CN209882237U - Blind buried orifice plate structure - Google Patents
Blind buried orifice plate structure Download PDFInfo
- Publication number
- CN209882237U CN209882237U CN201920277864.6U CN201920277864U CN209882237U CN 209882237 U CN209882237 U CN 209882237U CN 201920277864 U CN201920277864 U CN 201920277864U CN 209882237 U CN209882237 U CN 209882237U
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- Prior art keywords
- hole
- blind
- buried
- layer core
- core plate
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Abstract
The utility model discloses a blind buried hole plate structure, including top layer core, inlayer core, bottom core, first blind hole, second blind hole, through-hole, buried hole and resin consent, the first end of resin consent is located the upper surface of top layer core, the second end of resin consent with the first end of buried hole meets, just the aperture of resin consent is greater than the aperture of buried hole. The utility model discloses a blind buried hole plate structure is through setting up and the resin consent that the buried hole meets to the degree of depth of controlling twice drilling can realize a pressfitting, and a blind buried hole metallization, and a resin consent, the preparation flow is simple, effectively improves production efficiency, can reduce the rejection rate.
Description
Technical Field
The utility model relates to a circuit board manufacturing technology field especially relates to a blind buried hole plate structure.
Background
With the development of electronic products towards high density and high precision, the same requirements are correspondingly put forward on circuit boards. The most effective method for increasing the density of the circuit board is to reduce the number of through holes and to realize the purpose by accurately arranging blind buried holes. Blind holes are located on the top and bottom surfaces of the printed circuit board, have a certain depth, are used for the connection of the surface layer circuit and the lower inner layer circuit, the depth of the hole does not usually exceed a certain ratio (aperture); the buried via is a via hole connecting the inner layers and not visible in the surface layer of the finished board. With the popularization of blind buried hole circuit boards, how to manufacture blind buried hole boards faster and better is always an important direction for research of production and manufacturing units of circuit boards.
The existing blind and buried hole plate mainly passes through a mechanical blind and buried hole manufacturing process which mainly comprises the steps of firstly performing hole metallization and resin hole plugging on each layer of blind and buried holes, then manufacturing an inner layer pattern, and then pressing together to manufacture an outer layer pattern. If more than two blind buried hole designs exist in a certain layer, the metallization process of manufacturing the blind buried hole after more than two times of pressing is needed, so the manufacturing process of the blind buried hole plate structure is complex, the period is long, and the cost is high.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a blind buried hole plate structure.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a blind buried hole plate structure comprises a top layer core plate, an inner layer core plate, a bottom layer core plate, a first blind hole, a second blind hole, a through hole, a buried hole and a resin plug hole, wherein the first end of the resin plug hole is positioned on the upper surface of the top layer core plate, the second end of the resin plug hole is connected with the first end of the buried hole, and the aperture of the resin plug hole is larger than that of the buried hole; a first interlayer is arranged between the top layer core board and the inner layer core board, and a second interlayer is arranged between the inner layer core board and the bottom layer core board; the first end of the first blind hole is positioned on the upper surface of the top layer core plate, the second end of the first blind hole is positioned on the first interlayer, the distance from the second end of the first blind hole to the lower surface of the top layer core plate is equal to the distance from the second end of the first blind hole to the upper surface of the inner layer core plate, the first end of the second blind hole is positioned on the upper surface of the top layer core plate, the second end of the second blind hole is positioned on the second interlayer, the distance from the second end of the second blind hole to the lower surface of the inner layer core plate is equal to the distance from the second end of the second blind hole to the upper surface of the bottom layer core plate, the first end of the buried hole is positioned on the first interlayer, the distance from the first end of the buried hole to the lower surface of the top layer core plate is equal to the distance from the upper surface of the inner layer core plate, the second end of the buried hole is positioned in the middle of the second interlayer, and the distance from the second end of the buried hole to the, the first end of the through hole is positioned on the upper surface of the top layer core plate, and the second end of the through hole is positioned on the lower surface of the bottom layer core plate.
Preferably, the first blind hole, the second blind hole, the through hole and the buried hole have electroplated copper therein, and the resin plug hole is filled with epoxy resin therein.
Preferably, the thickness of the first interlayer and the second interlayer are both greater than 0.2 mm.
Preferably, the first interlayer and the second interlayer have the same thickness.
