN101296583A (en) * | 2008-04-24 | 2008-10-29 | 苏州市惠利华电子有限公司 | Method for processing printed circuit board |
| CN101977486A (en) * | 2010-10-29 | 2011-02-16 | 东莞红板多层线路板有限公司 | Method for manufacturing via stubs of circuit board |
| CN102159040A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for drilling hole on four-layered circuit board |
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| CN102958288A (en) | 2013-03-06 |
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Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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