Preferably, the aperture of the resin plug hole is larger than the aperture of the buried hole by 0.2 mm.
The utility model discloses a blind buried hole plate structure is through setting up and the resin consent that the buried hole meets to the degree of depth of controlling twice drilling can realize a pressfitting, and a blind buried hole metallization, and a resin consent, the preparation flow is simple, effectively improves production efficiency, can reduce the rejection rate.
Drawings
Fig. 1 is a schematic view of a blind buried hole plate structure of the present invention;
fig. 2 is the structure diagram of the blind buried hole plate structure after the first deep drilling control hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1, a schematic structural diagram of a blind buried orifice plate structure includes a top core plate 101, an inner core plate 102, a bottom core plate 103, a first blind hole 104, a second blind hole 105, a through hole 106, a buried hole 107, a resin plug hole 108, wherein a first end of the resin plug hole 108 is located on an upper surface of the top core plate 101, a second end of the resin plug hole 108 is connected with a first end of the buried hole 107, and a hole diameter of the resin plug hole 108 is larger than a hole diameter of the buried hole 107; a first interlayer 109 is arranged between the top core board 101 and the inner core board 102, and a second interlayer 110 is arranged between the inner core board 102 and the bottom core board 103; the first end of the first blind hole 104 is located on the upper surface of the top core board 101, the second end of the first blind hole 104 is located on the first interlayer 109, the distance from the second end of the first blind hole 104 to the lower surface of the top core board 101 is equal to the distance from the upper surface of the inner core board 102, the first end of the second blind hole 105 is located on the upper surface of the top core board 101, the second end of the second blind hole 105 is located on the second interlayer 110, the distance from the second end of the second blind hole 105 to the lower surface of the inner core board 102 is equal to the distance from the upper surface of the bottom core board 103, the first end of the buried hole 107 is located on the first interlayer 109, the distance from the first end of the buried hole 107 to the lower surface of the top core board 101 is equal to the distance from the upper surface of the inner core board 102, and the second end of the buried hole 107 is located in the middle of the layers of the second interlayer, and the distance from the second end of the buried via 107 to the lower surface of the inner core plate 102 is equal to the distance from the upper surface of the bottom core plate 103, the first end of the through hole 106 is located on the upper surface of the top core plate 101, and the second end of the through hole 106 is located on the lower surface of the bottom core plate 103.
In the above-mentioned blind buried-hole plate structure, the first blind hole 104, the second blind hole 105, the through hole 106 and the buried hole 107 have electroplated copper therein, and the resin plug hole 108 is filled with epoxy resin.
In the above-described blind buried orifice plate structure, the thicknesses of the first interlayer 109 and the second interlayer 110 are both greater than 0.2 mm.
In the above-described blind hole plate structure, the first interlayer 109 and the second interlayer 110 have the same thickness for the convenience of the manufacturing process.
In the above-mentioned blind buried-hole plate structure, the aperture of the resin plug hole 108 is 0.2mm larger than that of the buried hole 107, so as to ensure effective removal of the copper layer on the inner wall of the blind hole.
The blind buried hole plate is manufactured by the following specific steps:
(1) the material cutting sub-plate is used for respectively cutting a top core plate 201, an inner core plate 202 and a bottom core plate 203;
(2) pressing, namely pressing the top-layer core board 201, the inner-layer core board 202 and the bottom-layer core board 203 to form a mother board with a first interlayer 209 and a second interlayer 210;
(3) drilling a first depth control hole, namely respectively drilling a first blind hole 204, a second blind hole 205 and a through hole 206 on the motherboard by controlling the drilling depth of the drill; since the precision of the current depth-control drill is about +/-0.1 mm, in order to prevent the situation of no drilling or excessive drilling, the thickness of the first interlayer 209 and the second interlayer 210 is designed to be more than 0.2mm, and a drill is controlled to be in the middle of the first interlayer 209 and the second interlayer 210 during drilling. Wherein the buried via is first drilled as a second blind via 205 (shown in figure 2). If two layers of lines are just on the drill hole, the lines can be partially shifted to prevent open circuit.
(4) Copper deposition and electroplating for the first time, wherein the first blind hole 204, the second blind hole 205 and the through hole 206 are metalized through copper deposition and electroplating for the first time;
(5) performing second depth control drilling, namely selecting a second blind hole 205 corresponding to the target buried hole to perform second depth control drilling, wherein a drill bit used in the second depth control drilling is 0.2mm larger than a drill bit used in the first depth control drilling, so as to ensure that all copper in the hole with the depth from the upper surface of the top-layer core plate 101 in the second blind hole 205 to the middle of the first interlayer 109 can be fully drilled, and forming a resin plug hole 108 (shown in fig. 1);
(6) filling holes with resin and polishing, wherein after the resin filling holes 108 pass through a resin filling hole process, the interior of the resin filling holes 108 is filled with epoxy resin, so that second blind holes 205 passing through second depth control drilling holes become buried holes 107;
(7) and (5) carrying out subsequent process flows.
In the traditional blind buried hole plate manufacturing process, the daughter board needs to be pressed for many times, and the PCB is easily scrapped due to the fact that the warping plate is easily generated in the pressing process due to the fact that the structure is asymmetric. And the utility model provides a blind buried hole board structure carries out formation mother board after the pressfitting before drilling, and follow-up can directly drill on the mother board, and the process is simplified, improves production efficiency to effectively reduce the rejection rate.
The utility model discloses a blind buried hole plate structure is through setting up and the resin consent that the buried hole meets to the degree of depth of controlling twice drilling can realize a pressfitting, and a blind buried hole metallization, and a resin consent, the preparation flow is simple, effectively improves production efficiency, can reduce the rejection rate.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. A blind buried hole plate structure comprises a top layer core plate, an inner layer core plate, a bottom layer core plate, a first blind hole, a second blind hole, a through hole and a buried hole, and is characterized by further comprising a resin plug hole, wherein the first end of the resin plug hole is positioned on the upper surface of the top layer core plate, the second end of the resin plug hole is connected with the first end of the buried hole, and the aperture of the resin plug hole is larger than that of the buried hole; a first interlayer is arranged between the top layer core board and the inner layer core board, and a second interlayer is arranged between the inner layer core board and the bottom layer core board; the first end of the first blind hole is positioned on the upper surface of the top layer core plate, the second end of the first blind hole is positioned on the first interlayer, the distance from the second end of the first blind hole to the lower surface of the top layer core plate is equal to the distance from the second end of the first blind hole to the upper surface of the inner layer core plate, the first end of the second blind hole is positioned on the upper surface of the top layer core plate, the second end of the second blind hole is positioned on the second interlayer, the distance from the second end of the second blind hole to the lower surface of the inner layer core plate is equal to the distance from the second end of the second blind hole to the upper surface of the bottom layer core plate, the first end of the buried hole is positioned on the first interlayer, the distance from the first end of the buried hole to the lower surface of the top layer core plate is equal to the distance from the upper surface of the inner layer core plate, the second end of the buried hole is positioned in the middle of the second interlayer, and the distance from the second end of the buried hole to the, the first end of the through hole is positioned on the upper surface of the top layer core plate, and the second end of the through hole is positioned on the lower surface of the bottom layer core plate.
2. The blind and buried orifice plate structure of claim 1, wherein said first blind via, second blind via, through hole and buried via have electroplated copper therein, and said resin plug hole is filled with epoxy resin.
3. A blind buried orifice plate structure as set forth in claim 2 in which the thickness of each of the first and second interlayers is greater than 0.2 mm.
4. A blind buried orifice plate structure as set forth in claim 3 in which the first and second interlayers are of equal thickness.
5. A blind buried orifice plate structure as set forth in claim 4 in which the apertures of the resin plug holes are 0.2mm larger than the apertures of the buried holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920277864.6U CN209882237U (en) | 2019-03-05 | 2019-03-05 | Blind buried orifice plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920277864.6U CN209882237U (en) | 2019-03-05 | 2019-03-05 | Blind buried orifice plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209882237U true CN209882237U (en) | 2019-12-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920277864.6U Expired - Fee Related CN209882237U (en) | 2019-03-05 | 2019-03-05 | Blind buried orifice plate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209882237U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111757602A (en) * | 2020-06-02 | 2020-10-09 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of blind hole |
-
2019
- 2019-03-05 CN CN201920277864.6U patent/CN209882237U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111757602A (en) * | 2020-06-02 | 2020-10-09 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of blind hole |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191231 Termination date: 20210305 |
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| CF01 | Termination of patent right due to non-payment of annual fee |